CN218397402U - Monocrystalline silicon wafer chamfering device - Google Patents
Monocrystalline silicon wafer chamfering device Download PDFInfo
- Publication number
- CN218397402U CN218397402U CN202222768798.7U CN202222768798U CN218397402U CN 218397402 U CN218397402 U CN 218397402U CN 202222768798 U CN202222768798 U CN 202222768798U CN 218397402 U CN218397402 U CN 218397402U
- Authority
- CN
- China
- Prior art keywords
- clamping
- chamfering
- monocrystalline silicon
- workbench
- silicon wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Abstract
The utility model discloses a monocrystalline silicon wafer chamfering device, which comprises a support frame, a workbench, a telescopic mechanism, a clamping component and a chamfering component, wherein the support frame is vertically arranged relative to the ground, and the workbench is movably arranged on the support frame; one end of the telescopic mechanism is connected with the support frame, and the other end of the telescopic mechanism is connected with the workbench; the clamping assembly is rotatably arranged on the workbench and comprises a semicircular slide rail, a supporting table, a first locking mechanism, two groups of clamping mechanisms and two second locking mechanisms, wherein the semicircular slide rail is detachably arranged on the workbench; the supporting platform is rotatably arranged on the workbench and is connected with the semicircular slide rail in a sliding manner; the first locking mechanism is connected with the semicircular slide rail through threads. Therefore, the labor intensity of workers can be effectively reduced, the chamfering efficiency is improved, the condition of uneven chamfering is not easy to occur, and the chamfering quality of the monocrystalline silicon wafer is effectively improved.
Description
Technical Field
The utility model relates to a monocrystalline silicon piece production facility's technical field especially relates to a monocrystalline silicon piece chamfer device.
Background
Single crystal silicon, which is an important semiconductor material, has good electrical properties and thermal stability, and has been discovered and utilized since it has quickly replaced other semiconductor materials. The silicon material has good high temperature resistance and radiation resistance, and is particularly suitable for manufacturing high-power devices, so that the silicon material is the most applied semiconductor material.
The finished product after the monocrystalline silicon piece is produced can be a round wafer or a square wafer. And the produced monocrystalline silicon wafer needs to be subjected to chamfering treatment. The purpose of the chamfering is to remove burrs produced in the slicing process, namely, to grind the outer edge of the monocrystalline silicon wafer by using a grinding wheel.
However, most of the related chamfering methods are to polish and chamfer the edge of the monocrystalline silicon wafer by using a manually held grinding wheel, and such chamfering methods not only increase the labor intensity of workers, but also have low chamfering efficiency. In addition, because the grinding wheel is unstable when being held by hands, the condition of uneven chamfering is easy to occur, and the chamfering quality of the monocrystalline silicon wafer is influenced.
SUMMERY OF THE UTILITY MODEL
The present invention aims at solving at least one of the technical problems in the related art to a certain extent.
Therefore, an object of the utility model is to provide a monocrystalline silicon piece chamfer device, not only can effectively reduce staff's intensity of labour, promote chamfer efficiency, be difficult for appearing the uneven condition of chamfer moreover, effectively improve monocrystalline silicon piece's chamfer quality.
In order to achieve the above object, the first aspect of the present invention provides a single crystal silicon wafer chamfering apparatus, which includes a support frame, a worktable, a telescopic mechanism, a clamping assembly and a chamfering assembly, wherein the support frame is vertically disposed with respect to the ground, and the worktable is movably disposed on the support frame; one end of the telescopic mechanism is connected with the support frame, and the other end of the telescopic mechanism is connected with the workbench; the clamping assembly is rotatably arranged on the workbench and comprises a semicircular slide rail, a supporting table, a first locking mechanism, two groups of clamping mechanisms and two second locking mechanisms, wherein the semicircular slide rail is detachably arranged on the workbench; the support table is rotatably arranged on the workbench and is connected with the semicircular slide rail in a sliding manner; the first locking mechanism is in threaded connection with the semicircular slide rail, and one end of the first locking mechanism abuts against the support table; the two groups of clamping mechanisms are diagonally and symmetrically arranged on the supporting platform, and are movably connected with the supporting platform respectively; the two second locking mechanisms are respectively in threaded connection with two sides of the supporting table, and one ends of the two second locking mechanisms are respectively abutted to the corresponding clamping mechanisms; and one side of the chamfering assembly, which is close to the support platform, is erected on the support frame.
