CN218451093U

CN218451093U - Flexible circuit board structure for reducing magnetic field interference of semiconductor device

Info

Publication number: CN218451093U
Application number: CN202222588340.3U
Authority: CN
Inventors: 王奇
Original assignee: Dongguan Huabei Electronic Technology Co Ltd
Current assignee: Dongguan Huabei Electronic Technology Co Ltd
Priority date: 2022-09-28
Filing date: 2022-09-28
Publication date: 2023-02-03
Anticipated expiration: 2032-09-28

Abstract

The utility model relates to the technical field of flexible circuit boards, and discloses a flexible circuit board structure for reducing magnetic field interference of a semiconductor device, which comprises a flexible circuit board main body and a shielding component; the flexible circuit board main body is provided with a pin part which is used for being mutually bound with the display screen; the shielding component includes integrative connecting portion and the shielding part that links to each other, connecting portion and flexible circuit board main part structure as an organic whole, the shielding part is used for covering semiconductor device's surface, when pin portion and semiconductor device on this technical scheme's the flexible circuit board main part bind each other, the surface at semiconductor device also can be covered to the shielding part on the shielding component to accomplish binding and the production technology of shielding of semiconductor device simultaneously, this technical scheme still has seted up stress release hole at the junction of connecting portion and shielding part, makes the internal stress of the junction of connecting portion and shielding part obtain reducing, thereby reduce the pulling force that shielding part applyed to pin portion, avoid binding badly.

Description

Flexible circuit board structure for reducing magnetic field interference of semiconductor device

Technical Field

The utility model relates to a technical field of flexible circuit board especially relates to a reduce flexible circuit board structure of semiconductor device magnetic field interference.

Background

Referring to fig. 1, the conventional display screen 91 has an IC control chip 92 and a flexible circuit board 93 (also called FPC), the IC is a control unit, the FPC includes a circuit and an electronic device, the IC control chip 92 generates a magnetic field during operation, and the generated magnetic field affects a radio frequency signal emitted by the radio frequency device, thereby affecting the performance of the radio frequency device.

In view of the above, referring to fig. 1 to 3 together, a composite copper foil 94 for shielding is usually designed separately in the prior art, and the composite copper foil 94 includes an outer layer of insulating tape 941, a copper foil 942, and an inner layer of insulating tape 943 stacked in sequence, where the inner layer of insulating tape 943 is used to prevent the IC control chip 92 of the copper foil 942 from short-circuiting, the copper foil 942 plays a role of shielding, so that the magnetic field generated by the IC control chip 92 does not seriously affect the rf signal, and the outer layer of insulating tape 941 plays a role of protecting the copper foil 942 and preventing the copper foil 942 from electrically connecting with other circuits. The composite copper foil 94 needs to be manufactured by using a jig, and has the problems of long manufacturing period and high production cost, in addition, in order to realize the binding and shielding functions of the IC control chip 92, secondary operation is needed when the existing composite copper foil 94 is adopted, specifically, during assembly, the flexible circuit board 93 and the IC control chip 92 need to be bound on the display screen 91, and then the composite copper foil 94 is attached to the IC control chip 92 and the flexible circuit board 93.

In summary, the electronic product using the conventional composite copper foil 94 has the technical disadvantages of low production efficiency and high production cost.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a reduce semiconductor device magnetic field interference's flexible circuit board structure mainly solves prior art and because adopt composite copper foil to lead to having the technical problem that production efficiency is low and manufacturing cost is high when realizing that flexible circuit board binds and shielding function.

To achieve the purpose, the utility model adopts the following technical proposal:

a flexible circuit board structure for reducing magnetic field interference of a semiconductor device, the semiconductor device capable of generating a magnetic field during operation, the flexible circuit board structure comprising:

the flexible circuit board main body is provided with a pin part which is used for being mutually bound with the display screen;

the shielding component comprises a connecting part and a shielding part which are connected integrally, the connecting part and the flexible circuit board main body are of an integral structure, the shielding part is used for covering the surface of the semiconductor device, and a stress release hole is formed in the connecting part and the shielding part.

In one embodiment, the shielding part is arranged adjacent to the pin part, and one end of the shielding part facing the pin part is provided with a cutting line which extends into the stress release hole.

In one embodiment, the shield member has two connecting portions, one of the connecting portions is connected to one end of the shield portion along the length direction, the other connecting portion is connected to the other end of the shield portion along the length direction, the stress release holes are formed at the connecting positions of the two connecting portions and the shield portion, and the cutting line extends into the two stress release holes.

In one embodiment, the flexible circuit board main body comprises a first base layer and a conductive layer laid on the first base layer, the conductive layer is provided with conductive circuits, the pin parts are connected with the conductive circuits, and the connecting parts and the first base layer are of an integral structure.

