1333811 九、發明說明： 【發明所屬之技術領域】 本發明涉及電路板製造技術領域，尤其涉及一固持裝 置及固持方法。 【先前技術】 隨著電子工業之迅速發展，人們對電子產品之功能要 求越來越多、對性能要求越來越強、對體積要求越來越小、 對重量要求越來越輕，這促使作為電子產品重要構件之電 路板亦越來越薄，且其製作越來越精細。 電路板製作工藝包括鍍金工序，鍍金係指於電路基板 之終接端點鍍一層高化學鈍性之金層來保護終接端點，並 提供良好導電性。為防止導電線路與金層之間之原子擴 散，常於鍍金前先於導電線路鍍一薄鎳層。參見文獻： Development of electroless Ni/Au plated build-up flip chip package with highly reliable solder joints ； Yokomine, K. etc; Electronic Components and Technology Conference, Volume 51， 2001 〇 習知電路板鍍金工藝通常先使用鉚釘、鏍栓或彈簧夾 等固持件將電路基板固定於固持裝置，然後將固持裝置連 同電路基板浸入鍍槽，藉由化學鍍或電鍍於電路基板之終 接端點鍍一定厚度之鍍層後，再將固持裝置連同電路基板 取出鍍槽，並除去固持件，獲得與固持裝置脫離之已鍍金 電路基板。 7 丄 意圖參^ I固1 if ::知固持裝置10固定電路基板2。之示 桿 & 二： 固持桿u相二Λ 行之第二固持桿12。二根第一 與第二固# ” m 12之間，從而 具有第—固合Γ成掛架框體。每根第二固持桿12 …固持件= 固持面13相對之第二固持面 u符件30為設於第二固持桿12 簧夾，用於夾持電路基板2G之邊 ，13之彈 固定於第二固持桿12之第__固持面^而將电路基板2〇 惟，當電路基板2〇係柔性電路 弟二固持桿12之第一固持面 由::較薄，且 广採用固持件30將其固定到習知:;=^^ 板20容易向第：= 電路基 造成人為損壞電路基板2G，影 ^相與折傷， 成本。 心a後續鍍金效果並增加生產 【發明内容】 有鑑於此，提供一種固持裝 加工工件之人為損耗、降低生產成^持方法，以降低待 必要。 -生產成本與提高製品良率實為 :::以實施例具體說明—種固持裝置及固持方法。 裝置用於固定板狀或片狀待加工工件，1包括 一根第一固持桿與固持件。該二 牛八0括 每根第-固持桿具有固持面。；=:固持桿相對設置， 該固持件用於將待加工工件 8 固持桿。該固持裝置還包括抵靠件，該抵 固持面配合支撐待加工工件。 ”这 持桿=持括r下步驟:將抵靠件置於二根第-固 一固持桿之固桿，使抵靠件之抵靠面與第 /、面，將電路基板貼合於抵靠件之抵靠 寺加工工件固定於二根第-固持桿 靠面之抿^/目比，本技術方案之固持^置^置具有抵 件時技術方案之固持裝置固定待加工工 抵靠面與掛架之固持面f:—根弟一固持桿之間，且使其 -固持桿固定待加L:二 裝置能提高待加工工件於：：本技術方案之固持 人為因素引起之待加工工一==整度’降低 產效率，降低生產成本。 而“製品良率與生 【實施方式】 本技術方案之固掊梦署a m i μ ,,. , 从 "及固持方法適用於需將板狀或 片狀待加工工件懸掛固定進 ‘作之工序，如鐘金剪鞋夕 芯掛固定電路基板。以下將社 〇合優選實施例及附圖對本# 術方案之固持W持方法進行詳細說明。技 =見® 2’其為本技財案之錢實施例提供之 置100之示意圖。該固持裝罟 展 衣罝1〇〇包括掛牟m田杜 120與抵靠件130。 ㈣110固持件 1333811 掛架110包括二根第一固持桿112、二根第二固持桿 111與固定部113。二根第一固特桿112相對且平行設置， _ 二根第二固持桿111平行設於二根第一固持桿112之間， 且與第一固持桿112相連，從而與第一固持桿112圍合形 成一掛架框體。 每根第二固持桿111為長度可調式設計，其包括第一 桿體1111與第二桿體1112。第一桿體1111為空心管，第 φ 二桿體1112之形狀及尺寸與第一桿體1111匹配，其一端收 容於第一桿體1111，其可沿第一桿體1111長度方向於第一 桿體1111中滑動，以根據電路基板之尺寸調節第一固持桿 111之長度。第二固持桿111亦可為其他常見之長度可調式 構件。二相對設置之第一固持桿112之間距可藉由調節第 二固持桿111之長度實現。每根第一固持桿112具有固持 面1121及與固持面1121相連之夾持面1122。固持面1121 用以承載電路基板。夾持面1122設有限位孔1123，用以限 • 位固定抵靠件130於第一固持桿112。當然，第二固持桿 111與第一固持桿112之截面形狀可為多種形狀，如方形、 橢圓形、多邊形或其他不規則形狀。 固定部113連接於第一固持桿112與第二固持桿111 圍合形成之掛架框體。具體地，固定部113可設於第一固 持桿112之一端或連接於第二固持桿111，其可與第一固持 桿112或第二固持桿111 一體成型，亦可為獨立構件。本 實施例中，固定部113為掛鈎，其位於第一固持桿112之 一端，與第一固持桿112 —體成型，固定部113可懸掛於 1333811 電鍍槽中之陰極懸桿（圖未示），以實現掛架110與電源負 極之電氣連接。當然，固定部113亦可為導電夾或者其他 ' 具有夾持功能之裝置，只要能方便地設於第一固持桿112 與第二固持桿111圍合形成之掛架框體並藉由導線或其他 方式連接於電源負極即可。當固定部.113連接於第二固持 桿111時，應避免固定部113位於第一桿體1111與第二桿 體1112之結合處，影響第二桿體1112相對第一桿體1111 • 滑動。 固持件120為彈簧夾，其設於第一固持桿112之固持 面1121,用以央_持電路基板。固持件12 0亦可為娜釘、磁 鐵或鏍栓，其由電導性好之金屬材料或磁.性材料製成。當 固持件120為鉚釘或鏍栓時，第一固持桿112之固持面1121 設置有與固持件120尺寸及形狀適配之定位孔，該定位孔 用以收容穿設電路基板之固持件120,達成將電路基板固定 於第一固持桿112之固持面1121。當待加工工件為多層電 _ 路基板時，固持件120優選鉚釘或鏍栓，一方面可實現多 層電路基板與掛架110之定位固定，另一方面可實現多層 電路基板内之導電層與電源負極之電氣連接。 抵靠件130包括抵靠部131與支撐部132。 抵靠部131為長度可調式設計，包括第一抵靠部133 與第二抵靠部134。第一抵靠133具有第一抵靠面1331， 第二抵靠部134具有第二抵靠面1341，第一抵靠面1331 與第二抵靠面1341均為光滑表面，由此形成抵靠部131之 抵靠面1311。第一抵靠部133具有容置腔，用於收容第二 11 1333811 抵靠部134。第二抵靠部134可於第一抵靠部133中沿其長 度方向滑動，從而改變抵靠部131之長度，進而調節抵靠 ' 面1311之長度。抵靠面1311可為矩形，亦可為其他圖形， 如梯形、多邊形，但優選矩形，以利於後續將抵靠部131 置於二根第一固持桿112之間時，其與第一固持桿112之 固持面1121配合而支撐電路基板。為使抵靠面1311充分 與電路基板表面完全接觸，本實施例中抵靠部131由二套 $板組成。當然，抵靠部131還可是二同心套筒或者常見成 套設置之滑槽與滑塊。抵靠部131可為硬質板材。具體地， 抵靠部131可由聚碳酸酯、聚醯胺、聚醯亞胺、環氧樹脂 等塑膠或者金屬製成。為減輕重量便於後續操作，優選塑 膠質地之抵靠部131。 支撐部132設於抵靠部131之與抵靠面1311相對之另 一表面，其可為桿體，亦可為板狀物。本實施例中，支撐 部132自第一抵靠部133與第二抵靠部134之相對二端部 • 朝相同方向垂直延伸而成。支撐部132設有中心轴線平行 於抵靠面1311之定位件1321。定位件1321可為彈性銷釘， 即由彈簧與銷釘組成，其受外力作用時可伸縮。定位件1321 之形狀及尺寸與第一固持桿112之限位孔1123之形狀及尺 寸適配，其可收容于限位孔1123，用以與限位孔1123配合 固定抵靠件130於相對之二根第一固持桿112之夾持面 1122之間。