CN218424325U

CN218424325U - Wafer tiny particle belt cleaning device

Info

Publication number: CN218424325U
Application number: CN202222268853.6U
Authority: CN
Inventors: 何建军; 沈桂英; 赵有文
Original assignee: Rugao Compound Semiconductor Industry Research Institute; Nantong Fudian Semiconductor Material Technology Co ltd
Current assignee: Rugao Compound Semiconductor Industry Research Institute; Nantong Fudian Semiconductor Material Technology Co ltd
Priority date: 2022-08-29
Filing date: 2022-08-29
Publication date: 2023-02-03
Anticipated expiration: 2032-08-29

Abstract

The utility model relates to a belt cleaning device especially relates to a small granule belt cleaning device of wafer. The utility model aims at providing a can wash the tiny granule belt cleaning device of wafer automatically to the wafer. The utility model provides a such small particle belt cleaning device of wafer, including fixed frame, first shower nozzle and first liquid storage pot etc. the top intermediate junction of fixed frame has first liquid storage pot, and the bottom of second liquid storage pot is connected with first connecting pipe and intercommunication, and fixed frame top is passed to the lower part of first connecting pipe, and the bottom interval connection of first connecting pipe has first shower nozzle and the intercommunication that is used for washing the wafer. The utility model discloses a servo motor can drive and place the platform and rotate as drive power, drives the wafer and rotates for the wafer passes through first shower nozzle and second shower nozzle in proper order under, thereby can wash the wafer in proper order through DHF washing liquid and ozonized DI water.

Description

Wafer tiny particle belt cleaning device

Technical Field

The utility model relates to a belt cleaning device especially relates to a small granule belt cleaning device of wafer.

Background

Silicon wafers, also known as wafers, are processed from silicon ingots, and millions of transistors can be etched on the silicon wafers through a special process, and are widely used in the manufacture of integrated circuits.

At present, generally put into the washing pond by the staff with the washing liquid, then clip the wafer with the clip, submerge the wafer in the washing liquid again, then rock the clip, drive the wafer and rock in the washing liquid, accomplish cleaning, but at abluent in-process, the washing liquid can't realize very high frequency of washing to the wafer, the adnexed spot of wafer surface is difficult to get rid of, the cleaning performance is relatively poor, and need the staff to rock the clip with the hand always, the time is long, the painful condition appears easily in the arm, influence work efficiency.

In view of the foregoing, there is a need for a cleaning apparatus for cleaning micro particles on a wafer, which can automatically clean the wafer, to solve the above problems.

SUMMERY OF THE UTILITY MODEL

In order to overcome the staff and put into the washing liquid with the wafer and carry out the cleaning performance who rocks relatively poor, the condition of aching appears easily in addition in the arm, influences work efficiency's shortcoming, the utility model aims at providing a can be automatically carry out the small granule belt cleaning device of wafer that washes to the wafer.

The utility model discloses a following technical approach realizes:

the utility model provides a little granule belt cleaning device of wafer, including fixed frame, the storage water tank, first connecting pipe, first shower nozzle, first liquid storage pot, the second connecting pipe, the second shower nozzle, the second liquid storage pot, servo motor, the connecting axle, the mount and place the platform, the storage water tank has been placed to the lower part of fixed frame, the top intermediate junction of fixed frame has first liquid storage pot, the bottom of second liquid storage pot is connected with first connecting pipe and intercommunication, the fixed frame top is passed to the lower part of first connecting pipe, the bottom interval connection of first connecting pipe has the first shower nozzle and the intercommunication that are used for washing the wafer, the top rear side of fixed frame is connected with the second liquid storage pot, the rear side of second liquid storage pot is connected with the second connecting pipe and communicates, the lower part of second connecting pipe passes fixed frame top, the bottom interval connection of second connecting pipe has the second shower nozzle and the intercommunication that are used for washing the wafer, the upper portion intermediate junction of fixed frame has servo motor, be connected with on servo motor's the output shaft, the sub-unit connection of mount, the mount is located inside the fixed frame, even interval connection has three platform and communicates of placing that is used for placing the wafer.

Optionally, the wafer cleaning device further comprises a bevel gear and a roller brush, wherein the roller brush used for cleaning the wafer is rotatably connected to the rear side of the upper portion of the fixing frame in a bilateral symmetry mode, the bevel gear is connected to the front side of the roller brush and the upper portion of the connecting shaft, and the two bevel gears on the upper side are meshed with the bevel gear on the lower side.

Optionally, the wafer placing table further comprises a pulley group and a self-rotating disc, the self-rotating disc used for driving the wafer to rotate is rotatably connected in the placing table, and the pulley group is connected between the lower portion of the self-rotating disc and the lower portion of the connecting shaft.

Optionally, the protective housing is further included, the protective housing is connected to the bottom of the fixing frame, and the pulley sets are located inside the protective housing.

