CN218450670U - High-density PCB with good shielding effect - Google Patents
High-density PCB with good shielding effect Download PDFInfo
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- CN218450670U CN218450670U CN202222190794.5U CN202222190794U CN218450670U CN 218450670 U CN218450670 U CN 218450670U CN 202222190794 U CN202222190794 U CN 202222190794U CN 218450670 U CN218450670 U CN 218450670U
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Abstract
The utility model discloses a shield effectual high-density PCB board, including PCB board base member, weld region, pin through-hole region, locating hole, forbidden cloth district, shielding area. Practical with the connector cooperation during specific implementation, the stride between two adjacent pin pads sets up to 0.60MM, and this reduces electromagnetic wave interference apart from the pin pad of stride can the at utmost to improve the stability and the quality of signal. The bottom and the shielded area contact of the shield shell of connector make the utility model discloses combine to form a confined whole shield cover with the shield shell, shielding effect is better to improve the transmission speed and the quality of signal. The setting in forbidden cloth district can not follow the top surface that pin through-hole region and locating hole climbed PCB base member during tin soldering, ensures that no tin layer takes the form the clearance in the sky between the bottom of shielding shell and the shielding district, ensures that the bottom of shielding shell can accessible contact with the shielding layer, and shielding effect is good.
Description
Technical Field
The utility model belongs to the technical field of the communication and specifically relates to a shield effectual high-density PCB board.
Background
With the increasing demand of people for communication, the communication quality and speed in the communication field are more and more demanding. Often can set up the PCB board among the electronic equipment, it carries out electronic signal's transmission to inserting electronic components on the PCB board, in order to transmit high quality and high speed's electronic signal, often need to have good shielding property and good anti-electromagnetic interference, in the prior art, think that the step of pulling open PCB board pin pad is favorable to improving anti-electronic interference performance, the pin pad step of PCB board often can pull open as far as, like QSFP high-speed transmission field, the step of pin pad sets up to 0.8MM and is minimum step in the high-speed transmission field, the utility model discloses the step through pin pad in the rationally distributed encapsulation PCB board improves anti-electromagnetic interference performance. And among the prior art, often improve shielding nature through the structure that improves electronic components itself, neglected the design that can combine the PCB board to go to realize improving shielding nature, the utility model discloses a design that optimizes the PCB board from this aspect improves shielding performance.
SUMMERY OF THE UTILITY MODEL
In order to overcome the defects of the prior art, the utility model provides a shield effectual high-density PCB board.
The utility model provides a technical scheme that its technical problem adopted is: the utility model provides a shield effectual high-density PCB board, includes PCB board base member, weld zone, pin through-hole region, locating hole, forbidden cloth district, shielding area set up on PCB board base member, pin through-hole region sets up the both sides at the weld zone, the locating hole sets up the downside at the weld zone, forbidden cloth district, shielding area all set up the outside at the weld zone, the weld zone is equipped with a plurality of pin pad group, pin pad group includes a plurality of linear arrangement's foot pad, step distance between two adjacent pin pads is established between 0.55-0.65 MM.
According to the technical scheme, the layout forbidden area comprises a pin through hole layout forbidden area, a positioning hole layout forbidden area and a third layout forbidden area arranged on the outer side of the pin through hole area, the pin through hole layout forbidden area is arranged on the outer side of the pin through hole area, and the positioning hole layout forbidden area is arranged on the outer side of the positioning hole.
According to the technical scheme, the pin through hole area comprises a plurality of pin through holes which are linearly arranged, a rectangular pin through hole distribution forbidding area is arranged on the side face of each pin through hole, and the length direction of the rectangular pin through hole distribution forbidding area is consistent with the linear arrangement direction of the pin through holes.
According to the technical scheme, the periphery of the positioning hole is provided with a square positioning hole forbidden distribution area, and the positioning hole forbidden distribution area is limited on the inner side of the shielding area.
According to the further technical scheme, the shielding area surrounds the welding area.
According to the technical scheme, the shielding area is provided with a first shielding small area, a second shielding small area, a third shielding small area and a fourth shielding small area which surround the welding area, the width of the third shielding small area is larger than that of the first shielding small area, and the second shielding small area and the fourth shielding small area are arranged on two sides of the welding area 2 and are partially overlapped with the pin through hole area.
