CN217884305U - Circuit board convenient to fast heat dissipation - Google Patents
Circuit board convenient to fast heat dissipation Download PDFInfo
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- CN217884305U CN217884305U CN202221726639.4U CN202221726639U CN217884305U CN 217884305 U CN217884305 U CN 217884305U CN 202221726639 U CN202221726639 U CN 202221726639U CN 217884305 U CN217884305 U CN 217884305U
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- heat dissipation
- circuit board
- heat
- water storage
- shell
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Abstract
The utility model belongs to the technical field of the circuit board, especially, a circuit board convenient to quick heat dissipation, including heat dissipation shell and circuit board, the inside of heat dissipation shell is provided with heat abstractor, and heat abstractor includes the water storage chamber, and the water of water storage intracavity carries out the work of dispelling the heat to the circuit board. This circuit board convenient to quick heat dissipation, through setting up heat abstractor, can carry out the work of dispelling the heat to the circuit board fast, in the wind-force conveying pipeline that small-size fan produced, pipeline makes the rivers in the water storage cavity flow, drive the absorptive heat of heating panel, accelerate the radiating effect of heating panel, can accelerate the heat loss of water storage cavity rivers through the louvre, the air current of carrying in the water storage cavity can flow through going out the air cavity simultaneously, dispel the heat to the circuit board in the heat dissipation shell, it is not good to have solved current circuit board radiating effect, the radiating rate can not keep up with, influence circuit board life or cause the technical problem that the circuit board damaged.
Description
Technical Field
The utility model relates to a circuit board technical field especially relates to a circuit board convenient to quick heat dissipation.
Background
The circuit board enables the circuit to be miniaturized and visualized, and plays an important role in batch production of fixed circuits and optimization of electrical appliance layout.
Because the heat that produces when the electronic component on the circuit board uses is more and more, if the circuit board heat dissipation is handled not well, can influence the result of use of the components and parts installed on the circuit board, traditional radiating mode generally sets up the heat dissipation fan on the next door of circuit board, takes away the heat through the air flow, but this method is because circuit board bottom space is less, the heat is difficult for dispersing, the radiating effect is relatively poor, the radiating rate can not keep up with, lead to circuit board high temperature very easily and influence circuit board life or cause the circuit board to damage.
SUMMERY OF THE UTILITY MODEL
Based on current circuit board radiating effect is not good, and the radiating rate can not keep up with, leads to the circuit board high temperature very easily and influence circuit board life or cause the technical problem of circuit board damage, the utility model provides a circuit board convenient to fast heat dissipation.
The utility model provides a circuit board convenient for quick heat dissipation, which comprises a heat dissipation shell and a circuit board, wherein a heat dissipation device is arranged inside the heat dissipation shell, the heat dissipation device comprises a water storage cavity, and the circuit board is subjected to heat dissipation work by water in the water storage cavity;
the lower surface of circuit board bonds and has heat conduction silica gel, the lower fixed surface of heat conduction silica gel is connected with the heating panel.
Preferably, the heat sink further comprises a heat dissipation coating, and an outer surface of the heat dissipation coating is coated on an outer surface of the heat dissipation shell;
through above-mentioned technical scheme, the heat dissipation coating comprises nanometer heat dissipation coating, can increase the radiating effect of heat dissipation shell.
Preferably, a small fan is fixedly installed on the outer surface of the heat dissipation shell, a filter screen is fixedly installed on the outer surface of the small fan, a conveying pipeline is fixedly installed on the outer surface of the small fan, one end of the conveying pipeline is fixedly installed on the inner wall of the water storage cavity, and an air hole is formed in the outer surface of the conveying pipeline;
through above-mentioned technical scheme, the filter screen filters the air that gets into in the pipeline, and the separation that produces through the fan is carried and is got into the water storage intracavity for the water of water storage intracavity takes place to flow, absorbs the heat on the circuit board, accelerates thermal dissipation.
Preferably, the bottom of the heat dissipation shell is provided with heat dissipation holes, and the water storage cavity is arranged at the bottom of the heat dissipation shell;
through above-mentioned technical scheme, store the cooling water through the water storage chamber, the cooling water of thermovent to water storage intracavity carries out the heat dissipation work.
Preferably, an air outlet cavity is formed in the outer side surface of the heat dissipation shell, one end of the air outlet cavity is fixedly communicated with the inner wall of the water storage cavity, and a breathable film is fixedly mounted on the inner wall of an air outlet of the air outlet cavity;
through above-mentioned technical scheme, can evacuate the gas of pipeline transport through going out the air cavity, can dispel the heat to the circuit board in the heat dissipation shell once more simultaneously, and the ventilated membrane comprises waterproof ventilated membrane, prevents in can be ventilative that water from getting into the heat dissipation shell, causes the influence to the circuit board.
