CN218450690U

CN218450690U - High temperature resistant PCBA mainboard for intelligence audio amplifier

Info

Publication number: CN218450690U
Application number: CN202222683747.4U
Authority: CN
Inventors: 李志军; 黄定洪
Original assignee: Shenzhen Hanfeng Electronics Co ltd
Current assignee: Shenzhen Hanfeng Electronics Co ltd
Priority date: 2022-10-12
Filing date: 2022-10-12
Publication date: 2023-02-03
Anticipated expiration: 2032-10-12

Abstract

The utility model discloses an intelligence audio amplifier is with high temperature resistant PCBA mainboard, including the mainboard body, be equipped with components and parts installing zone, fixed orifices and slotted hole on the mainboard body, the slotted hole distributes in the outside of components and parts installing zone, the gomphosis has radiator unit in the slotted hole, radiator unit comprises screen cover, heat dissipation cover, micro motor, heat dissipation fan and hou gai, screen cover and hou gai are respectively through the screw fixation on the both ends cover mouth of heat dissipation cover. Be equipped with independent components and parts installing zone and radiating area on this PCBA mainboard, be equipped with radiator unit in the slotted hole of radiating area, adopt the hidden structure of gomphosis between this radiator unit and the slotted hole, through the radiator unit of different positions, can effectually carry out the continuation heat dissipation to electronic components on the mainboard to reach PCBA mainboard and the mesh of point components and parts high temperature resistance, the effectual normal operating who guarantees PCBA mainboard and electronic components, improved PCBA mainboard and electronic components's life.

Description

High temperature resistant PCBA mainboard for intelligence audio amplifier

Technical Field

The utility model relates to a PCBA mainboard technical field specifically is a high temperature resistant PCBA mainboard for intelligent audio amplifier.

Background

The main board of the sound box is a main component formed by the sound box, and comprises an audio amplification chip, a power supply chip and the like, so that the functions of digital signal processing, analog conversion … … and the like are realized, the main board of the sound box is a PCBA main board, and the PCBA main board is a finished product circuit board after electronic elements are processed or welded on the PCB board through an SMT (surface mounted technology) loading process and a whole process of a DIP (dual in-line package) plug-in unit.

Because install the electronic components of multiple different grade type on the PCBA mainboard, at the in-process that the PCBA mainboard used, electronic components's operation can produce the heat certainly, cause the mainboard high temperature, electronic components is under long-term high temperature condition operation, cause electronic components's ageing very easily, damage even, simultaneously, present PCBA mainboard is mostly integration unistructure mainboard, do not have relevant radiating component, consequently, the short problem of PCBA mainboard and electronic components life appears easily. For this reason, a corresponding technical scheme needs to be designed for solution.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

The utility model provides a not enough to prior art, the utility model provides an intelligence high temperature resistant PCBA mainboard for audio amplifier has solved integration unistructure mainboard, and mainboard and electronic components cause ageing, the damage of electronic components very much under long-term high temperature condition operation, influence mainboard and electronic components life's problem.

(II) technical scheme

In order to achieve the above purpose, the utility model discloses a following technical scheme realizes: the utility model provides an intelligence high temperature resistant PCBA mainboard for audio amplifier, the embodiment of the utility model provides a technical scheme: the utility model provides an intelligence is high temperature resistant PCBA mainboard for audio amplifier, includes the mainboard body, be equipped with components and parts installing zone, fixed orifices and slotted hole on the mainboard body, the slotted hole distributes in the outside of components and parts installing zone, the gomphosis has radiator unit in the slotted hole, radiator unit comprises screen cover, heat exchanger, micro motor, heat dissipation fan and hou gai, screen cover and hou gai respectively through the screw fixation on the both ends cover mouth of heat exchanger, micro motor and heat dissipation fan all are located the heat exchanger, micro motor covers after passing through the screw fixation, the heat dissipation fan is connected on micro motor's transmission end, be connected with the flexible subassembly of rotation on the heat exchanger both sides outer wall, radiator unit connects in the slotted hole through rotating flexible subassembly.