According to the technical scheme, the widths of the second shielding cell and the fourth shielding cell are both larger than the width of the pin through hole forbidden region.
According to the technical scheme, the welding areas are sequentially and linearly arranged, a fifth shielding small area is arranged between every two adjacent welding areas and partially overlapped with the pin through hole area, and the width of the fifth shielding small area is larger than the width of the pin through hole forbidden distribution area and smaller than the diameter of the pin through hole.
According to the further technical scheme, the shielding area is a copper plating layer.
The beneficial effects of the utility model are that a shield effectual high-density PCB board is provided, practical with the connector cooperation during concrete implementation, step between two adjacent pin pads sets up to 0.60MM, and this can be the biggest reduction electromagnetic wave interference apart from the pin pad of step to improve the stability and the quality of signal. The bottom and the shielded area contact of the shield shell of connector make the utility model discloses combine to form a confined whole shield cover with the shield shell, shielding effect is better to improve the transmission speed and the quality of signal. The forbidden district sets up and ensures that these regions can not arrange any electronic components or any electric conductor, reduces other electronic components and brings electromagnetic interference, tin can not climb to the top surface of PCB base member from pin through-hole region and locating hole when also avoiding soldering tin, ensures that there is not tin layer rack between the bottom of shielding shell and the shielding district to form the clearance, ensures that the bottom of shielding shell can accessible contact with the shielding layer, thereby ensures that the shielding layer and the shielding shell of PCB top surface combine to form a confined shield cover, and shielding effect is good.
Drawings
Fig. 1 is a schematic structural view of a high density PCB board with good shielding effect.
Fig. 2 is a schematic view of the front view structure of the high density PCB board with good shielding effect.
Fig. 3 is a schematic view of the structure of region a of fig. 2 according to the present invention.
Fig. 4 is a schematic view of the structure of the area B of fig. 2 according to the present invention.
Fig. 5 is a schematic structural diagram of the application of the high-density PCB and QSFP connector with good shielding effect.
Fig. 6 is a schematic structural view of a QSFP connector for shielding a high-density PCB board with a good shielding effect.
Detailed Description
The embodiments of the present invention will be described with reference to the accompanying drawings and related examples, but the embodiments of the present invention are not limited to the following examples, and the relevant essential components of the present invention related to the technical field should be regarded as known in the art, and can be known and grasped by those skilled in the art.
The terms "lower side", "outer side", "upper side" and the like are described in the specification with reference to FIG. 2.
Referring to fig. 1 to 6, the present invention is implemented as follows: the utility model provides a shield effectual high-density PCB board, includes PCB board base member 1, solder area 2, pin through-hole district 3, locating hole 4, forbidden cloth district 5, shielding district 6 set up on PCB board base member 1, pin through-hole district 3 sets up the both sides at solder area 2, locating hole 4 sets up the downside at solder area 2, forbidden cloth district 5, shielding district 6 set up the outside at solder area 2, solder area 2 is equipped with a plurality of pin pad group 21, pin pad group 21 includes a plurality of linear arrangement's pin pad 211, the step distance between two adjacent pin pad 211 is established to 0.60MM. The PCB substrate 1 includes a bottom surface 11 and a top surface 12, and the soldering region 2 is disposed on the top surface 12 of the PCB substrate 1. The shielding region 6 is shown to be covered with an electrical conductor.
The utility model discloses practical with QSFP connector cooperation when specifically implementing, QSFP connector 10 is including shielding shell 101, signal module 102, shielding shell 101 is equipped with sunken pin 1011, signal module 102 is equipped with reference column 1021, SMT welds pin 1022 with the utility model discloses a pin pad 211 welds, sunken pin 1011 insert in the pin through-hole district 3 and with the bottom welding of PCB board base member 1. The positioning column 1021 is inserted into the positioning hole 4, and the arrangement of the forbidden arrangement region 5 ensures that other electronic components are not arranged in the forbidden arrangement region 5 to avoid generating electromagnetic interference. The bottom and the shielding region 6 contact of shielding shell 101 make the utility model discloses combine to form a confined whole shield cover with shielding shell 101, shielding effect is better to improve the transmission speed and the quality of signal. The step distance between two adjacent pin pads 211 is set to be 0.60MM, and the pin pads 211 at the step distance can reduce electromagnetic wave interference to the greatest extent, so that the stability and the quality of signals are improved.