In one embodiment, the shielding member comprises a second base layer and a shielding layer laid on one side or two sides of the second base layer, and the second base layer in the connecting part and the first base layer are of an integral structure.

In one embodiment, the shielding layer in the connecting part and the conductive layer are of an integral structure.

In one embodiment, the shielding member further comprises a protective layer adhered to a side of the shielding layer facing away from the second base layer.

In one embodiment, the flexible circuit board main body further comprises a copper layer laid on the surface of the first base layer, which faces away from the conductive layer; and protective layers are bonded to one surface of the copper layer, which is back to the first base layer, and one surface of the conductive layer, which is back to the first base layer.

In one embodiment, the first base layer is provided with a windowing groove at a position back to the conductive layer, the windowing groove is close to the pin part, and the first base layer is exposed out of the groove bottom.

In one embodiment, a shielding element for shielding part of the conductive circuit is arranged in the windowing groove.

Compared with the prior art, the utility model provides a reduce flexible circuit board structure of semiconductor device magnetic field interference has following beneficial effect at least:

according to the technical scheme, when the flexible circuit board is designed, the flexible circuit board is configured to comprise a flexible circuit board main body and a shielding component, pin parts used for being mutually bound with a display screen are arranged on the flexible circuit board main body, the shielding component is also configured to comprise a connecting part and a shielding part which are connected, and the connecting part and the flexible circuit board are configured into an integral structure design;

in practical use, because the shielding component and the flexible circuit board main body are integrally connected, when the pin part on the flexible circuit board main body and the display screen are bound with each other, the shielding part on the shielding component can also cover the surface of a semiconductor device (such as an IC control chip), thereby simultaneously completing the production process of binding and shielding the flexible circuit board. In addition, bind the completion back each other at flexible circuit board main part and display screen, because semiconductor device has certain height, so connecting portion and cover have certain height drop between the shielding part on semiconductor device surface, consequently, this technical scheme has still seted up stress release hole at the junction of connecting portion and shielding part for the internal stress of the junction of connecting portion and shielding part obtains reducing, thereby avoid the shielding part to apply great pulling force to pin portion, promptly, ensure to bind the accuracy of location, the reliability that very high pin portion and semiconductor device bound.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the description below are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without inventive labor.

Fig. 1 is a schematic structural diagram of a conventional flexible circuit board and a display screen bonded to each other;

FIG. 2 is a schematic view of the structure of FIG. 1 after a piece of composite copper foil is attached;

FIG. 3 is a schematic view showing an internal structure of a conventional composite copper foil for shielding an IC control chip;

fig. 4 is a schematic structural diagram of a flexible circuit board structure for reducing magnetic field interference of a semiconductor device according to an embodiment of the present disclosure;

FIG. 5 isbase:Sub>A first cross-sectional view taken at A-A of FIG. 4;

FIG. 6 is a schematic structural diagram of the flexible circuit board structure and the display screen shown in FIG. 4 after being bonded to each other;

FIG. 7 is an enlarged view of a portion of FIG. 6 at A;

FIG. 8 isbase:Sub>A second cross-sectional view taken at A-A of FIG. 4;

FIG. 9 isbase:Sub>A third cross-sectional view taken at A-A of FIG. 4;

fig. 10 isbase:Sub>A fourth cross-sectional view taken atbase:Sub>A-base:Sub>A in fig. 4.

Wherein, in the figures, the respective reference numerals:

10. a flexible circuit board main body; 101. a first base layer; 102. a conductive layer; 1021. a lead part; 103. a copper layer; 104. a glue layer; 105. a protective layer; 106. windowing a groove; 107. a shielding element;

20. a shielding member; 201. a second base layer; 202. a shielding layer; 203. a connecting portion; 204. a shielding part; 205. a stress release hole; 206. cutting lines;

30. a semiconductor device; 40. a square frame;

91. a display screen; 92. an IC control chip; 93. a flexible circuit board; 94. compounding copper foil; 941. an outer layer of insulating tape; 942. copper foil; 943. the inner layer is an insulating tape.

Detailed Description

In order to make the technical problems, technical solutions and advantageous effects to be solved by the present application clearer, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.

It will be understood that the terms "upper," "lower," "top," "bottom," "inner," "outer," and the like are used in the orientation or positional relationship indicated in the drawings for convenience in describing the present application and for simplicity in description, and do not indicate or imply that the referenced devices or elements must be in a particular orientation, constructed and operated in a particular orientation, and therefore should not be considered limiting to the present application.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.

In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail with reference to the accompanying drawings and embodiments.