Preferably, the rotating telescopic assembly comprises a rotating buckle and a telescopic rod, and the rotating end of the rotating buckle is connected with the outer wall of the heat dissipation cover.

Preferably, the telescopic link is the multistage telescopic link, the flexible end of telescopic link is integrated structure with the knot body of rotatory knot, be equipped with the bulb on the stiff end outer wall of telescopic link, the bulb is integrated structure with the telescopic link.

Preferably, the inner wall of the groove hole is provided with a ball groove, and the ball groove is connected with the ball head in an embedded mode.

Preferably, the rear cover is provided with a separation net, a motor fixing plate is welded on the middle net body of the separation net, and a motor fixing hole and a circuit through hole are formed in the motor fixing plate.

Preferably, a circuit series connection mode is adopted between micro motors of the heat dissipation assemblies distributed on the outer sides of the component mounting areas, and the circuits connected in series between the micro motors are connected to a power supply interface in the component mounting areas.

(III) advantageous effects

1. Be equipped with independent components and parts installing zone and radiating area on this PCBA mainboard, be equipped with radiator unit in the slotted hole of radiating area, adopt the hidden structure of gomphosis between this radiator unit and the slotted hole, gomphosis through expansion bracket cooperation bulb and ball groove rotates, can expand radiator unit and adjust radiator unit's heat dissipation position, radiator unit's micro motor adopts the series connection mode with mainboard power source interface simultaneously, after the mainboard connection power, micro motor will drive the heat dissipation fan and rotate, therefore, radiator unit through different positions, can effectually carry out the continuation heat dissipation to electronic components on the mainboard, thereby reach PCBA mainboard and the mesh of some components and parts high temperature resistance, the effectual normal operating who guarantees PCBA mainboard and electronic components, PCBA mainboard and electronic components's life has been improved.

2. This heat dissipation component on PCBA mainboard adopts the hidden structure of accomodating/expansion, when the PCBA mainboard was idle, can hide heat dissipation component in the slot hole, does not occupy the usage space of PCBA mainboard.

Drawings

FIG. 1 is a schematic view of the PCBA main board of the present invention;

FIG. 2 is a schematic view of a local structure of the PCBA motherboard of the present invention;

FIG. 3 is a schematic structural view of the heat dissipation assembly of the present invention;

fig. 4 is an exploded view of the whole heat dissipating module of the present invention;

FIG. 5 is a schematic view of the structure of the heat dissipation cover of the present invention;

fig. 6 is a schematic view of the structure of the slot of the present invention.

In the figure, 1-main board body;

2, a component mounting area;

3-fixing holes;

4-a slot;

5-heat dissipation assembly, 501-mesh cover, 502-heat dissipation cover, 503-micro motor, 504-heat dissipation fan, 505-rear cover, 506-rotating buckle, 507-telescopic rod, 508-bulb;

6-ball groove.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-6, an embodiment of the present invention provides a technical solution: a high-temperature-resistant PCBA mainboard for an intelligent sound box comprises a mainboard body 1, a component mounting area 2, a fixing hole 3 and a slotted hole 4 are arranged on the mainboard body 1, the slotted hole 4 is distributed on the outer side of the component mounting area 2, a heat dissipation component 5 is embedded in the slotted hole 4, the heat dissipation component 5 is composed of a net cover 501, a heat dissipation cover 502, a micro motor 503, a heat dissipation fan 504 and a rear cover 505, the net cover 501 and the rear cover 505 are fixed on two end cover openings of the heat dissipation cover 502 through screws respectively, the micro motor 503 and the heat dissipation fan 504 are both located in the heat dissipation cover 502, the micro motor 503 is fixed on the rear cover 505 through screws, the heat dissipation fan 504 is connected to a transmission end of the micro motor 503, rotary telescopic components are connected to the outer walls of two sides of the heat dissipation cover 502, and the heat dissipation component 5 is connected to the slotted hole 4 through the rotary telescopic components;