限位孔1123與第一固持桿112之固持面1121 之間距等於定位件1321與抵靠面1311之距離，以確保抵 靠件130固定於第一固持桿112時其抵靠面1311與固持面 12 1333811 1121位於同一平面，同時使支撐部132部分突出於第一固 持桿112，便於操作人員手持抵靠件130。 • 以上對本實施例提供之固持裝置100進行了詳細描 述，以下將以電路基板200為例，說明本技術方案之固持 方法。該固持方法包括以下步驟： 第一步，調節第二固持桿111之長度，使二根第一固 持桿112之間距與電路基板200之長度匹配。 φ 第二固持桿111之長度可藉由使第二固持桿111之第 二桿體1112沿第一桿體1111長度方向於第一桿體1111中 滑動而得到調節。第二固持桿111之長度應使電路基板200 之邊緣對應固定於固持件120，以便於後續利用固持件120 將電路基板固定於二第一固持桿112。 第二步，將抵靠件130與二根第一固持桿112配合， 使抵靠件130之抵靠面1311與二根第一固持桿112之固持 面1121共面。 • 該抵靠件130與二根第一固持桿112之配合可按下述 方式進行。首先，將抵靠件130置於二根第二固持桿111 與二根第一固持桿112圍合形成之掛架框體内；其次，使 第二抵靠部134沿第一抵靠部133之長度方向滑動，以調 節抵靠件130之抵靠部131之長度，至抵靠部131之長度 等於相對之二根第一固持桿112之間距；最後，調節抵靠 件130之抵靠面1311與第一固持桿112之固持面1121之 位置關係，使抵靠件130之抵靠面1311與第一固持桿112 之固持面1121共面。本實施例中，將定位件1321與第一 13 1333811 固持桿112之限位孔1123對應，使其收容于限位孔1123 即可。 • 第三步，將電路基板200貼合於抵靠件130之抵靠面 1311，採用固持件120將電路基板200固定於二根第一固 持桿112。 請一併參閱圖2及圖3，由於本實施例中之固持件120 為彈簧夾，其藉由彈簧夾之張合力將電路基板200邊緣夾 φ 持於掛架110之固持面1121，並使電路基板200中心區域 與抵靠面1311貼合。當固持件120為螺栓或鉚釘時，其藉 由穿設電路基板200邊緣之導通孔後與第一固持桿112之 定位孔將電路基板200邊緣固定於掛架110之固持面 1121。如果電路基板200為雙面電路板，當將電路基板200 貼合於抵靠件130之抵靠面1311並固定於掛架100後，需 向抵靠件130施加外力，使其定位件1321處於壓縮狀態， 從而將抵靠件130抽離掛架110,然後將掛架110連同電路 _ 基板200置於電鍍槽，使固定部113懸掛於電鍍槽之陰極 懸桿即可進行鍍金製程。若電路基板200為單面電路板， 可不必將抵靠件130從掛架110抽離。 本實施例之固持裝置100結構簡單，其藉由設置具有 光滑抵靠面1311之抵靠件130填充第二固持桿111與第一 固持桿112圍合形成之掛架框體内，使抵靠件130之抵靠 面1311與第一固持桿112之固持面1121共面，從而使抵 靠件130支撐待加工工件，進而確保待加工工件平整地固 定於第一固持桿112,避免了使用先前技術之固持裝置及固 14 1333811 致使待力二工件彎折進而損傷。因此，本技術 ” *寺裝置可提尚製品良率並降低了生產成本。 實施例之固持裝置工⑼之第—固持桿ιΐ2亦 長度可調式，以根據待加工工件之尺寸靈活改變相 ‘太：固::杯111之間距。同理’亦可於第-固持桿112 汉置^領域常見之滑動機構，如滑執，以根據待加工工件 ^尺寸改變第—固持桿112之二相鄰定位孔之間距。另， 實施例之固持裝置100之結構進行線性括展，即 使八包括多根相互平行且相對設置之第二@持#山 :I; Ϊ平::I目對设置之第一固持桿112，進而使得每相鄰 :=一固持桿U1與每相鄰二根第—固持桿出圍合形 成筏數掛架框體’以便於同時固定複數待加工工件。 综上所述’本發料已符合發明專利之要件，遂依法 2出^利申請。惟，以上所述者僅為本發明之較佳實施方 式’自不能以此限制本案之中請專利範圍。舉凡孰 =人士援依本發明之精神所作之等效修飾或變二J 應涵盍於以下申請專利範圍内。 【圖式簡單說明】 圖1係先前技術之固持裝置固定電路板之示意圖。 圖2係本技術方案之實施例提供之固持裝置之示意圖。 圖3係本技術方案之實施例提供之固持裂置固 板之示意圖。 主要元件符號說明 15 1333811 固持裝置 10，100 ’ 第一固持桿 11，112 • 第二固持桿 12, 111 第一固持面 13 第二固持面 14 電路基板 20，200 固持件 30，120 0 掛架 110 固定部 113 抵靠件 130 抵靠部 131 支撐部 132 第一抵靠部 133 第二抵靠部 134 第一桿體 1111 • 第二桿體 1112 固持面 1121 夾持面 1122 限位孔 1123 抵靠面 1311 定位件 1321 第一抵靠面 1331 第二抵靠面 1341 161333811 IX. Description of the Invention: [Technical Field] The present invention relates to the field of circuit board manufacturing technology, and in particular, to a holding device and a holding method. [Prior Art] With the rapid development of the electronics industry, people have more and more functional requirements for electronic products, more and more demanding performance requirements, smaller and smaller volume requirements, and lighter weight requirements. Circuit boards, which are important components of electronic products, are becoming thinner and thinner, and their production is becoming more and more elaborate. The board fabrication process includes a gold plating process in which a gold layer of a highly chemically inactive layer is applied to the termination of the circuit substrate to protect the termination terminals and provide good electrical conductivity. In order to prevent atomic diffusion between the conductive line and the gold layer, a thin nickel layer is often plated on the conductive line before gold plating. References: Development of electroless Ni/Au plated build-up flip chip package with highly reliable solder joints ; Yokomine, K. etc; Electronic Components and Technology Conference, Volume 51, 2001 A holding member such as a shackle or a spring clip fixes the circuit substrate to the holding device, and then immerses the holding device together with the circuit substrate in the plating tank, and then plating a certain thickness of the plating layer on the terminal end of the circuit substrate by electroless plating or electroplating, and then The holding device takes out the plating tank together with the circuit substrate, and removes the holding member to obtain a gold-plated circuit substrate that is detached from the holding device. 