CN218499466U

CN218499466U - Radiator and oven

Info

Publication number: CN218499466U
Application number: CN202221484572.8U
Authority: CN
Inventors: 张传美; 王定远; 耿丽丽; 段耀铎; 贾晓芸
Original assignee: Qingdao Haier Smart Technology R&D Co Ltd; Haier Smart Home Co Ltd
Current assignee: Qingdao Haier Smart Technology R&D Co Ltd; Haier Smart Home Co Ltd
Priority date: 2022-06-14
Filing date: 2022-06-14
Publication date: 2023-02-17
Anticipated expiration: 2032-06-14

Abstract

The application relates to the technical field of heat dissipation, and discloses a heat radiator which comprises a temperature equalizing element, a liquid cooling plate and a fin group, wherein the temperature equalizing element is used for being in heat conduction connection with a radio frequency module so as to receive heat generated by the radio frequency module; the liquid cooling plate is provided with a liquid inlet, a liquid outlet and a flow passage communicated with the liquid inlet and the liquid outlet; the fin group and the temperature equalizing element are respectively arranged on two sides of the liquid cooling plate; the liquid cooling plate is filled with cooling liquid, the temperature equalizing element exchanges heat with the cooling liquid in the liquid cooling plate, the cooling liquid after heat exchange exchanges heat with the fin group again, and heat is transferred to the fin group for heat dissipation. The heat is transferred to the liquid cooling plate through the temperature equalizing element, so that the heat transfer area can be enlarged, and the uniformity of heat transfer can be improved; heat is diffused and transferred to the fin group through cooling liquid to be subjected to air cooling heat dissipation, local overhigh temperature is avoided, and the heat dissipation effect of the radiator on the radio frequency module is effectively improved through the combination of liquid heat dissipation and air cooling heat dissipation. The present application further discloses an oven.

Description

Radiator and oven

Technical Field

The present application relates to the field of heat dissipation technologies, and for example, to a heat sink and an oven.

Background

No matter how the appearance and the function of the oven in the current market are improved, the problem of too much baking and roasting is not solved, and the barbecue tastes firewood, the baked bread is burnt and the like. The reason is that the traditional oven is uneven in internal heating, the food is baked more and dried more, the food is hard to be burnt outside and tender inside, and the original taste is lost. Adopt radio frequency (solid-state microwave) culinary art food, can adopt the bigger wavelength of lower frequency 40.68/433/915MHz, "directly" let food inside and outside generate heat simultaneously, reach the effect that outer burnt tender in the lining, and all other culinary art modes (fry in shallow oil fry cook steak roast), all be indirect heating mode (heat the food outside earlier, let food self pass heat from outside to inside), the radio frequency source part in the radio frequency oven is power amplifier chip, its consumption is very big, heat flux density is big, traditional aluminium crowded heat dissipation, heat pipe heat dissipation and water-cooling head heat dissipation can't effectively solve the heat dissipation problem of radio frequency module.

SUMMERY OF THE UTILITY MODEL

The following presents a simplified summary in order to provide a basic understanding of some aspects of the disclosed embodiments. This summary is not an extensive overview and is intended to neither identify key/critical elements nor delineate the scope of such embodiments, but is intended to be a prelude to the more detailed description that is presented later.

The embodiment of the disclosure provides a radiator and an oven, so as to improve the radiating effect of a radio frequency module.

In some embodiments, the heat sink comprises:

the temperature equalizing element is used for being in heat conduction connection with the radio frequency module so as to receive heat generated by the radio frequency module;

the liquid cooling plate is provided with a liquid inlet, a liquid outlet and a flow channel communicated with the liquid inlet and the liquid outlet; and (c) and (d),

the fin group and the temperature equalizing element are respectively arranged on two sides of the liquid cooling plate;

the liquid cooling plate is filled with cooling liquid, the temperature equalizing element exchanges heat with the cooling liquid in the liquid cooling plate, the cooling liquid after heat exchange exchanges heat with the fin group again, and heat is transferred to the fin group for heat dissipation.

In some embodiments, the heat sink further comprises:

the connecting pipeline is connected with the liquid inlet and the liquid outlet in series so that the cooling liquid circularly flows in a closed loop mode in the liquid cooling plate and the connecting pipeline;

wherein, a circulating pump is arranged in the connecting pipeline to drive the cooling liquid to flow.