In the drawings, the shielding region 6 is a shaded portion for more clear illustration.
On the basis of the above embodiment, as a further preferable mode, the keep-out region 5 includes a pin through hole keep-out region 51, a positioning hole keep-out region 52, and a third keep-out region 53 disposed outside the pin through hole region 3. The pin through hole forbidden distribution region 51 is arranged on the outer side of the pin through hole region 3, and the positioning hole forbidden distribution region 52 is arranged on the outer side of the positioning hole 4
The arrangement of the pin through hole forbidden arrangement region 51, the positioning hole forbidden arrangement region 52 and the third forbidden arrangement region 53 ensures that no electronic component or any conductor is arranged in the regions, so that the electromagnetic interference caused by other electronic components is reduced. The arrangement of the pin through hole forbidden arrangement region 51 and the positioning hole forbidden arrangement region 52 also avoids tin from climbing to the top surface 12 of the PCB substrate 1 from the pin through hole region 3 and the positioning hole 4 during tin soldering, ensures that no tin layer is formed in the gap between the bottom of the shielding shell 101 and the shielding region 6, ensures that the bottom of the shielding shell and the shielding layer can be in barrier-free contact, thereby ensuring that the shielding layer of the PCB top surface 12 is combined with the shielding shell 101 to form a closed shielding cover, and the shielding effect is good.
On the basis of the above embodiment, as a further preferable option, the pin through hole region 3 includes a plurality of pin through holes 31 arranged in a straight line, rectangular pin through hole forbidden arrangement regions 51 are disposed on upper and lower side surfaces of the pin through holes 31, a length direction of the rectangular pin through hole forbidden arrangement region 51 is consistent with a direction in which the pin through holes 31 are linearly arranged, and a width of the rectangular pin through hole forbidden arrangement region 51 is smaller than a diameter of the pin through holes 31.
Occupy the tin in pin through-hole 31, pin through-hole 31's week is equipped with 11 sticky tin districts in the bottom surface that are located PCB base member 1 to after sinking pin 1011 inserts in the pin through-hole 31 conveniently and PCB base member 1 welding, pin through-hole forbidden cloth district 51 is established to rectangle and length direction and the square unanimity of pin through-hole 31 linear arrangement, thereby shielding area 6's electric conductor can not set up in pin through-hole forbidden cloth district 51, in climbing tin to pin through-hole forbidden cloth district 51 can not appear when guaranteeing to sink pin 1011 and pin through-hole 31 welding, thereby guarantee pin through-hole 31 and PCB board independent welding, guarantee welding quality, tin can not climb to PCB base member 1's top surface 12 from pin through-hole 3 when also avoiding soldering tin, guarantee that no tin layer is built on stilted to become the clearance between shielding shell 101's bottom and shielding area 6, guarantee that shielding shell's bottom and shielding layer can accessible contact, thereby guarantee that PCB board top surface 12's shielding layer combines with shielding shell 101 to form a confined shield, shielding effect is good.
On the basis of the above embodiment, as a further preferred option, the positioning hole distribution prohibiting area 52 in a square shape is arranged on the periphery of the positioning hole 4, so that tin is prevented from climbing to the top surface 12 of the PCB substrate 1 from the positioning hole 4 during soldering, and no tin layer is formed between the bottom of the shielding case 101 and the shielding area 6 in an overhead manner to form a gap, thereby ensuring that the bottom of the shielding case and the shielding layer can be in barrier-free contact, further ensuring that the shielding layer on the top surface 12 of the PCB substrate is combined with the shielding case 101 to form a closed shielding case, and having a good shielding effect. The positioning hole forbidden area 52 is defined on the inner side of the shielding area 6, so that the shielding area 6 can be enclosed into a circle to be in contact with the bottom of the shielding shell 101 to form an integral shielding cover.