The utility model discloses a monocrystalline silicon piece chamfering device not only can effectively reduce staff's intensity of labour, promotes chamfer efficiency, is difficult for appearing the uneven condition of chamfer moreover, effectively improves monocrystalline silicon piece's chamfer quality. In addition, the movable clamping mechanism can clamp and chamfer monocrystalline silicon wafers with different sizes and shapes (the different shapes refer to circular or square), and the applicability of the device is effectively improved.
In addition, the chamfering device for the monocrystalline silicon wafer, which is proposed according to the application, can also have the following additional technical characteristics:
specifically, a sliding groove is formed in the support table, the clamping mechanism comprises a sliding block and a clamping component, the sliding block is slidably arranged in the sliding groove, the top wall of the sliding block protrudes out of the sliding groove, and the sliding block is connected with one end of the second locking mechanism in an abutting mode; the clamping component is detachably arranged on the side wall of the sliding block.
Specifically, the clamping component comprises a clamping cylinder and a clamping block, wherein the clamping cylinder is detachably arranged on one side of the sliding block; the clamping block is detachably connected with the telescopic rod of the clamping cylinder.
Specifically, the chamfering assembly comprises a driving mechanism and a grinding wheel, wherein the driving mechanism is erected on the supporting frame through a supporting cantilever; the grinding wheel is arranged on the driving mechanism.
Specifically, the first locking mechanism and the second locking mechanism are handle bolts respectively.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 is a schematic structural diagram of a chamfering apparatus for monocrystalline silicon wafers according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of a chamfering apparatus for monocrystalline silicon wafers according to another embodiment of the present invention;
fig. 3 is a schematic structural diagram of a chamfering device for monocrystalline silicon wafers according to another embodiment of the present invention.
As shown in the figure: 10. a support frame; 20. a work table; 30. a telescopic mechanism; 40. a clamping assembly; 41. A semicircular slide rail; 42. a support table; 421. a chute; 43. a first locking mechanism; 44. a clamping mechanism; 441. a slider; 442. a clamping member; 4421. a clamping cylinder; 4422. a clamping block; 45. a second locking mechanism; 50. a chamfering assembly; 51. a drive mechanism; 52. and (7) grinding the grinding wheel.
Detailed Description
Reference will now be made in detail to the embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary intended for explaining the present invention, and should not be construed as limiting the present invention. On the contrary, the embodiments of the invention include all changes, modifications and equivalents coming within the spirit and terms of the claims appended hereto.
The following describes a single crystal silicon wafer chamfering apparatus according to an embodiment of the present invention with reference to the drawings.
As shown in fig. 1, the chamfering device for monocrystalline silicon wafers according to an embodiment of the present invention may include a supporting frame 10, a worktable 20, a retractable mechanism 30, a clamping assembly 40, and a chamfering assembly 50.
Wherein, the supporting frame 10 is vertically arranged relative to the ground, and the working platform 20 is movably arranged on the supporting frame 10. It should be noted that, in the embodiment, the supporting frame 10 is provided with a slide way (not specifically identified in the drawings), and the bottom wall of the working platform 20 is fixedly connected with a supporting block (not specifically identified in the drawings), and the supporting block is slidably disposed in the slide way. That is, the table 20 slides on the support frame 10 through the support block.
One end of the telescopic mechanism 30 is connected to the supporting frame 10, and the other end of the telescopic mechanism 30 is connected to the worktable 20.
It should be noted that the retractable mechanism 30 described in this embodiment can be an electric telescopic rod, as shown in fig. 1, the push rod of the electric telescopic rod is in a half-extended state.
