CN218416598U - Far-field voice module and projection equipment - Google Patents

Abstract

The utility model discloses a far field voice module and projection equipment, wherein, the far field voice module comprises a shell, a cushion pad, a microphone component, a sealing component and a pressing component; the buffer pad is positioned between the shell and the microphone assembly, the microphone assembly comprises a circuit board and a microphone arranged on one side of the circuit board, which is far away from the buffer pad, and the shell, the buffer pad and the circuit board are respectively provided with a first sound pick-up hole, a second sound pick-up hole and a third sound pick-up hole which correspond to the microphone; the sealing assembly comprises a first sealing layer and a second sealing layer which are bonded with each other, the first sealing layer is provided with an accommodating groove, the first sealing layer is arranged on one side of the circuit board, which deviates from the cushion pad, the microphone is arranged in the accommodating groove, the second sealing layer is arranged on one side of the first sealing layer, which deviates from the circuit board, and the press fitting part is connected to the shell to press the sealing assembly, the microphone assembly and the cushion pad on the inner side of the shell. The utility model provides a far field pronunciation module gas tightness is good, the end is made an uproar low, has improved sensitivity and recognition rate.

Description

Far-field voice module and projection equipment

Technical Field

The utility model relates to a projection equipment technical field especially relates to a far field pronunciation module and projection equipment.

Background

Far-field voice function is as a neotype interactive mode, and pronunciation through the people interact with machine equipment, can liberate user's both hands, breaks away from the constraint of remote controller, consequently receives people's favor more and more. In recent years, a far-field voice function is applied to projection equipment, and in order to realize the function, hardware is required to meet certain admission conditions, and generally, the requirements on the sealing performance and the noise floor of a microphone are related to the structure. However, the existing far-field speech mounting structure commonly used for projection equipment has the problems of poor air tightness and large background noise, so that the sensitivity of far-field speech is poor, the recognition rate is low, and the requirements of testing and application cannot be met.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a far field pronunciation module to there is the problem that the gas tightness is poor, the end is made an uproar is big in solving current far field pronunciation mounting structure.

The utility model provides a far field pronunciation module, include: the microphone comprises a shell, a cushion pad, a microphone component, a sealing component and a pressing component; the buffer pad and the microphone assembly are arranged on the inner side of the shell, the buffer pad is positioned between the shell and the microphone assembly, the microphone assembly comprises a circuit board and a microphone arranged on one side of the circuit board, which is far away from the buffer pad, and a first sound pickup hole, a second sound pickup hole and a third sound pickup hole which correspond to the microphone are respectively arranged on the shell, the buffer pad and the circuit board; the sealing assembly comprises a first sealing layer and a second sealing layer which are bonded with each other, the first sealing layer is provided with an accommodating groove, the first sealing layer is arranged on one side, deviating from the buffer pad, of the circuit board, the microphone is arranged in the accommodating groove, the second sealing layer is arranged on one side, deviating from the circuit board, of the first sealing layer, the pressing piece is arranged on one side, deviating from the first sealing layer, of the second sealing layer, and the pressing piece is connected to the shell so as to press the sealing assembly, the microphone assembly and the buffer pad on the inner side of the shell.

In one embodiment, the accommodating groove is disposed through the first sealing layer.

In one embodiment, the second sealing layer is at least two layers.

In one embodiment, two adjacent second sealing layers are connected by an adhesive layer.

In one embodiment, the thickness of each second sealant layer is the same.

In one embodiment, the number of the microphones is at least one, and the number of the first sound pickup holes, the number of the second sound pickup holes and the number of the third sound pickup holes correspond to the number of the microphones one to one.

In one embodiment, the cushion, the first sealant and the second sealant are made of elastic materials.

In one embodiment, the cushion pad, the first sealing layer, and the second sealing layer are made of foam.

In one of the embodiments, the press part is plate-shaped and made of a metal material.

The utility model also provides a projection equipment, including above-mentioned far field pronunciation module.