Optionally, the first and second showerheads are arranged in a cross.

Optionally, round holes are arranged on the placing tables at intervals.

Compared with the prior art, the utility model, possess following advantage:

1. the utility model discloses a servo motor can drive and place the platform and rotate as drive power, drives the wafer and rotates for the wafer passes through first shower nozzle and second shower nozzle in proper order under, thereby can wash the wafer in proper order through DHF washing liquid and ozonized DI water.

2. The utility model discloses a servo motor can drive the cylinder brush and rotate as drive power, and when the wafer contacted with the cylinder brush, the cylinder brush can be scrubbed the wafer to that can be better washs the wafer.

Drawings

Fig. 1 is a schematic perspective view of the present invention.

Fig. 2 is a schematic view of the three-dimensional structure of the parts such as the placing table and the fixing frame of the present invention.

Fig. 3 is the three-dimensional structure diagram of the servo motor, the fixing frame and the placing table.

Fig. 4 is a schematic perspective view of the bevel gear and the roller brush of the present invention.

Description of the reference numerals: 1_ fixed frame, 2_ water storage tank, 3_ first connecting pipe, 4_ first spray head, 5_ first liquid storage tank, 6_ second connecting pipe, 7_ second spray head, 8_ second liquid storage tank, 9_ servo motor, 10_ connecting shaft, 11_ fixed frame, 12_ placing table, 13_ bevel gear, 14_ roller brush, 15_ belt pulley group, 16_ self-rotation disc and 17_ protective housing.

Detailed Description

The following description is only a preferred embodiment of the present invention, and does not limit the scope of the present invention.

Example 1

The utility model provides a little granule belt cleaning device of wafer, refer to fig. 1-3, including fixed frame 1, storage water tank 2, first connecting pipe 3, first shower nozzle 4, first liquid storage pot 5, second connecting pipe 6, second shower nozzle 7, second liquid storage pot 8, servo motor 9, connecting axle 10, mount 11 and place platform 12, storage water tank 2 has been placed to the lower part of fixed frame 1, fixed frame 1's top intermediate junction has first liquid storage pot 5, the bottom of second liquid storage pot 8 is connected with first connecting pipe 3 and communicates, the lower part of first connecting pipe 3 passes fixed frame 1 top, the bottom interval of first connecting pipe 3 is connected with first shower nozzle 4 and communicates, the top rear side of fixed frame 1 is connected with second liquid storage pot 8, the rear side of second liquid storage pot 8 is connected with second connecting pipe 6 and communicates, the lower part of second connecting pipe 6 passes fixed frame 1 top, the bottom interval of second connecting pipe 6 is connected with second shower nozzle 7 and communicates, first shower nozzle 4 and second shower nozzle 7 are arranged alternately, first shower nozzle 4 and second shower nozzle 7 can be down sprayed the washing liquid and the water of washing liquid and the wafer and the connecting axle 10 of the fixed frame 1 upper part of the interval and evenly connect with the output shaft 12, the fixed frame 11 of the stand 12 is connected with the fixed frame, the stand 12 is connected with the fixed frame 11, the interval of the fixed frame, the even output shaft that is connected with the output shaft that the servo motor that is connected with the fixed frame 11 that has been connected with the interval.

When the wafer needs to be cleaned, firstly, a proper amount of DHF cleaning liquid and ozonated DI water are respectively added into the first liquid storage tank 5 and the second liquid storage tank 8 through a water pipe (not shown), then the servo motor 9, the first spray head 4 and the second spray head 7 are started, an output shaft of the servo motor 9 drives the connecting shaft 10 to rotate at a slow speed, the connecting shaft 10 drives the fixing frame 11 and the placing table 12 to rotate at a slow speed, the first spray head 4 sprays ozonated DI water downwards, the second spray head 7 sprays DHF cleaning liquid downwards, meanwhile, a worker places the wafer on the placing table 12 in sequence, the placing table 12 drives the wafer to rotate, the wafer sequentially passes through the positions right below the first spray head 4 and the second spray head 7, so that the wafer can be washed by the DHF cleaning liquid and the ozonated DI water in sequence, waste liquid can drop into the water storage tank 2 through a circular hole to be collected, then the cleaned wafer needs to be manually taken out, and a new wafer is placed on the placing table 12, and after all wafers are washed, the water storage tank is taken out, the servo motor 9, the waste liquid storage tank 2 is taken out, and the waste liquid in-water storage tank 2 can be taken out, and finally, and the waste liquid can be taken out, and the waste liquid can be treated in-storage tank 2.