The clamping assembly 40 is rotatably disposed on the worktable 20, and the clamping assembly 40 may include a semicircular slide rail 41, a support table 42, a first locking mechanism 43, two sets of clamping mechanisms 44, and two second locking mechanisms 45.
Wherein, semicircular slide rail 41 detachably sets up on workstation 20, and supporting bench 42 rotationally sets up on workstation 20, and supporting bench 42 and semicircular slide rail 41 slide and link to each other, namely, be equipped with arc spout (not specific sign in the figure) on the diapire of supporting bench 42, and supporting bench 42 slides through arc spout and semicircular slide rail 41 and links to each other. It will be appreciated that the semicircular slide rails 41 described in this embodiment are removably disposed on the table 20 to facilitate installation and replacement of the semicircular slide rails 41. For example, the semicircular slide rail 41 may be connected to the table 20 by snapping, riveting, or threaded fastener connections.
It should be noted that the supporting base 42 described in this embodiment is a square supporting base 42, and one corner of the square supporting base 42 is chamfered, and the chamfered end faces the chamfer component 50.
The first locking mechanism 43 is connected with the semicircular slide rail 41 through threads, one end of the first locking mechanism 43 is abutted to the supporting table 42, the two groups of clamping mechanisms 44 are symmetrically arranged on the supporting table 42 in a diagonal manner to clamp the monocrystalline silicon wafer to be chamfered, the two groups of clamping mechanisms 44 are movably connected with the supporting table 42 respectively, the two second locking mechanisms 45 are connected with the threads on the two sides of the supporting table 42 respectively, and one ends of the two second locking mechanisms 45 are abutted to the corresponding clamping mechanisms 44 respectively. It can be understood that, by arranging the two sets of clamping mechanisms 44 diagonally and movably on the re-supporting table 42, the worker can clamp and fix monocrystalline silicon wafers of different sizes by adjusting the relative distance between the two sets of clamping mechanisms, so as to improve the applicability of clamping and fixing monocrystalline silicon wafers of different sizes.
For clarity of the above embodiment, in one embodiment of the present invention, the first locking mechanism 43 and the second locking mechanism 45 may be handle bolts.
The chamfering unit 50 is mounted on the supporting frame 10 at a side adjacent to the supporting table 42, and is used for grinding and chamfering the single crystal silicon wafer.
Specifically, when the monocrystalline silicon wafer to be chamfered needs to be chamfered, relevant workers firstly set the monocrystalline silicon wafer chamfering device at the position of the monocrystalline silicon wafer to be chamfered (the position can be a production workshop or a chamfering factory building of the monocrystalline silicon wafer).
When the end of the square monocrystalline silicon wafer to be chamfered is rounded, the related worker firstly rotates the handle bolt (the first locking mechanism 43) to loosen the support platform 42 locked on the semicircular slide rail 41, and then the worker rotates the support platform 42 to make it rotationally slide along the semicircular slide rail 41, so that the support platform 42 is far away from the chamfering assembly 50.
Then, the staff will treat the square monocrystalline silicon piece of fillet and place on supporting bench 42, and be located between the diagonal angle of two sets of fixture 44, then the staff controls two sets of fixture 44 respectively will treat the monocrystalline silicon piece centre gripping of fillet and fix on supporting bench 42, and should treat the square monocrystalline silicon piece of fillet and treat that the chamfer end is protruding from supporting bench 42.
Then, staff antiport supporting bench 42, supporting bench 42 drive the square monocrystalline silicon piece of treating the fillet and do the circumferential motion, do the square monocrystalline silicon piece of circumferential motion treat that the fillet is the circumference with chamfer subassembly 50 and encircle the contact to by chamfer subassembly 50 polishing into the fillet. By rounding the square monocrystalline silicon wafer, the labor intensity of workers can be effectively reduced, the chamfering efficiency is improved, the condition of uneven chamfering is not easy to occur, and the chamfering quality of the monocrystalline silicon wafer is effectively improved.