Preferably, the lower surface of the heat dissipation plate is fixedly mounted with the inner bottom wall of the heat dissipation shell, and the outer surface of the heat dissipation shell is provided with a wire outlet hole;
through above-mentioned technical scheme, absorb the heat of heating panel through the heating panel and then transmit to the water storage intracavity, the outlet is convenient for laying of circuit.
The utility model provides a beneficial effect does:
through setting up heat abstractor, can carry out the work of dispelling the heat to the circuit board fast, in the wind-force transport and delivery pipeline that produces through small-size fan, make the rivers in the water storage cavity flow through pipeline, drive the heat that the heating panel absorbs, accelerate the radiating effect of heating panel, can accelerate the heat loss of water storage cavity rivers through the louvre, the air current of carrying in the water storage cavity can flow through going out the air cavity simultaneously, dispel the heat to the circuit board in the heat dissipation shell, thereby can accelerate the radiating effect, it is not good to have solved current circuit board radiating effect, the radiating rate can not keep up with, lead to the circuit board high temperature very easily and influence circuit board life or cause the technical problem that the circuit board damaged.
Drawings
Fig. 1 is a schematic view of a circuit board convenient for rapid heat dissipation according to the present invention;
fig. 2 is a perspective view of a circuit board structure of a circuit board convenient for rapid heat dissipation according to the present invention;
fig. 3 is a perspective view of a heat-conducting silica gel structure of a circuit board convenient for rapid heat dissipation according to the present invention;
fig. 4 is a perspective view of a heat dissipation hole structure of a circuit board convenient for rapid heat dissipation according to the present invention;
fig. 5 is a perspective view of a fan structure of a circuit board convenient for rapid heat dissipation according to the present invention;
fig. 6 is a perspective view of a conveying pipeline structure of a circuit board convenient for rapid heat dissipation according to the present invention;
fig. 7 is a perspective view of a breathable film structure of a circuit board convenient for rapid heat dissipation.
In the figure: 1. a heat dissipation housing; 11. a circuit board; 12. a heat-dissipating coating; 13. a wire outlet hole; 2. heat conducting silica gel; 21. a heat dissipation plate; 3. a small fan; 31. a filter screen; 32. a delivery conduit; 33. air holes are formed; 34. a water storage cavity; 35. heat dissipation holes; 36. an air outlet cavity; 37. and (3) a breathable film.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
Referring to fig. 1-7, a circuit board convenient for rapid heat dissipation includes a heat dissipation case 1 and a circuit board 11, the heat dissipation case 1 is composed of a box body and a box cover, the box body and the box cover are fixed by screws, so as to facilitate the installation of the circuit board 11, a heat dissipation device is arranged inside the heat dissipation case 1, the heat dissipation device includes a water storage cavity 34, and the circuit board 11 is subjected to heat dissipation work by water in the water storage cavity 34;
further, the heat dissipation device also comprises a heat dissipation coating 12, and the outer surface of the heat dissipation coating 12 is coated on the outer surface of the heat dissipation shell 1; the heat dissipation coating 12 is made of nano heat dissipation paint, and can increase the heat dissipation effect of the heat dissipation housing 1.
Further, a small fan 3 is fixedly installed on the outer surface of the heat dissipation shell 1, in order to automatically control the opening of the small fan 3, a temperature sensor can be arranged in the heat dissipation shell 1 to detect the heat of the heat dissipation plate 21, a filter screen 31 is fixedly installed on the outer surface of the small fan 3, a conveying pipeline 32 is fixedly installed on the outer surface of the small fan 3, one end of the conveying pipeline 32 is fixedly installed with the inner wall of the water storage cavity 34, and an air hole 33 is formed in the outer surface of the conveying pipeline 32; the air that gets into in the pipeline 32 is filtered to filter screen 31, and the separation that produces through the fan is carried and is got into in the water storage chamber 34 for the water in the water storage chamber 34 takes place to flow, absorbs the heat on the circuit board 11, accelerates thermal dissipation.
Further, the bottom of the heat dissipation shell 1 is provided with a heat dissipation hole 35, and the water storage cavity 34 is arranged at the bottom of the heat dissipation shell 1; the cooling water is stored in the water storage cavity 34, and the heat dissipation holes 35 dissipate the heat of the cooling water in the water storage cavity 34.
Furthermore, an air outlet cavity 36 is formed in the outer side surface of the heat dissipation shell 1, one end of the air outlet cavity 36 is fixedly communicated with the inner wall of the water storage cavity 34, and a breathable film 37 is fixedly mounted on the inner wall of an air outlet of the air outlet cavity 36; can evacuate the gas of pipeline 32 transport through gas outlet cavity 36, can dispel the heat to circuit board 11 in the heat dissipation shell 1 again simultaneously, ventilated membrane 37 comprises waterproof ventilated membrane 37, prevents in can ventilative the water entering heat dissipation shell 1, causes the influence to circuit board 11.
