CN218473508U - Electroplating clamp and vertical continuous electroplating line of flexible circuit board - Google Patents
Electroplating clamp and vertical continuous electroplating line of flexible circuit board Download PDFInfo
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- CN218473508U CN218473508U CN202222418003.XU CN202222418003U CN218473508U CN 218473508 U CN218473508 U CN 218473508U CN 202222418003 U CN202222418003 U CN 202222418003U CN 218473508 U CN218473508 U CN 218473508U
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- circuit board
- flexible circuit
- electroplating
- frames
- plating jig
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Abstract
The utility model discloses an electroplating jig and perpendicular continuous plating line of flexible circuit board relates to circuit board electroplate processing technology field. This flexible circuit board's electroplating jig includes: 2 or more than 2 annular frames which are matched in sequence; each annular frame is provided with a magnetic part for realizing mutual attraction of the adjacent annular frames; and each 2 adjacent annular frames realize the clamping of the flexible circuit board through the magnetic parts. The utility model discloses a fixed flexible circuit board of complete centre gripping flexible circuit board's cyclic annular frame can realize and keep the exhibition flat of flexible circuit board at the in-process that removes in the aqueduct, avoids warping and fold problem to ensure flexible circuit board's electroplating quality.
Description
Technical Field
The utility model belongs to the technical field of circuit board electroplating process, especially, relate to a flexible circuit board's electroplating jig and perpendicular continuous plating line.
Background
The flexible printed circuit board is a flexible printed circuit board which is made of polyimide or polyester film as a base material and has high reliability and excellent performance. The flexible printed circuit board or FPC for short has the characteristics of high wiring density, light weight and thin thickness. In the production process, in order to improve the conductivity, wear resistance, corrosion resistance and the like of the printed circuit, the flexible circuit board is generally required to be subjected to surface treatment, such as an electroplating process.
In the field of electroplating, a vertical continuous electroplating line is an industrial electroplating production line with mature technology at present, and products to be plated are sequentially and continuously immersed into a flume, moved and moved out to complete electroplating treatment; the traditional included angle only fixes the upper part of the flexible circuit board, and the whole flexible circuit board is easy to deform and wrinkle in the moving process of the flexible circuit board in the aqueduct, thereby seriously influencing the electroplating quality of the flexible circuit board.
SUMMERY OF THE UTILITY MODEL
In view of the above, an object of the present invention is to provide an electroplating jig for a flexible printed circuit board, so as to solve the problem of poor electroplating quality of the flexible printed circuit board in the prior art.
In some illustrative embodiments, the plating jig of the flexible circuit board includes: 2 or more than 2 annular frames which are matched in sequence; each annular frame is provided with a magnetic part for realizing mutual attraction of the adjacent annular frames; and each 2 adjacent annular frames realize the clamping of the flexible circuit board through the magnetic parts.
In some optional embodiments, the magnetic members are uniformly distributed on the annular frame.
In some optional embodiments, the magnetic member is a magnet.
In some optional embodiments, a rubber pad is arranged on the opposite surface between every 2 adjacent annular frames.
In some optional embodiments, 2 surfaces of each of the ring frames are respectively provided with the rubber pads.
In some optional embodiments, the ring frame is provided with a hanging hook.
In some optional embodiments, the plating jig is applied to a vertically continuous plating line.
Another object of the present invention is to provide a vertical continuous electroplating line, which employs any one of the above electroplating clamps for flexible printed circuit boards.
Compared with the prior art, the utility model has the advantages of as follows:
the utility model discloses a fixed flexible circuit board of complete centre gripping flexible circuit board's cyclic annular frame can realize and keep the exhibition flat of flexible circuit board at the in-process that removes in the aqueduct, avoids warping and fold problem to ensure flexible circuit board's electroplating quality.
Drawings
FIG. 1 is a first exemplary structure of a plating jig for a flexible circuit board according to an embodiment of the present invention;
FIG. 2 is a second exemplary structure of a plating jig for a flexible circuit board according to an embodiment of the present invention;
fig. 3 is a third structural example of the plating jig for the flexible circuit board according to the embodiment of the present invention.
Detailed Description
The following description and the drawings sufficiently illustrate specific embodiments of the invention to enable those skilled in the art to practice them. Other embodiments may incorporate structural, logical, electrical, process, and other changes. The examples merely typify possible variations. Individual components and functions are optional unless explicitly required, and the sequence of operations may vary. Portions and features of some embodiments may be included in or substituted for those of others. The scope of embodiments of the present invention encompasses the full ambit of the claims, as well as all available equivalents of the claims. In this context, these embodiments of the invention may be referred to, individually or collectively, by the term "utility model" merely for convenience and without automatically limiting the scope of this application to any single utility model or utility model concept if more than one is in fact disclosed.
It should be noted that, in the present invention, the technical features may be combined with each other without conflict.
