CN218471899U

CN218471899U - Dry etching device with partitioned temperature control

Info

Publication number: CN218471899U
Application number: CN202222407748.6U
Authority: CN
Inventors: 费爱勇; 李宁; 居法银
Original assignee: Zhejiang Unisom New Material Technology Co ltd
Current assignee: Zhejiang Unisom New Material Technology Co ltd
Priority date: 2022-09-09
Filing date: 2022-09-09
Publication date: 2023-02-10
Anticipated expiration: 2032-09-09

Abstract

The utility model relates to a dry etching device technical field discloses a dry etching device with subregion control by temperature change, including: a plurality of water coolers with temperature control function; the base is used for placing the wafer and comprises a placing area, the placing area is composed of a plurality of subareas, and a flow channel is arranged in each subarea; the water cooler comprises a water inlet pipe and a water outlet pipe, wherein one ends of the water inlet pipe and the water outlet pipe are respectively communicated with two ends of the flow channel, and the other ends of the water inlet pipe and the water outlet pipe are connected with the water cooler to realize liquid circulation. The utility model has the advantages of, this dry etching device is a plurality of divisions through the district setting of placeeing that will be used for placeeing the wafer, all sets up the runner on every subregion, and every subregion links to each other with the cold water machine that has the temperature control function through inlet tube and outlet pipe respectively, and then realizes the subregion independent control of wafer base temperature to can realize fixed point regulation and control, improve wafer sculpture yields.

Description

Dry etching device with partitioned temperature control

Technical Field

The utility model relates to a dry etching device technical field especially relates to a dry etching device with subregion control by temperature change.

Background

In a dry etching machine, a wafer is usually placed on a wafer pedestal for etching, the temperature of the wafer rises during the etching process, and the temperature of the wafer is controlled by a water cooling machine connected with the wafer pedestal.

In the existing dry etching machine, the temperature of the whole wafer base is controlled by only one water cooling machine, so that the wafer etching uniformity generally cannot achieve a very good effect, the independent control of the regions cannot be realized, and the yield is low.

SUMMERY OF THE UTILITY MODEL

The above-mentioned not enough to prior art exists, the utility model aims to solve the technical problem that a dry etching device with subregion control by temperature change that sculpture is even, fixed point regulation and control is proposed.

The utility model provides a technical scheme that its technical problem adopted is, provides a dry etching device with subregion control by temperature change, including:

a plurality of water coolers with temperature control function;

the base is used for placing the wafer and comprises a placing area, the placing area is composed of a plurality of subareas, and a flow channel is arranged in each subarea;

the water cooler comprises a water inlet pipe and a water outlet pipe, wherein one ends of the water inlet pipe and the water outlet pipe are respectively communicated with two ends of a flow channel, and the other ends of the water inlet pipe and the water outlet pipe are connected with the water cooler to realize liquid circulation.

Further, it is circular to place the district, and is a plurality of the subregion all is fan-shaped setting, and is a plurality of the area of subregion equals.

Furthermore, the number of the partitions is four, the flow channel comprises a plurality of sections of channels which are arranged in parallel, and the plurality of channels on each partition are arranged in concentric arcs of 90 degrees; and the distance between two adjacent channels is equal.

Further, a plurality of the partitions have gaps therebetween.

Further, the placing area is provided with a plurality of placing areas which are arranged around the circumference of the base.

The water chiller is characterized by further comprising a base, wherein the base is arranged on the base, and the water chiller is arranged below the base; the water inlet pipe and the water outlet pipe on any partition can penetrate through the base to be connected with the water chiller.

Compared with the prior art, the utility model discloses following beneficial effect has at least:

the utility model discloses in, this dry etching device is a plurality of partitions through the district setting of placeeing that will be used for placeeing the wafer, all sets up the runner on every partition, and every partition links to each other with the cold water machine that has the temperature control function through inlet tube and outlet pipe respectively, and then realizes the subregion independent control of wafer base temperature, and evenly distributed's runner makes the wafer sculpture even to can realize the fixed point regulation and control, improve wafer sculpture yields.

Drawings

FIG. 1 is a schematic structural diagram of a dry etching apparatus with partitioned temperature control according to the present invention;

FIG. 2 is a front view of FIG. 1;

fig. 3 is a schematic structural view of a single placement area in fig. 1.

In the figure:

100. a base; 110. a placement area; 111. partitioning; 120. a flow channel; 121. a channel;

200. a water inlet pipe;

300. a water outlet pipe;

400. a base.

Detailed Description

The following are specific embodiments of the present invention and the accompanying drawings are used to further describe the technical solution of the present invention, but the present invention is not limited to these embodiments.

As shown in fig. 1 to 3, a dry etching apparatus with zoned temperature control includes: a plurality of water coolers (not shown) with temperature control function; the base 100 is used for placing a wafer, the base 100 comprises a placing area 110, the placing area 110 is composed of a plurality of partitions 111, and a flow channel 120 is arranged in each partition 111; the water cooler comprises a water inlet pipe 200 and a water outlet pipe 300, wherein one ends of the water inlet pipe 200 and the water outlet pipe 300 are respectively communicated with two ends of the flow channel 120, and the other ends of the water inlet pipe 200 and the water outlet pipe 300 are connected with the water cooler to realize liquid circulation.

