CN218470045U - Thick film pressure sensitive head and pressure sensor - Google Patents

Abstract

The utility model discloses a thick film pressure sensitive head, it includes: the metal cylinder is internally provided with a longitudinally extending leading-in channel of which the bottom end is used for leading in fluid to be measured, and the top end of the leading-in channel is plugged with an elastic metal diaphragm; the baffle plate is longitudinally arranged in the guide-in channel, one end of the baffle plate extends to the inner side wall of the elastic metal diaphragm and transversely divides the guide-in channel into a first guide-in cavity and a second guide-in cavity; and the pressure sensing assembly is fixed on the outer side wall of the elastic metal diaphragm and comprises two pressure sensing circuits, and the two pressure sensing circuits are longitudinally in one-to-one correspondence with the first lead-in cavity and the second lead-in cavity. The lead-in channel is divided into two lead-in cavities, and the deformation of the two parts of the elastic metal diaphragm is correspondingly measured through the two pressure sensing circuits, so that the problem of failure of the pressure sensing circuits can be avoided to a great extent on the premise that the manufacturing cost is improved by a small amount, and the service life and the reliability of the sensor are improved.

Description

Thick film pressure sensitive head and pressure sensor

Technical Field

The utility model relates to a pressure sensor technical field, concretely relates to thick film pressure sensing head and pressure sensor.

Background

The thick film pressure sensor is a pressure sensor for measuring pressure by utilizing piezoresistive effect of a thick film resistor, and a thick film pressure sensitive head of the thick film pressure sensor obtains a measuring signal through a Wheatstone bridge which is fixed on the back surface of a measuring diaphragm and consists of a piezoresistor. Thick film pressure sensors are capable of measuring relatively large pressures, but are relatively expensive to manufacture. The existing thick film pressure sensor can cause defects of cracking, falling and the like of a piezoresistor on the back surface under long-time continuous working load, so that the resistance value is drifted, even fails.

SUMMERY OF THE UTILITY MODEL

To prior art not enough, the utility model aims to provide a thick film pressure sensitive head and pressure sensor to improve its reliability.

A thick film pressure sensitive head, comprising:

the metal cylinder is internally provided with a longitudinally extending leading-in channel of which the bottom end is used for leading in fluid to be measured, and the top end of the leading-in channel is plugged with an elastic metal diaphragm;

the baffle plate is longitudinally arranged in the guide-in channel, one end of the baffle plate extends to the inner side wall of the elastic metal diaphragm, and the guide-in channel is transversely divided into a first guide-in cavity and a second guide-in cavity; and

the pressure sensing assembly is fixed on the outer side wall of the elastic metal diaphragm and comprises two pressure sensing circuits, and the two pressure sensing circuits are longitudinally in one-to-one correspondence with the first lead-in cavity and the second lead-in cavity.

Preferably, the pressure sensing circuit comprises a wheatstone bridge formed by sequentially connecting a first resistor, a second resistor, a third resistor and a fourth resistor end to end; the connection parts of the first resistor and the second resistor, the second resistor and the third resistor, the third resistor and the fourth resistor, and the fourth resistor and the first resistor are electrically connected to the first bonding pad, the second bonding pad, the third bonding pad and the fourth bonding pad in a one-to-one correspondence manner; the first resistor and the third resistor are both piezoresistors.

Preferably, the pressure sensing circuit further comprises a thermistor, the first pad or the third pad is electrically connected to one end of the thermistor, and the other end of the thermistor is electrically connected to the fifth pad.

Preferably, two of said pressure sensing circuits share a single said thermistor.

Preferably, the first resistor and the third resistor are close to each other, and the centers of the first resistor and the third resistor are longitudinally opposite to the center of the first lead-in cavity or the second lead-in cavity respectively.

The utility model discloses still claim a pressure sensor, it includes:

the thick film pressure sensitive head;

the connecting seat is arranged on one side of the top end of the thick film pressure sensitive head;

the shell is connected with the connecting seat and the thick film pressure sensitive head, and a mounting cavity is defined among the thick film pressure sensitive head, the connecting seat and the shell; and

and the circuit board is arranged in the mounting cavity and is connected with the pressure sensing assembly.

