CN218473475U

CN218473475U - Multilayer FPC board of easily buckling

Info

Publication number: CN218473475U
Application number: CN202222245389.9U
Authority: CN
Inventors: 邓永强; 刘涛
Original assignee: Dongguan Changlian Electronic Technology Co ltd
Current assignee: Dongguan Changlian Electronic Technology Co ltd
Priority date: 2022-08-25
Filing date: 2022-08-25
Publication date: 2023-02-10
Anticipated expiration: 2032-08-25

Abstract

The utility model discloses a FPC board that multilayer was easily buckled, including the base plate layer, the both sides on base plate layer are all fixed and are provided with high temperature resistant thin layer, and one side that base plate layer was kept away from to two high temperature resistant thin layers is all fixed and is provided with the antistatic layer, and one side that high temperature resistant thin layer was kept away from to two antistatic layers is all fixed and is provided with the elasticity steel sheet, the utility model relates to a FPC board that multilayer was easily buckled, set up the preformed hole of bending through the middle part between two adjacent FPC layers, come to be convenient for bend the processing to multilayer FPC board, avoid breaking in the in-process multilayer FPC board that bends, come to guide into on a plurality of fin with the heat that multilayer FPC board work produced through two a plurality of fins, set up the heat dissipation that accelerates multilayer FPC board through the cooperation of a plurality of fin and a plurality of louvre, avoid multilayer FPC board because of the radiating effect difference fast ageing, and then influence the life of multilayer FPC board.

Description

Multilayer FPC board of easily buckling

Technical Field

The utility model relates to a multilayer FPC board field specifically is an FPC board that multilayer was easily buckled.

Background

With the development of the lithium ion battery quick charging technology for the mobile phone, the high-power quick charging method is more and more widely used. In the process of high-power charging, the loss of battery energy and the rise of temperature need to be reduced, one method is realized by reducing the internal resistance of the whole battery by increasing the number of layers of the FPC board, for example, the thickness of a main circuit copper foil can be doubled by a four-layer board compared with a two-layer board, the internal resistance can be reduced by half, the energy loss is correspondingly reduced, the battery can generate heat and the temperature is reduced, so that the use of the multilayer FPC board is gradually wide, but the existing multilayer FPC board can be broken when being bent and can be rapidly aged due to poor heat dissipation effect, and the service life of the multilayer FPC board is further influenced.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide an easy FPC board of buckling of multilayer to what put forward in the solution above-mentioned background art can appear splitting and multilayer FPC board because of the poor quick ageing of radiating effect when bending multilayer FPC board, and then influences the problem of multilayer FPC board's life.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a FPC board that multilayer is easily buckled, includes the base plate layer, the both sides on base plate layer are all fixed and are provided with high temperature resistant thin layer, two one side that the base plate layer was kept away from to high temperature resistant thin layer is all fixed and is provided with antistatic layer, two one side that high temperature resistant thin layer was kept away from to antistatic layer is all fixed and is provided with a plurality of evenly distributed's heat radiation structure, a plurality of, heat radiation structure all includes conducting strip, fin and a plurality of louvre, the fixed fin that is provided with in top of conducting strip, a plurality of evenly distributed's louvre has been seted up on the top of fin, the base plate layer includes a plurality of FPC layer and a plurality of powerful adhesive linkage, every adjacent two both sides between the FPC layer are all fixed and are provided with powerful adhesive linkage, through the middle part setting between two adjacent louvre layers, are convenient for bend the processing to the multilayer FPC board, avoid bending in-process multilayer FPC board fracture to can play the supplementary effect of bending through the setting of two elastic steel sheet, avoid playing the guard action to multilayer FPC board that can be done work through a plurality of heat conduction to the multilayer FPC board and the heat dissipation effect of the heat radiation is accelerated through the cooperation of the multilayer FPC board, and the heat dissipation effect of the multilayer FPC board that sets up the heat radiation is poor.

Preferably, every adjacent two middle part between the FPC layer all can form the preformed hole of bending, is convenient for bend the processing to the multilayer FPC board through the setting of the preformed hole of bending, avoids breaking in the in-process multilayer FPC board of bending.

Preferably, a plurality of the strong bonding layers are made of epoxy resin, and the epoxy resin has good bonding performance.

Preferably, the thicknesses of a plurality of strong bonding layers are all 11 μm, so as to ensure that two FPC layers are completely bonded.

Preferably, the plurality of FPC layers are of FPC single-board structures, and copper foils are arranged on the surfaces of the plurality of FPC layers.

Preferably, the diameters of the plurality of heat dissipation holes are all 5 μm, so as to ensure normal heat dissipation.

Compared with the prior art, the beneficial effects of the utility model are that: set up the preformed hole of bending through the middle part between two adjacent FPC layers, be convenient for bend the processing to multilayer FPC board, avoid breaking at in-process multilayer FPC board of bending, and can play the supplementary effect of bending through the setting of two elasticity steel sheets, avoid can playing the guard action to multilayer FPC board, the heat that comes multilayer FPC board work to produce is leading-in to a plurality of fin through two a plurality of fin, the heat dissipation of multilayer FPC board is accelerated through the cooperation setting of a plurality of fin and a plurality of louvre, avoid multilayer FPC board because of the radiating effect is poor ageing fast, and then influence the life of multilayer FPC board.

Drawings

Fig. 1 is a front sectional view of the present invention;

FIG. 2 is a structural diagram of the heat dissipation structure of the present invention;

FIG. 3 is an enlarged view of a portion A of the present invention;

fig. 4 is a structure diagram of the substrate layer of the present invention.