Specifically, the dry etching apparatus is provided with a placing area 110 on a base 100, the placing area 110 is used for placing a wafer, the placing area 110 is provided into a plurality of partitions 111, and each partition 111 is provided with a flow channel 120, the flow channel 120 on each partition 111 is connected with a water cooling machine through a water inlet pipe 200 and a water outlet pipe 300; the number of the water coolers corresponds to the number of the subareas 111 one by one, and the water coolers realize the circulation of liquid through a water pump, so that the water coolers with the temperature control function can carry out independent temperature control on the subareas 111 of the wafer base 100, and fixed-point regulation and control can be realized; and the wafer is etched uniformly through the uniformly arranged runners 120.

In this embodiment, the placing region 110 is circular, the plurality of partitions 111 are all fan-shaped, and the areas of the plurality of partitions 111 are equal. In practical use, the diameter of the placing region 110 is slightly larger than the diameter of the wafer, so as to be sufficient for placing the wafer; a plurality of partitions 111 having equal areas to ensure etching uniformity.

As shown in fig. 3, the number of the sub-areas 111 is four, the flow channel 120 includes a plurality of parallel channels 121, and the plurality of channels 121 on each sub-area 111 are arranged in concentric arcs of 90 °; and the distance between two adjacent channels 121 is equal. Namely, each partition 111 is arranged in a quarter circle, one end of the flow channel 120 on any partition 111 is arranged near the center of the placement area 110, and the other end is laid from inside to outside along the partition 111 in sequence; the plurality of channels 121 are spaced apart and connected by vertical segments on two radii of the included angle of the partition 111, and the channels 121 are spaced apart and arc-shaped to ensure uniformity of temperature control of the wafer pedestal 100.

Preferably, gaps are formed among the plurality of partitions 111 to prevent temperature regulation and control among the partitions 111 from interfering with each other, so that independent control of the temperature of each partition 111 is ensured; it should be noted that the gap is small, and only the heat transfer between the adjacent partitions 111 needs to be isolated.

In the actual use process, the placing areas 110 are provided in a plurality, and the placing areas 110 are arranged around the circumference of the base 100. That is, a single wafer base 100 can place a plurality of wafers to improve the production efficiency, and the placing areas 110 are disposed at the edge of the base 100, so that there is enough space between the wafers to ensure that the wafers on the placing areas 110 do not interfere with each other.

The dry etching device with the partition temperature control function further comprises a base 400, wherein the base 100 is arranged on the base 400, and the water cooling machine is arranged below the base 400; the water inlet pipe 200 and the water outlet pipe 300 on any partition 111 can penetrate through the base 400 to be connected with the water chiller. In practical use, the base 400 is a body of the etching device, the base 100 is accommodated in the base 400, and the water inlet pipe 200 and the water outlet pipe 300 of any one partition 111 penetrate through the base 400 to be connected with the water chiller; wherein, each placing area 110 is arranged in equal distance, so as to etch a plurality of wafers evenly, and facilitate the arrangement of the water inlet pipe 200 and the water outlet pipe 300; the water cooler is disposed below the base 400 to fully utilize the space of the etching apparatus,

in the scheme, the dry etching device with the partitioned temperature control is designed to meet the requirement on high uniformity of wafer etching, and meanwhile, the 111-domain independent control and fixed-point regulation and control of the partitions are realized, so that the yield of wafer etching is improved.

It should be noted that all the directional indicators (such as up, down, left, right, front, back \8230;) in the embodiments of the present invention are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the attached drawings), and if the specific posture is changed, the directional indicator is changed accordingly.

Furthermore, the descriptions in the present application as to "first," "second," "a," etc. are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicit ly indicating a number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In the present application, unless expressly stated or limited otherwise, the terms "connected" and "fixed" are to be construed broadly, e.g., "fixed" may be fixedly connected or detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In addition, the technical solutions between the embodiments of the present invention can be combined with each other, but it is necessary to be able to be realized by a person having ordinary skill in the art as a basis, and when the technical solutions are contradictory or cannot be realized, the combination of such technical solutions should be considered to be absent, and is not within the protection scope of the present invention.

Claims

1. A dry etching device with partitioned temperature control is characterized by comprising:

a plurality of water coolers with temperature control function;

the wafer positioning device comprises a base used for placing a wafer, wherein the base comprises a placing area, the placing area consists of a plurality of subareas, and a flow channel is arranged in each subarea;

2. The dry etching apparatus according to claim 1, wherein the placement area is circular, the plurality of partitions are all fan-shaped, and the areas of the plurality of partitions are equal.

3. The dry etching apparatus with zone temperature control as claimed in claim 2, wherein the number of the zones is four, the flow channels comprise a plurality of parallel channels, and the plurality of channels in each zone are arranged in concentric arcs of 90 °; and the distance between two adjacent channels is equal.

4. The dry etching apparatus with zone temperature control according to claim 1, wherein a plurality of the zones have gaps therebetween.

5. The dry etching apparatus with zoned temperature control according to claim 1, wherein the plurality of deposition regions are provided, and the plurality of deposition regions are provided around a circumference of the susceptor.

6. The dry etching device with the zone temperature control function according to claim 5, further comprising a base, wherein the base is arranged on the base, and the water chiller is arranged below the base; the water inlet pipe and the water outlet pipe on any partition can penetrate through the base to be connected with the water chiller.