CN218470063U

CN218470063U - Differential pressure sensor

Info

Publication number: CN218470063U
Application number: CN202222330504.2U
Authority: CN
Inventors: 马哲炜; 徐晨; 陈思宇
Original assignee: Kaisheng Power Technology Jiaxing Co ltd
Current assignee: Kaisheng Power Technology Jiaxing Co ltd
Priority date: 2022-08-31
Filing date: 2022-08-31
Publication date: 2023-02-10
Anticipated expiration: 2032-08-31

Abstract

The utility model discloses a differential pressure sensor, including casing, PCB board and response chip, still include the installing support, chip assembly district and panel assembly district have on the support, PCB board and response chip are pasted respectively on panel assembly district and chip assembly district, have seted up the air vent on the chip assembly district, bind between PCB board and the response chip and be connected, the support is adorned in the casing, the utility model discloses add one in the casing and bear the support, it can make chip and PCB board carry out the combination assembly according to the demand of difference, and the mass of being convenient for is markd, improves production efficiency.

Description

Differential pressure sensor

Technical Field

The utility model belongs to the technical field of the sensor, more specifically the utility model relates to a differential pressure sensor that says so.

Background

The differential pressure sensor is used for a tail gas treatment system, detects the pressure loss of waste gas passing through the particle catcher, detects the number of the captured particles and helps the ECU to select reasonable regeneration time.

The working principle of the differential pressure sensor is that the measured pressure directly acts on the diaphragm of the sensor to make the diaphragm generate micro displacement in direct proportion to the water pressure, so that the capacitance value of the sensor changes, and the change is detected by the electronic circuit and converted to output a standard measuring signal corresponding to the pressure.

The existing differential pressure sensor generally comprises a shell, wherein two cavities are formed in the shell, the two cavities are respectively connected with two air inlet nozzles, a PCB (printed circuit board) is arranged in the shell, various components including an induction chip are fixed on the PCB, the whole PCB is installed in the shell to form sealing, the two cavities are communicated with each other at the induction chip, so that the induction chip can be simultaneously communicated with the two cavities to measure differential pressure, however, for manufacturers, the differential pressure sensor of each type needs to be designed independently, the differential pressure sensors are usually only different in chips, other components are the same, the whole PCB cannot be calibrated in batch, and the production efficiency is low.

SUMMERY OF THE UTILITY MODEL

The utility model provides a not enough to prior art, the utility model provides an add one in the casing and bear the support, it can make chip and PCB board carry out the combination assembly according to the demand of difference, and the mass of being convenient for is markd, improves production efficiency.

In order to achieve the above purpose, the utility model provides a following technical scheme: the utility model provides a differential pressure sensor, includes casing, PCB board and response chip, still includes the installing support, has chip assembly district and panel assembly district on the support, PCB board and response chip are pasted respectively on panel assembly district and chip assembly district, have seted up the air vent on the chip assembly district, bonding connection between PCB board and the response chip, the support is adorned in the casing.

Further be provided with plug and two suction nozzles on the casing, be provided with the contact pin in the plug, the contact pin extends to inside the casing, be provided with on the PCB board with contact pin complex through-hole, the through-hole department that the panel assembly area of support corresponds the PCB board is provided with welding gap.

Further be provided with first cavity and second cavity in the casing, be provided with the baffle between first cavity and the second cavity, the support passes through the fix with screw on the baffle, just PCB board and response chip be located between baffle and the support, the support compresses tightly PCB board and response chip on the baffle.

Further one side surface of the support facing the PCB and the induction chip is coated with silica gel.

Furthermore, a positioning lug is arranged on the support, a positioning through groove is formed in the PCB, a positioning sinking groove is formed in the partition plate, and the positioning lug penetrates through the positioning through groove to the positioning sinking groove.

Compared with the prior art, the beneficial effects of the utility model are that: the induction chip and the PCB are respectively and independently adhered and fixed on the support and are connected through the bonding technology, and the chips of different models can be selected to be combined as required, so that the product is convenient to calibrate in batches, the production efficiency is improved, and the assembly are convenient during production.

Drawings

Fig. 1 is an exploded view of a differential pressure sensor according to the present invention;

fig. 2 is an exploded view of the differential pressure sensor of the present invention;

fig. 3 is a front view of the combination of the bracket, the inductive chip and the PCB of the present invention;

fig. 4 is a three-dimensional structure diagram of the utility model, in which the bracket, the induction chip and the PCB are matched;

fig. 5 is a three-dimensional structure view of the middle support of the present invention.

Reference numerals: 1. a housing; 11. a plug; 111. inserting a pin; 12. an air inlet nozzle; 13. a partition plate; 2. a support; 21. a panel assembly area; 211. welding a notch; 22. a chip mounting area; 221. a vent hole; 23. positioning the bump; 31. a PCB board; 311. a through hole; 32. an induction chip; 33. bonding lines; 41. a first cover plate; 42. and a second cover plate.

Detailed Description

Embodiments of the differential pressure sensor of the present invention are further described with reference to fig. 1 to 5.

In the description of the present invention, it should be noted that, for the orientation words, such as the terms "center", "lateral (X)", "longitudinal (Y)", "vertical (Z)", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., the orientation and the positional relationship are indicated based on the orientation or the positional relationship shown in the drawings, and the description is only for convenience of describing the present invention and simplifying the description, but not for indicating or implying that the device or the element referred to must have a specific orientation, be constructed and operated in a specific orientation, and should not be construed as limiting the specific protection scope of the present invention.

Furthermore, if the terms "first" and "second" are used for descriptive purposes only, they are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features. Thus, the definition of "a first" or "a second" feature may explicitly or implicitly include one or more of the features, and "a plurality" or "a plurality" in the description of the invention means two or more unless a specific definition is explicitly provided.

The utility model provides a differential pressure sensor, includes casing 1, PCB board 31 and response chip 32, still includes installing support 2, has chip assembly district 22 and panel assembly district 21 on the support 2, PCB board 31 and response chip 32 paste respectively on panel assembly district 21 and chip assembly district 22, have seted up air vent 221 on chip assembly district 22, bind between PCB board 31 and the response chip 32 and be connected, support 2 adorns in casing 1.

In this embodiment, the PCB 31 and the sensing chip 32 are adhered by using a silicone gel, during assembly, the silicone gel is coated on the surface of the support 2, the PCB 31 and the sensing chip 32 are respectively adhered on the support 2, and then cured at a high temperature, and a bonding line 33 is formed by bonding to connect the PCB 31 and the sensing chip 32 to form a module, the sensing chip 32 faces the air vent 221, so that the sensing chip 32 can receive air pressure on both sides, and the PCB 31 in this embodiment has other components except for the chip, which can also be referred to as a PCBA.

In this embodiment, a first chamber and a second chamber are provided in the housing 1, a partition plate 13 is provided between the first chamber and the second chamber, the bracket 2 is fixed on the partition plate 13 by screws, the PCB 31 and the sensing chip 32 are located between the partition plate 13 and the bracket 2, and the bracket 2 compresses the PCB 31 and the sensing chip 32 on the partition plate 13.

As shown in fig. 1 and 2, in the module formed by the bracket 2, the sensing chip 32 and the PCB 31 is flipped and mounted in the first cavity or the second cavity of the housing 1, the PCB 31 and the sensing chip 32 are clamped and fixed more firmly, and the partition 13 has an opening corresponding to the sensing chip 32 to communicate with the first cavity and the second cavity.

Specifically, a first cover plate 41 and a second cover plate 42 are respectively arranged on two sides of the shell 1, the first cover plate 41 covers one side of the first cavity, the second cover plate 42 covers one side of the second cavity, and the first cover plate and the second cover plate are sealed and fixed with the shell 1 through sealant, so that the first cavity and the second cavity are completely isolated from the outside.

Preferably, a plug 11 and two air inlet nozzles 12 are arranged on the housing 1, a contact pin 111 is arranged in the plug 11, the contact pin 111 extends into the housing 1, a through hole 311 matched with the contact pin 111 is arranged on the PCB 31, and a welding gap 211 is arranged at a position of the plate assembly area 21 of the bracket 2 corresponding to the through hole 311 of the PCB 31.

As shown in fig. 2 and 5, the soldering gap 211 exposes all the through holes 311, and after the pins 111 pass through the through holes 311, the pins 111 and the PCB 31 are soldered and conducted through the soldering gap 211 on the outside.

In this embodiment, it is preferable that the bracket 2 is provided with a positioning protrusion 23, the pcb 31 is provided with a positioning through groove, the partition 13 is provided with a positioning sinking groove, and the positioning protrusion 23 penetrates through the positioning through groove to reach the positioning sinking groove.

The positioning bump 23 not only can realize initial positioning of the bracket 2 and the partition board 13, but also can realize position fixing of the PCB 31, and ensure accurate installation of each component in the housing 1.

It is above only the utility model discloses a preferred embodiment, the utility model discloses a scope of protection does not only confine above-mentioned embodiment, the all belongs to the utility model discloses a technical scheme under the thinking all belongs to the utility model discloses a scope of protection. It should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.

Claims

1. The utility model provides a differential pressure sensor, includes casing, PCB board and response chip, its characterized in that: still include the installing support, chip assembly district and panel assembly district have on the support, PCB board and response chip are pasted respectively on panel assembly district and chip assembly district, have seted up the air vent on the chip assembly district, bond between PCB board and the response chip and be connected, the support is adorned in the casing.

2. The differential pressure sensor of claim 1, wherein: the PCB board is characterized in that a plug and two air inlet nozzles are arranged on the shell, contact pins are arranged in the plug and extend into the shell, through holes matched with the contact pins are formed in the PCB board, and welding notches are formed in the positions, corresponding to the through holes of the PCB board, of the board assembling area of the support.

3. The differential pressure sensor as recited in claim 2, wherein: the PCB induction device is characterized in that a first cavity and a second cavity are arranged in the shell, a partition plate is arranged between the first cavity and the second cavity, the support is fixed on the partition plate through screws, the PCB and the induction chip are located between the partition plate and the support, and the PCB and the induction chip are tightly pressed on the partition plate through the support.

4. A differential pressure sensor as recited in claim 3 wherein: the support scribbles silica gel towards one side surface of PCB board and response chip.

5. The differential pressure sensor as recited in claim 4, wherein: the PCB is characterized in that a positioning lug is arranged on the support, a positioning through groove is formed in the PCB, a positioning sink groove is formed in the partition plate, and the positioning lug penetrates through the positioning through groove to the positioning sink groove.