The utility model provides a far field pronunciation module and projection equipment, through pressfitting with seal assembly, microphone subassembly and buffer pad pressure locate the inboard of casing, the microphone subassembly includes circuit board and microphone, sets up the blotter between circuit board and casing, avoids the vibration of casing to transmit the circuit board, reduces the pickup end of microphone and makes an uproar, and the circuit board deviates from is located to the microphone the blotter one side, be equipped with the first sound hole of picking up, second sound hole and the third sound hole of picking up that correspond with the microphone on casing, blotter and the circuit board respectively, the outside pronunciation of casing passes in proper order and respectively picks up the sound hole and is received by the microphone, and the seal assembly that sets up on one side of deviating from the blotter at the circuit board includes the first sealing layer and the second sealing layer that bond mutually, and the microphone is located in the holding tank of first sealing layer, and the back and the side of microphone are sealed isolation, and the gas tightness of microphone is good to improve far field pronunciation's sensitivity and rate of discernment.

Drawings

Fig. 1 is a schematic structural diagram of a far-field speech module according to an embodiment of the present invention;

fig. 2 is an exploded schematic view of a far-field speech module according to an embodiment of the present invention;

fig. 3 is a schematic view of another perspective explosion structure of the far-field speech module according to an embodiment of the present invention;

fig. 4 is a schematic structural diagram of a sealing assembly in a far-field speech module according to an embodiment of the present invention;

fig. 5 is an exploded view of the seal assembly of fig. 4.

The reference numbers illustrate: 10. a housing; 11. a first sound pickup hole; 12. a stud; 20. a cushion pad; 21. a second sound pickup hole; 30. a microphone assembly; 31. a circuit board; 32. a microphone; 33. a third sound pickup hole; 40. a seal assembly; 41. a first sealing layer; 411. accommodating grooves; 42. a second sealing layer; 50. pressing and combining the parts; 60. and locking the screw.

Detailed Description

The principles and features of the present invention will be described with reference to the drawings, which are provided for illustration only and are not intended to limit the scope of the invention.

In the description of the present invention, it is to be understood that the terms "center", "length", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "inner", "outer", "circumferential", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the system or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be interconnected within two elements or in a relationship where two elements interact with each other unless otherwise specifically limited. The specific meaning of the above terms in the present invention can be understood according to specific situations by those of ordinary skill in the art.

As shown in fig. 1, fig. 2 and fig. 3, for the utility model provides a far field voice module, include: the housing 10, the cushion 20, the microphone assembly 30, the sealing assembly 40 and the press-fit member 50; the buffer pad 20 and the microphone assembly 30 are arranged inside the casing 10, the buffer pad 20 is arranged between the casing 10 and the microphone assembly 30, the microphone assembly 30 comprises a circuit board 31 and a microphone 32 arranged on one side of the circuit board 31 departing from the buffer pad 20, and the casing 10, the buffer pad 20 and the circuit board 31 are respectively provided with a first sound pickup hole 11, a second sound pickup hole 21 and a third sound pickup hole 33 corresponding to the microphone 32; the sealing assembly 40 comprises a first sealing layer 41 and a second sealing layer 42 which are bonded with each other, the first sealing layer 41 is provided with an accommodating groove 411, the first sealing layer 41 is arranged on one side of the circuit board 31 departing from the buffer pad 20, the microphone 32 is arranged in the accommodating groove 411, the second sealing layer 42 is arranged on one side of the first sealing layer 41 departing from the circuit board 31, the press fitting piece 50 is arranged on one side of the second sealing layer 42 departing from the first sealing layer 41, and the press fitting piece 50 is connected to the shell 10 so as to press the sealing assembly 40, the microphone, the assembly 30 and the buffer pad 20 on the inner side of the shell 10.