7 意图 Intention to participate in the I if 1 if: the holding device 10 fixes the circuit board 2. The rod & 2: The second holding rod 12 of the holding rod u phase. Between the first and second solids ” m 12 , thereby having the first-solid-fitted truss frame. Each second holding rod 12 ... retaining member = holding surface 13 opposite to the second holding surface The member 30 is disposed on the second holding rod 12 spring clip for clamping the side of the circuit board 2G, and the 13 spring is fixed to the __ holding surface of the second holding rod 12 to shield the circuit board 2, when the circuit The first holding surface of the substrate 2 flexible circuit 2 holding rod 12 is: thinner, and is widely fixed by the holding member 30 to the conventional:; =^^ The board 20 is easy to cause the := circuit base artificial Damage to the circuit board 2G, shadowing and frustration, cost. Heart a subsequent gold plating effect and increase production [Invention] In view of this, it is provided to provide a method for fixing the wear and tear of the workpiece and reducing the production and holding method to reduce the waiting Necessary - production cost and improvement of product yield::: specific examples - holding device and holding method. The device is used to fix the plate or sheet to be processed, 1 includes a first holding rod and Holding member. The second holding member has a holding surface for each of the first holding rods; The rod is oppositely disposed, and the holding member is used for holding the rod to be processed. The holding device further includes an abutting member that cooperates with the workpiece to be processed. “This rod=holds the step of r: the abutment The workpiece is placed on the two fixed rods of the first solid-solid holding rod, so that the abutting surface of the abutting member and the /, the surface, the circuit substrate is attached to the abutting member, and the workpiece is fixed to the two parts - The holding surface of the holding rod is 抿 / / , , , , , 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 固 固 固 固 固 固 固 固 固 固 固 固 固 固 固 固 固 固 固 固 固 固 固 固Between, and the - holding rod fixed to be added L: two devices can improve the workpiece to be processed in:: the technical solution of the technical solution caused by the processing of workers = = uniformity 'reduced production efficiency, reducing production costs. And "product yield and production [implementation] The technical solution of the ami 掊 ami , , , 从 从 ami ami ami ami ami ami ami ami ami ami ami ami ami ami ami ami ami ami ami ami ami ami ami ami ami ami ami ami ami ami ami ami ami ami ami ami For example, the method of fixing the holding circuit of the present invention is described in detail in the preferred embodiment and the accompanying drawings. The technique = see 2' is the technical case. The embodiment of the present invention provides a schematic diagram of the device 100. The holding device 1 includes a hanging m and a pair of members 130. (4) 110 holder 1333811 The hanger 110 includes two first holding rods 112 and two The second holding rod 111 and the fixing portion 