When the square single crystal silicon wafer or the circular single crystal silicon wafer is chamfered, the rod of the electric telescopic rod is in a half-extended state, and the support base 42 is locked to the semicircular slide rail 41 by the handle bolt (the first locking mechanism 43). Then, the staff places the monocrystalline silicon piece of waiting to the chamfer angle on the supporting bench 42 earlier, and is located between the diagonal angle of two sets of fixture 44, then the staff controls two sets of fixture 44 respectively will wait to chamfer the monocrystalline silicon piece of right angle centre gripping and fix on supporting bench 42, and should wait to chamfer the end of the monocrystalline silicon piece of right angle and stand out supporting bench 42.
Then, the worker controls the chamfering assembly 50 to polish and chamfer the end to be chamfered of the monocrystalline silicon wafer. Meanwhile, the worker controls the push rod of the electric telescopic rod (the telescopic mechanism 30) to be completely pushed out, and pushes the clamping assembly 40 away from the chamfering assembly 50 through the workbench 20. Meanwhile, the monocrystalline silicon wafer to be chamfered is carried away from the chamfering unit 50 by the holding unit 40. After electric telescopic handle's push rod was released completely, electric telescopic handle's push rod drives through work platform and treats the monocrystalline silicon piece rectilinear movement of chamfering and be close to chamfering subassembly 50 gradually and polish the chamfer, and when electric telescopic handle's push rod retracted completely, the monocrystalline silicon piece of treating the chamfering is polished the chamfer and is accomplished by chamfering subassembly 50. The chamfering machine not only can effectively reduce the labor intensity of workers and improve the chamfering efficiency, but also is not easy to cause the condition of uneven chamfering, effectively improves the chamfering quality of monocrystalline silicon wafers, and can improve the applicability to the chamfering of monocrystalline silicon wafers with different shapes.
In an embodiment of the present invention, as shown in fig. 2, a sliding groove 421 is provided on the supporting platform 42, and the clamping mechanism 44 may include a sliding block 441 and a clamping component 442.
The sliding block 441 is slidably disposed in the sliding slot 11, a top wall of the sliding block 441 protrudes out of the sliding slot 11, the sliding block 441 is connected to one end of the second locking mechanism 45 in an abutting manner, and the clamping member 442 is detachably disposed on a side wall of the sliding block 441. It is understood that the clamping member 442 described in this embodiment is detachably provided on the side wall of the slider 441, facilitating the installation and replacement of the clamping member 442. For example, the clamping member 442 may be coupled to the slider 441 by a threaded fastener such as a screw, bolt, or bolt.
For clarity of the above embodiment, in an embodiment of the present invention, as shown in fig. 2, the clamping part 442 may include a clamping cylinder 4421 and a clamping block 4422.
Wherein, the clamping cylinder 4421 is detachably arranged at one side of the sliding block 441, and the clamping block 4422 is detachably connected with the telescopic rod of the clamping cylinder 4421.
It should be noted that the clamping block 4422 described in this embodiment may be a rubber block, that is, the single crystal silicon wafer to be chamfered is clamped by the rubber block, which can effectively prevent the clamping block 4422 from damaging the single crystal silicon wafer to be chamfered.
Specifically, when the monocrystalline silicon wafer to be chamfered needs to be clamped, the related staff extend out by controlling the telescopic rod of the clamping cylinder 4421 and push the clamping block 4422 to approach the monocrystalline silicon wafer to be chamfered, and push the monocrystalline silicon wafer to be chamfered tightly against the side wall of the slide block 441, so that the monocrystalline silicon wafers with different sizes and different shapes (the different shapes refer to circles or squares) can be clamped and fixed, and the applicability of clamping the monocrystalline silicon wafers with different sizes is improved.