The embodiment of the utility model discloses an electroplating clamp of a flexible circuit board, in particular to a flexible circuit board electroplating clamp, as shown in figures 1-3, figures 1-3 are respectively one to three structural examples of the flexible circuit board electroplating clamp in the embodiment of the utility model; this electroplating jig includes: 2 or more than 2 annular frames 10 matched in sequence; wherein, each annular frame 10 is provided with a magnetic part 20 for realizing mutual attraction of the adjacent annular frames; each 2 adjacent ring frames 10 realize the clamping of the flexible circuit board 40 through the magnetic members 20.
The mutually matched annular frames 10 indicate that the annular frames 10 are corresponding in shape, so that the flexible circuit board 40 can be clamped in all directions, and the requirement of flattening the flexible circuit board 40 is further met.
The utility model discloses a fixed flexible circuit board of complete centre gripping flexible circuit board's cyclic annular frame can realize and keep the exhibition flat of flexible circuit board at the in-process that removes in the aqueduct, avoids warping and fold problem to ensure flexible circuit board's electroplating quality.
The shape of the ring frame 10 in the embodiment of the present invention may be any shape including the size of the circuit to be plated on the flexible circuit board, and may be a closed structure or a non-closed structure; preferably, the annular frame is rectangular, square, or the like.
The embodiment of the present invention provides a magnet for the magnetic member 20, or an equivalent or a matched magnet, for example, a magnetic attraction relationship between a steel plate and a magnet.
In some embodiments, the magnetic member 20 may be in the shape of a strip, a button, or the like; preferably, the magnetic members 20 are uniformly arranged on the frame body of the ring frame 10, so as to improve the clamping strength of the flexible circuit board 40 in all directions.
Further, the magnetic member 20 is a magnet and is disposed on each of the ring frames 10 through a uniform magnetic pole direction, so that the versatility of the ring frames 10 is improved, and any 2 ring frames 10 can be matched with each other.
In some embodiments, a rubber pad 30 is disposed on the opposite surface between every 2 adjacent ring frames 10, and the rubber pad 30 has a strong friction force with the flexible circuit board 40, so as to avoid a loose deformation during the clamping process of the flexible circuit board 40. On the other hand, the rubber pad is also beneficial to avoid rigid contact between the ring frame 10 and the flexible circuit board 40, thereby reducing the deformation under force at the clamping position of the flexible circuit board 40.
Preferably, in the embodiment of the present invention, 2 surfaces of each of the ring frames 10 are respectively provided with the rubber pad 30, so as to improve the versatility of the ring frame 10, and any 2 ring frames 10 can be mutually matched.
In some embodiments, the ring frame 10 of the present invention is provided with a hook (not shown) for hanging, and the hook is used to be connected with a moving mechanism on an electroplating line in a matching manner, so as to realize the movement of the electroplating clamp.
The electroplating clamp in the embodiment of the utility model can be applied to a vertical continuous electroplating line and can also be applied to other electroplating environment systems.
Another object of the present invention is to provide a vertical continuous electroplating line, which employs any one of the above electroplating clamps for flexible printed circuit boards.
Those of skill would further appreciate that the various illustrative logical blocks, modules, circuits, and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware, computer software, or combinations of both. To clearly illustrate this interchangeability of hardware and software, various illustrative components, blocks, modules, circuits, and steps have been described above generally in terms of their functionality. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the overall system. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present disclosure.
Claims (8)
1. An electroplating jig for a flexible circuit board, comprising: 2 or more than 2 annular frames which are matched in sequence; each annular frame is provided with a magnetic part for realizing mutual attraction of the adjacent annular frames; and each 2 adjacent annular frames realize the clamping of the flexible circuit board through the magnetic parts.
2. The plating jig of claim 1, wherein the magnetic members are uniformly distributed on the ring frame.
3. The plating jig of claim 1, wherein the magnetic member is a magnet.
4. A plating jig according to claim 1, wherein a rubber pad is provided on the opposing face between every 2 adjacent ones of said ring frames.
5. A plating jig according to claim 4, wherein each of 2 surfaces of the ring-shaped frames is provided with the rubber pad, respectively.
6. A plating jig according to claim 1, wherein the ring frame is provided with a hook for hanging.
7. The plating jig of claim 1, wherein the plating jig is applied to a vertically continuous plating line.
8. A vertical continuous plating line characterized by comprising the plating jig for a flexible circuit board according to any one of claims 1 to 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222418003.XU CN218473508U (en) | 2022-09-13 | 2022-09-13 | Electroplating clamp and vertical continuous electroplating line of flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222418003.XU CN218473508U (en) | 2022-09-13 | 2022-09-13 | Electroplating clamp and vertical continuous electroplating line of flexible circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218473508U true CN218473508U (en) | 2023-02-10 |
Family
ID=85142806
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222418003.XU Active CN218473508U (en) | 2022-09-13 | 2022-09-13 | Electroplating clamp and vertical continuous electroplating line of flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218473508U (en) |
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2022
- 2022-09-13 CN CN202222418003.XU patent/CN218473508U/en active Active
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