Preferably, a first supporting piece for mounting the circuit board is arranged in the mounting cavity; the first supporting piece comprises a supporting plate vertical to the longitudinal direction, two ends of the supporting plate in the transverse first direction respectively extend out of a first supporting foot plate stopped on the metal cylinder towards one side of the bottom end, and two ends of the supporting plate in the transverse second direction oppositely form abdicating notches; the transverse first direction is perpendicular to the transverse second direction.

Preferably, a second supporting member is disposed in the mounting cavity, the top end of the second supporting member is stopped at the bottom end of the connecting base, and the bottom end of the second supporting member is stopped at the supporting plate or two ends of the bottom end of the second supporting member along the transverse second direction respectively extend out of the second supporting foot plate stopped at the bottom end of the metal cylinder.

Preferably, the circuit board is provided with a connecting plate, a first mounting plate and a second mounting plate which are sequentially arranged from the top side to the bottom side, the middle part of the metal cylinder is expanded to form a matching connecting part, the lower part of the shell is sleeved on the matching connecting part in an interference manner and is connected to a supporting step surface formed on the metal cylinder towards the bottom end; the upper side of the matching connecting part is inwards recessed to form an isolation groove; the connecting plate faces a first end of the isolation groove along the transverse second direction from a bottom end side; the first end of the connecting plate along the transverse second direction is fixedly connected to the end face of the top end of the elastic metal diaphragm, and the first end of the first mounting plate and the first end of the second mounting plate along the transverse second direction are connected through a longitudinal second connecting plate; a second end of the elastic metal diaphragm along the transverse second direction is connected with a corresponding end of the first mounting plate through a first connecting plate which is tilted towards one side of the top end; a first mounting plate electrically connected to a pad of the pressure sensing circuit; and the second mounting plate is connected with a plurality of pins.

Preferably, the bottom end of the connecting seat is relatively expanded to form a flange disc, and a sealing ring is sleeved on the connecting seat; the top end of the shell is rolled inwards to form a curled edge, and the sealing ring is pressed on the flange disc towards one side of the bottom end of the curled edge; the flange plate stops on the top end of the second support towards the bottom end; the pin is embedded and fixed on the connecting seat.

The utility model discloses a thick film pressure sensing head, it is through separating leading-in passageway into two leading-in chambeies to correspondingly measure the deflection of elastic metal diaphragm's two parts respectively through two pressure sensing circuit. The pressure sensing circuit can be manufactured by the original screen printing process at one time, so that the cost is slightly increased. Through the redundancy design, the utility model discloses can avoid the inefficacy problem of pressure sensing circuit to a great extent under the prerequisite that this a small amount of promotion of manufacturing, improve the life and the reliability of sensor.

Drawings

FIG. 1 is a perspective view of a thick film pressure sensitive head of a preferred embodiment;

FIG. 2 is an exploded view of a thick film pressure sensitive head of a preferred embodiment;

FIG. 3 is a top view of a thick film pressure sensitive head of a preferred embodiment;

FIG. 4 isbase:Sub>A plan cross-sectional view ofbase:Sub>A preferred embodiment thick film pressure sensitive head taken along A-A shown in FIG. 3;

FIG. 5 is a schematic view of the interlayer structure of a pressure sensitive component of a preferred embodiment;

FIG. 6 is a perspective view of another preferred embodiment thick film pressure sensitive head;

FIG. 7 is a top view of another preferred embodiment of a thick film pressure sensitive head;

FIG. 8 isbase:Sub>A plan cross-sectional view of another preferred embodiment ofbase:Sub>A thick film pressure sensitive head taken along A-A shown in FIG. 2;

FIG. 9 is a top view of a portion of another preferred embodiment of a pressure sensing assembly;

FIG. 10 is a top view of a portion of a pressure sensing assembly in accordance with yet another preferred embodiment;

FIG. 11 is a perspective view of a preferred embodiment pressure sensor;

FIG. 12 is a top view of a preferred embodiment pressure sensor;

