CN114615579A

CN114615579A - Far field voice installation structure and intelligent projection equipment

Info

Publication number: CN114615579A
Application number: CN202210190384.2A
Authority: CN
Inventors: 黄思尧
Original assignee: Formovie Chongqing Innovative Technology Co Ltd
Current assignee: Formovie Chongqing Innovative Technology Co Ltd
Priority date: 2022-02-28
Filing date: 2022-02-28
Publication date: 2022-06-10

Abstract

The invention relates to a far-field voice installation structure and intelligent projection equipment. Far-field pronunciation mounting structure includes the casing, first bolster, first sealing member, the microphone, the circuit board, sealed buffering subassembly and pressfitting spare, the pressfitting spare will range upon range of the sealed buffering subassembly that sets up in proper order, the back of casing is located in circuit board and first bolster pressure, the thickness of first sealing member is greater than the thickness of first bolster, the hole of stepping down has been seted up on the first bolster, first sealing member is located in the hole of stepping down and first sealing member presses and locates between the back of casing and the front of circuit board, the casing, correspond respectively on first sealing member and the circuit board and seted up the pronunciation hole, the microphone is installed in the back of circuit board and the pickup portion of microphone is towards the pronunciation hole, sealed buffering subassembly cladding is in the microphone periphery. Through first bolster, first sealing member, sealed buffering subassembly and pressfitting component combination sealed fixed, promote far field and awaken sensitivity and recognition rate up.

Description

Far field voice installation structure and intelligent projection equipment

Technical Field

The invention relates to the technical field of radio equipment installation, in particular to a far-field voice installation structure and intelligent projection equipment.

Background

Far-field voice is an interaction mode between people and machines, and is widely applied to intelligent products such as intelligent televisions, intelligent projectors and intelligent sound boxes. Compared with near-field voice, the action distance of far-field voice is usually 1 m to 10 m, and the operations such as content search on demand, equipment control, playing control and the like can be remotely realized. Far-field speech equipment usually uses a microphone array to pick up speech, and traditional far-field speech equipment usually uses a single silica gel pad to seal a microphone, so that the problems of large noise, poor air tightness and low frequency index exist, and the problems of poor far-field awakening recognition degree and poor sensitivity are caused.

Disclosure of Invention

In view of the above, it is desirable to provide a far-field voice installation structure and an intelligent projection device, which address the problem of poor far-field wake-up recognition and sensitivity.

The utility model provides a far-field pronunciation mounting structure, includes casing, first bolster, first sealing member, microphone, circuit board, sealed buffering subassembly and pressfitting spare, first bolster reaches the circuit board range upon range of set up in the back of casing, set up the hole of stepping down on the first bolster, first sealing member is located in the hole of stepping down, the thickness of first sealing member is greater than the thickness of first bolster is so that the both sides of first sealing member butt respectively the back of casing with the front of circuit board, the microphone install in the back of circuit board, be equipped with respectively on casing, first sealing member and the circuit board with first pronunciation hole, second pronunciation hole and the third pronunciation hole that the microphone corresponds, sealed buffering subassembly cladding in the microphone periphery, the pressfitting spare connect in the casing and will sealed buffering subassembly, The circuit board and the first buffer piece are arranged on the back surface of the shell in a pressing mode.

In one embodiment, the sealing buffer assembly includes a second sealing element and a second buffering element, the front surface of the second sealing element is provided with an accommodating groove, the front surface of the second buffering element is provided with a groove, the front surface of the second sealing element is pressed against the back surface of the circuit board, the microphone is located in the accommodating groove, the second buffering element is pressed against the back surface of the circuit board, and the second sealing element is located in the groove.

In one embodiment, the sealing buffer assembly includes a third buffer member, and the third buffer member is disposed on the back surface of the second buffer member and the front surface of the pressing member in a pressing manner.

In one embodiment, the first buffer member, the first sealing member, the second buffer member, the second sealing member and the third buffer member are made of an elastic material.

In one embodiment, the first buffer member, the first sealing member, the second sealing member and the third buffer member are all made of foam; the second buffer piece is a silica gel sleeve.

In one embodiment, an edge of the first buffer member protrudes from an edge of the circuit board.