Example 2

In addition to embodiment 1, referring to fig. 4, the wafer cleaning device further includes bevel gears 13 and roller brushes 14, the roller brushes 14 are rotatably connected to the rear side of the upper portion of the fixing frame 1 in a left-right symmetric manner, the wafer can be cleaned by the rotation of the roller brushes 14, the bevel gears 13 are connected to the front sides of the roller brushes 14 and the upper portion of the connecting shaft 10, and the upper bevel gears 13 are engaged with the lower bevel gears 13.

When the connecting shaft 10 rotates, the connecting shaft 10 can drive the roller brush 14 to rotate through meshing of the bevel gear 13, when the placing table 12 rotates, the wafer can be driven to rotate, when the wafer is in contact with the roller brush 14, the roller brush 14 can scrub the wafer, therefore, the wafer can be better cleaned, and when the connecting shaft 10 stops rotating, the roller brush 14 stops rotating.

Referring to fig. 4, still including pulley block 15 and from the carousel 16, place the interior equal rotary type of platform 12 and be connected with from the carousel 16, from the carousel 16 rotates and to drive the rotation of wafer for the wafer carries out all-round washing, all be connected with pulley block 15 between the lower part of from the carousel 16 and the lower part of connecting axle 10, pulley block 15 comprises two belt pulleys and a flat belt, from the carousel 16 the lower part and the lower part of connecting axle 10 all be connected with the belt pulley, all around there being the flat belt on two corresponding belt pulleys.

When the staff put the wafer in proper order on placing platform 12, the wafer is located from carousel 16 top, and when connecting axle 10 was rotating, connecting axle 10 can drive from carousel 16 through pulley group 15 and rotate, and from carousel 16 can drive the wafer rotation to can all-roundly wash the wafer, when connecting axle 10 stall, from carousel 16 stall.

Referring to fig. 2, the belt conveyor further includes a protective shell 17, the protective shell 17 is connected to the bottom of the fixing frame 11, and the pulley groups 15 are located inside the protective shell 17.

The protective housing 17 protects the pulley block 15 from DHF cleaning fluid and ozonated DI water falling onto the pulley block 15 surface.

The above description is only for the specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art can easily think of the changes or substitutions within the technical scope of the present invention, and all should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims

1. The wafer tiny particle cleaning device is characterized by comprising a fixed frame (1), a water storage tank (2), a first connecting pipe (3), a first spray head (4), a first liquid storage tank (5), a second connecting pipe (6), a second spray head (7), a second liquid storage tank (8), a servo motor (9), a connecting shaft (10), a fixed frame (11) and a placing table (12), wherein the water storage tank (2) is placed at the lower part of the fixed frame (1), the first liquid storage tank (5) is connected to the middle of the top of the fixed frame (1), the bottom of the second liquid storage tank (8) is connected with the first connecting pipe (3) and communicated, the lower part of the first connecting pipe (3) penetrates through the top of the fixed frame (1), the bottom of the first connecting pipe (3) is connected with the first spray head (4) for flushing a wafer at intervals and communicated, the rear side of the top of the fixed frame (1) is connected with the second liquid storage tank (8), the rear side of the second connecting pipe (8) is connected with the second connecting pipe (6) and communicated, the lower part of the second connecting pipe (6) penetrates through the top of the fixed frame (1), the bottom of the second connecting pipe (6) is connected with an output shaft (9) for flushing the middle connecting pipe (9) at intervals, the servo motor (9) is connected with the upper part of the servo motor (9), the lower part of the connecting shaft (10) is connected with a fixing frame (11), the fixing frame (11) is positioned in the fixing frame (1), and the fixing frame (11) is uniformly connected with three placing platforms (12) used for placing wafers at intervals and communicated with each other.

2. The wafer micro-particle cleaning device as claimed in claim 1, further comprising bevel gears (13) and roller brushes (14), wherein the roller brushes (14) for cleaning the wafer are rotatably connected to the rear side of the upper part of the fixing frame (1) in a left-right symmetrical manner, the bevel gears (13) are connected to the front sides of the roller brushes (14) and the upper part of the connecting shaft (10), and the two bevel gears (13) on the upper side are meshed with the bevel gears (13) on the lower side.

3. The wafer fine particle cleaning device as claimed in claim 2, further comprising a pulley set (15) and a self-rotation disc (16), wherein the self-rotation disc (16) for driving the wafer to rotate is rotatably connected in the placing table (12), and the pulley set (15) is connected between the lower part of the self-rotation disc (16) and the lower part of the connecting shaft (10).

4. A wafer tiny particle cleaning device as claimed in claim 3, characterized by further comprising a protective case (17), the protective case (17) is connected to the bottom of the fixing frame (11), and the pulley sets (15) are all located inside the protective case (17).

5. A wafer fine particle cleaning apparatus as set forth in claim 4, wherein the first and second nozzles (4, 7) are arranged in a crossing manner.

6. A wafer fine particle cleaning device as set forth in claim 5, characterized in that the placing tables (12) are provided with circular holes at intervals.