CN218414518U - Chip packaging transfer device - Google Patents
Chip packaging transfer device Download PDFInfo
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- CN218414518U CN218414518U CN202221290346.6U CN202221290346U CN218414518U CN 218414518 U CN218414518 U CN 218414518U CN 202221290346 U CN202221290346 U CN 202221290346U CN 218414518 U CN218414518 U CN 218414518U
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- chip
- workbench
- rotating wheel
- rotating
- transfer device
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- 238000012546 transfer Methods 0.000 title claims abstract description 22
- 238000004806 packaging method and process Methods 0.000 title description 4
- 230000007246 mechanism Effects 0.000 claims abstract description 21
- 238000000034 method Methods 0.000 claims abstract description 11
- 230000008569 process Effects 0.000 claims abstract description 10
- 238000001179 sorption measurement Methods 0.000 claims abstract description 10
- 239000000463 material Substances 0.000 claims abstract description 9
- 239000003292 glue Substances 0.000 claims description 25
- 238000002347 injection Methods 0.000 claims description 8
- 239000007924 injection Substances 0.000 claims description 8
- 235000017166 Bambusa arundinacea Nutrition 0.000 claims description 5
- 235000017491 Bambusa tulda Nutrition 0.000 claims description 5
- 241001330002 Bambuseae Species 0.000 claims description 5
- 235000015334 Phyllostachys viridis Nutrition 0.000 claims description 5
- 239000011425 bamboo Substances 0.000 claims description 5
- 238000012545 processing Methods 0.000 abstract description 12
- 238000005538 encapsulation Methods 0.000 abstract description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 230000008901 benefit Effects 0.000 abstract description 4
- 230000005540 biological transmission Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 230000005945 translocation Effects 0.000 description 1
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Abstract
The utility model is suitable for a chip production technical field provides chip package transfer device, the device includes: the bottom of the workbench is provided with a base, and the workbench is provided with a top plate; the rotatable adsorption mechanism is arranged in the base, corresponds to the material suction port formed on the workbench and is used for adsorbing and fixing the chip; the automatic dispensing mechanism is arranged on the top plate and used for acting on the chip to process; and the transferring mechanism is arranged on the workbench and used for clamping and fixing the chip and driving the chip to be transferred and conveyed. The utility model discloses to prior art when processing the chip can not carry out the pivoted problem, be provided with rotatable adsorption apparatus structure, do benefit to rotatable adsorption apparatus structure and on can adsorbing the basis of fixed chip, can drive the chip again and rotate, and then adjust the angular position of chip, and then make things convenient for the encapsulation processing of chip more, be provided with the transfer mechanism, can drive the chip change position, improved the automation process of chip processing.
Description
Technical Field
The utility model belongs to the technical field of chip production, especially, relate to chip package transfer device.
Background
The chip is a general name of semiconductor element products, is a method for miniaturizing a circuit, and is manufactured on the surface of a semiconductor wafer frequently, after the chip is powered on, a starting instruction is firstly generated to start the chip, and then new instructions and data are continuously received to complete functions, and the chip is ubiquitous in the fields of calculation, communication, manufacturing, traffic, internet and the like.
Chip manufacturing is including the encapsulation, and the encapsulation is that installation shell plays to lay, fix, seal, protection and the effect of reinforcing electrothermal performance on the chip, and current seal is changeed the process and is mostly fixed the back with the chip and carry out operations such as point again, hot pressing, can not adjust the angle of chip, and the encapsulation effect is poor.
SUMMERY OF THE UTILITY MODEL
An object of the embodiment of the utility model is to provide a chip package transfer device aims at solving the problem that proposes among the above-mentioned background art.
The embodiment of the utility model provides a realize like this, chip package transfer device, the device includes:
the bottom of the workbench is provided with a base, and the workbench is provided with a top plate;
the rotatable adsorption mechanism is arranged in the base, corresponds to the material suction port formed on the workbench and is used for adsorbing and fixing the chip;
the automatic dispensing mechanism is arranged on the top plate and used for acting on the chip to process;
and the transferring mechanism is arranged on the workbench and used for clamping and fixing the chip and driving the chip to be transferred and conveyed.
The embodiment of the utility model provides a chip packaging transfer device is fixed to the chip when processing the chip among the prior art, can not carry out the pivoted problem, is provided with rotatable adsorption apparatus structure, does benefit to rotatable adsorption apparatus structure and can adsorb fixed chip's basis on, can drive the chip again and rotate, and then adjusts the angular position of chip, and then makes things convenient for the encapsulation processing of chip more, is provided with the transfer mechanism, can drive the chip shift position, has improved the automation process of chip processing.