The far-field voice module is characterized in that the sealing assembly 40, the microphone assembly 30 and the buffer pad 20 are pressed on the inner side of the shell 10 through the pressing piece 50 and are tightly abutted with each other, the microphone assembly 30 comprises the circuit board 31 and the microphone 32, the buffer pad 20 is arranged between the circuit board 31 and the shell 10 to prevent vibration of the shell 10 from being transmitted to the circuit board 31, and the sound pickup bottom noise of the microphone 32 is reduced, the microphone 32 is arranged on one side, away from the buffer pad 20, of the circuit board 31, the shell 10, the buffer pad 20 and the circuit board 31 are respectively provided with the first sound pickup hole 11, the second sound pickup hole 21 and the third sound pickup hole 33 corresponding to the microphone 32, voice outside the shell 10 sequentially passes through the sound holes to be picked up by the microphone 32, the sealing assembly 40 arranged on one side, away from the buffer pad 20, of the circuit board 31 comprises the first sealing layer 41 and the second sealing layer 42 which are bonded with each other, the microphone 32 is arranged in the accommodating groove 411 of the first sealing layer 41, the back surface and the side surface of the microphone 32 are sealed and isolated, and the side surface of the microphone 32 is good, so that the air tightness and the recognition rate of the far-field voice are improved.

The utility model provides a far field pronunciation module, it is applicable in projection equipment, intelligent audio amplifier, TV set, but speech control's electronic equipment such as air conditioner or robot for receive pronunciation control signal.

Specifically, the cushion pad 20, the first sealant 41, and the second sealant 42 are all made of an elastic material. For example, the cushion pad 20, the first sealant 41, and the second sealant 42 are made of foam. The foam has excellent sealing performance and compression deformation resistance, and can ensure that the far-field voice module meets the requirements of sealing performance and noise floor. In other embodiments, the cushion 20, the first sealant 41, and the second sealant 42 may also be made of an elastic material such as silicone, rubber, etc. It is understood that the cushion 20, the first sealant layer 41, and the second sealant layer 42 can be made of the same elastic material, or can be made of different kinds of elastic materials.

Wherein the first sealant 41 and the second sealant 42 in the sealing assembly 40 are bonded. Optionally, the first sealing layer 41 and the second sealing layer 42 may be bonded and fixed by a double-sided adhesive tape or glue to form an integrated structure, so that the sealing effect of the microphone 32 can be ensured when the sealing assembly 40 is tightly abutted to the circuit board 31, the air tightness is improved, the assembly is convenient, and the assembly efficiency is improved.

The first sealing layer 41 and the second sealing layer 42 have the same overall shape. For example, the overall shape of the first sealant 41 and the second sealant 42 is circular. When the first sealing layer 41 and the second sealing layer 42 are pressed by the pressing part 50, the first sealing layer and the second sealing layer extend uniformly in the circumferential direction, and deform uniformly, so that the sealing effect of the microphone 32 can be ensured. The outer diameters of the first sealant 41 and the second sealant 42 may be set according to the size of the microphone 32 and the airtightness requirement condition of the microphone 32. The outer diameters of the first and second seal layers 41, 42 may be the same, or the outer diameter of the first seal layer 41 may be slightly smaller than the outer diameter of the second seal layer 42. Of course, the overall shape of the first sealing layer 41 and the second sealing layer 42 may be other regular or irregular shapes such as a rectangle, an ellipse, a triangle, a pentagon, and a hexagon.

The first pick-up sound hole 11, the second pick-up sound hole 21 and the third pick-up sound hole 33 are identical in shape. For example, the first sound pickup hole 11, the second sound pickup hole 21 and the third sound pickup hole 33 are all circular, wherein the diameter of the second sound pickup hole 21 is larger than that of the first sound pickup hole 11, the diameter of the second sound pickup hole 21 is larger than that of the third sound pickup hole 33, the second sound pickup hole 21 is disposed on the cushion pad 20, and the cushion pad 20 is made of an elastic material, when the cushion pad 20 is deformed to extend toward the inner side of the hole by compression of the housing 10 and the circuit board 31, because the second sound pickup hole 21 has the largest diameter, the risk that the second sound pickup hole 21 is filled or the cushion pad 20 blocks the first sound pickup hole 11 and the third sound pickup hole 33 is avoided, and the voice outside the housing 10 can smoothly pass through the first sound pickup hole 11, the second sound pickup hole 21 and the third sound pickup hole 33 to be received by the microphone 32. The diameter of the second sound collecting hole 21 after the cushion 20 is compressed can be calculated according to the compression amount of the cushion 20 and the diameter of the second sound collecting hole 21, so that the risk that the second sound collecting hole 21 is filled or the cushion 20 shields the first sound collecting hole 11 and the third sound collecting hole 33 can be effectively avoided. Of course, the shapes of the first sound pickup hole 11, the second sound pickup hole 21, and the third sound pickup hole 33 may be other common shapes such as a rectangle and an ellipse.

