CN218473688U

CN218473688U - Electronic device with temperature sensing and heating functions

Info

Publication number: CN218473688U
Application number: CN202222300255.2U
Authority: CN
Inventors: 覃志平; 方传彪; 张波; 郭颂
Original assignee: Shenzhen Urovo Technology Corp ltd
Current assignee: Shenzhen Urovo Technology Corp ltd
Priority date: 2022-08-30
Filing date: 2022-08-30
Publication date: 2023-02-10
Anticipated expiration: 2032-08-30

Abstract

The utility model discloses an electron device with temperature sensing heating function, it includes the shell, and the surface of shell is equipped with the temperature sensing piece that is used for sensing ambient temperature, and the one end of shell is equipped with heating module, and this shell is equipped with mainboard and temperature sensing subassembly, and temperature sensing subassembly includes the FPC board, is equipped with on the FPC board to be used for with the thermistor of temperature sensing piece contact, the first end and the mainboard connection of FPC board, second end and heating module are connected. This electronic device with temperature sensing heating function is for can being used to work under extremely abominable low temperature environment, through thermistor response low temperature environment and by parts such as heating module to electronic device's screen subassembly heat, can avoid electronic device because of the temperature crosses the condition that causes relevant components and parts unable work excessively to guarantee electronic device's normal operating.

Description

Electronic device with temperature sensing and heating functions

Technical Field

The utility model relates to a terminal equipment field especially relates to an electron device with temperature sensing heating function.

Background

With the development of electronic information technology, more and more functions are integrated in the intelligent terminal device, and the device becomes more and more intelligent. For example, some temperature sensors are added in some devices, if the temperature of the devices is too high, the devices can be automatically powered off or shut down, and unnecessary loss caused by burning out of a mainboard and ignition of a battery is avoided. The related equipment is provided with a temperature sensing device for sensing the external environment temperature, and the equipment can be automatically heated or cooled according to the change of the environment temperature. However, related devices cannot be made into three-proofing products, or the three-proofing products are not directly contacted with the outside environment through sensors, so that the difference between the detected temperature and the actual temperature is large, and the detection is inaccurate.

SUMMERY OF THE UTILITY MODEL

The to-be-solved technical problem of the present invention is to provide an electronic device with temperature sensing and heating functions.

The utility model provides a technical scheme that its technical problem adopted is: an electronic device with a temperature sensing and heating function is constructed, and comprises a shell, wherein a temperature sensing element for sensing the ambient temperature is arranged on the surface of the shell, and a heating module is arranged at one end of the shell;

the shell is provided with a mainboard and a temperature sensing assembly, the temperature sensing assembly comprises an FPC board, a thermistor which is used for contacting with the temperature sensing element is arranged on the FPC board, the first end of the FPC board is connected with the mainboard, and the second end of the FPC board is connected with the heating module.

In some embodiments, a waterproof test hole is formed in the housing, and the temperature sensing element is fixed to the waterproof test hole through waterproof glue.

In some embodiments, a support is arranged on the main board, and the FPC board is arranged on the support;

the FPC board is characterized in that a buffer piece is arranged on the support, and the buffer piece is located below the FPC board and arranged opposite to the thermistor.

In some embodiments, a motherboard connector is disposed on the motherboard, and an FPC connector connected to the motherboard connector is disposed at a first end of the FPC board.

In some embodiments, the second end of the FPC board is provided with a spring piece, the heating module includes a heating main body and a heating module FPC connected to the heating main body, and one end of the heating module FPC away from the heating main body is connected to the spring piece.

In some embodiments, the heating body includes a heating coil connected to one end of the heating module FPC.

In some embodiments, a heat-conducting silicone member is disposed between the temperature sensing member and the thermistor.

In some embodiments, the temperature sensing element is a metallic element.

In some embodiments, the temperature sensing element is aluminum or copper.

In some embodiments, the housing includes a face assembly and a bottom assembly that mate with each other.

Implement the utility model discloses following beneficial effect has: this electronic device with temperature sensing heating function, it includes the shell, and the surface of shell is equipped with the temperature sensing piece that is used for sensing ambient temperature, and the one end of shell is equipped with heating module, and this shell is equipped with mainboard and temperature sensing subassembly, and the temperature sensing subassembly includes the FPC board, is equipped with on the FPC board to be used for with the thermistor of temperature sensing piece contact, the first end and the mainboard connection of FPC board, second end and heating module connection. This electron device with temperature sensing heating function mainly for can be used to on the equipment of work under extremely abominable low temperature environment, come automatic for equipment and screen heating and by parts such as heating module to electron device's screen subassembly heating through thermistor response low temperature environment, can avoid appearing electron device because of the temperature crosses the condition that causes the unable work of a lot of relevant components and parts excessively to guarantee equipment electron device's normal operating.

Drawings

In order to explain the technical solution of the present invention more clearly, the present invention will be further described with reference to the accompanying drawings and examples, it should be understood that the following drawings only show some examples of the present invention, and therefore should not be considered as limiting the scope, for those skilled in the art, other related drawings can be obtained from these drawings without inventive effort. In the drawings:

fig. 1 is a schematic perspective view of an electronic device with a temperature sensing and heating function according to some embodiments of the present invention;

fig. 2 is a front view of an electronic device with temperature sensing and heating functions according to some embodiments of the present invention;

fig. 3 is an exploded view of an electronic device with a temperature sensing and heating function according to some embodiments of the present invention;

fig. 4 is a schematic view of a heating module in accordance with some embodiments of the present invention;

fig. 5 is a schematic structural view of a stent in some embodiments of the present invention;

fig. 6 is a schematic structural diagram of a temperature sensing assembly according to some embodiments of the present invention.

Detailed Description

In order to clearly understand the technical features, objects, and effects of the present invention, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the following description, it should be understood that the directions or positional relationships indicated by "front", "back", "upper", "lower", "left", "right", "longitudinal", "horizontal", "vertical", "horizontal", "top", "bottom", "inner", "outer", "head", "tail", etc. are configured and operated in specific directions based on the directions or positional relationships shown in the drawings, and are only for convenience of describing the present invention, but do not indicate that the device or element referred to must have a specific direction, and thus, should not be construed as limiting the present invention.

It is also noted that, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," "disposed," and the like are intended to be inclusive and mean, for example, that they may be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. When an element is referred to as being "on" or "under" another element, it can be "directly" or "indirectly" on the other element or intervening elements may also be present. The terms "first", "second", "third", etc. are only for convenience in describing the present technical solution, and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated, whereby the features defined as "first", "second", "third", etc. may explicitly or implicitly include one or more of such features. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

Referring to fig. 1 to 6, an electronic device with temperature sensing and heating functions in some embodiments of the present invention includes a housing 1, a temperature sensing element 2 for sensing an ambient temperature is disposed on a surface of the housing 1, a heating module 3 is disposed at one end of the housing 1, the housing 1 is provided with a main board 4 and a temperature sensing assembly 5, the temperature sensing assembly 5 includes an FPC board 51, a thermistor 513 for contacting the temperature sensing element 2 is disposed on the FPC board 51, a first end of the FPC board 51 is connected to the main board 4, and a second end of the FPC board 51 is connected to the heating module 3.

It can be understood that the electronic device with temperature sensing and heating functions is mainly used in devices operating in extremely harsh low temperature environment, and the devices may be devices including but not limited to POS machines, interphones, tablets, electronic readers, computers, electronic display screens, and the like. This electronic device with temperature sensing heating function passes through thermistor 513 and the cooperation of temperature-sensing piece 2, the especially low temperature ambient temperature of response ambient temperature, and then sends relevant signal and gives mainboard 4, send relevant control signal and transmission electric energy etc. by mainboard 4 and give heating module 3, give electronic device relevant part by heating module 3 and heat like screen assembly etc. can avoid appearing electronic device because of the temperature crosses the condition that leads to the fact the unable work of relevant many components and parts too low, with guarantee equipment electronic device's normal operating. In other embodiments, the electronic device with temperature-sensing heating function can also sense a high-temperature environment through the thermistor 513 to automatically cool the device and the screen, for example, a cooling module such as a micro fan may be provided.

Preferably, the housing 1 may be made of PVC, which has good hardness and rigidity, corrosion resistance, easy processing, and long service life. In other embodiments, the housing 1 may also be made of PP, ABS or other materials, which is not limited herein.

In some embodiments, the housing 1 includes a face assembly 12 and a bottom assembly 13 that mate with each other. It will be appreciated that the front shell assembly 12 and the bottom shell assembly 13 may be connected together by fasteners, and together they are used to house the main board 4, the temperature sensing assembly 5 and the power supply module, and that the front shell assembly 12 may include a screen assembly and related buttons, etc., which are connected to the main board 4.

In some embodiments, the casing 1 is provided with a waterproof test hole 11, and the temperature sensing element 2 is fixed on the waterproof test hole 11 by waterproof glue. It can be understood that the waterproof test hole 11 is a circular through hole, and the diameter of the waterproof test hole 11 can be the same as the diameter of the temperature sensing element 2, so as to ensure the sealing performance of the electronic device with temperature sensing and heating functions. The surface of the waterproof test hole 11 can be pasted with a waterproof double-sided adhesive tape to be connected with the temperature sensing element 2, and the waterproof test hole can be sealed and waterproof. In other embodiments, the temperature sensing element 2 and the housing 1 can be integrally formed by injection molding, so that the cost can be effectively reduced, the requirement of simplifying assembly can be met, and the overall structure is firmer and more reliable.