In some embodiments, the flow channel includes a plurality of internal circulation units, adjacent internal circulation units being in communication by a single flow path;

the internal circulation unit comprises a plurality of micro flow paths communicated with each other, and the cooling liquid can circularly flow in the micro flow paths of the internal circulation unit so as to prolong the retention time of the cooling liquid in the internal circulation unit.

In some embodiments, the internal circulation cell is configured with a plurality of nip points, adjacent ones of which define the microfluidic circuit therebetween.

In some embodiments, the internal circulation unit comprises at least a first row of roll point groups and the second row of roll point groups;

and the rolling points of the first row of rolling point groups and the rolling points of the second row of rolling point groups are arranged in a staggered manner.

In some embodiments, the heat conducting side of the fin group is in heat conducting connection with the liquid cooling plate;

the fin group is provided with an accommodating groove for accommodating the liquid inlet and the liquid outlet on the heat conduction side, so that the fin group is tightly attached to the liquid cooling plate.

In some embodiments, the fin set comprises a plurality of fins, the fins comprising:

the first bent part is formed by bending and extending the first edge of the fin;

the first bending parts of the adjacent fins are sequentially connected to form a heat conduction surface, and the heat conduction surface is attached to the surface of the liquid cooling plate so as to enlarge the heat transfer area between the fin group and the liquid cooling plate.

In some embodiments, the fin face of the fin is configured with a raised structure to enlarge the contact area of the fin with the airflow.

In some embodiments, some or all of the regions of the fins are configured with the raised structures, and/or some or all of the fins of the fin group are configured with the raised structures.

In some embodiments, the oven comprises: the heat sink provided in the foregoing embodiments.

The radiator and the oven provided by the embodiment of the disclosure can realize the following technical effects:

the heat generated by the radio frequency module is transferred to the liquid cooling plate through the temperature equalizing element, so that the heat transfer area can be enlarged, and the uniformity of heat transfer can be realized; the heat and the cooling liquid heat transfer of transmission to the liquid cooling board, through cooling liquid with heat diffusion and transmit to fin group, avoid local high temperature on the one hand, on the other hand carries out the air-cooled heat dissipation through fin group, like this, through the radiating combination of liquid heat dissipation and air-cooled, improved the radiating effect of radiator to the radio frequency module effectively.

The foregoing general description and the following description are exemplary and explanatory only and are not restrictive of the application.

Drawings

One or more embodiments are illustrated by way of example in the accompanying drawings, which correspond to the accompanying drawings and not in limitation thereof, in which elements having the same reference numeral designations are shown as like elements and not in limitation thereof, and wherein:

fig. 1 is a schematic structural diagram of the heat sink provided in the embodiment of the present disclosure;

fig. 2 is an exploded schematic view of the heat sink provided by the embodiments of the present disclosure;

FIG. 3 is a schematic structural view of the liquid cooling plate provided by the disclosed embodiment;

fig. 4 is a schematic structural diagram of the fin group provided in the embodiment of the present disclosure.

Reference numerals are as follows:

10: a temperature equalizing element; 20: a liquid-cooled plate; 201: a liquid inlet; 202: a liquid outlet; 203: a flow channel; 204: an internal circulation unit; 205: a single flow path; 206: rolling points; 30: a fin set; 301: a containing groove; 302: a fin; 303: a first bent portion; 304: a heat conducting surface.

Detailed Description

So that the manner in which the features and advantages of the embodiments of the present disclosure can be understood in detail, a more particular description of the embodiments of the disclosure, briefly summarized above, may be had by reference to the appended drawings, which are included to illustrate, but are not intended to limit the embodiments of the disclosure. In the following description of the technology, for purposes of explanation, numerous details are set forth in order to provide a thorough understanding of the disclosed embodiments. However, one or more embodiments may be practiced without these details. In other instances, well-known structures and devices may be shown in simplified form in order to simplify the drawing.

The terms "first," "second," and the like in the description and in the claims, and the above-described drawings of embodiments of the present disclosure, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It should be understood that the data so used may be interchanged as appropriate for the embodiments of the disclosure described herein. Furthermore, the terms "include" and "have," as well as any variations thereof, are intended to cover a non-exclusive inclusion.