Drawings
Fig. 1 is a schematic structural diagram of a chip packaging and transferring device according to an embodiment of the present invention;
fig. 2 is a top view of a worktable in the chip package transferring apparatus provided by the embodiment of the present invention;
fig. 3 is a schematic structural view of a transmission belt in a chip package transfer apparatus according to an embodiment of the present invention.
In the drawings: 1-a workbench; 2-a base; 3-a top plate; 4-a hydraulic cylinder; 5, mounting a plate; 6-a glue injection cylinder; 7-glue injection port; 8-a telescopic member; 9-material blocking conical block; 10-a material sucking port; 11-a first electric machine; 12-a rotating table; 13-a vacuum machine; 14-vacuum chuck; 15-a second motor; 16-a first rotating wheel; 17-a transmission belt; 18-a second rotating wheel; 19-a rotating shaft; 20-a slide block; 21-an electric push rod; 22-a splint; 23-conveying belt.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The following detailed description is provided for the specific embodiments of the present invention.
As shown in fig. 1, a structure diagram of a chip package transferring device according to an embodiment of the present invention is provided, the device includes:
the device comprises a workbench 1, wherein a base 2 is installed at the bottom of the workbench 1, and a top plate 3 is installed on the workbench 1;
the rotatable adsorption mechanism is arranged in the base 2, corresponds to the material suction port 10 formed in the workbench 1 and is used for adsorbing and fixing the chip;
the automatic dispensing mechanism is arranged on the top plate 3 and used for acting on the chip to process;
and the transfer mechanism is arranged on the workbench 1 and used for clamping and fixing the chip and driving the chip to be transferred and conveyed.
The utility model discloses an in an embodiment, this chip package transfer device, the chip is fixed when processing the chip among the prior art, can not carry out the pivoted problem, is provided with rotatable adsorption apparatus and constructs, does benefit to rotatable adsorption apparatus and constructs on can adsorbing the basis of fixed chip, can drive the chip again and rotate, and then adjusts the angular position of chip, and then makes things convenient for the encapsulation processing of chip more, is provided with the transfer mechanism, can drive the chip translocation, has improved the automation process of chip processing.
As shown in fig. 1, as a preferred embodiment of the present invention, the rotatable adsorbing mechanism includes:
a first motor 11 installed in the base 2;
the rotating platform 12 is in driving connection with the output end of the first motor 11, and the rotating platform 12 is driven to rotate by starting the first motor 11;
When the production and processing, the vacuum machine 13 is started, the vacuum machine 13 generates negative pressure through the vacuum sucker 14, and then can adsorb and fix the chip, when the chip needs to be driven to rotate, the first motor 11 is started, the first motor 11 drives the rotating platform 12 to rotate, and then the chip can be driven to rotate integrally, so that the angle position of the chip is adjusted, and the chip is more convenient to process and package.
As shown in fig. 1, as another preferred embodiment of the present invention, the automatic dispensing mechanism includes:
a hydraulic cylinder 4 mounted on the top plate 3;
the mounting plate 5 is fixedly connected with the hydraulic cylinder 4;
the glue injection cylinder 6 is arranged on the mounting plate 5 and used for filling glue, and a glue injection opening 7 is connected to the glue injection cylinder 6;
the putty awl piece 9 is installed in injecting glue section of thick bamboo 6, the shutoff is stopped up injecting glue mouth 7, putty awl piece 9 through the extensible member 8 with injecting glue section of thick bamboo 6 links to each other, drives putty awl piece 9 through the flexible of starting extensible member 8 and removes for control injecting glue mouth 7 goes out to glue.
When carrying out the point and gluing, start 4 extensions of hydraulic cylinder and drive mounting panel 5 and descend until injecting glue mouth 7 can contact with the chip, plug up awl piece 9 through plug up awl piece 9 in the injecting glue section of thick bamboo 6, drive plug up awl piece 9 when starting 8 contractions of extensible member and rise, glue can follow the gap outflow between plug up awl piece 9 and the injecting glue mouth 7, through the ejection of compact of the flexible control injecting glue mouth 7 of control extensible member 8.
As shown in fig. 2 to 3, as a preferred embodiment of the present invention, the transfer mechanism includes:
a second motor 15 installed at an outer side of the table 1;
the first rotating wheel 16 is in driving connection with the output end of the second motor 15, a driving belt 17 is connected to the first rotating wheel 16 and is in driving connection with a second rotating wheel 18, and the first rotating wheel 16 is used for transmitting the rotating force of the first rotating wheel 16 to the second rotating wheel 18;
the rotating shaft 19 is fixedly connected with the first rotating wheel 16 and the second rotating wheel 18 respectively, a sliding block 20 is installed on the rotating shaft 19 in a threaded connection mode, and the sliding block 20 changes the rotating force into linear motion to drive the chip to transfer;
In order to improve the automation of chip processing, can place unprocessed chip in a heap, it supports to press on the lateral wall of chip to drive splint 22 through the extension of start electric putter 21, and then can fasten the chip clip firmly, can drive first rotation wheel 16 through starting second motor 15 and rotate, drive belt 17 transmits the turning force of first rotation wheel 16 for second rotation wheel 18, and then drive two pivot 19 rotations, can drive slider 20 from this and remove on workstation 1, and then can shift the chip to on inhaling material mouthful 10, process, rethread slider 20 drives the chip after the processing and shifts out.
As shown in fig. 2 to 3, as a preferred embodiment of the present invention, the device further comprises a transmission belt 23 installed in the empty slot formed on the working table 1 for transferring the chip.
Be provided with transmission band 23, conveniently drive the chip and transport the transmission, facilitate for the staff.
The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (5)
1. Chip package transfer device, characterized in that, the device includes:
the bottom of the workbench is provided with a base, and the workbench is provided with a top plate;
the rotatable adsorption mechanism is arranged in the base, corresponds to the material suction port formed on the workbench and is used for adsorbing and fixing the chip;
the automatic dispensing mechanism is arranged on the top plate and used for acting on the chip to process;
and the transferring mechanism is arranged on the workbench and used for clamping and fixing the chip and driving the chip to be transferred and conveyed.
2. The chip package transfer device of claim 1, wherein the rotatable suction mechanism comprises:
a first motor installed in the base;
the rotating platform is in driving connection with the output end of the first motor and is driven to rotate by starting the first motor;
the vacuum machine is installed on the rotating platform, the vacuum machine is connected with the vacuum chuck, the vacuum chuck is connected with the material sucking port, and the vacuum machine and the vacuum chuck generate negative pressure to adsorb the fixed chip.
3. The chip package transfer device of claim 1, wherein the automatic dispensing mechanism comprises:
a hydraulic cylinder mounted on the top plate;
the mounting plate is fixedly connected with the hydraulic cylinder;
the glue injection cylinder is arranged on the mounting plate and used for injecting glue, and a glue injection opening is connected to the glue injection cylinder;
the putty awl piece is installed in the injecting glue section of thick bamboo, the shutoff the injecting glue mouth, the putty awl piece pass through the extensible member with the injecting glue section of thick bamboo links to each other, drives the movement of putty awl piece through the flexible of starting the extensible member for the play of control injecting glue mouth glues.
4. The chip package transfer device of claim 1, wherein the transfer mechanism comprises:
the second motor is arranged on the outer side of the workbench;
the first rotating wheel is in driving connection with the output end of the second motor, and is connected with a driving belt in driving connection with the second rotating wheel and used for transmitting the rotating force of the first rotating wheel to the second rotating wheel;
the rotating shaft is fixedly connected with the first rotating wheel and the second rotating wheel respectively, a sliding block is installed on the rotating shaft in a threaded connection mode, and the sliding block changes rotating force into linear motion to drive the chip to transfer;
the electric push rod is fixedly connected with the sliding block, a clamping plate is arranged on the electric push rod, and the clamping plate is driven to clamp and fix the chip through the expansion of the electric push rod.
5. The chip package transferring apparatus according to any one of claims 1 to 4, further comprising a transfer tape mounted in a recess formed in the worktable for transferring the chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221290346.6U CN218414518U (en) | 2022-05-26 | 2022-05-26 | Chip packaging transfer device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221290346.6U CN218414518U (en) | 2022-05-26 | 2022-05-26 | Chip packaging transfer device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218414518U true CN218414518U (en) | 2023-01-31 |
Family
ID=85010629
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221290346.6U Active CN218414518U (en) | 2022-05-26 | 2022-05-26 | Chip packaging transfer device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218414518U (en) |
-
2022
- 2022-05-26 CN CN202221290346.6U patent/CN218414518U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20240122 Address after: 1st Floor, Building 1, No. 399, Yanxin Road, Huishan District, Wuxi City, Jiangsu Province, 214000 Patentee after: Wuxi Qixin Semiconductor Technology Co.,Ltd. Country or region after: China Address before: 601-18, Floor 6, Block B, Building 1, No. 3, Disheng Middle Road, Beijing Economic and Technological Development Zone, Daxing District, Beijing, 100176 Patentee before: BEIJING TECHBROOK AUTOMATION TECHNOLOGY CO.,LTD. Country or region before: China |