In one embodiment, the far-field speech mounting structure further includes a locking member, a convex pillar is disposed on the back surface of the housing, a connecting hole is disposed on the convex pillar, a through hole corresponding to the connecting hole is disposed on the pressing member, and the locking member penetrates through the through hole and is connected with the connecting hole to lock the pressing member to the housing.

In one embodiment, the back of the casing is provided with a limiting frame, the plurality of protruding columns are arranged in a space defined by the limiting frame, the plurality of protruding columns are arranged at intervals to define an installation area, and the first buffer member, the circuit board and the sealing buffer assembly are arranged in the installation area in a pressing manner.

In one embodiment, a positioning column is arranged in the mounting area, and the first buffer piece and the circuit board are respectively provided with a first positioning hole and a second positioning hole which are matched with the positioning column;

or, be equipped with the reference column in the installation region, set up on the first bolster with reference column complex first locating hole, the back of first bolster is equipped with convex spacing portion, be equipped with on the circuit board with spacing portion complex spacing hole.

The intelligent projection equipment comprises a projection main body and the far-field voice installation structure, wherein the shell is connected with the projection main body, and the back face of the shell faces the inside of the projection main body.

According to the far-field voice installation structure and the intelligent projection equipment, the first buffer piece is arranged between the circuit board and the shell in a pressing mode, so that vibration of the shell is prevented from being transmitted to the circuit board, and pickup noise is reduced; the first buffer piece is provided with a yielding hole, a first sealing piece with the thickness larger than that of the first buffer piece is arranged in the yielding hole, the first sealing piece is arranged between the back surface of the shell and the front surface of the circuit board in a pressing mode, the shell, the first sealing piece and the circuit board are respectively and correspondingly provided with a voice hole, the microphone is arranged on the back surface of the circuit board, a voice pick-up part of the microphone faces the voice hole, external voice sequentially enters the voice pick-up part of the microphone through the voice holes and is received by the microphone, meanwhile, the first sealing piece seals and isolates the voice hole of the circuit board and the periphery of the voice hole of the shell, so that the external voice can only enter the voice pick-up part of the microphone from the voice holes, the front noise interference is avoided, meanwhile, the back surface of the circuit board is provided with a sealing buffer component which is coated on the periphery of the microphone, the back surface and the side surface of the microphone are sealed and isolated, and the noise interference of the back surface is avoided, each part is pressed and arranged on the back surface of the shell through the pressing part, so that the airtightness consistency and the frequency response index are improved, and the far field awakening sensitivity and the identification rate are improved.

Drawings

FIG. 1 is an exploded view of a far field speech mounting configuration of an embodiment of the present application from a first perspective;

FIG. 2 is an assembled schematic view of FIG. 1;

FIG. 3 is an exploded view of a far field speech mounting structure from a second perspective in accordance with an embodiment of the present application;

FIG. 4 is an assembly diagram of a far field speech mounting structure from a third perspective in accordance with an embodiment of the present application;

FIG. 5 is a schematic cross-sectional view taken along A-A in FIG. 4;

FIG. 6 is an enlarged schematic view at B of FIG. 5;

description of reference numerals:

10. a housing; 110. a first speech hole; 120. a convex column; 122. connecting holes; 130. a limiting frame; 140. an installation area; 142. a positioning column; 20. a first buffer member; 210. a hole of abdication; 220. a first positioning hole; 30. a first seal member; 310. a second speech hole; 40. a microphone; 410. a sound pickup section; 50. a circuit board; 510. a third speech hole; 520. a second positioning hole; 60. a sealing cushion assembly; 61. a second seal member; 610. accommodating grooves; 62. a second buffer member; 620. a groove; 63. a third buffer member; 70. a pressing part; 710. a through hole; 80. a locking member; 90. and (4) a dust screen.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present invention more comprehensible, embodiments accompanying figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "first," "second," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present invention and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood according to specific situations by those of ordinary skill in the art.

In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. As used herein, the terms "vertical," "horizontal," "upper," "lower," "first," "second," and the like are for illustrative purposes only and do not denote a single embodiment.