In the embodiments of the present disclosure, the terms "upper", "lower", "inner", "middle", "outer", "front", "rear", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings. These terms are used primarily to better describe the disclosed embodiments and their examples and are not intended to limit the indicated devices, elements or components to a particular orientation or to be constructed and operated in a particular orientation. Moreover, some of the above terms may be used in other meanings besides orientation or positional relationship, for example, the term "upper" may also be used in some cases to indicate a certain attaching or connecting relationship. The specific meanings of these terms in the embodiments of the present disclosure can be understood by those of ordinary skill in the art as appropriate.

In addition, the terms "disposed," "connected," and "secured" are to be construed broadly. For example, "connected" may be a fixed connection, a detachable connection, or a unitary construction; can be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intervening media, or may be in internal communication between two devices, elements or components. Specific meanings of the above terms in the embodiments of the present disclosure can be understood by those of ordinary skill in the art according to specific situations.

The term "plurality" means two or more unless otherwise specified.

In the embodiment of the present disclosure, the character "/" indicates that the preceding and following objects are in an or relationship. For example, A/B represents: a or B.

The term "and/or" is an associative relationship that describes objects, meaning that three relationships may exist. For example, a and/or B, represents: a or B, or A and B.

It should be noted that, in the case of no conflict, the embodiments and features in the embodiments of the present disclosure may be combined with each other.

With reference to fig. 1 to 4, the present disclosure provides a heat sink, which includes a temperature equalizing element 10, a liquid cooling plate 20, and a fin set 30, where the temperature equalizing element 10 is used for being connected to a radio frequency module in a heat conducting manner to receive heat generated by the radio frequency module; the liquid cooling plate 20 is configured with a liquid inlet 201 and a liquid outlet 202, and a flow passage 203 communicating the liquid inlet 201 and the liquid outlet 202; the fin group 30 and the temperature equalizing element 10 are respectively arranged on two sides of the liquid cooling plate 20; wherein, the liquid cooling plate 20 is filled with cooling liquid, the temperature equalizing element 10 exchanges heat with the cooling liquid in the liquid cooling plate 20, the cooling liquid after heat exchange exchanges heat with the fin group 30 again, and the heat is transferred to the fin group 30 for heat dissipation.

By adopting the radiator provided by the embodiment of the disclosure, heat generated by the radio frequency module is transferred to the liquid cooling plate 20 through the temperature equalizing element 10, so that not only can the heat transfer area be enlarged, but also the uniformity of heat transfer can be realized; the heat and the cooling liquid heat exchange transmitted to the liquid cooling plate 20 are conducted, the heat is diffused and transmitted to the fin group 30 through the cooling liquid, on one hand, the local temperature is prevented from being too high, on the other hand, air cooling heat dissipation is conducted through the fin group 30, and therefore the heat dissipation effect of the radiator on the radio frequency module is effectively improved through the combination of liquid heat dissipation and air cooling heat dissipation.

In addition, in the area of the liquid cooling plate where the radio frequency module is not installed, the cooling liquid completes heat exchange with the surrounding air, then flows to the area where the radio frequency module is installed for heat exchange, and circulates in a reciprocating mode, so that heat transferred by the temperature equalizing element is dissipated, and the purpose of heat dissipation and temperature reduction of the radio frequency module is achieved.

Optionally, the temperature equalization element 10 is a plate like structure. Therefore, the radio frequency module can be tightly attached to the plate surface of the temperature equalizing element 10, and the temperature equalizing element 10 and the liquid cooling plate 20 can also be tightly attached to each other, so that the heat transfer efficiency is improved.

Alternatively, the temperature equalization element 10 may employ a temperature equalization plate. The number of the radio frequency modules is multiple, and the heating values of different radio frequency modules are different. In this way, the area of the temperature equalizing element 10 corresponding to the rf module with a higher heating value receives more heat than other areas. Through adopting the temperature-uniforming plate, the heat that will transmit to temperature-uniforming element 10 is evenly distributed through the heat transfer medium flow that fills in the temperature-uniforming plate, has improved temperature-uniforming element 10's temperature uniformity, not only avoids local overheat phenomenon, but also can avoid giving out heat the higher radio frequency module high temperature and burn out.