further, the rotating telescopic assembly comprises a rotating buckle 506 and a telescopic rod 507, and the rotating end of the rotating buckle 506 is connected with the outer wall of the heat dissipation cover 502;

according to the above description, it is further explained that the rotating buckle 506 mainly provides rotation for the heat dissipation cover 502, so as to adjust the position of the whole heat dissipation assembly, facilitate the accommodation of the heat dissipation assembly 5 in the slot 4, and facilitate the adjustment of the position of the heat dissipation assembly 5 after being unfolded;

further, the telescopic rod 507 is a multi-section telescopic rod, the telescopic end of the telescopic rod 507 and the buckle body of the rotating buckle 506 are in an integrated structure, a ball head 508 is arranged on the outer wall of the fixed end of the telescopic rod 507, and the ball head 508 and the telescopic rod 507 are in an integrated structure;

according to the above description, it is further explained that the telescopic rod 507 with a multi-section structure can effectively reduce the length of the rod body after being stored, the stored telescopic rod 507 can be completely hidden in the slot hole 4, and the ball head 508 mainly limits the heat dissipation assembly 5 in the slot hole 4 through the telescopic rod 507;

further, the inner wall of the slot 4 is provided with a ball groove 6, and the ball groove 6 is embedded and connected with the ball head 508;

according to the above description, it is further explained that the ball groove 6 is embedded with the ball head 508 to limit the telescopic rod 507, that is, the heat dissipation assembly 5, and meanwhile, the ball head 508 can perform limit rotation in the ball groove 6, so as to adjust the heat dissipation position/angle of the heat dissipation assembly 5;

further, the rear cover 505 is provided with a separation net, a motor fixing plate is welded on the middle net body of the separation net, and a motor fixing hole and a line through hole are formed in the motor fixing plate;

according to the above description, further elaborating, the rear cover 505 mainly provides a sealing effect for the rear end of the heat dissipation cover 503, and also provides a fixing effect for the micro motor 503;

further, the micro motors 503 of the heat dissipation assemblies 5 distributed outside the component mounting area 2 are connected in series by a line, and the line connected in series between the micro motors 503 is connected to the power supply interface in the component mounting area 2;

according to the above description, it is further explained that the micro motor 503 is connected in series, which is convenient for the connection of the circuit, and meanwhile, the power is supplied through the power interface on the component mounting area 2, so that when the PCBA motherboard is used, the micro motor 503 of the heat dissipation assembly 5 is activated, which ensures that the heat dissipation is continuously provided for the motherboard for a long time, and the micro motor 503 can be a micro dc brushless three-phase motor with a model of SL-370-DJ;

it is comprehensive above, when this PCBA mainboard is in use, install the mainboard through fixed orifices 3 on the mainboard, manual adjustment slotted hole 4 interior radiating component 5's position, stretch radiating component 5 to the slotted hole 4 outside through telescopic link 507, simultaneously rotate radiating component 5 once more, through bulb 508 and the spacing rotating-structure of ball groove 6, adjust radiating component 5's radiating position, after the position adjustment, with relevant connection port and the corresponding circuit articulate on mainboard body 1, when power source on mainboard body 1 communicates external power supply, micro motor 503 will circular telegram and drive radiating fan 504 and rotate, through radiating component 5 of different positions on mainboard body 1, and drive radiating fan 504 with the help of micro motor 503 and drive the air flow, thereby provide radiating effect to the components and parts of installation on components and parts installing zone 2, when mainboard body 1 is idle, accomodate radiating component to slotted hole 4 through telescopic link 507 cooperation rotatory knot 506, realize hiding.