113. The two first fixing rods 112 are opposite and arranged in parallel, and the two second holding rods 111 are disposed in parallel between the two first holding rods 112, and are fixed with the first holding rod 112. The rods 112 are connected to form a pylon frame with the first holding rod 112. Each of the second holding rods 111 is of a length adjustable design and includes a first rod body 1111 and a second rod body 1112. The first rod The body 1111 is a hollow tube, and the shape and size of the φ second rod 1112 and the first rod 1 111 matching, one end of which is received in the first rod body 1111, which can slide in the first rod body 1111 along the length direction of the first rod body 1111 to adjust the length of the first holding rod 111 according to the size of the circuit substrate. The rod 111 can also be other common length adjustable members. The distance between the first holding rods 112 can be achieved by adjusting the length of the second holding rod 111. Each of the first holding rods 112 has a holding surface 1121 and The holding surface 1121 is connected to the clamping surface 1122. The holding surface 1121 is for carrying the circuit substrate. The clamping surface 1122 is provided with a limiting hole 1123 for limiting the fixing of the abutting member 130 to the first holding rod 112. Of course, the second The cross-sectional shape of the holding rod 111 and the first holding rod 112 may be various shapes, such as a square shape, an elliptical shape, a polygonal shape, or other irregular shapes. The fixing portion 113 is connected to the first holding rod 112 and the second holding rod 111 to be formed. In particular, the fixing portion 113 can be disposed at one end of the first holding rod 112 or connected to the second holding rod 111, which can be integrally formed with the first holding rod 112 or the second holding rod 111, or can be Independent component In the embodiment, the fixing portion 113 is a hook, which is located at one end of the first holding rod 112, and is integrally formed with the first holding rod 112. The fixing portion 113 can be suspended from the cathode suspension rod (not shown) in the 1333811 plating tank. The electrical connection between the pylon 110 and the negative pole of the power supply can be realized. Of course, the fixing portion 113 can also be a conductive clip or other device having a clamping function, as long as it can be conveniently disposed on the first holding rod 112 and the second holding rod 111. The formed frame frame can be connected to the negative pole of the power source by wires or other means. When the fixing portion 113 is connected to the second holding rod 111, the fixing portion 113 should be prevented from being located at the joint of the first rod body 1111 and the second rod body 1112, and the second rod body 1112 is prevented from sliding relative to the first rod body 1111. The holding member 120 is a spring clip which is disposed on the holding surface 1121 of the first holding rod 112 for holding the circuit board. The holding member 120 may also be a nail, a magnet or a shackle, which is made of a metal material or a magnetic material having good electrical conductivity. When the holding member 120 is a rivet or a shackle, the holding surface 1121 of the first holding rod 112 is provided with a positioning hole adapted to the size and shape of the holding member 120, and the positioning hole is for receiving the holding member 120 of the circuit board. A fixing surface 1121 that fixes the circuit board to the first holding rod 112 is achieved. When the workpiece to be processed is a multi-layer electric circuit substrate, the holding member 120 is preferably a rivet or a shackle. On the one hand, the positioning and fixing of the multi-layer circuit substrate and the pylon 110 can be realized, and on the other hand, the conductive layer and the power source in the multi-layer circuit substrate can be realized. Electrical connection of the negative pole. The abutting member 130 includes an abutting portion 131 and a supporting portion 132. The abutting portion 131 is of a length adjustable design and includes a first abutting portion 133 and a second abutting portion 134. The first abutting surface 133 has a first abutting surface 1331, and the second abutting surface 134 has a second abutting surface 1341. The first abutting surface 1331 and the second abutting surface 1341 are both smooth surfaces, thereby forming abutment. The abutting surface 1311 of the portion 131. The first abutting portion 133 has a receiving cavity for receiving the second 11 1333811 abutting portion 134. The second abutting portion 134 is slidable in the longitudinal direction of the first abutting portion 133, thereby changing the length of the abutting portion 131, thereby adjusting the length of the abutting surface 1311. The abutting surface 1311 may be a rectangle, or may be other shapes, such as a trapezoid, a polygon, but preferably a rectangle, to facilitate the subsequent placement of the abutting portion 131 between the two first holding rods 112, and the first holding rod. The holding surface 1121 of 112 is fitted to support the circuit substrate. In order to make the abutting surface 1311 fully in contact with the surface of the circuit board, the abutting portion 131 in this embodiment is composed of two sets of panels. Of course, the abutment portion 131 can also be a two concentric sleeve or a common set of chutes and sliders. The abutting portion 131 may be a hard plate. Specifically, the abutting portion 131 may be made of plastic or metal such as polycarbonate, polyamide, polyimide, epoxy or the like. In order to reduce the weight for subsequent operations, the abutting portion 131 of the plastic texture is preferred. The support portion 132 is disposed on the other surface of the abutting portion 131 opposite to the abutting surface 1311. The support portion 132 may be a rod body or a plate. In this embodiment, the support portion 132 is formed to extend perpendicularly from the opposite ends of the first abutting portion 133 and the second abutting portion 134 in the same direction. The support portion 132 is provided with a positioning member 1321 whose central axis is parallel to the abutting surface 1311. The positioning member 1321 can be an elastic pin, that is, a spring and a pin, which can be extended and contracted by an external force. The shape and size of the positioning member 1321 are adapted to the shape and size of the limiting hole 1123 of the first holding rod 112. The positioning member 1312 can be received in the limiting hole 1123 for fixing the abutting member 130 with the limiting hole 1123. Between the clamping faces 1122 of the two first holding bars 112. The distance between the limiting hole 1123 and the holding surface 1121 of the first holding rod 112 is equal to the distance between the positioning member 1321 and the abutting surface 1311 to ensure the abutting surface 1311 and the holding surface when the abutting member 130 is fixed to the first holding rod 112. 