In the figure: 1. a substrate layer; 11. an FPC layer; 12. a strong adhesive layer; 13. bending the preformed hole; 2. a heat dissipation structure; 21. a heat conductive sheet; 22. a heat sink; 23. heat dissipation holes; 3. a high temperature resistant film layer; 4. an antistatic layer; 5. an elastic steel sheet.

Detailed Description

The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.

Referring to fig. 1-4, the present invention provides a multi-layer flexible printed circuit board (FPC) comprising a substrate layer 1, wherein high temperature resistant thin film layers 3 are fixedly disposed on both sides of the substrate layer 1, antistatic layers 4 are fixedly disposed on both sides of the two high temperature resistant thin film layers 3 away from the substrate layer 1, elastic steel sheets 5 are fixedly disposed on both sides of the two antistatic layers 4 away from the high temperature resistant thin film layers 3, a plurality of uniformly distributed heat dissipation structures 2 are fixedly disposed on both sides of the two elastic steel sheets 5 away from the antistatic layers 4, each heat dissipation structure 2 comprises a heat conduction sheet 21, a heat dissipation sheet 22 and a plurality of heat dissipation holes 23, a heat dissipation sheet 22 is fixedly disposed on the top end of the heat conduction sheet 21, a plurality of uniformly distributed heat dissipation holes 23 are disposed on the top end of the heat dissipation sheet 22, the substrate layer 1 comprises a plurality of FPC layers 11 and a plurality of strong adhesive layers 12, both sides between per two adjacent FPC layers 11 are all fixed and are provided with powerful adhesive linkage 12, set up the preformed hole 13 of bending through the middle part between two adjacent FPC layers 11, it handles to bend the multilayer FPC board to be convenient for, avoid breaking in the in-process multilayer FPC board of bending, and can play the supplementary effect of bending through the setting of two elasticity steel sheets 5, avoid can playing the guard action to the multilayer FPC board, lead into on a plurality of fin 22 through two a plurality of fin 21 with the heat that the work of multilayer FPC board produced, the heat dissipation of multilayer FPC board is accelerated in the cooperation setting of a plurality of fin 22 and a plurality of louvre 23, avoid the multilayer FPC board because of the radiating effect difference fast ageing, and then influence the life of multilayer FPC board.

The middle part between every two adjacent FPC layers 11 all can form the preformed hole 13 of bending, is convenient for bend the processing to multilayer FPC board through the setting of the preformed hole 13 of bending, avoids breaking in the in-process multilayer FPC board that bends.

The plurality of strong adhesive layers 12 are made of epoxy resin, and the epoxy resin has good adhesive property.

The thickness of each of the strong adhesive layers 12 is 11 μm to ensure complete adhesion of the two FPC layers 11.

The plurality of FPC layers 11 are of FPC single-board structures, and copper foils are arranged on the surfaces of the plurality of FPC layers 11.

The diameters of the heat dissipation holes 23 are all 5 μm to ensure the normal heat dissipation.

When the embodiment of the application is used: set up through the middle part between two adjacent FPC layers 11 and bend preformed hole 13, be convenient for bend the processing to the multilayer FPC board, avoid in-process multilayer FPC board fracture of bending, and can play the supplementary effect of bending through setting up of two elasticity steel sheets 5, avoid can playing the guard action to the multilayer FPC board, in the use, bring the heat that multilayer FPC board work produced into a plurality of fin 22 through two a plurality of fin 21, the heat dissipation of multilayer FPC board is accelerated in cooperation setting through a plurality of fin 22 and a plurality of louvre 23, avoid the multilayer FPC board because of the radiating effect difference is ageing fast, and then influence the life of multilayer FPC board.

Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.

Claims

1. The utility model provides a FPC board that multilayer is apt to buckle, includes base plate layer (1), its characterized in that: the utility model discloses a heat dissipation structure, including base plate layer (1), high temperature resistant thin layer (3) and antistatic layer (4), two are all fixed being provided with in one side that base plate layer (1) was kept away from in high temperature resistant thin layer (3), two one side that antistatic layer (4) were kept away from in one side of antistatic layer (3) is all fixed being provided with elastic steel sheet (5), two elastic steel sheet (5) one side of keeping away from antistatic layer (4) is all fixed being provided with a plurality of evenly distributed's heat radiation structure (2), a plurality of heat radiation structure (2) all include conducting strip (21), fin (22) and a plurality of louvre (23), the fixed fin (22) that is provided with in top of conducting strip (21), louvre (23) of a plurality of evenly distributed are seted up on the top of fin (22), base plate layer (1) includes a plurality of FPC layer (11) and a plurality of powerful adhesive linkage (12), every adjacent two both sides between FPC layer (11) are all fixed being provided with powerful adhesive linkage (12).

2. A multilayer flexible FPC board as claimed in claim 1, wherein: and a bending reserved hole (13) is formed in the middle between every two adjacent FPC layers (11).

3. A multi-layer flexible FPC board as claimed in claim 1, wherein: and a plurality of the strong bonding layers (12) are all made of epoxy resin.

4. A multi-layer flexible FPC board as claimed in claim 1, wherein: the thicknesses of the strong bonding layers (12) are all 11 mu m.

5. A multi-layer flexible FPC board as claimed in claim 1, wherein: the FPC layers (11) are of FPC single-board structures, and copper foils are arranged on the surfaces of the FPC layers (11).

6. A multi-layer flexible FPC board as claimed in claim 1, wherein: the diameters of the heat dissipation holes (23) are all 5 mu m.