In addition, in order to increase the clamping range of the clamping mechanism 44, the worker may release the sliders 441 locked to the support base 42 by rotating the handle screw (the second locking mechanism 45), and then the worker may adjust the diagonal distance between the two sliders 441 by moving the sliders 441. Meanwhile, the clamping cylinder 4421 also moves along with the slider 441, so that the range for clamping and fixing the monocrystalline silicon wafers of different sizes is enlarged, and the applicability of the clamping mechanism 44 for clamping and fixing the monocrystalline silicon wafers of different sizes can be effectively improved.
In one embodiment of the present invention, as shown in fig. 2, the chamfer assembly 50 may include a drive mechanism 51 and a grinding wheel 52.
Wherein, a driving mechanism 51 is mounted on the supporting frame 10 through a supporting cantilever (not specifically identified in the figure), and a grinding wheel 52 is arranged on the driving mechanism 51. It should be noted that the drive mechanism 51 described in this embodiment may be a servo motor.
It can be understood that when the monocrystalline silicon wafer to be chamfered needs to be chamfered, the relevant worker controls the servo motor (driving mechanism 51) to drive the grinding wheel 52 to rotate, and the grinding wheel 52 rotates to grind and chamfer the monocrystalline silicon wafer to be chamfered. Not only can the chamfering efficiency be improved, but also the condition of uneven chamfering is not easy to occur, and the chamfering quality of the monocrystalline silicon wafer is effectively improved.
As a possible case, as shown in fig. 3, in order to increase the grinding range of the grinding wheel 52, a groove (not specifically shown) may be provided on the support frame 10, and a rotatable threaded rod (not specifically shown) may be provided in the groove, and one end of the threaded rod may extend out of the groove and be connected to the driving handle, and the support arm may be movably provided on the support frame 10, and a support block (not shown) may be provided on a bottom wall of the support arm, the support block may be slidably provided in the groove, and the support block may be threadedly connected to the threaded rod.
It can be understood that when the distance between the grinding wheel 52 and the monocrystalline silicon wafer to be chamfered needs to be adjusted, related workers can control the rotation of the threaded rod by rotating the driving handle, the rotating threaded rod drives the supporting block to move in the groove, and the supporting cantilever drives the grinding wheel 52 to move back and forth, so that the distance between the grinding wheel 52 and the monocrystalline silicon wafer to be chamfered is adjusted, and the grinding range of the grinding wheel 52 can be effectively enlarged.
To sum up, the utility model discloses monocrystalline silicon piece chamfer device not only can effectively reduce staff's intensity of labour, promotes chamfer efficiency, is difficult for appearing the uneven condition of chamfer moreover, effectively improves monocrystalline silicon piece's chamfer quality. In addition, the movable clamping mechanism can clamp and chamfer monocrystalline silicon wafers with different sizes and shapes (the different shapes refer to circular or square), and the applicability of the device is effectively improved.
In the description of the present specification, the terms "first", "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless explicitly defined otherwise.
In the description of the present specification, reference to the description of "one embodiment," "some embodiments," "an example," "a specific example," or "some examples" or the like means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Moreover, various embodiments or examples and features of various embodiments or examples described in this specification can be combined and combined by one skilled in the art without being mutually inconsistent.
Although embodiments of the present invention have been shown and described, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that variations, modifications, substitutions and alterations of the above embodiments may be made by those of ordinary skill in the art without departing from the scope of the present invention.
Claims (5)
1. A monocrystalline silicon wafer chamfering device is characterized by comprising a support frame, a workbench, a telescopic mechanism, a clamping assembly and a chamfering assembly, wherein,
the supporting frame is vertically arranged relative to the ground, and the workbench is movably arranged on the supporting frame;
one end of the telescopic mechanism is connected with the support frame, and the other end of the telescopic mechanism is connected with the workbench;
the clamping component is rotatably arranged on the workbench and comprises a semicircular slide rail, a supporting platform, a first locking mechanism, two groups of clamping mechanisms and two second locking mechanisms, wherein,
the semicircular slide rail is detachably arranged on the workbench;
the supporting platform is rotatably arranged on the workbench and is connected with the semicircular sliding rail in a sliding manner;
the first locking mechanism is in threaded connection with the semicircular slide rail, and one end of the first locking mechanism abuts against the support platform;
the two groups of clamping mechanisms are diagonally and symmetrically arranged on the supporting platform, and are movably connected with the supporting platform respectively;
the two second locking mechanisms are respectively in threaded connection with two sides of the supporting table, and one ends of the two second locking mechanisms are respectively abutted to the corresponding clamping mechanisms;
and one side of the chamfering assembly, which is close to the support platform, is erected on the support frame.