Referring to fig. 1 to 6, an embodiment of the present application provides a far-field speech mounting structure, which includes a housing 10, a first buffer 20, a first sealing element 30, a microphone 40, a circuit board 50, a sealing buffer assembly 60, and a pressing element 70. The pressing member 70 presses the sealing buffer assembly 60, the circuit board 50, and the first buffer member 20, which are sequentially stacked, to the rear surface of the housing 10. Namely, the first cushion member 20 is located between the circuit board 50 and the housing 10, and the sealing cushion assembly 60 is located between the circuit board 50 and the pressing member 70. When the utility model is used, the surface facing to the outside is the front surface, and the reverse surface.

Further, the housing 10, the first sealing member 30 and the circuit board 50 are respectively provided with a first sound hole 110, a second sound hole 310 and a third sound hole 510. The microphone 40 is mounted on the back surface of the circuit board 50, and the sound pickup portion 410 of the microphone 40 faces the third sound hole 510. The sealing buffer assembly 60 covers the periphery of the microphone 40.

Further, a yielding hole 210 is formed in the first buffer member 20, the first sealing member 30 is arranged in the yielding hole 210, the thickness of the first sealing member 30 is larger than that of the first buffer member 20, so that the two sides of the first sealing member 30 are respectively abutted to the back surface of the casing 10 and the front surface of the circuit board 50, namely, the first sealing member 30 is pressed between the back surface of the casing 10 and the front surface of the circuit board 50. That is, one side of the first sealing member 30 is attached to the back surface of the housing 10, and the other side is attached to the front surface of the circuit board 50. Due to the extrusion of the pressing element 70, the first sealing element 30 and the first buffering element 20 are compressed to a certain extent after the extrusion, and the thickness of the compressed first sealing element 30 is greater than or equal to that of the first buffering element 20.

Optionally, the first buffer 20 is a buffer foam. In other embodiments, the first buffer member 20 may also be made of an elastic material with a shock absorption function, such as silicon rubber or rubber. The first sealing member 30 is a sealing foam. In other embodiments, the first sealing element 30 may be made of an elastic material having a sealing function, such as silicone rubber or rubber.

In the far-field voice installation structure of the embodiment, the first buffer member 20 is pressed between the circuit board 50 and the casing 10, so that the vibration of the casing 10 is prevented from being transmitted to the circuit board 50, and the sound pickup noise is reduced; the first buffer member 20 is provided with a yielding hole 210, a first sealing member 30 with a thickness larger than that of the first buffer member 20 is arranged in the yielding hole 210, the first sealing member 30 is arranged between the back surface of the casing 10 and the front surface of the circuit board 50 in a pressing manner, voice holes are correspondingly arranged on the casing 10, the first sealing member 30 and the circuit board 50 respectively, the microphone 40 is arranged on the back surface of the circuit board 50, the sound pickup part 410 of the microphone 40 faces the voice holes, external voices enter the sound pickup part 410 of the microphone 40 through the voice holes in sequence to be received by the microphone 40, and meanwhile, the first sealing member 30 seals and isolates the voice holes of the circuit board 50 and the periphery of the voice holes of the casing 10, so that the external voices only can enter the sound pickup part 410 of the microphone 40 from the voice holes, and noise interference on the front surface is avoided; meanwhile, the back surface of the circuit board 50 is provided with a sealing buffer component 60 which is wrapped on the periphery of the microphone 40, the back surface and the side surface of the microphone 40 are sealed and isolated, noise interference on the back surface is avoided, all parts are tightly pressed and arranged on the back surface of the shell 10 through a pressing component 70, airtightness consistency and frequency response indexes are improved, and therefore far field awakening sensitivity and identification rate are improved.

The far-field voice installation structure is applicable to intelligent electric products such as intelligent sound boxes, intelligent televisions and intelligent projectors.

Referring to fig. 1, 3, 5 and 6, in particular, in one embodiment, the sealing buffer assembly 60 includes a second sealing element 61 and a second buffer element 62. The front of second sealing member 61 is equipped with holding tank 610, the front of second bolster 62 is equipped with recess 620, the front pressure of second sealing member 61 is located the back of circuit board 50, microphone 40 is located in the holding tank 610, second bolster 62 is located the back of circuit board 50, second sealing member 61 is located in the recess 620. The second sealing member 61 is wrapped around the microphone 40 through the receiving groove 610, so that noise on the back of the microphone 40 is isolated. The second buffer member 62 is coated on the periphery of the second sealing member 61 through the groove 620, and plays a role in buffering the vibration from the pressing member 70 and improving the air tightness.