Alternatively, the temperature equalization element 10 may also be a metal plate. Such as a copper plate. Thus, the heat transferred by the rf module is quickly transferred to the liquid cooling plate 20 for heat dissipation.

The temperature equalizing element 10 is connected with the radio frequency module in a heat conduction mode. For example, the temperature equalization element 10 is connected with the radio frequency module through a fastener, namely a bolt or a screw, and the thermal grease is coated on the interface to reduce the air thermal resistance. Or, the temperature equalizing element 10 and the radio frequency module are directly bonded through the heat-conducting silica gel, so that not only is the connection realized, but also the heat-conducting efficiency can be improved. Or the temperature equalizing element 10 is welded with the radio frequency module. Such as brazing, soldering, etc. In addition, a heat conducting fin with high heat conductivity coefficient can be arranged between the temperature equalizing element 10 and the radio frequency module to further reduce the contact thermal resistance and improve the heat conducting efficiency between the temperature equalizing element and the radio frequency module, thereby improving the heat radiating effect of the radio frequency module.

The cooling liquid enters the liquid-cooling plate 20 from the liquid inlet 201, flows along the flow passage 203, and is discharged from the liquid outlet 202. Wherein, the heat transferred to the liquid cooling plate 20 exchanges heat with the flowing cooling liquid, and the temperature of the temperature equalizing element 10 is reduced. In addition, the region with higher local temperature is flushed by the ceaseless flow of the cooling liquid, so that heat can be quickly carried away from the region, and the temperature of the region can be effectively reduced. The cooling liquid after heat exchange exchanges heat with the fin group 30, the heat is transferred to the fin group 30, the heat is dissipated to the surrounding environment through the fin group 30, and the temperature of the whole radiator and the radio frequency module is reduced.

Alternatively, the cooling liquid may be water.

This embodiment combines together through water-cooling and forced air cooling, can avoid the too high problem of local heat flow, has improved the radiating effect of radiator to radio frequency module effectively.

Alternatively, the temperature equalization element 10, the liquid cooling plate 20 and the fin group 30 may be designed integrally. Thus, the heat transfer efficiency can be improved. In addition, the integrated heat dissipation device is formed, so that the weight is small, the space is saved, and the layout of application products such as an oven is more favorable.

In addition, when the radiator is in use, the cooling liquid in the liquid cooling plate 20 can effectively protect against fire, and the radio frequency module is prevented from being damaged.

Optionally, the heat sink further comprises: a connecting pipeline, which is connected in series with the liquid inlet 201 and the liquid outlet 202, so that the cooling liquid circularly flows in a closed loop manner in the liquid cooling plate 20 and the connecting pipeline; wherein, a circulating pump is arranged in the connecting pipeline to drive the cooling liquid to flow.

The liquid inlet 201 and the liquid outlet 202 are connected in series through the connecting pipeline, the cooling liquid circularly flows in a closed loop manner in the liquid cooling plate 20 and the connecting pipeline, and the cooling liquid is driven to flow by the circulating pump. Thus, the radiator can be suitable for the inclined and overturning installation. In addition, the radiator is an independent structure, so that the influence of other parts of an applied product is avoided, and the disassembly and the assembly are facilitated.

In practical applications, the cooling liquid entering the liquid cooling plate 20 from the liquid inlet 201 flows while exchanging heat; after the cooling liquid completes the heat exchange with the fin group 30, the temperature is reduced, and when the cooling liquid flows out from the liquid outlet 202, the temperature difference with the cooling liquid at the liquid inlet 201 is not large, so that the cooling liquid flowing into the connecting pipeline performs the next circulation.

The circulating pump can ensure that the cooling liquid has enough power to circularly flow in the liquid cooling plate 20 and the connecting pipeline, and overcome the possible temperature difference, pressure difference and gravity action.

Optionally, the flow channel 203 comprises a plurality of internal circulation units 204, and adjacent internal circulation units 204 are communicated through a single flow channel 205; the internal circulation unit 204 includes a plurality of micro channels connected to each other, and the cooling liquid can flow in the micro channels of the internal circulation unit 204 in a circulating manner, so as to prolong the retention time of the cooling liquid in the internal circulation unit 204.