In one embodiment, the press 50 is plate-shaped and made of a metal material. Specifically, the pressing member 50 may be made of a metal material such as stainless steel, iron, copper, aluminum or alloy, which has good rigidity, and the pressing member 50 has a plate shape, so that when the pressing member 50 abuts against the components between the pressing housing 10 and the pressing member 50, the cushion pad 20, the microphone assembly 30 and the sealing assembly 40 are uniformly stressed, thereby ensuring the air tightness of the microphone 32.

Optionally, the press 50 is fixedly attached to the inside of the housing 10 by means of a locking screw 60. Specifically, as shown in fig. 1 and 2, the pressing member 50 is provided with a plurality of through holes, the inner side of the housing 10 is provided with a plurality of studs 12 corresponding to the through holes, and each stud 12 is provided with a threaded hole. During assembly, the cushion 20, the microphone assembly 30, the sealing assembly 40 and the pressing piece 50 are sequentially placed on the inner side of the housing 10, the first sound pickup hole 11, the second sound pickup hole 21 and the third sound pickup hole 33 are made to correspond to each other, and then the plurality of locking screws 60 are respectively inserted into the corresponding through holes to be connected with the threaded holes and are gradually screwed until the pressing piece 50 presses the cushion 20, the microphone assembly 30 and the sealing assembly 40.

Further, the inner side of the casing 10 is further provided with a positioning column, the circuit board 31 is provided with a positioning hole, and the positioning column is inserted into the positioning hole, so that the microphone 32 and the third sound pickup hole 33 on the circuit board 31 can be ensured to correspond to the first sound pickup hole 11 on the casing 10, and the voice outside the casing 10 can smoothly pass through the first sound pickup hole 11, the second sound pickup hole 21 and the third sound pickup hole 33 to be received by the microphone 32.

In one embodiment, as shown in fig. 4 and 5, the receiving groove 411 is disposed through the first sealing layer 41. By penetrating the accommodating groove 411 through the first sealing layer 41, a sufficient accommodating space is provided for the microphone 32, and when the sealing assembly 40 is compressed, the back and the side of the microphone 32 in the accommodating groove 411 are sealed and isolated, so that the microphone 32 is ensured to have good air tightness. It is understood that when the first sealing layer 41 has a relatively thick thickness, such as when the thickness of the first sealing layer 41 is greater than 1.2 times the height of the microphone 32, the accommodating groove 411 may not be disposed through the first sealing layer 41, and in this case, the accommodating groove 411 is disposed on a side of the first sealing layer 41 facing the circuit board 31.

In one embodiment, second sealant layer 42 is at least two layers. Since the fitting position of the closing member 50 inside the housing 10 is fixed, for example, the height of the stud 12 for fixing the closing member 50 is fixed, the compression amount of the cushion pad 20 and the sealing member 40 can be rapidly adjusted by adjusting the number of layers of the second sealing layer 42, thereby ensuring the air tightness and noise-reduction requirements of the microphone 32. It will be appreciated that the specific number of layers of the second sealing layer 42 may be determined based on the distance between the truss 50 and the housing 10.

Further, the adjacent two second seal layers 42 are connected by an adhesive layer. Specifically, two adjacent second sealing layers 42 may be connected by bonding layers such as a double-sided tape and a glue layer, so that the first sealing layer 41 and the second sealing layer 42 in the sealing assembly 40 are connected, thereby ensuring the sealing effect of the microphone 32, improving the air tightness, facilitating the assembly, and improving the assembly efficiency.

Furthermore, the thickness of each second sealing layer 42 is the same, and the elastic material substrate with the same thickness can be used for manufacturing the second sealing layer 42, so that the stock can be reduced. Of course, the thickness of each second sealant layer 42 may also be different. By adjusting the thickness of the second sealing layer 42, the sealing effect of the microphone 32 is ensured.