FIG. 13 is a plan sectional view of a preferred embodiment of the pressure sensor taken along B-B shown in FIG. 7;

FIG. 14 is a perspective cross-sectional view (with portions broken away) of a preferred embodiment pressure sensor taken along B-B shown in FIG. 7;

FIG. 15 is a perspective view of a first support of a preferred embodiment;

FIG. 16 is a perspective view of a second support member of a preferred embodiment;

FIG. 17 is a perspective view of a circuit board of a preferred embodiment;

FIG. 18 is a perspective view of a preferred embodiment protective head;

in the figure: 1. a metal cylinder; 10. a connecting seat; 100. a thick film pressure sensitive head; 101. an elastic metal diaphragm; 102. an isolation trench; 103. a mating connection portion; 104. supporting the step surface; 105. a first support surface; 106. a sealing groove; 107. a lead-in channel; 107a, a first introduction cavity; 107b, a second introduction cavity; 108. a partition plate; 109. a circumferential positioning structure; 109a, positioning cutting grooves; 11. a protective head; 110. a flange plate; 111. a columnar head; 112. a recess; 113. a support leg; 114. inserting a core; 117. positioning the blind hole; 115. a gap; 116. positioning and trimming; 12. a second support member; 120. a second support leg; 120a, edges; 130. a support leg positioning notch; 2. a housing; 201. curling; 3. a first support member; 301. a support plate; 302. a first support leg plate; 303. a abdication gap; 304. a positioning column; 4. a dielectric layer; 5. a pressure sensing assembly; 50. a pressure sensing circuit; 501. a first resistor; 502. a second resistor; 503. a third resistor; 504. a fourth resistor; 505. a thermistor; 506. a conductor; 50a, a first pad; 50b, a second pad; 50c, a third pad; 50d, a fourth pad; 50e, a fifth pad; 6. a circuit board; 601. a connecting plate; 602. a first mounting plate; 603. a second mounting plate; 604. a second connecting plate; 605. a first connecting plate; 606. positioning the through hole; 607. a pin mounting hole; 7. conditioning the chip; 8. a seal ring; 9. a pin; 140. inserting holes;

Detailed Description

The technical solution of the present invention will be clearly and completely described with reference to the accompanying drawings. The following examples are illustrative only for the purpose of explaining the present invention and are not to be construed as limiting the invention. In the following description, the same reference numerals are used to designate the same or equivalent elements, and the repetitive description is omitted.

In the description of the present invention, it should be understood that the terms "upper", "lower", "inner", "outer", "left", "right", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, or orientations or positional relationships that a product of the present invention is usually placed when used, or orientations or positional relationships that a person skilled in the art usually understands, only for convenience of describing the present invention and simplifying the description, but not for indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as limiting the present invention.

In addition, the terms "mounted," "connected," and "connected" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood as appropriate by those of ordinary skill in the art.

It should be further understood that the term "and/or" as used in the present specification and the corresponding claims refers to any and all possible combinations of one or more of the listed items.

As shown in fig. 1-5. In a preferred embodiment of the present invention, the pressure sensing assembly 5 includes a dielectric layer 4, a pressure sensing circuit 50 and a layer of protective glaze 03. The pressure sensing circuit 50 covers the top of the dielectric layer 4, and has a plurality of sensing elements and a plurality of bonding pads, wherein the plurality of bonding pads include a first bonding pad 50a, and the plurality of sensing elements include a plurality of resistors 500. The sensing element and the plurality of pads are electrically connected by a conductor 506. The protective glaze 03 covers the top of the other portions of the pressure sensing circuit 50 except for the first pads 50 a. Preferably, a conductive protection layer 04 covers the top of the protective glaze 03, and the conductive protection layer 04 at least covers the sensitive element and is fixed and electrically connected with the first pad 50 a.

According to the pressure sensing assembly, the conductive protective layer is covered on the protective glaze, so that the surface of the glaze layer can be enhanced during severe contraction/stretching of the protective glaze, cracking or peeling of the glaze layer is avoided, electromagnetic interference on a pressure sensing circuit can be shielded, and the measurement accuracy is improved; in addition, the electrical connection stability of the corresponding pad can be improved.