Based on the plurality of micro channels communicated with each other in the internal circulation unit 204, when the cooling liquid flows in the internal circulation unit 204, the cooling liquid is continuously divided and converged by the micro channels, so that the flow path of the cooling liquid is prolonged, the flow time, i.e. the residence time, of the cooling liquid in the internal circulation unit 204 is prolonged, the heat exchange time of the cooling liquid in the internal circulation unit 204 is prolonged, and the heat exchange efficiency of the cooling liquid and the temperature-equalizing plate is improved.

The adjacent internal circulation units 204 are connected by a single flow path 205, so that the cooling liquid can only flow to the liquid outlet 202, but can not flow back to the liquid inlet 201, and the circulation fluidity of the cooling liquid in the liquid cooling plate 20 and the connecting pipeline is ensured.

The flow channel 203 of the liquid cooling plate 20 can be manufactured by various methods such as blowing, pressing, etching, and the like.

Referring to fig. 3, in the present embodiment, the liquid inlet 201 and the liquid outlet 202 are respectively located at two opposite sides of the liquid cooling plate 20 and include two main flow paths. The two main flow paths are respectively branched from the liquid inlet 201 to both sides and then converged to the liquid outlet 202. Each main flow path is provided with a plurality of internal circulation units 204. The liquid inlet 201 is connected to an internal circulation unit 204, and the liquid outlet 202 is connected to the main flow path. The temperature of the cooling liquid entering the liquid cooling plate 20 from the liquid inlet 201 is relatively low, and the cooling liquid with a lower temperature circularly flows in the internal circulation unit 204 communicated with the liquid inlet 201, so that the heat exchange efficiency of the cooling liquid and the temperature-equalizing plate can be effectively improved, and the heat dissipation of the temperature-equalizing plate and the radio frequency module is accelerated.

Optionally, the internal circulation unit 204 is configured with a plurality of nips 206, with a microchannel defined between adjacent nips 206.

The internal circulation unit 204 blocks the cooling liquid through the rolling point 206, and the cooling liquid is divided when flowing through the rolling point 206, so that the time of the cooling liquid flowing through the internal circulation unit 204 is prolonged, and the cooling liquid can be continuously divided and converged, thereby being beneficial to uniform heat distribution.

In addition, by providing the nip 206, especially in the case where the liquid-cooled plates 20 are of the blown-up structure, it is helpful to ensure the structural strength of the region where the internal circulation unit 204 is located.

In practical applications, the micro flow paths in the liquid cooling plate 20 can also be implemented by multiple sections of grooves that are connected to each other, and are not limited to the solution provided in this embodiment that the micro flow paths are defined by the nip points 206.

In this embodiment, the number of the rolling points 206 and the number of rows of the rolling point groups are not particularly limited, and may be determined according to actual conditions.

Optionally, the internal circulation unit 204 includes at least a first row of rolling point groups and a second row of rolling point groups; and the rolling points of the first row of rolling point groups and the rolling points of the second row of rolling point groups are arranged in a staggered manner.

By arranging the first row of rolling point groups and the second row of rolling point groups in a staggered manner, the micro flow channels in the internal circulation unit 204 are regularly arranged, and the flow areas of the micro flow channels are equal as much as possible. When the cooling liquid flows through the internal circulation unit 204, it is ensured that the pressure conditions at all positions of the internal circulation unit 204 are not greatly different, that is, the flow impact force of the cooling liquid received by the internal circulation unit 204 is uniformly distributed.

The first row of rolling points and the second row of rolling points each include at least a plurality of rolling points 206, but the number of rolling points in the first row of rolling points may be the same as or different from the number of rolling points in the second row of rolling points.

In the case that the internal circulation unit 204 includes multiple rows of rolling point groups, the rolling point groups of adjacent rows are staggered, that is, the rolling points in the rolling point groups of adjacent rows are staggered.

Optionally, the heat conducting side of the fin group 30 is in heat conducting connection with the liquid cooling plate 20; the fin set 30 has a receiving groove 301 for receiving the liquid inlet 201 and the liquid outlet 202 on the heat conducting side, so that the fin set 30 is tightly attached to the liquid cooling plate 20.

The liquid inlet 201 and the liquid outlet 202 of the liquid cooling plate 20 are provided with a connecting joint 40 for connecting with a connecting pipeline, and the liquid inlet 201 and the liquid outlet 202 are both provided with a connecting joint 40. In order to improve the heat dissipation efficiency of the heat sink, the heat conduction side of the fin group 30 is equal to the area of the plate surface of the liquid cooling plate 20, or slightly smaller than the area of the plate surface of the liquid cooling plate 20. Under the condition that the fin group 30 is connected with the liquid cooling plate 20 in a heat conducting manner, the accommodating groove 301 is formed in the heat conducting side, so that the liquid inlet 201 and the liquid outlet 202 of the liquid cooling plate 20 and the connecting joint 40 can be prevented from interfering with the fin group 30, and the joint heat conduction between the fin group 30 and the liquid cooling plate 20 is influenced.

Wherein, under the condition of fin group 30 and the integrated design of liquid cooling plate 20, the size of storage tank 301 slightly is greater than the size of inlet 201, liquid outlet 202 and attach fitting 40, like this, can be convenient for connecting line and the dismouting of inlet 201 and liquid outlet 202 of liquid cooling plate 20.

In addition, the heat conduction connection between the fin group 30 and the liquid cooling plate 20 can refer to the heat conduction connection between the temperature equalizing element 10 and the radio frequency module, and an appropriate connection mode is selected. And will not be described in detail herein.

Optionally, the fin set 30 includes a plurality of fins 302, the fins 302 including: a first bent portion 303 formed by bending and extending a first edge of the fin 302; the first bending portions 303 of the adjacent fins 302 are sequentially connected to form a heat conducting surface 304, and the heat conducting surface 304 is attached to the surface of the liquid cooling plate 20, so as to enlarge the heat transfer area between the fin group 30 and the liquid cooling plate 20.

The fins 302 in the fin group 30 exchange heat with the cooling liquid in the liquid cooling plate 20, the cooling liquid transfers heat to the fins 302 of the fin group 30, and the heat dissipation area of the heat sink is enlarged through the fins 302, which is beneficial to improving the heat dissipation efficiency of the heat sink.

The first bent portions 303 of the plurality of fins 302 in the fin group 30 are sequentially connected to form a heat conduction surface 304, i.e., a surface of the fin group 30 where the heat conduction side is attached to the liquid cooling plate 20. The fin assembly 30 can be closely attached to the surface of the liquid cooling plate 20 through the heat conducting surface 304, so as to improve the heat transfer area, i.e. the heat transfer efficiency of the two. In addition, the fin group 30 is attached to the plate surface of the liquid cooling plate 20 via the heat conduction surface 304, and the connection stability between the fin group 30 and the liquid cooling plate 20 can be improved.

The fin group 30 is formed by sequentially connecting the first bent portions 303 of the plurality of fins 302, so that the distance between the adjacent fins 302 is adjustable, that is, the distance between the adjacent fins 302 is adjusted by adjusting the width of the first bent portions 303. Therefore, in an effective installation space, the distance between the fins 302 is reduced, the number of the fins 302 is increased, and the heat dissipation area of the radiator is enlarged.

It should be noted that the first direction may be a direction perpendicular to the fins 302, but is not limited to the direction perpendicular to the fins 302.

Alternatively, the fin group 30 may be an integrally formed structure to improve the structural strength of the fin group 30 and prevent deformation during welding and transportation. Alternatively, the fins 302 of the fin group 30 may be curved.

When the airflow passes through the gap between adjacent fins 302 of the fin group 30, the heat on the fins 302 is blown away from the fins 302, and the air-cooled enhanced heat dissipation is performed, so that the heat dissipation effect of the heat sink on the radio frequency module is improved.

Optionally, the fin surface of the fin 302 is configured with a raised structure to enlarge the contact area of the fin 302 with the airflow, and increase the disturbance to the boundary layer of the airflow to enhance heat exchange.

Through the fin face structure protruding structure at fin 302 for, like this, make the fin face area increase of fin 302, under the circumstances of the fin face is flowed through to the air current, can enlarge the area of contact with fin 302, thereby enlarged the heat transfer area and the heat exchange efficiency of air current with fin 302, improved the radiating efficiency of fin 302.

Alternatively, the raised structure may be corrugated or dot-shaped.

Optionally, some or all of the area of the fins 302 is configured with a raised structure. Some or all of the fins 302 of the fin set 30 are configured with a raised structure. Therefore, the fin surface area of the fins 302 is increased, the contact area between the fins 302 and the heat exchange area between the fin group and the air flow can be enlarged under the condition that the air flow flows through the fin surface, and the heat dissipation efficiency of the fin group is improved.