Preferably, the temperature sensing element 2 is a metal element, which may be aluminum or copper. It will be appreciated that aluminum or copper are both high thermal conductivity metals that can quickly conduct temperature information to the thermistor 513. In other embodiments, the temperature sensing element 2 may also be a non-metal element, and the non-metal element may be diamond, graphite, silicon carbide, or other carbon rod materials with high thermal conductivity, as long as the requirement of good thermal conductivity is met, which is not limited herein.

In some embodiments, the temperature sensing element 2 may be provided with a boss 21, the boss 21 is disposed in the waterproof test hole 11, the upper surface of the boss 21 may be exposed outside the casing 1, the temperature of the temperature sensing element 2 is consistent with the ambient temperature due to the heat transfer principle, and the thermistor 513 is in contact with the temperature sensing element 2 in the casing 1, so that the temperature of the temperature sensing element 2 can be sensed.

Further, a heat conductive silicone grease is disposed between the temperature sensing element 2 and the thermistor 513. It can be understood that, can paste heat conduction silicone grease spare between this temperature sensing piece 2 and thermistor 513, this heat conduction silicone grease spare can play and make thermistor 513 radiating effect, prevents that local temperature is too high and make thermistor 513 damage, and thermistor 513 even the temperature of heat-generating body all can be in the constant temperature state after long-time work like this, makes unnecessary heat can distribute away. The heat-conducting silicone grease piece also has dustproof and anticorrosion properties, and further protects the thermistor 513.

Preferably, the thermistor 513 may be a chip resistor, which may be connected to the FPC board 51 by a screen printing method, and the thermistor 513 is moisture and high temperature resistant, has a small temperature coefficient, and can greatly save the circuit space cost, making the design more fine.

In some embodiments, the support 41 is disposed on the motherboard 4, the FPC board 51 is disposed on the support 41, the support 41 is disposed with the buffer 411, and the buffer 411 is disposed under the FPC board 51 and opposite to the thermistor 513. It is understood that the supporting frame 41 is a substantially platform structure, the supporting frame 41 can be connected to the main board 4 by a fastening member such as a bolt or a screw, or can be connected by an adhesive member such as glue, and the upper end surface of the supporting frame can be provided with a locking groove 412 matching with the shape of the FPC board 51, and the FPC board 51 can be fixed on the supporting frame 41 by a double-sided adhesive tape in the locking groove 412. Wherein, this bolster 411 accessible glue pastes in this thermistor 513 downside, and it is used for buffering because of the elastic deformation that thermistor 513 and temperature sensing element 2 contact produced, avoids leading to thermistor 513 to damage because of the contact of temperature sensing element 2, has guaranteed this electronic device with temperature sensing heating function's life and the stability of during operation. Preferably, the buffer 411 may be a buffer foam, which has good flexibility and chemical stability, and is shockproof and has good sealing performance.

In some embodiments, the temperature sensing element 2 and the thermistor 513 can transmit temperature through an elastic structure, which can be a spring element, a spring plate structure, or a buffer 411 with a buffering function in other forms of structures, such as a spiral spring structure, where one end of the spiral spring structure is connected to the temperature sensing element 2, and the other end of the spiral spring structure is in contact with the thermistor 513. If the elastic sheet structure is adopted, the elastic sheet structure can be a U-shaped structure, a C-shaped structure, etc., one end of the elastic sheet structure is connected with the temperature sensing element 2, and the other end of the elastic sheet structure is contacted with the thermistor 513.

Further, a motherboard connector 42 is provided on the motherboard 4, and an FPC connector 511 connected to the motherboard connector 42 is provided at a first end of the FPC 51. It is understood that the first end of the FPC board 51 is detachably connected to the FPC connector 511.

The second end of the FPC board 51 is provided with a spring piece 512, the heating module 3 includes a heating main body 31 and a heating module FPC32 connected to the heating main body 31, and one end of the heating module FPC32 away from the heating main body 31 is connected to the spring piece 512.

It is understood that the elastic sheet 512 is disposed on the second end of the FPC board 51, the heating module FPC32 is further provided with a copper sheet, and the elastic sheet 512 is used for connecting with the copper sheet on the heating module FPC32 to fix one end of the heating module FPC32 at the second end of the FPC board 51, thereby achieving mutual signal and current transmission. Further, the spring plate 512 can be made of beryllium copper alloy. The beryllium copper alloy has strong fatigue resistance and higher elasticity. In other embodiments, an end of the heating module FPC32 remote from the heating main body 31 may be connected by a connector provided on a second end of the FPC board 51, i.e., the heating module FPC32 and the FPC board 51 may be detachably connected by a connector.