The lower surface of the circuit board 11 is bonded with the heat-conducting silica gel 2, and the lower surface of the heat-conducting silica gel 2 is fixedly connected with a heat dissipation plate 21.
Furthermore, the lower surface of the heat dissipation plate 21 is fixedly mounted with the inner bottom wall of the heat dissipation shell 1, and the outer surface of the heat dissipation shell 1 is provided with a wire outlet hole 13; the heat of the heat dissipation plate 21 is absorbed by the heat dissipation plate 21 and then transferred into the water storage cavity 34, and the wire outlet 13 facilitates the wiring.
Through setting up heat abstractor, can dispel the heat the work to circuit board 11 fast, in the wind-force transport and delivery pipeline 32 through small-size fan 3 production, make the rivers in the water storage chamber 34 flow through pipeline 32, drive the absorptive heat of heating panel 21, accelerate the radiating effect of heating panel 21, can accelerate the heat loss of rivers in the water storage chamber 34 through louvre 35, the air current of carrying can flow out through play air cavity 36 in the water storage chamber 34 simultaneously, circuit board 11 to in the heat dissipation shell 1 dispels the heat, thereby can accelerate the radiating effect, it is not good to have solved current 11 radiating effect of circuit board, the radiating rate can not keep up with, lead to 11 high temperatures of circuit board and influence 11 life of circuit board or cause the technical problem that 11 circuit boards damaged very easily.
The working principle is as follows: when needs dispel the heat to circuit board 11, the opening of steerable small fan 3, the wind-force that small fan 3 produced passes through pipeline 32 and carries and get into in the water storage chamber 34 in the heat dissipation shell 1, can make the rivers in the water storage chamber 34 appear flowing through bleeder vent 33, the heat of circuit board 11 is absorbed by heating panel 21 through heat conduction silica gel 2, the rivers in the water storage chamber 34 flow the heat dissipation that can drive heating panel 21, the heat dissipation that the water in the water storage chamber 34 was absorbed can be accelerated to louvre 35 simultaneously, the gas that pipeline 32 carried can flow out through the ventilated membrane 37 on the gas outlet of going out gas chamber 36, dispel the heat to circuit board 11 once more.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.
Claims (6)
1. The utility model provides a circuit board convenient to quick heat dissipation, includes heat dissipation shell (1) and circuit board (11), its characterized in that: a heat dissipation device is arranged in the heat dissipation shell (1), the heat dissipation device comprises a water storage cavity (34), and water in the water storage cavity (34) conducts heat dissipation work on the circuit board (11);
the lower surface of circuit board (11) bonds and has heat conduction silica gel (2), the lower fixed surface of heat conduction silica gel (2) is connected with heating panel (21).
2. The circuit board for facilitating rapid heat dissipation according to claim 1, wherein: the heat dissipation device further comprises a heat dissipation coating (12), and the outer surface of the heat dissipation coating (12) is coated on the outer surface of the heat dissipation shell (1).
3. The circuit board for facilitating rapid heat dissipation according to claim 1, wherein: the utility model discloses a fan, including heat dissipation shell (1), the outer fixed surface of heat dissipation shell (1) installs small-size fan (3), the outer fixed surface of small-size fan (3) installs filter screen (31), the outer fixed surface of small-size fan (3) installs pipeline (32), the one end of pipeline (32) with the inner wall fixed mounting in water storage chamber (34), bleeder vent (33) have been seted up to the surface of pipeline (32).
4. The circuit board for facilitating rapid heat dissipation according to claim 1, wherein: the bottom of the heat dissipation shell (1) is provided with heat dissipation holes (35), and the water storage cavity (34) is arranged at the bottom of the heat dissipation shell (1).
5. The circuit board for facilitating rapid heat dissipation of claim 1, wherein: the inside gas outlet cavity (36) of having seted up of lateral surface of heat dissipation shell (1), the one end of gas outlet cavity (36) with the fixed intercommunication of inner wall in water storage chamber (34), the gas outlet inner wall fixed mounting who goes out gas cavity (36) has ventilated membrane (37).
6. The circuit board for facilitating rapid heat dissipation according to claim 1, wherein: the lower surface of the heat dissipation plate (21) is fixedly mounted with the inner bottom wall of the heat dissipation shell (1), and a wire outlet hole (13) is formed in the outer surface of the heat dissipation shell (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221726639.4U CN217884305U (en) | 2022-07-06 | 2022-07-06 | Circuit board convenient to fast heat dissipation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221726639.4U CN217884305U (en) | 2022-07-06 | 2022-07-06 | Circuit board convenient to fast heat dissipation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217884305U true CN217884305U (en) | 2022-11-22 |
Family
ID=84099664
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221726639.4U Active CN217884305U (en) | 2022-07-06 | 2022-07-06 | Circuit board convenient to fast heat dissipation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217884305U (en) |
-
2022
- 2022-07-06 CN CN202221726639.4U patent/CN217884305U/en active Active
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