Referring to fig. 4 and 5, the present embodiment provides a flexible circuit board structure for reducing magnetic field interference of a semiconductor device, the flexible circuit board structure includes a flexible circuit board main body 10 and a shielding member 20 integrally connected, a block 40 shown in fig. 5 indicates a position of the shielding member 20, and the flexible circuit board main body 10 is located below the block 40 shown in fig. 5.

Referring to fig. 5, the flexible circuit board body 10 includes a first base layer 101, a conductive layer 102 and a copper layer 103, wherein the conductive layer 102 is disposed on one side of the first base layer 101, the copper layer 103 is disposed on the other side of the first base layer 101 opposite to the conductive layer 102, and a glue layer 104 and a protective layer 105 are respectively disposed on one side of the conductive layer 102 opposite to the first base layer 101 and one side of the copper layer 103 opposite to the first base layer 101.

Referring to fig. 5, the first base layer 101 is made of a PI material, and the PI is polyimide, which has various properties, such as high temperature resistance, good abrasion resistance, and good insulation. The first base layer 101 mainly serves to reinforce and thicken the conductive layer 102, mainly because it is very thin and not enough to support the glue layer 104 and the protective layer 105 alone. In other embodiments, the first substrate 101 may be made of PET, FR4 or ET.

Referring to fig. 5, the conductive layer 102 is also a conventional conductive layer 102, the main material of the conductive layer 102 is copper, the conductive layer 102 includes a conductive circuit and a lead portion 1021 electrically connected to the conductive circuit, and the lead portion 1021 is used for bonding with a display panel.

Referring to fig. 5, the copper layer 103 may also be provided with a conductive trace, so that the flexible circuit board main body 10 forms a circuit board with two conductive surfaces, and when the copper layer 103 is not provided with a conductive trace, the copper layer 103 plays a role of shielding the conductive layer 102, so that the conductive layer 102 and external electronic components are not interfered with each other.

Referring to fig. 5, the adhesive layer 104 functions as an adhesive layer 105, the protective layer 105 functions as a protective layer for the conductive layer 102 or the copper layer 103 or functions to prevent the conductive layer 102 or the copper layer 103 from short-circuiting with an external circuit, and the protective layer 105 may also be made of PI material.

Referring to fig. 4 and 5, a windowing groove 106 is formed in the flexible circuit board main body 10, the windowing groove 106 is disposed at a side of the first base layer 101 opposite to the conductive layer 102, the windowing groove 106 is close to the lead portion 1021, and the bottom of the groove is exposed out of the first base layer 101, the windowing groove 106 is used for increasing flexibility around the lead portion 1021, so that the flexible circuit board structure is easier to bend.

Referring to fig. 4, a shielding element 107 is disposed in the window groove 106, and the shielding element 107 is used for shielding the MIPI circuit of the conductive circuit inside the conductive layer 102.

Referring to fig. 5, from the perspective of the structural layer, the shielding member 20 includes a second base layer 201 and a shielding layer 202 laid on both sides of the second base layer 201. Preferably, the side of the shielding layer 202 facing away from the second base layer 201 is adhered with the protective layer 105.

Referring to fig. 4, from the viewpoint of functional division, the shielding member 20 includes two connecting portions 203 and two shielding portions 204, and the two connecting portions 203 are integrally connected to the flexible circuit board main body 10. Referring to fig. 7, the shielding portion 204 is used to cover the surface of the semiconductor device 30 to reduce the interference of the magnetic field generated by the semiconductor device 30 to the radio frequency signal. Specifically, referring to fig. 4 and 5, the second base layer 201 inside the connection portion 203 and the first base layer 101 inside the flexible circuit board main body 10 are integrated, and preferably, the shielding layer 202 inside the connection portion 203 and the conductive layer 102 or the copper layer 103 inside the flexible circuit board main body 10 are also integrated.

Referring to fig. 8, in another embodiment, the shielding layer 202 may be disposed on one side of the second substrate 201, referring to fig. 9, in another embodiment, the shielding layer 202 may be disposed on the other side of the second substrate 201.

Referring to fig. 10, according to the specific requirements of the shielding, the shielding layer 202 inside the connecting portion 203 may be made of other shielding materials, and in this case, the shielding layer 202 is not integrated with the conductive layer 102 or the copper layer 103 inside the flexible circuit board main body 10.

Referring to fig. 7, in actual use, since the shielding member 20 and the flexible circuit board main body 10 are integrally connected, when the pin portion 1021 on the flexible circuit board main body 10 and the display screen are bound to each other, the shielding portion 204 on the shielding member 20 can also cover the surface of the semiconductor device 30 (such as an IC control chip), thereby completing the binding and shielding production process of the semiconductor device 30 at the same time.