Optionally, in one embodiment, the second sealing element 61 is a sealing foam, and the second buffer element 62 is a silicone sleeve. In other embodiments, the second sealing element 61 may also be made of an elastic material with a sealing effect, such as silicone rubber, etc., and the second buffer element 62 may also be made of an elastic material with a buffering effect, such as a rubber sleeve, etc.

Further, in one embodiment, the sealing buffer assembly 60 includes a third buffer member 63, and the third buffer member 63 is disposed on the back surface of the second buffer member 62 and the front surface of the compressing element 70 in a compressing manner. The third buffer member 63 is further disposed between the pressing member 70 and the second buffer member 62, so as to further prevent the vibration of the pressing member 70 from being transmitted to the microphone 40, reduce the pickup noise, and improve the far-field awakening sensitivity and the recognition rate.

In one embodiment, the second buffer member 62 is a silicone sleeve. The third buffer member 63 is made of buffer foam. First bolster 20 adopts buffering silica gel cover, and inside formation recess 620 has certain thickness, not only can play the absorbing effect of buffering, can also play the effect of adjusting the compression volume of closing piece 70 simultaneously. The third buffer member 63 is made of buffer foam and made of different buffer materials with the first buffer member 20, so that two-stage buffer protection is formed, and the buffer effect is better. In other embodiments, the third buffer 63 may also be made of an elastic material with a buffering function, such as silicone rubber or rubber.

In one embodiment, when the circuit board 50 is pressed on the first buffer 20, the edge of the first buffer 20 protrudes from the edge of the circuit board 50. Referring to fig. 1 and 3, the length of the circuit board 50 is less than the length of the first cushion member 20, and the width of the circuit board 50 is less than the width of the first cushion member 20. During assembly, the periphery of the first buffer member 20 is isolated from the periphery of the circuit board 50, and the edge of the circuit board 50 is not in contact with the casing 10, so that the vibration of the casing 10 is further prevented from being transmitted to the circuit board 50, and the sound wave vibration of the casing 10 is eliminated.

Referring to fig. 1 and 3, further, in one embodiment, the far-field speech mounting structure further includes a locking member 80, and the rear surface of the housing 10 has a protruding column 120. The convex column 120 is provided with a connecting hole 122, and the pressing member 70 is provided with a through hole 710 corresponding to the connecting hole 122. The locking member 80 passes through the through hole 710 and is connected with the connecting hole 122 to lock the closing member 70 to the housing 10. Optionally, the protruding column 120 is a structure integrally formed with the casing 10, the connecting hole 122 is a threaded hole, the locking member 80 is a screw, the locking member 80 is connected with the connecting hole 122 in a threaded fit manner after passing through the through hole 710, and the pressing member 70 is gradually pressed and locked towards the direction of the back of the casing 10. In other embodiments, the retaining member 80 may also be a self-tapping screw, and the attachment holes 122 may be unthreaded holes that mate with the self-tapping screw. Optionally, the press 70 is a metal plate.

Referring to fig. 1, in one embodiment, a limiting frame 130 is disposed on the back surface of the housing 10, and a plurality of protruding columns 120 are disposed. The plurality of protruding columns 120 are disposed in a space surrounded by the limiting frame 130, the plurality of protruding columns 120 are disposed at intervals to surround and form a mounting area 140, and the first buffer member 20, the circuit board 50 and the sealing buffer assembly 60 are pressed on the mounting area 140. In the present embodiment, four protruding columns 120 are disposed at four corners of the limiting frame 130. The four posts 120 enclose a mounting area 140. The convex column 120 can be used for positioning and limiting the periphery of the first buffer member 20 to a certain extent, so that the installation is convenient, and the circuit board 50 is arranged in the area covered by the first buffer member 20, compared with the structure of the convex column 120 outside the limiting frame 130, the contact between the circuit board 50 and the shell 10 can be further avoided, and the bottom noise is reduced. Further, a plurality of protruding columns 120 are spaced apart from the circuit board 50, so as to prevent the vibration of the housing 10 from being transmitted to the circuit board 50.