12 1333811 1121 is located on the same plane, while the support portion 132 is partially protruded from the first holding rod 112, so that the operator can hold the abutting member 130. The holding device 100 provided in this embodiment is described in detail above. The following holds the circuit board 200 as an example to describe the holding method of the present invention. The holding method comprises the following steps: In the first step, the length of the second holding rod 111 is adjusted so that the distance between the two first holding rods 112 matches the length of the circuit substrate 200. The length of the second holding rod 111 can be adjusted by sliding the second rod 1112 of the second holding rod 111 in the longitudinal direction of the first rod 1111 in the first rod 1111. The length of the second holding rod 111 is such that the edge of the circuit substrate 200 is correspondingly fixed to the holding member 120 so as to be used to fix the circuit substrate to the two first holding rods 112 by the holding member 120. In the second step, the abutting member 130 is engaged with the two first holding rods 112 such that the abutting surface 1311 of the abutting member 130 is coplanar with the holding surfaces 1111 of the two first holding rods 112. • The engagement of the abutment 130 with the two first retaining bars 112 can be performed in the following manner. First, the abutting member 130 is placed in the pylon frame formed by the two second holding rods 111 and the two first holding rods 112; secondly, the second abutting portion 134 is along the first abutting portion 133. Sliding in the length direction to adjust the length of the abutting portion 131 of the abutting member 130, the length of the abutting portion 131 is equal to the distance between the two opposing first holding rods 112; finally, the abutting surface of the abutting member 130 is adjusted The positional relationship between the 1311 and the holding surface 1121 of the first holding rod 112 is such that the abutting surface 1311 of the abutting member 130 is coplanar with the holding surface 1121 of the first holding rod 112. In this embodiment, the positioning member 1321 is corresponding to the limiting hole 1123 of the first 13 1333811 holding rod 112, and is received in the limiting hole 1123. In the third step, the circuit board 200 is attached to the abutting surface 1311 of the abutting member 130, and the circuit board 200 is fixed to the two first holding rods 112 by the holding member 120. Referring to FIG. 2 and FIG. 3 together, since the holding member 120 in the embodiment is a spring clip, the edge of the circuit board 200 is clamped to the holding surface 1121 of the hanger 110 by the tensioning force of the spring clip, and The central area of the circuit board 200 is in contact with the abutting surface 1311. When the holding member 120 is a bolt or a rivet, the edge of the circuit board 200 is fixed to the holding surface 1121 of the hanger 110 by the through hole of the edge of the circuit board 200 and the positioning hole of the first holding rod 112. If the circuit board 200 is a double-sided circuit board, after the circuit board 200 is attached to the abutting surface 1311 of the abutting member 130 and fixed to the hanger 100, an external force is applied to the abutting member 130 so that the