In some embodiments, a window groove 14 is formed on a side wall of the outer shell 1 close to the side wall provided with the waterproof test hole 11, the heating body 31 is disposed in the window groove 14 and can be connected with the outer shell 1 through a fastener, the outer shell 1 and the heating body 31 can be connected through a buckle or can be fixedly connected through glue, further, the heating module FPC32 can be disposed in the outer shell 1, and a portion of the heating module FPC32 can be fixedly connected with an internal structure of the outer shell 1 through a bonding member such as glue.

Further, the heating main body 31 includes a positioning plate and a heating coil disposed in the positioning plate or on the side surface of the positioning plate, the positioning plate can be fixed on the window, and the heating coil is connected to one end of the heating module FPC32 away from the elastic piece 512. It will be appreciated that the heating body 31 incorporates a heating coil for converting electrical energy into heat energy for heating components such as a screen assembly.

It can be understood that the working principle of the electronic device with temperature sensing and heating functions is as follows: the temperature sensing element 2 is exposed outside the housing 1, the temperature of the temperature sensing element 2 is consistent with the ambient temperature due to the heat transfer principle, and the thermistor 513 can contact with the temperature sensing element 2 in the housing 1, so that the temperature of the temperature sensing element 2 can be sensed. The thermistor 513 represents the sensed temperature change as a resistance value change, and then transmits the parameter information to the motherboard 4 through the FPC board 51, the motherboard 4 can determine whether the ambient temperature is lower than the set temperature, if the ambient temperature is lower than the set temperature, the motherboard 4 can send a control instruction to distribute current to the FPC board 51, the current is transmitted to the heating main body 31 through the elastic piece 512, and the heating main body 31 converts the electric energy into heat energy through the heating coil to heat the screen assembly or other assemblies. After heating for a certain time, the temperature of the electronic device with the temperature sensing and heating function reaches the temperature capable of working normally.

Further, the electronic device with the temperature sensing and heating functions has the beneficial effects that:

1. the thermistor 513 is attached to the FPC board 51, the external environment temperature can be directly sensed by matching with the temperature sensing element 2, the detection is accurate, the performance-price ratio of the thermistor 513 is higher than that of a sensor, and the production cost is reduced;

2. the electronic device with the temperature-sensing heating function is mainly applied to three-proofing equipment, and solves the application problem of the thermistor 513 in waterproof products;

3. the waterproof test hole 11 of the electronic device with the temperature-sensing heating function is utilized, other holes are not added on the shell 1, and the appearance of the electronic device with the temperature-sensing heating function is not influenced;

4. the problem that the element device assembly in the electronic device with the temperature sensing and heating functions cannot work normally in an extremely low temperature environment is solved, and normal operation of equipment is guaranteed.

It is understood that the above examples only represent preferred embodiments of the present invention, which are described in more detail and detail, but are not to be construed as limiting the scope of the present invention; it should be noted that, for those skilled in the art, the above technical features can be freely combined, and several modifications and improvements can be made without departing from the concept of the present invention, which all belong to the protection scope of the present invention; therefore, all changes and modifications that come within the meaning and range of equivalency of the claims are to be embraced within their scope.

Claims

1. An electronic device with temperature sensing and heating functions is characterized by comprising a shell, wherein a temperature sensing element for sensing the ambient temperature is arranged on the surface of the shell, and a heating module is arranged at one end of the shell;

2. The electronic device with temperature sensing and heating functions of claim 1, wherein the housing is provided with a waterproof test hole, and the temperature sensing element is fixed on the waterproof test hole by waterproof glue.

3. The electronic device with temperature-sensing heating function according to claim 1, wherein a support is provided on the main board, and the FPC board is provided on the support;

the support is provided with a buffer piece, and the buffer piece is located below the FPC board and arranged opposite to the thermistor.

4. The electronic device with temperature-sensing heating function according to claim 1, wherein a motherboard connector is provided on the motherboard, and an FPC connector connected to the motherboard connector is provided at the first end of the FPC board.

5. The electronic device with the temperature-sensing heating function according to claim 1, wherein a spring piece is disposed at the second end of the FPC board, the heating module comprises a heating main body and a heating module FPC connected to the heating main body, and one end of the heating module FPC away from the heating main body is connected to the spring piece.

6. The electronic device with a temperature-sensitive heating function according to claim 5, wherein the heating main body includes a heating coil connected to one end of the heating module FPC.

7. The electronic device with temperature-sensing heating function according to any one of claims 1 to 6, wherein a heat-conductive silicone member is disposed between the temperature-sensing element and the thermistor.

8. The electronic device with temperature-sensing heating function according to any one of claims 1 to 6, wherein the temperature-sensing element is a metal element.

9. The electronic device with temperature-sensing heating function according to claim 8, wherein the temperature-sensing element is aluminum or copper.

10. The electronic device with temperature-sensing heating function according to any one of claims 1-6, wherein the housing comprises a front shell assembly and a bottom shell assembly that are engaged with each other.