Specifically, the protective glaze 03 may have a first covering portion 31, a first position-avoiding portion 32 and a second position-avoiding portion 30. The first cover part 31 covers the other portions of the pressure sensing circuit 50 except for the pads. The first pad 50a faces the second bit escape part 30, and the other pads face the first bit escape part 32. The first pad 50a is connected to the conductive protective layer 04 through the second bit escape portion 30. The conductive protection layer 04 may have a second covering portion 41 and a third position-giving portion 42. The second cover part 41 covers the first pad 50a and the other portions of the pressure sensing circuit 50 except for the pad. The first abdicating part 32, the third abdicating part 42 and the second abdicating part 30 may each include one or more windows opened on the protective glaze 03 and/or one or more notches formed by inward contraction of the edge of the protective glaze 03.

The plurality of resistors 500 may include a first resistor 501, a second resistor 502, a third resistor 503, and a fourth resistor 504. The first resistor 501, the second resistor 502, the third resistor 503 and the fourth resistor 504 are sequentially connected end to form a wheatstone bridge. The junctions of the first resistor 501 and the second resistor 502, the second resistor 502 and the third resistor 503, the third resistor 503 and the fourth resistor 504, and the fourth resistor 504 and the first resistor 501 are electrically connected to the first pad 50a, the second pad 50b, the third pad 50c, and the fourth pad 50d in a one-to-one correspondence. The first resistor 501 and the third resistor 503 are both piezoresistors. Preferably, the first resistor 501 and the third resistor 503 are close to each other, and the centers of the first resistor 501 and the third resistor 503 are longitudinally opposite to the center of the first lead-in cavity 107a or the second lead-in cavity 107b.

In other embodiments, the pressure sensing circuit 50 further includes a thermistor 505. The first pad 50a or the third pad 50c is electrically connected to one end of the thermistor 505. The other end of the thermistor 505 is electrically connected to a fifth land 50e.

The conductive protective layer 04 can be formed by printing a metal paste on the top of the protective glaze 03 through screen printing and then firing. The resistors and the pads are electrically connected by a conductor 506.

Please refer to fig. 1-4. The thick film pressure sensitive head 100 may include a metal can 1, a diaphragm 108, and pressure sensing circuitry 50. A longitudinally extending introduction passage 107 is provided in the metal tube 1. The bottom end of the introduction channel 107 is used for introducing the fluid to be measured, and the top end of the introduction channel 107 is sealed by the elastic metal diaphragm 101. The bottom of the medium layer 4 of the pressure sensing assembly 5 is attached and fixed on the outer side wall of the elastic metal diaphragm 101.

Referring to fig. 8-10, in other embodiments, the partition 108 is preferably disposed longitudinally in the introduction channel 107, and the top end of the partition extends to the inner side wall of the elastic metal diaphragm 101. The partition 108 partitions the introduction passage 107 laterally to form a first introduction chamber 107a and a second introduction chamber 107b. The pressure sensing assembly 5 is fixed to the outer sidewall (i.e., the top end sidewall) of the elastic metal diaphragm 101. The pressure sensing assembly 5 includes two pressure sensing circuits 50. The two pressure sensing circuits 50 are longitudinally in one-to-one correspondence with the first introduction chamber 107a and the second introduction chamber 107b, so as to output corresponding measurement signals according to the deformation of the corresponding two parts of the elastic metal diaphragm 101 under the pressure of the fluid to be measured, respectively.

The thick film pressure sensitive head of the present embodiment measures the amount of deformation of the two portions of the elastic metal diaphragm by dividing the introduction channel into two introduction chambers and correspondingly by two pressure sensing circuits, respectively. The pressure sensing circuit can be manufactured by the original screen printing process at one time, so that the cost is slightly increased. Therefore, through the redundancy design, the failure problem of the pressure sensing circuit can be avoided to a great extent on the premise that the manufacturing cost is slightly improved, and the service life and the reliability of the sensor are improved.