On the basis of the above embodiment, it is further preferable that the shielding region 6 surrounds the periphery of the land 2. The signal module 102 is welded to the pin pad 211 in the welding area 2, and the shielding area 6 surrounds the welding position between the signal module 102 and the pin pad 211, so that electromagnetic wave interference generated when the signal module 102 interacts with the pin pad 211 can be shielded.
On the basis of the above embodiment, as a further preferable mode, the shielding region 6 is provided with a first shielding cell 61, a second shielding cell 62, a third shielding cell 64 and a fourth shielding cell 65 which surround the land 2, the width of the third shielding cell 64 is larger than that of the first shielding cell 61, and the second shielding cell 62 and the fourth shielding cell 65 are provided on both sides of the land 2 and both overlap with the pin through hole region 3.
On the basis of the above embodiment, as a further preference, the widths of the second shielding cell 62 and the fourth shielding cell 65 are both greater than the width of the pin via forbidden region 51. The widths of the second shielding cell 62 and the fourth shielding cell 65 near one side of the outside of the pin through hole 31 are larger than the diameter of the pin through hole 31.
The width of the second shielding cell 62 and the width of the fourth shielding cell 65 are both greater than the width of the pin through hole forbidden distribution region 51, so that the outer side of the pin through hole forbidden distribution region 51 can be contacted with the bottom of the shielding shell 101, the shielding region 6 is combined with the shielding shell 101 to form a closed integral shielding cover, the shielding effect is better, and the transmission speed and the quality of signals are improved. The third elastic sheet 1014 and the fourth elastic sheet 1015 are arranged on two sides of the shielding shell 101, and the widths of the second shielding small area 62 and the fourth shielding small area 65 close to one side of the outer side of the pin through hole 31 are larger than the diameter of the pin through hole 31. After ensuring that the pin enters the pin through hole 31, the third elastic sheet 1014 and the fourth elastic sheet 1015 can be respectively abutted against and conducted with the second shielding cell 62 and the fourth shielding cell 65, so that the shielding region 6 is ensured to be combined with the shielding shell 101 to form a closed integral shielding cover, the shielding effect is better, and the transmission speed and the quality of signals are improved.
In addition to the above embodiment, it is further preferable that four pads 2 are sequentially arranged linearly, a fifth shielding area 66 is arranged between adjacent pads 2, and the fifth shielding area 66 partially overlaps with the pin through hole area 3. The width of the fifth shielding cell 66 is greater than the width of the pin via keep-out region 51 and less than the diameter of the pin via 31.
Because of the requirement of signal transmission, the signal modules 102 and the welding areas 2 are respectively provided with four in a linear arrangement in turn, and the fifth shielding small area 66 is arranged between the adjacent welding areas 2, so that a closed shielding cover is enclosed in the small area welded by each signal module 102 and the pin welding pad 211, the shielding effect is good, and the transmission speed and the quality of signals are improved. The width of the fifth shielding cell 66 is greater than the width of the pin through hole forbidden arrangement region 51 and less than the diameter of the pin through hole 31, so that the outer side of the pin through hole forbidden arrangement region 51 can be contacted with the bottom of the shielding shell 101, the shielding region 6 is combined with the shielding shell 101 to form a closed integral shielding cover, the shielding effect is better, and the transmission speed and the quality of signals are improved. The width of the fifth shielding small area 66 is greater than the width of the pin through hole forbidden arrangement area 51 and is less than the diameter of the pin through hole 31, it is ensured that the left and right sides of the pin through hole 31 are not covered by a conductive layer, tin climbing to the two sides of the pin through hole 31 cannot occur when the pin 1011 and the pin through hole 31 are welded, thereby ensuring independent welding of the pin through hole 31 and the PCB, the welding quality is ensured, tin cannot climb to the top surface 12 of the PCB substrate 1 from the pin through hole area 3 during tin soldering is also avoided, it is ensured that no tin layer is overhead to form a gap between the bottom of the shielding shell 101 and the shielding area 6, it is ensured that the bottom of the shielding shell and the shielding layer can be in barrier-free contact, thereby it is ensured that the shielding layer of the PCB substrate top surface 12 and the shielding shell 101 are combined to form a closed shielding cover, and the shielding effect is good. Because the metal surface is formed by welding the sinking pins 1011 and the pin through holes 31, the metal surface and the shielding layer are contacted with the bottom surface 11 of the shielding shell 101 to form the integral shielding cover, and the shielding effect is good.
