CN218447949U

CN218447949U - Chip-scale packaging structure of light-emitting chip

Info

Publication number: CN218447949U
Application number: CN202222108146.0U
Authority: CN
Inventors: 李卓然
Original assignee: Runxi Intelligent Shenzhen Co ltd
Current assignee: Runxi Intelligent Shenzhen Co ltd
Priority date: 2022-08-11
Filing date: 2022-08-11
Publication date: 2023-02-03
Anticipated expiration: 2032-08-11

Abstract

The utility model discloses a chip-scale packaging structure of a light-emitting chip, which comprises a substrate, wherein a connecting frame is arranged above the substrate, a clamping groove is arranged on one side of the connecting frame, a first buckle is arranged on two sides of the upper end of the substrate, and the substrate is connected with the connecting frame through the first buckle and the clamping groove; install the circuit board on the base plate, be equipped with on the circuit board and install the wafer, be connected with the pin on the circuit board, the pin passes the connecting frame and is located the connecting frame outside, has seted up the sliding tray on the base plate, and sliding tray inside sliding connection has the slide bar, and slide bar one end is located base plate one side, and the pin passes slide bar one end, and the slide bar other end is located the inside fixedly connected with buckle two of sliding tray, and the inside slide bar below that is located of base plate is equipped with the dog. The utility model discloses a design has the slide bar, and inside the extension can be so that pin one end is located the slide bar through the slide bar, protected the pin that spills through the slide bar, avoid the pin to take place crooked rupture even.

Description

Chip-scale packaging structure of light-emitting chip

Technical Field

The utility model relates to an encapsulation structure, concretely relates to chip scale package structure of luminous chip.

Background

The LED chip is a solid semiconductor device, the heart of the LED is a semiconductor wafer, one end of the wafer is attached to a support, the other end of the wafer is a cathode, the other end of the wafer is connected with the anode of a power supply, and the whole wafer is packaged by epoxy resin. The existing packaging structure can not protect the pins led out by the chip. Therefore, those skilled in the art have provided a chip scale package structure of a light emitting chip to solve the above problems in the prior art.

SUMMERY OF THE UTILITY MODEL

In order to solve the technical problem, the utility model provides a chip-level packaging structure of a light-emitting chip, which comprises a substrate, wherein a connecting frame is arranged above the substrate, a clamping groove is arranged on one side of the connecting frame, first buckles are arranged on two sides of the upper end of the substrate, and the substrate is connected with the connecting frame through the first buckles and the clamping groove;

install the circuit board on the base plate, be equipped with on the circuit board and install the wafer, be connected with the pin on the circuit board, the pin passes the connecting frame and is located the connecting frame outside, has seted up the sliding tray on the base plate, and sliding tray inside sliding connection has the slide bar, and slide bar one end is located base plate one side, and the pin passes slide bar one end, and the slide bar other end is located the inside fixedly connected with buckle two of sliding tray, and the inside slide bar below that is located of base plate is equipped with the dog.

Preferably: fixedly connected with lens on the connecting frame, lie in lens outside fixedly connected with protective frame on the connecting frame. The lens is arranged above the wafer, and can diffuse the light source when the lens is a concave surface and gather the light source when the lens is a convex surface.

Preferably: one side of the connecting frame is provided with a notch below the clamping groove, the pin penetrates through the notch, and one side and two sides of the buckle extend to the lower side of the pin.

Preferably, the following components: the inside circuit board that is located of base plate below is equipped with the ceramic plate, and a plurality of radiating grooves have been seted up to the base plate lower extreme.

Preferably, the following components: the pins are electrically connected with the wafer.

Preferably, the following components: one end of the second buckle is exposed out of the substrate.

The utility model discloses a technological effect and advantage:

the utility model discloses a design has the slide bar, and inside the extension can be so that pin one end is located the slide bar through the slide bar, protected the pin that spills through the slide bar, avoid the pin to take place crooked rupture even.

Drawings

FIG. 1 is a schematic structural diagram provided herein;

FIG. 2 is a schematic structural diagram of a substrate provided herein;

FIG. 3 is a schematic structural diagram of a connection frame provided in the present application;

fig. 4 is a schematic structural view of a ceramic plate provided herein;

FIG. 5 is a schematic structural view of a second buckle provided by the present application;

in the figure:

1. a substrate; 2. a connecting frame; 3. a lens; 4. a protective frame; 5. a circuit board; 6. a wafer; 7. a pin; 8. a first buckle is arranged; 9. a card slot; 10. a ceramic plate; 11. a heat sink; 12. a slide bar; 13. a second buckle; 14. a stopper; 15. a sliding groove.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments. The embodiments of the present invention have been presented for purposes of illustration and description, and are not intended to be exhaustive or limited to the invention in the form disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiment was chosen and described in order to best explain the principles of the invention and the practical application, and to enable others of ordinary skill in the art to understand the invention for various embodiments with various modifications as are suited to the particular use contemplated.