With reference to fig. 1 to 4, an embodiment of the present disclosure provides an oven including the heat sink provided in the above embodiments. The radiator comprises a temperature equalizing element 10, a liquid cooling plate 20 and a fin group 30, wherein the temperature equalizing element 10 is used for being in heat conduction connection with the radio frequency module so as to receive heat generated by the radio frequency module; the liquid cooling plate 20 is configured with a liquid inlet 201 and a liquid outlet 202, and a flow passage 203 communicating the liquid inlet 201 and the liquid outlet 202; the fin group 30 and the temperature equalizing element 10 are respectively arranged on two sides of the liquid cooling plate 20; wherein, the liquid cooling plate 20 is filled with cooling liquid, the temperature equalizing element 10 exchanges heat with the cooling liquid in the liquid cooling plate 20, the cooling liquid after heat exchange exchanges heat with the fin group 30 again, and the heat is transferred to the fin group 30 for heat dissipation.

By adopting the oven provided by the embodiment of the disclosure, heat generated by the radio frequency module is transferred to the liquid cooling plate 20 through the temperature equalizing element 10, so that not only the heat transfer area can be enlarged, but also the uniformity of heat transfer can be realized; the heat and the cooling liquid heat transfer of transmission to liquid cooling plate 20, through cooling liquid with heat diffusion and transmission to fin group 30, avoid local high temperature on the one hand, on the other hand carries out the forced air cooling heat dissipation through fin group 30, like this, through the radiating combination of liquid heat dissipation and forced air cooling, improved the radiating effect of radiator to radio frequency module effectively to guarantee the result of use of oven, promote user experience.

The above description and drawings sufficiently illustrate embodiments of the disclosure to enable those skilled in the art to practice them. Other embodiments may include structural and other changes. The examples merely typify possible variations. Individual components and functions are optional unless explicitly required, and the sequence of operations may vary. Portions and features of some embodiments may be included in or substituted for those of others. The embodiments of the present disclosure are not limited to the structures that have been described above and illustrated in the drawings, and various modifications and changes can be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims

1. A heat sink, comprising:

the liquid cooling plate is provided with a liquid inlet, a liquid outlet and a flow channel communicated with the liquid inlet and the liquid outlet; and the combination of (a) and (b),

2. The heat sink of claim 1, further comprising:

the connecting pipeline is connected in series with the liquid inlet and the liquid outlet so that the cooling liquid circularly flows in a closed loop manner in the liquid cooling plate and the connecting pipeline;

wherein, be equipped with the circulating pump in the connecting line to drive the cooling liquid flows.

3. The heat sink of claim 1,

the flow channel comprises a plurality of internal circulation units, and adjacent internal circulation units are communicated through a single flow path;

the internal circulation unit comprises a plurality of communicated micro flow channels, and the cooling liquid can circularly flow in the micro flow channels of the internal circulation unit so as to prolong the retention time of the cooling liquid in the internal circulation unit.

4. The heat sink of claim 3,

the internal circulation unit is provided with a plurality of rolling points, and the micro flow path is defined between the adjacent rolling points.

5. The heat sink according to claim 4,

the internal circulation unit at least comprises a first row of rolling point groups and a second row of rolling point groups;

6. The heat sink of claim 1,

the heat conduction side of the fin group is in heat conduction connection with the liquid cooling plate;

7. The heat sink as recited in any one of claims 1 to 6, wherein the fin group comprises a plurality of fins, the fins comprising:

the first bending parts of the adjacent fins are sequentially connected to form a heat conduction surface, and the heat conduction surface is attached to the surface of the liquid cooling plate so as to enlarge the heat transfer area of the fin group and the liquid cooling plate.

8. The heat sink of claim 7,

the fin surface of the fin is provided with a convex structure so as to enlarge the contact area between the fin and the air flow, disturb the boundary layer of the air flow and enhance the heat exchange.

9. The heat sink of claim 8,

some or all of the regions of the fins are configured with the raised structures, and/or some or all of the fins of the fin group are configured with the raised structures.

10. An oven, characterized in that it comprises a radiator according to any one of claims 1 to 9.