During assembly, the first buffer member 20, the first sealing member 30, the circuit board 50 and the sealing buffer assembly 60 are sequentially stacked in the mounting region 140, and finally the pressing member 70 is pressed on the sealing buffer assembly 60 and is compressed and locked on the convex column 120 downwards through the locking member 80; alternatively, the first sealing member 30 may be attached to the front surface of the circuit board 50, the second sound hole 310 and the third sound hole 510 are disposed in a manner of being opposite to each other, the second sealing member 61 is attached to the back surface of the circuit board 50, and then the circuit board 50 is disposed in the mounting region 140. After all the elements in the installation area 140 are stacked, the overall height is greater than or equal to that of the convex column 120, the pressing piece 70 is pressed on the sealing buffer component 60, and the pressing piece 70 is gradually extruded to the sealing buffer component 60 in the locking process of the locking piece 80 to press all the elements in the installation area 140 tightly, so that the air tightness is improved; the pressing element 70 is pressed to the end surface of the protruding pillar 120 and then is not pressed down any more, thereby protecting the circuit board 50 and the microphone 40.

In this embodiment, two microphones 40 are disposed on the back of the circuit board 50 at intervals, two first sound holes 110 are correspondingly disposed on the housing 10, two yielding holes 210 are disposed on the first buffer 20, two third sound holes 510 are disposed on the circuit board 50, and two first sealing members 30 and two sealing buffer assemblies 60 are disposed on the circuit board 50, so as to form a double-sound receiving function, and further improve the far-field awakening sensitivity and recognition rate.

Optionally, referring to fig. 1, in an embodiment, a positioning column 142 is disposed in the mounting region 140, and the first cushion 20 and the circuit board 50 are respectively provided with a first positioning hole 220 and a second positioning hole 520. Through the cooperation of the first positioning hole 220, the second positioning hole 520 and the positioning post 142, the first cushion 20 and the circuit board 50 can be accurately mounted to the corresponding positions, which facilitates the accurate alignment of the first sound hole 110, the second sound hole 310 and the third sound hole 510. In other embodiments, the height of the positioning column 142 is less than the thickness of the first buffer 20, the circuit board 50 is not provided with the second positioning hole 520, but the back surface of the first buffer 20 is provided with a protruding limiting portion, the circuit board 50 is provided with a limiting hole, and the circuit board 50 is positioned by the matching of the limiting hole and the limiting portion, so as to effectively prevent the vibration of the housing 10 from being transmitted to the circuit board 50.

Optionally, referring to fig. 6, the far-field speech mounting structure further includes a dust screen 90, and the dust screen 90 is pressed between the circuit board 50 and the first sealing member 30 and is located between the second speech hole 310 and the third speech hole 510. By the dust screen 90, external dust and other objects are prevented from entering the interior of the housing 10 to damage the internal components such as the microphone 40. Optionally, in other embodiments, the dust screen 90 may also be pressed between the first sealing member 30 and the housing 10 and located between the first sound hole 110 and the second sound hole 310. The outer periphery of the dust screen 90 is covered with the first sealing member 30, and sound is prevented from entering the sound pickup portion 410 from a gap around the dust screen.

An embodiment of the present application still provides an intelligent projection equipment, including the projection main part and far field pronunciation mounting structure, casing 10 with the projection main part is connected, the back orientation of casing 10 inside the projection main part.