The measurement signal is converted into a digital signal through an analog/digital conversion module, and then the digital signal is conditioned through a conditioning circuit and then a pressure measurement result is output.

Please refer to fig. 10. In other embodiments, two pressure sensing circuits 50 may share a single thermistor 505. Thus, the manufacturing cost can be further reduced. Correspondingly, the second cover part 41 is divided into two independent areas to be respectively connected with the first pads of the two pressure sensing circuits 50.

Please refer to fig. 11-14. The utility model relates to a pressure sensor of preferred implementation, except including above-mentioned thick film pressure sensitive head 100, still include connecting seat 10, casing 2 and circuit board 6. Wherein, the connecting seat 10 is disposed on one side of the top end of the thick film pressure sensitive head 100. The connection socket 10 is connected with the thick film pressure sensitive head 100 through the housing 2. A mounting cavity is defined by the thick film pressure sensitive head 100, the connecting base 10 and the housing 2. The circuit board 6 is disposed in the mounting cavity and connected to the pressure sensing assembly 5.

The middle of the metal cylinder 1 is enlarged to form a matching connection portion 103, and the lower portion of the housing 2 is shrink-fitted on the matching connection portion 103 and is connected to a supporting step surface 104 formed on the metal cylinder 1 toward the bottom end. The upper side of the mating connection portion 103 is recessed inward to form an isolation groove 102, thereby isolating the influence of stress during mounting on the measurement result. The outer wall of the lower part of the metal cylinder 1 may be provided with a sealing groove 106, so that a sealing body is convenient to arrange when the metal cylinder is connected with a container containing a fluid to be measured.

In other embodiments, it is preferable that the middle of the metal tube 1 is provided with a circumferential positioning structure 109. Specifically, the circumferential positioning structure 109 may be a positioning notch 109a, or a straight cut edge.

Please refer to fig. 15. To facilitate the mounting of the circuit board 6, in other embodiments, the first support member 3 may be disposed within the mounting cavity. The mating connection 103 has a first support surface 105 facing the tip. The first support 3 includes a support plate 301 perpendicular to the longitudinal direction, and two ends of the support plate 301 in the first transverse direction extend out towards the bottom end side to form a first support foot plate 302 stopped on the first support surface 105.

As shown in fig. 16, a second support member 12 is provided in the mounting cavity to facilitate the connection between the connecting socket 10 and the metal cylinder 1. The top end of the second support member 12 is stopped on the bottom end of the connecting socket 10. The bottom end of the second supporting member 12 is stopped on the supporting plate 301, or more preferably, two ends of the bottom end of the second supporting member 12 along the second transverse direction respectively extend towards the bottom end to stop on the second supporting foot plate 120 on the metal cylinder 1. Wherein, the transverse first direction is vertical to the transverse second direction. Wherein, two ends of the supporting plate 301 in the second transverse direction may form an abdicating notch 303 relatively to abdicate the second supporting foot plate 120.

In other embodiments, it is preferred that the second support 12 is annular. The lateral cross-section of the second support leg plate 120 is arc-shaped. The edges 120a of the two transverse ends of the second supporting foot plate 120 inwardly abut against the flat end surface formed at the abdicating notch 303, so as to facilitate the positioning between the first supporting piece 3 and the second supporting piece 12.

As shown in fig. 17, the circuit board 6 may have a connection plate 601, a first mounting plate 602, and a second mounting plate 603 provided in this order from the top side to the bottom side. The connection plate 601 faces the first end of the isolation groove 102 in the transverse second direction from the bottom end side. The conditioning chip 7 and the analog/digital converter are fixedly connected to the first mounting plate 602. The first pad 50a is connected to a power terminal, the second pad 50b is connected to a common ground terminal, and the second pad 50b and the fourth pad 50d are connected to input terminals of the analog-to-digital converter, respectively. A plurality of pin mounting holes 607 are formed in the second mounting plate 603, and the pin mounting holes 607 are electrically connected to the bottom ends of the pins 9. In the present invention, the analog/digital converter is a dual-mode input analog/digital converter to process the signals measured by the two pressure sensing circuits 50 respectively.

A first end of the connecting plate 601 in the transverse second direction is fixedly connected to the top end face of the elastic metal diaphragm 101. The first mounting plate 602 is connected to the first end of the second mounting plate 603 along the second transverse direction by a second longitudinal connecting plate 604. A second end of the elastic metal diaphragm 101 in the transverse second direction is connected to a corresponding end of the first mounting plate 602 by a first connection plate 605 tilted to the top end side. The first mounting plate 602 is electrically connected to pads of the pressure sensing circuit 50. A plurality of pins 9 are attached to the second mounting plate 603.

In other embodiments, the first mounting plate 602 may have a positioning through hole 606, and the supporting plate 301 may have a positioning post 304 fixed thereon, and the positioning post 304 is disposed in the positioning through hole 606.

In other embodiments, it is preferred that the bottom end of the coupling socket 10 is relatively enlarged to form a flange plate 110. The connecting seat 10 is sleeved with a sealing ring 8. The top end of the housing 2 is rolled inward to form a rolled edge 201. The bottom-facing side of the bead 201 presses the sealing ring 8 against the flange 110. The flange 110 stops on the top end of the second support 12 towards the bottom end. The pin 9 is embedded on the connecting seat 10.

Referring to fig. 18, in other embodiments, it is preferable that a protection head 11 is fixed on the top end of the connection base 10. Specifically, the top end of the connecting base 10 is provided with an inserting hole 140 (as shown in fig. 13). The protective head 11 comprises a longitudinally extending cylindrical head 111. The bottom end of the column head 111 correspondingly extends out of a ferrule 114. The ferrule 114 is correspondingly inserted into the insertion hole 140. The bottom end periphery of the column head 111 is protruded toward the bottom end side to form a plurality of legs 113 spaced in the circumferential direction. The top end of the periphery of the connecting base 10 forms a plurality of leg positioning notches 130 for correspondingly accommodating the legs 113. The tip periphery of the cylindrical head 111 is recessed inwardly to form a plurality of circumferentially spaced recesses 112. The pin 9 is inserted through the columnar head 111 and is passed out from a through hole formed in the bottom of the concave portion 112 toward the tip side. The center of the top end of the columnar head 111 is provided with a positioning blind hole 117, and a positioning trimming 116 is formed on the outer wall of the columnar head 111, so that the columnar head can be conveniently connected and positioned with external equipment.

Preferably, the center of the ferrule 114 forms a gap 115, and the gap 115 divides the ferrule 114 in half. In this manner, the ferrule 114 can be made somewhat flexible to facilitate a mating connection with the mating opening 140.

The scope of the present disclosure is defined not by the detailed description but by the claims and their equivalents, and all modifications within the scope of the claims and their equivalents are to be construed as being included in the present disclosure.

Claims (10)

1. A thick film pressure sensitive head, comprising:

the device comprises a metal cylinder (1), wherein a longitudinally extending leading-in channel (107) with the bottom end used for leading in a fluid to be detected is arranged in the metal cylinder, and an elastic metal membrane (101) is sealed and blocked at the top end of the leading-in channel (107);

a partition plate (108) longitudinally arranged in the introduction channel (107), wherein one end of the partition plate (108) extends to the inner side wall of the elastic metal diaphragm (101) and transversely divides the introduction channel (107) into a first introduction cavity (107 a) and a second introduction cavity (107 b); and

the pressure sensing assembly (5) is fixed on the outer side wall of the elastic metal diaphragm (101), the pressure sensing assembly (5) comprises two pressure sensing circuits (50), and the two pressure sensing circuits (50) are longitudinally in one-to-one correspondence with the first leading-in cavity (107 a) and the second leading-in cavity (107 b).

2. The thick film pressure sensitive head of claim 1, wherein the pressure sensing circuit (50) comprises a wheatstone bridge of a first resistor (501), a second resistor (502), a third resistor (503), and a fourth resistor (504) connected end-to-end in sequence; the joints of the first resistor (501) and the second resistor (502), the second resistor (502) and the third resistor (503), the third resistor (503) and the fourth resistor (504), and the fourth resistor (504) and the first resistor (501) are electrically connected to the first bonding pad (50 a), the second bonding pad (50 b), the third bonding pad (50 c) and the fourth bonding pad (50 d) in a one-to-one correspondence manner; the first resistor (501) and the third resistor (503) are both piezoresistors.

3. The thick film pressure sensitive head of claim 2, wherein the pressure sensing circuit (50) further comprises a thermistor (505), the first pad (50 a) or the third pad (50 c) being electrically connected to one end of the thermistor (505), the other end of the thermistor (505) being electrically connected to the fifth pad (50 e).

4. The thick film pressure sensitive head of claim 3, wherein two of said pressure sensing circuits (50) share one of said thermistors (505).

5. The thick-film pressure sensitive head according to claim 2, wherein the first (501) and third (503) resistors are close together with their centers longitudinally aligned with the centers of the first (107 a) or second (107 b) lead-in chambers, respectively.

6. A pressure sensor, comprising:

the thick film pressure sensitive head (100) of any of claims 1 to 5;

the connecting seat (10) is arranged on one side of the top end of the thick film pressure sensitive head (100);

the shell (2) is connected with the connecting seat (10) and the thick film pressure sensitive head (100), and an installation cavity is defined among the thick film pressure sensitive head (100), the connecting seat (10) and the shell (2); and

and the circuit board (6) is arranged in the mounting cavity and is connected with the pressure sensing assembly (5).

7. A pressure sensor according to claim 6, characterized in that a first support (3) for mounting the circuit board (6) is arranged in the mounting cavity; the first supporting piece (3) comprises a supporting plate (301) perpendicular to the longitudinal direction, two ends of the supporting plate (301) in the transverse first direction respectively extend towards one side of the bottom end to stop the first supporting foot plate (302) on the metal cylinder (1), and two ends of the supporting plate (301) in the transverse second direction are opposite to form a yielding notch (303); the transverse first direction is perpendicular to the transverse second direction.

8. The pressure sensor according to claim 7, wherein a second supporting member (12) is disposed in the mounting cavity, and the top end thereof is stopped on the bottom end of the connecting base (10), the bottom end thereof is stopped on the supporting plate (301) or both ends of the bottom end thereof along the second transverse direction respectively extend out toward the bottom end and are stopped on the second supporting foot plate (120) on the metal cylinder (1).

9. The pressure sensor according to claim 8, wherein the circuit board (6) has a connecting plate (601), a first mounting plate (602) and a second mounting plate (603) arranged in sequence from the top side to the bottom side, the middle part of the metal cylinder (1) is enlarged to form a fitting connecting part (103), the lower part of the housing (2) is sleeved on the fitting connecting part (103) in an interference manner, and is connected to a supporting step surface (104) formed on the metal cylinder (1) towards the bottom end; the upper side of the matching connecting part (103) is inwards sunken to form an isolation groove (102); the connecting plate (601) faces a first end of the isolation groove (102) along the transverse second direction from a bottom end side; a first end of the connecting plate (601) along the transverse second direction is fixedly connected to the top end face of the elastic metal diaphragm (101), and the first mounting plate (602) and a first end of the second mounting plate (603) along the transverse second direction are connected through a longitudinal second connecting plate (604); a second end of the elastic metal diaphragm (101) along the transverse second direction is connected with a corresponding end of the first mounting plate (602) through a first connecting plate (605) tilting towards one side of the top end; a first mounting plate (602) electrically connected to pads of the pressure sensing circuit (50); the second mounting plate (603) is connected with a plurality of pins (9).

10. The pressure sensor according to claim 9, wherein the bottom end of the connecting base (10) is relatively enlarged to form a flange disc (110), and a sealing ring (8) is sleeved on the connecting base (10); the top end of the shell (2) is rolled inwards to form a curled edge (201), and one side of the curled edge (201) facing the bottom end presses the sealing ring (8) on the flange disc (110); the flange disc (110) stops on the top end of the second support (12) towards the bottom end; the pin (9) is embedded and fixed on the connecting seat (10).

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