Referring to fig. 1 to 5, in the present embodiment, a chip scale package structure of a light emitting chip is provided, including a substrate 1, a connection frame 2 is installed above the substrate 1, a lens 3 is fixedly connected to the connection frame 2, a protection frame 4 is fixedly connected to the connection frame 2 and located outside the lens 3, a clamping groove 9 is arranged on one side of the connection frame 2, a first buckle 8 is arranged on two sides of an upper end of the substrate 1, and the substrate 1 is connected to the connection frame 2 through the first buckle 8 and the clamping groove 9;

install circuit board 5 on

base plate

1, 1 inside 5 below that are located the circuit board of base plate is equipped with ceramic plate 10, and a plurality of radiating grooves 11 have been seted up to 1 lower extreme of base plate, is equipped with on circuit board 5 and installs wafer 6, is connected with pin 7 on the circuit board 5, pin 7 passes the connecting frame 2 and is located the 2 outsides of connecting frame, 2 one side of connecting frame is located the below of draw-in groove 9 and is equipped with the breach, and pin 7 passes the breach, and 8 both sides of buckle extend to pin 7 below, have seted up sliding tray 15 on the

base plate

1, and 15 inside sliding connection of sliding tray have

slide bar

12, and 12 one end of slide bar is located 1 one side of base plate, and pin 7 passes 12 one end of slide bar, and the 12 other end of slide bar is located two 13 of 15 inside fixedly connected with buckles of sliding tray, two 13 one end of buckle spill in the 1 outside of base plate, and 1 inside be located slide bar 12 below and be equipped with dog 14.

The utility model discloses a theory of operation is:

this application is when using, circuit board 5 is installed on base plate 1, and make pin 7 pass inside slide bar 12, dispel the heat to circuit board 5 during operation through ceramic plate 10 on the base plate 1, radiating groove 11 through the below increases the radiating effect, detain connection frame 2 on base plate 1, make a buckle 8 card go into inside draw-in groove 9, make connection frame 2 inseparable with base plate 1, shift out slide bar 12 from base plate 1 again, make two 13 of buckles be located dog 14 one side, it is spacing to slide bar 12 through dog 14, make when not using, protect pin 7.

It is to be understood that the disclosed embodiments are merely exemplary of the invention, and are not intended to limit the invention to the precise embodiments disclosed. Based on the embodiments in the present disclosure, all other embodiments obtained by a person of ordinary skill in the art and related fields without creative efforts shall fall within the protection scope of the present disclosure. Structures, devices and methods of operation not specifically described or illustrated in the present application are not specifically illustrated or described, but are generally practiced in the art without limitation.

Claims

1. A chip-scale packaging structure of a light-emitting chip comprises a substrate (1), and is characterized in that a connecting frame (2) is mounted above the substrate (1), a clamping groove (9) is formed in one side of the connecting frame (2), first buckles (8) are arranged on two sides of the upper end of the substrate (1), and the substrate (1) is connected with the connecting frame (2) through the first buckles (8) and the clamping groove (9);

install circuit board (5) on base plate (1), be equipped with on circuit board (5) and install wafer (6), be connected with pin (7) on circuit board (5), pin (7) pass connecting frame (2) and are located the connecting frame (2) outside, sliding tray (15) have been seted up on base plate (1), sliding tray (15) inside sliding connection has slide bar (12), slide bar (12) one end is located base plate (1) one side, slide bar (12) one end is passed in pin (7), slide bar (12) other end is located inside fixedly connected with buckle two (13) of sliding tray (15), base plate (1) inside is located slide bar (12) below and is equipped with dog (14).

2. The chip scale package structure of the light emitting chip as claimed in claim 1, wherein the connection frame (2) is fixedly connected with a lens (3), and the connection frame (2) is fixedly connected with a protection frame (4) at an outer side of the lens (3).

3. The chip scale package structure of the light emitting chip according to claim 1, wherein one side of the connection frame (2) is located below the slot (9) and has a notch, the pin (7) passes through the notch, and two sides of the first latch (8) extend to below the pin (7).

4. The chip scale package structure of the light emitting chip as claimed in claim 1, wherein a ceramic board (10) is disposed below the circuit board (5) inside the substrate (1), and a plurality of heat dissipation grooves (11) are formed at a lower end of the substrate (1).

5. The chip scale package structure of the light emitting chip as claimed in claim 1, wherein the leads (7) are electrically connected to the wafer (6).

6. The chip scale package structure of the light emitting chip as claimed in claim 1, wherein one end of the second latch (13) is exposed outside the substrate (1).