The intelligent projection equipment of this embodiment, the projection main part includes the main casing and sets up the projection subassembly in the projection main part. The housing 10 is connected with the main housing to form an inner cavity, the back of the housing 10 faces the inner cavity, and the first buffer member 20, the circuit board 50, the sealing buffer assembly 60, the pressing member 70 and the like which are arranged on the housing 10 in a pressing manner are all arranged in the inner cavity. The first buffer piece 20 is pressed between the circuit board 50 and the shell 10, so that the vibration of the shell 10 is prevented from being transmitted to the circuit board 50, and the pickup noise is reduced; the first buffer member 20 is provided with a yielding hole 210, the first sealing member 30 with a thickness larger than that of the first buffer member 20 is arranged in the yielding hole 210, the first sealing member 30 is arranged between the back surface of the casing 10 and the front surface of the circuit board 50 in a pressing manner, sound holes are correspondingly arranged on the casing 10, the first sealing member 30 and the circuit board 50 respectively, the microphone 40 is arranged on the back surface of the circuit board 50, the sound pick-up portion 410 of the microphone 40 faces the sound holes, external voices sequentially enter the sound pick-up portion 410 of the microphone 40 through the sound holes to be received by the microphone 40, meanwhile, the first sealing member 30 seals and isolates the sound holes of the circuit board 50 and the periphery of the sound holes of the casing 10, so that the external voices only enter the sound pick-up portion 410 of the microphone 40 from the sound holes to avoid noise interference of the front surface, and meanwhile, the back surface of the circuit board 50 is provided with a sealing buffer component 60 covering the periphery of the microphone 40, the back and the side of the microphone 40 are sealed and isolated, noise interference on the back is avoided, all parts are tightly pressed and arranged on the back of the shell 10 through the pressing part 70, the air tightness consistency and the frequency response index are improved, and therefore the far field awakening sensitivity and the far field awakening recognition rate are improved. The microphone 40 can sensitively recognize and respond by receiving an external voice command, and triggers the projection component to perform a corresponding operation and control action.

All possible combinations of the technical features of the above embodiments may not be described for the sake of brevity, but should be considered as within the scope of the present disclosure as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. The utility model provides a far-field pronunciation mounting structure, its characterized in that, includes casing, first bolster, first sealing member, microphone, circuit board, sealed buffering subassembly and pressfitting spare, first bolster reaches the circuit board range upon range of set up in the back of casing, set up the hole of stepping down on the first bolster, first sealing member is located in the hole of stepping down, the thickness of first sealing member is greater than the thickness of first bolster so that the both sides of first sealing member butt respectively the back of casing with the front of circuit board, the microphone install in the back of circuit board, be equipped with respectively on casing, first sealing member and the circuit board with first pronunciation hole, second pronunciation hole and third pronunciation hole that the microphone corresponds, sealed buffering subassembly cladding in the microphone periphery, the pressfitting spare connect in the casing and will sealed buffering subassembly, The circuit board and the first buffer piece are arranged on the back surface of the shell in a pressing mode.

2. The far-field speech mounting structure according to claim 1, wherein the sealing buffer assembly comprises a second sealing element and a second buffer element, a receiving groove is formed on a front surface of the second sealing element, a groove is formed on a front surface of the second buffer element, a front surface of the second sealing element is pressed against a back surface of the circuit board, the microphone is located in the receiving groove, the second buffer element is pressed against a back surface of the circuit board, and the second sealing element is located in the groove.

3. The far-field speech mounting arrangement according to claim 2, wherein the sealing bumper assembly comprises a third bumper member, the third bumper member being crimped to a rear surface of the second bumper member and a front surface of the crimp member.

4. The far-field speech mounting arrangement according to claim 3, wherein the first buffer, the first seal, the second buffer, the second seal and the third buffer are made of an elastomeric material.

5. The far-field speech mounting structure of claim 4, wherein the first, second, and third bumpers are all foam; the second buffer piece is a silica gel sleeve.

6. The far-field speech mounting arrangement according to any of claims 1-5, wherein an edge of the first buffer is disposed to protrude beyond an edge of the circuit board.

7. The far-field speech mounting structure according to claim 6, further comprising a locking member, wherein the back surface of the housing has a protruding post, the protruding post is provided with a connecting hole, the pressing member is provided with a through hole corresponding to the connecting hole, and the locking member passes through the through hole and is connected with the connecting hole to lock the pressing member to the housing.

8. The far-field speech mounting structure according to claim 7, wherein a plurality of limiting frames are disposed on the back surface of the housing, the plurality of protruding columns are disposed in a space surrounded by the limiting frames, a mounting area is formed by the plurality of protruding columns being spaced apart from each other, and the first buffer member, the circuit board, and the sealing buffer assembly are pressed in the mounting area.

9. The far-field speech mounting structure according to claim 8, wherein a positioning column is disposed in the mounting region, and the first buffer and the circuit board are respectively provided with a first positioning hole and a second positioning hole which are matched with the positioning column;

10. An intelligent projection device, comprising a projection main body and the far-field speech mounting structure of any one of claims 1 to 9, wherein the housing is connected with the projection main body, and the back surface of the housing faces the inside of the projection main body.