After the flexible circuit board main body 10 and the display screen are bound to each other, since the semiconductor device 30 has a certain height, a certain height difference exists between the connecting portion 203 and the shielding portion 204 covering the surface of the semiconductor device 30, although the shielding member 20 is flexible, at this time, the connecting portion 203 still receives a large pulling internal stress applied by the shielding portion 204, and since the connecting portion 203 on the shielding member 20 and the flexible circuit board main body 10 are integrally connected, a pulling force applied by the shielding portion 204 on the connecting portion 203 will be transmitted to the pin portion 1021 in the flexible circuit board main body 10, and at this time, the pin portion 1021 in the flexible circuit board main body 10 and the display screen 91 are bound to be deviated or unstable.

In view of the above, referring to fig. 4 to fig. 7, a stress release hole 205 is formed at a connection portion of the connecting portion 203 and the shielding portion 204 in the shielding member 20, so that an internal stress at the connection portion of the connecting portion 203 and the shielding portion 204 is reduced, thereby preventing the shielding portion 204 from applying a large pulling force to the pin portion 1021. Moreover, the shielding part 204 and the lead part 1021 of the present technical solution are arranged adjacently, so that the present embodiment further provides a cutting line 206 at one end of the shielding part 204 facing the lead part 1021, and the cutting line 206 extends into the two stress releasing holes 205, so that the internal stress at the connection part of the connecting part 203 and the shielding part 204 is further reduced, and it is ensured that the lead part 1021 does not separate from the display screen after the binding is completed, thereby improving the reliability of the mutual binding between the lead part 1021 and the display screen.

In conclusion, according to the technical scheme of the embodiment, on the premise of realizing the binding and shielding functions of the semiconductor device 30, the existing composite copper foil is not needed, so that the production efficiency of the product is improved, and meanwhile, the production cost is reduced.

The foregoing is considered as illustrative only of the preferred embodiments of the invention, and not as limiting the scope of the invention in any way. Any modifications, equivalents and improvements made within the spirit and principles of the invention and other embodiments of the invention without the creative effort of those skilled in the art are intended to be included within the protection scope of the invention.

Claims

1. A flexible circuit board structure for reducing magnetic field interference of a semiconductor device, the semiconductor device being capable of generating a magnetic field during operation, the flexible circuit board structure comprising:

the shielding component comprises a connecting part and a shielding part which are connected integrally, the connecting part and the flexible circuit board main body are of an integral structure, the shielding part is used for covering the surface of the semiconductor device, and a stress release hole is formed in the joint of the connecting part and the shielding part.

2. The flexible circuit board structure for reducing magnetic field interference of a semiconductor device according to claim 1, wherein the shielding portion is disposed adjacent to the lead portion, and one end of the shielding portion facing the lead portion is provided with a trimming line, the trimming line extending into the stress relief hole.

3. The flexible circuit board structure for reducing magnetic field interference of semiconductor device according to claim 2, wherein the shield member has two connecting portions, one of the connecting portions is connected to one end of the shield portion along the length direction, the other connecting portion is connected to the other end of the shield portion along the length direction, the stress releasing holes are formed at the connecting portions of the two connecting portions and the shield portion, and the cutting line extends into the two stress releasing holes.

4. The flexible circuit board structure for reducing magnetic field interference of semiconductor device according to claim 1, wherein the flexible circuit board body comprises a first base layer and a conductive layer laid on the first base layer, the conductive layer has conductive traces thereon, the pin portion is connected to the conductive traces, and the connecting portion and the first base layer are of an integral structure.

5. The flexible circuit board structure for reducing magnetic field interference of semiconductor device according to claim 4, wherein the shielding member comprises a second base layer and a shielding layer laid on one or both surfaces of the second base layer, and the second base layer in the connecting portion is integrated with the first base layer.

6. The flexible circuit board structure for reducing magnetic field interference of a semiconductor device according to claim 5, wherein the shielding layer in the connecting portion is of an integral structure with the conductive layer.

7. The flexible circuit board structure for reducing magnetic field interference of a semiconductor device according to claim 5, wherein said shielding member further comprises a protective layer adhered to a side of said shielding layer opposite to said second base layer.

8. The flexible circuit board structure for reducing magnetic field interference of semiconductor device according to claim 4, wherein said flexible circuit board body further comprises a copper layer laid on a surface of said first base layer facing away from said conductive layer; and a protective layer is bonded on one surface of the copper layer, which is back to the first base layer, and one surface of the conductive layer, which is back to the first base layer.

9. The flexible circuit board structure for reducing magnetic field interference of a semiconductor device according to claim 8, wherein the first base layer is provided with a window groove at a position facing away from the conductive layer, the window groove is close to the lead portion, and the first base layer is exposed at the bottom of the groove.

10. The flexible circuit board structure for reducing magnetic field interference of semiconductor device according to claim 9, wherein a shielding element for shielding a portion of said conductive trace is disposed in said window groove.