positioning member 1321 is In a compressed state, the abutting member 130 is pulled away from the pylon 110, and then the pylon 110 is placed in the plating tank together with the circuit _ substrate 200, and the fixing portion 113 is suspended from the cathode suspension rod of the plating tank to perform a gold plating process. If the circuit substrate 200 is a single-sided circuit board, it is not necessary to pull the abutting member 130 away from the pylon 110. The holding device 100 of the present embodiment has a simple structure, and the abutting member 130 having the smooth abutting surface 1311 is filled with the second holding rod 111 and the first holding rod 112 to form a pylon frame, so as to abut The abutting surface 1311 of the member 130 is coplanar with the holding surface 1121 of the first holding rod 112, so that the abutting member 130 supports the workpiece to be processed, thereby ensuring that the workpiece to be processed is flatly fixed to the first holding rod 112, thereby avoiding the use of the previous holding rod 112. The technical holding device and the solid 14 1333811 cause the two workpieces to be bent and damaged. Therefore, the present technology "* temple device can improve the product yield and reduce the production cost. The holding device of the embodiment (9) - the holding rod ι ΐ 2 is also adjustable in length to flexibly change the phase according to the size of the workpiece to be processed. : solid:: the distance between the cups 111. The same reason can also be used in the first-holding rod 112, the common sliding mechanism in the field, such as sliding, to change the second adjacent to the holding rod 112 according to the size of the workpiece to be processed The distance between the positioning holes is different. In addition, the structure of the holding device 100 of the embodiment is linearly extended, even if the eight includes a plurality of parallel and oppositely disposed second @持#山:I; Ϊ平::I目对第第A holding rod 112, so that each adjacent: = a holding rod U1 and each adjacent two first holding rods are enclosed to form a plurality of rack frames 'to facilitate simultaneous fixation of a plurality of workpieces to be processed. 'The present issue has met the requirements of the invention patent, and the application is based on the law. However, the above description is only the preferred embodiment of the present invention, which can't limit the scope of patents in this case. The equivalent of the person's assistance in accordance with the spirit of the present invention BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a schematic view of a prior art holding device fixed circuit board. Figure 2 is a schematic view of a holding device provided by an embodiment of the present technical solution. 3 is a schematic diagram of a retaining split solid plate provided by an embodiment of the present technical solution. Main component symbol description 15 1333811 Holding device 10, 100 'First holding rod 11, 112 • Second holding rod 12, 111 First holding surface 13 second holding surface 14 circuit substrate 20, 200 holding member 30, 120 0 pylon 110 fixing portion 113 abutting member 130 abutting portion 131 supporting portion 132 first abutting portion 133 second abutting portion 134 first rod body 1111 • Second rod body 1112 Retaining surface 1121 Clamping surface 1122 Restricting hole 1123 Abutting surface 1311 Locating member 1321 First abutting surface 1331 Second abutting surface 1341 16