In one embodiment, there is at least one microphone 32, and the number of the first sound pickup hole 11, the second sound pickup hole 21 and the third sound pickup hole 33 corresponds to the number of microphones 32. As shown in fig. 1, 2 and 3, the number of the microphones 32 is two, two microphones 32 are arranged on the circuit board 31 at intervals, accordingly, two first sound-collecting holes 11 are arranged on the housing 10, two cushion pads 20 are arranged, each cushion pad 20 is provided with a second sound-collecting hole 21, and the circuit board 31 is provided with a third sound-collecting hole 33 corresponding to the two microphones 32. Of course, the number of the microphones 32 may be provided in plural, such as 2, 4, 6 or 8. The plurality of microphones 32 are uniformly distributed along a straight line, or are distributed in a rectangular array, or are distributed in a circular array, or are uniformly distributed in other forms.

The utility model also provides a projection equipment, including above-mentioned far field pronunciation module.

In the projection device, the sealing assembly 40, the microphone assembly 30 and the buffer pad 20 are pressed on the inner side of the casing 10 through the pressing piece 50 and are tightly abutted with each other, the microphone assembly 30 comprises the circuit board 31 and the microphone 32, the buffer pad 20 is arranged between the circuit board 31 and the casing 10 to prevent the vibration of the casing 10 from being transmitted to the circuit board 31, and reduce the sound pickup noise of the microphone 32, the microphone 32 is arranged on one side of the circuit board 31, which is far away from the buffer pad 20, the casing 10, the buffer pad 20 and the circuit board 31 are respectively provided with the first sound pickup hole 11, the second sound pickup hole 21 and the third sound pickup hole 33 corresponding to the microphone 32, the voice outside the casing 10 sequentially passes through the sound pickup holes to be received by the microphone 32, the sealing assembly 40 arranged on one side of the circuit board 31, which is far away from the buffer pad 20, comprises the first sealing layer 41 and the second sealing layer 42 which are bonded, the microphone 32 is arranged in the accommodating groove 411 of the first sealing layer 41, the back and the side surface of the microphone 32 are sealed and isolated, and the microphone 32 is good, so that the air tightness and the recognition rate of the far-field voice are improved.

The above description is only for the preferred embodiment of the present invention, and is not intended to limit the present invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included within the protection scope of the present invention.

Claims (10)

1. A far-field speech module, comprising: the microphone comprises a shell, a cushion pad, a microphone component, a sealing component and a pressing component;

the buffer pad and the microphone assembly are arranged on the inner side of the shell, the buffer pad is positioned between the shell and the microphone assembly, the microphone assembly comprises a circuit board and a microphone arranged on one side of the circuit board, which is far away from the buffer pad, and a first sound pickup hole, a second sound pickup hole and a third sound pickup hole which correspond to the microphone are respectively arranged on the shell, the buffer pad and the circuit board; the sealing assembly comprises a first sealing layer and a second sealing layer which are bonded with each other, the first sealing layer is provided with an accommodating groove, the first sealing layer is arranged on one side, away from the buffering pad, of the circuit board, the microphone is arranged in the accommodating groove, the second sealing layer is arranged on one side, away from the circuit board, of the first sealing layer, the pressing piece is arranged on one side, away from the first sealing layer, of the second sealing layer, and the pressing piece is connected to the shell so as to press the sealing assembly, the microphone assembly and the buffering pad on the inner side of the shell.

2. The far-field speech module of claim 1, wherein the receiving groove is disposed through the first sealing layer.

3. The far-field speech module of claim 1, wherein the second encapsulant layer is at least two layers.

4. The far-field speech module according to claim 3, wherein two adjacent second sealant layers are connected by an adhesive layer.

5. The far-field speech module of claim 3, wherein the second sealant layers are of the same thickness.

6. The far-field speech module of claim 1, wherein there is at least one microphone, and the number of the first, second and third pickup holes corresponds to the number of microphones.

7. The far-field speech module according to claim 1, wherein the cushion, the first sealing layer and the second sealing layer are made of an elastic material.

8. The far-field speech module according to claim 7, wherein the cushion, the first sealing layer and the second sealing layer are made of foam.

9. The far-field speech module according to claim 1, wherein the press is plate-shaped and made of a metallic material.

10. A projection device comprising the far-field speech module of any one of claims 1 to 9.

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