In addition to the above embodiments, it is further preferable that the shielding region 6 is a copper plating layer. The copper has good conductivity, strong shielding function, simple and convenient production and low cost.
The utility model discloses simple structure, and anti-electromagnetic interference and shielding are effectual.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of improvements and decorations can be made without departing from the principle of the present invention, and these improvements and decorations should also be regarded as the protection scope of the present invention.
Claims (9)
1. The utility model provides a shield effectual high-density PCB board, characterized by includes PCB board base member (1), land (2), pin through hole region (3), locating hole (4), forbidden cloth district (5), shielding region (6) set up on PCB board base member (1), pin through hole region (3) set up the both sides at land (2), locating hole (4) set up the downside at land (2), forbidden cloth district (5), shielding region (6) all set up the outside at land (2), land (2) are equipped with a plurality of pin group (21), pin group (21) include a plurality of linear arrangement's pin pad (211), the step between two adjacent pin pads (211) is established between 0.55-0.65 MM.
2. The PCB with good shielding effect according to claim 1, wherein the forbidden layout region (5) comprises a pin through hole forbidden layout region (51), a positioning hole forbidden layout region (52) and a third forbidden layout region (53) arranged outside the pin through hole region (3), the pin through hole forbidden layout region (51) is arranged outside the pin through hole region (3), and the positioning hole forbidden layout region (52) is arranged outside the positioning hole (4).
3. The PCB with good shielding effect and high density as claimed in claim 2, wherein the pin through hole region (3) comprises a plurality of pin through holes (31) arranged in a straight line, a rectangular pin through hole forbidden arrangement region (51) is arranged on the side surface of the pin through hole (31), and the length direction of the rectangular pin through hole forbidden arrangement region (51) is consistent with the linear arrangement direction of the pin through holes (31).
4. A high-density PCB with good shielding effect as claimed in claim 3, wherein the positioning hole (4) is provided with a positioning hole forbidden distribution region (52) at its periphery, and the positioning hole forbidden distribution region (52) is defined at the inner side of the shielding region (6).
5. A high density PCB board with good shielding effect as claimed in claim 1, characterized in that said shielding region (6) surrounds the soldering region (2).
6. A high-density PCB board with good shielding effect as claimed in claim 2, characterized in that said shielding region (6) is provided with a first shielding cell (61), a second shielding cell (62), a third shielding cell (64) and a fourth shielding cell (65) which surround the bonding pad (2), said third shielding cell (64) has a width larger than the width of the first shielding cell (61), said second shielding cell (62) and said fourth shielding cell (65) are provided on both sides of the bonding pad (2) and are partially overlapped with the pin through hole region (3).
7. The PCB with good shielding effect as claimed in claim 6, wherein the widths of the second shielding cell (62) and the fourth shielding cell (65) are both greater than the width of the pin through hole distribution inhibition region (51).
8. The PCB with good shielding effect as claimed in claim 1, wherein the bonding pads (2) are provided with a plurality of sequentially arranged pads, a fifth shielding small area (66) is provided between the adjacent bonding pads (2), the fifth shielding small area (66) is partially overlapped with the pin through hole area (3), and the width of the fifth shielding small area (66) is larger than the width of the pin through hole forbidden distribution area (51) and smaller than the diameter of the pin through hole (31).
9. A high density PCB with good shielding as claimed in claim 1, wherein said shielding region (6) is a copper plated layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222190794.5U CN218450670U (en) | 2022-08-19 | 2022-08-19 | High-density PCB with good shielding effect |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222190794.5U CN218450670U (en) | 2022-08-19 | 2022-08-19 | High-density PCB with good shielding effect |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218450670U true CN218450670U (en) | 2023-02-03 |
Family
ID=85095029
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222190794.5U Active CN218450670U (en) | 2022-08-19 | 2022-08-19 | High-density PCB with good shielding effect |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218450670U (en) |
-
2022
- 2022-08-19 CN CN202222190794.5U patent/CN218450670U/en active Active
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