The utility model discloses a 1 mainboard body, 2 components and parts installing areas, 3 fixed holes, 4 slotted holes, 5 heat dissipation components, 501 net cover, 502 heat dissipation cover, 503 micro motor, 504 heat dissipation fan, 505 back cover, 506 rotary buckle, 507 telescopic rod, 508 bulb, 6 ball groove, the components are all universal standard components or components known by technicians in the field, the structure and principle of the components are all known by technicians through technical manuals or conventional experimental methods, the problem solved by the utility model is that the integrated unijunction mainboard, the mainboard and electronic components are operated under long-term high temperature condition, which can easily cause aging and damage of the electronic components, and affect the service life of the mainboard and the electronic components, the PCBA mainboard is provided with independent components and parts installing areas and heat dissipation areas, and the slotted holes of the heat dissipation areas are internally provided with heat dissipation components, adopt the hidden structure of gomphosis between this heat radiating component and the slotted hole, the gomphosis through expansion bracket cooperation bulb and ball groove rotates, can expand heat radiating component and adjust heat radiating position to heat radiating component, heat radiating component's micro motor and mainboard power source interface adopt the series connection mode simultaneously, after the mainboard connection power, micro motor will drive the heat dissipation fan and rotate, therefore, heat radiating component through different positions, can effectually carry out the continuation heat dissipation to electronic components on the mainboard, thereby reach PCBA mainboard and the mesh of point components and parts high temperature resistance, the effectual normal operating of having guaranteed PCBA mainboard and electronic components, heat radiating component on this PCBA mainboard adopts the hidden structure of accomodating/expanding, when the PCBA mainboard is idle, can hide heat radiating component in the slotted hole, do not occupy the usage space of PCBA mainboard.

The basic principles and the main features of the invention and the advantages of the invention have been shown and described above, it will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, but that the invention may be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims

1. The utility model provides an intelligence high temperature resistant PCBA mainboard for audio amplifier which characterized in that: including mainboard body (1), be equipped with components and parts installing zone (2), fixed orifices (3) and slotted hole (4) on mainboard body (1), slotted hole (4) distribute in the outside of components and parts installing zone (2), radiating component (5) have been embedded to slotted hole (4), radiating component (5) comprise lid (501), heat exchanger (502), micro motor (503), cooling fan (504) and hou gai (505), lid (501) and hou gai (505) are fixed in on the both ends cover mouth of cooling exchanger (502) through the screw respectively, micro motor (503) and cooling fan (504) all are located cooling exchanger (502), micro motor (503) are fixed in on hou gai (505) through the screw, cooling fan (504) are connected in the transmission of micro motor (503) and are served, be connected with on the both sides outer wall of cooling exchanger (502) and rotate flexible subassembly, radiating component (5) are connected in slotted hole (4) through rotating flexible subassembly.

2. The high-temperature-resistant PCBA mainboard for intelligent loudspeaker box of claim 1, characterized in that: the rotating telescopic assembly comprises a rotating buckle (506) and a telescopic rod (507), and the rotating end of the rotating buckle (506) is connected with the outer wall of the heat dissipation cover (502).

3. The high-temperature-resistant PCBA mainboard for intelligent loudspeaker box of claim 2, characterized in that: the telescopic link (507) is the multistage telescopic link, the flexible end of telescopic link (507) is integrated structure with the knot body of rotatory knot (506), be equipped with bulb (508) on the stiff end outer wall of telescopic link (507), bulb (508) are integrated structure with telescopic link (507).

4. The high temperature resistant PCBA mainboard for intelligent sound box of claim 1, characterized in that: the inner wall of the slotted hole (4) is provided with a ball groove (6), and the ball groove (6) is connected with the ball head (508) in an embedded mode.

5. The high temperature resistant PCBA mainboard for intelligent sound box of claim 1, characterized in that: the motor is characterized in that a separation net is arranged on the rear cover (505), a motor fixing plate is welded on the middle net body of the separation net, and a motor fixing hole and a circuit through hole are formed in the motor fixing plate.

6. The high temperature resistant PCBA mainboard for intelligent sound box of claim 1, characterized in that: the miniature motors (503) of the heat dissipation assemblies (5) distributed on the outer sides of the component mounting areas (2) are connected in series through lines, and the lines connected in series between the miniature motors (503) are connected to power interfaces in the component mounting areas (2).