2. The single crystal silicon wafer chamfering apparatus according to claim 1, wherein a slide groove is provided on the supporting table, the chucking mechanism includes a slider and a chucking member, wherein,
the sliding block is slidably arranged in the sliding groove, the top wall of the sliding block protrudes out of the sliding groove, and the sliding block is connected with one end of the second locking mechanism in an abutting mode;
the clamping component is detachably arranged on the side wall of the sliding block.
3. The single crystal silicon wafer chamfering apparatus according to claim 2, wherein the holding members comprise a holding cylinder and a holding block, wherein,
the clamping cylinder is detachably arranged on one side of the sliding block;
the clamping block is detachably connected with the telescopic rod of the clamping cylinder.
4. The monocrystalline silicon wafer chamfering apparatus according to claim 1, wherein the chamfering assembly comprises a driving mechanism and a grinding wheel, wherein,
the driving mechanism is erected on the supporting frame through a supporting cantilever;
the grinding wheel is arranged on the driving mechanism.
5. The monocrystalline silicon wafer chamfering device according to claim 1, wherein the first locking mechanism and the second locking mechanism are handle bolts, respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222768798.7U CN218397402U (en) | 2022-10-20 | 2022-10-20 | Monocrystalline silicon wafer chamfering device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222768798.7U CN218397402U (en) | 2022-10-20 | 2022-10-20 | Monocrystalline silicon wafer chamfering device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218397402U true CN218397402U (en) | 2023-01-31 |
Family
ID=85002842
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222768798.7U Active CN218397402U (en) | 2022-10-20 | 2022-10-20 | Monocrystalline silicon wafer chamfering device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218397402U (en) |
-
2022
- 2022-10-20 CN CN202222768798.7U patent/CN218397402U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN112621285A (en) | Positioning and clamping device for machining | |
| CN108857751B (en) | Stone polisher | |
| CN218397402U (en) | Monocrystalline silicon wafer chamfering device | |
| CN219310975U (en) | Polishing device for crane part machining | |
| CN117020806A (en) | Deburring device for die-casting aluminum alloy cover plate | |
| CN113799013B (en) | Anchor clamps for mechanical maintenance | |
| CN215317889U (en) | Engineering machine tool accessory burnishing device | |
| CN112091764B (en) | High-precision polishing equipment | |
| CN214186720U (en) | Silicon rod grinding machine | |
| CN114473867A (en) | Special grinding machine fixture for sliding plate brick | |
| CN220993940U (en) | Mechanical part grinding device | |
| CN219805814U (en) | Surface grinder with clamp | |
| CN219583253U (en) | Milling and grinding double-spindle gantry machining center | |
| CN216463111U (en) | Positioning and clamping device for machining | |
| CN219311038U (en) | Surface polishing device for hardware fitting machining | |
| CN214025030U (en) | Polishing equipment for processing and producing rubber sealing element | |
| CN217966908U (en) | Automobile mold part machining and clamping device | |
| CN217255523U (en) | Special grinding machine fixture for sliding plate brick | |
| CN220881949U (en) | Lock shell clamping device | |
| CN217832991U (en) | Engine bolt end face grinding equipment | |
| CN221088329U (en) | Grinder fixture and coreless grinder | |
| CN216098114U (en) | Precision grinder worktable mechanism | |
| CN218658159U (en) | Part grinding device for maintaining machining equipment | |
| CN220516458U (en) | Copper alloy processing burnishing machine | |
| CN218658305U (en) | Spring bolt processing equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |