CN218388061U - FPC structure easy to radiate heat - Google Patents
FPC structure easy to radiate heat Download PDFInfo
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- CN218388061U CN218388061U CN202222162894.7U CN202222162894U CN218388061U CN 218388061 U CN218388061 U CN 218388061U CN 202222162894 U CN202222162894 U CN 202222162894U CN 218388061 U CN218388061 U CN 218388061U
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- heat
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Abstract
The utility model provides an easy radiating FPC structure, including the FPC subassembly, the FPC subassembly includes the FPC main part, and the front of FPC main part is provided with the district of buckling, is provided with heat radiation structure between district of buckling and the FPC main part, heat radiation structure including set up in the FPC main part and with the corresponding flexible heat dissipation part in buckle position, the positive one side of flexible heat dissipation part is connected with the heat conduction portion. The utility model discloses a heat radiation structure who sets up, heat conduction portion among the heat radiation structure can be with IC's heat transfer for flexible heat dissipation portion, and the position that flexible heat dissipation portion set up is corresponding with the position in district of buckling, owing to the adoption be flexible heat dissipation portion, when the FPC main part is buckled from the district of buckling, can solve the too big problem of district's position hardness of buckling like this.
Description
Technical Field
The utility model relates to a FPC technical field particularly, relates to an easy radiating FPC structure.
Background
The FPC is a flexible printed circuit board which is made of polyimide or polyester film as a base material and has high reliability and excellent flexibility, and the FPC has the characteristics of high wiring density, light weight, thin thickness and good bending property, for example, the patent in China: CN202121058564.2 provides an FPC bending region optimization structure.
Because IC generates heat the problem, can paste the graphite flake of thickness 0.055mm in order to reach the heat dissipation at the IC back, but present structure is that the graphite flake pastes FPC's the position region of buckling from the IC position at the display screen glass back, leads to FPC to buckle the position hardness increase, is unfavorable for buckling, in the structure that face iron frame and backlight assembly clearance are littleer in addition, often because FPC buckles the position and leads to FPC to buckle the back and push up the iron frame excessively hard, lead to the size to exceed standard, influence the quality problem. Therefore, we improve this and propose an FPC structure that is easy to dissipate heat.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a: the problem that the bending position of the FPC is increased in hardness and is not beneficial to bending due to the fact that the graphite flake is attached to the bending position area of the FPC from the IC position on the back of the display screen glass at present is solved.
In order to realize the purpose of the utility model, the utility model provides a following technical scheme:
easy radiating FPC structure, including the FPC subassembly, the FPC subassembly includes the FPC main part, the front of FPC main part is provided with the bending zone, be provided with heat radiation structure between bending zone and the FPC main part, heat radiation structure is including setting up in the FPC main part and with the corresponding flexible heat dissipation part in bending zone position, the positive one side of flexible heat dissipation part is connected with the heat conduction portion.
As the utility model discloses preferred technical scheme, the one end of FPC main part is provided with the link, the position of link is close to the district of buckling.
As the utility model discloses preferred technical scheme, flexible heat dissipation part is the heat dissipation coating, the front of FPC main part is scribbled in the heat dissipation coating brush.
As the utility model discloses preferred technical scheme, the heat dissipation coating is the carbon thick liquid, and the heat dissipation coating covers the district of buckling.
As the utility model discloses preferred technical scheme, the heat conduction portion is the graphite flake, the graphite flake is close to FPC main part one side and is connected with the heat dissipation coating.
As the utility model discloses preferred technical scheme, the graphite flake is located the one side that the district of buckling is close to the link, and the position of graphite flake avoids the district of buckling.
As the preferred technical scheme of the utility model, still include a plurality of reinforced structure, it is a plurality of reinforced structure all sets up between graphite flake and thermal coating.
As the utility model discloses preferred technical scheme, reinforced structure includes heat conduction reinforcing portion, heat conduction reinforcing portion sets up between graphite flake and thermal coating, be provided with the isolation part in the heat conduction reinforcing portion, the isolation part is located one side that the thermal coating was kept away from to the graphite flake.
As the utility model discloses preferred technical scheme, heat conduction reinforcing portion is the heat conduction sticky tape, the heat conduction sticky tape is pasted between heat dissipation coating and graphite flake surface, and the one end of heat dissipation coating is far away to the heat conduction sticky tape stretches out the graphite flake.
As the utility model discloses preferred technical scheme, the isolation part is for from type paper, keep away from the back of thermal coating one end at the heat conduction sticky tape from the type paper setting.
Compared with the prior art, the beneficial effects of the utility model are that:
in the scheme of the utility model: 1. through the arranged heat dissipation structure, the heat conducting part in the heat dissipation structure can transfer the heat of the IC to the flexible heat dissipation part, the position of the flexible heat dissipation part corresponds to the position of the bending area, and due to the adoption of the flexible heat dissipation part, the problem of overlarge hardness of the bending area can be solved when the FPC body is bent from the bending area;
2. through the reinforced structure who sets up, heat conduction sticky tape among the reinforced structure can strengthen being connected between graphite flake and the heat dissipation coating on the one hand, the condition of graphite flake and heat dissipation coating junction perk when reducing to buckle, on the other hand can improve the graphite flake and to the thermal transmission efficiency of heat dissipation coating, tear the back off type paper and stick to the panel iron frame of display module assembly to the one end that stretches out the graphite flake to the heat conduction sticky tape, can improve the stability of being connected between FPC main part and the display module assembly, and improve the stability of being connected between graphite flake and the IC.
Drawings
Fig. 1 is a schematic structural diagram of an FPC structure that is easy to dissipate heat according to the present invention;
fig. 2 is a schematic structural diagram of a heat dissipation coating of an FPC structure easy to dissipate heat provided by the present invention;
fig. 3 is a schematic structural diagram of a bending region of the FPC structure easy to dissipate heat provided by the present invention;
fig. 4 is a schematic structural diagram of a reinforcing structure of an FPC structure easy to dissipate heat provided by the present invention;
fig. 5 is a schematic structural view of the heat conductive adhesive tape of the FPC structure easy to dissipate heat.
The following are marked in the figure:
1. an FPC assembly; 101. an FPC main body; 102. a bending zone; 103. a connecting end;
2. a heat dissipation structure; 201. a heat-dissipating coating; 202. a graphite sheet;
3. reinforcing the structure; 301. a thermally conductive adhesive tape; 302. and (7) release paper.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings. It is to be understood that the embodiments described are only some of the embodiments of the present invention, and not all of them.
Thus, the following detailed description of the embodiments of the present invention is not intended to limit the scope of the invention as claimed, but is merely representative of some embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
It should be noted that, in the case of no conflict, the embodiments of the present invention and the features and technical solutions in the embodiments may be combined with each other.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined or explained in subsequent figures.
In the description of the present invention, it should be noted that the terms "upper" and "lower" indicate the orientation or position relationship based on the orientation or position relationship shown in the drawings, or the orientation or position relationship that the utility model is usually placed when using, or the orientation or position relationship that the skilled person usually understands, and such terms are only for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the device or element that is referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be interpreted as limiting the present invention. Furthermore, the terms "first," "second," and the like are used merely to distinguish one description from another, and are not to be construed as indicating or implying relative importance.
Example 1:
as shown in fig. 1, 2, 3 and 4, the present embodiment provides an FPC structure easy to dissipate heat, including an FPC component 1, the FPC component 1 includes an FPC main body 101, a bending region 102 is disposed on a front surface of the FPC main body 101, a heat dissipation structure 2 is disposed between the bending region 102 and the FPC main body 101, the heat dissipation structure 2 includes a flexible heat dissipation portion disposed on the FPC main body 101 and corresponding to the bending region 102, a heat conduction portion is connected to one side of the front surface of the flexible heat dissipation portion, the heat conduction portion can transfer heat of an IC to the flexible heat dissipation portion, the position of the flexible heat dissipation portion corresponds to the position of the bending region 102, and the flexible heat dissipation portion is adopted, so when the FPC main body 101 is bent from the bending region 102, the problem of excessive hardness of the bending region 102 can be solved.
Example 2:
the scheme of example 1 is further described below in conjunction with specific working modes, which are described in detail below:
as shown in fig. 1, 2, 3 and 4, the present embodiment provides an FPC structure with easy heat dissipation, including an FPC assembly 1, the FPC assembly 1 includes an FPC main body 101, a bending region 102 is disposed on a front surface of the FPC main body 101, a heat dissipation structure 2 is disposed between the bending region 102 and the FPC main body 101, the heat dissipation structure 2 includes a flexible heat dissipation portion disposed on the FPC main body 101 and corresponding to the bending region 102, a heat conduction portion is connected to one side of the front surface of the flexible heat dissipation portion, the heat conduction portion can transfer heat of an IC to the flexible heat dissipation portion, the position of the flexible heat dissipation portion corresponds to the position of the bending region 102, and due to the adoption of the flexible heat dissipation portion, when the FPC main body 101 is bent from the bending region 102, the problem of excessive hardness of the bending region 102 can be solved.
As shown in fig. 3, in addition to the above-mentioned mode, in a preferred embodiment, a connection terminal 103 is further disposed at one end of the FPC main body 101, the connection terminal 103 is located near the bending region 102, and the connection terminal 103 is used for connecting the FPC assembly 1 to the display module.
As shown in fig. 1, 2 and 3, as a preferred embodiment, in addition to the above-mentioned embodiment, the flexible heat dissipation portion is a heat dissipation coating 201, the heat dissipation coating 201 is coated on the front surface of the FPC main body 101, and heat transferred from the heat conduction portion can be dissipated through the heat dissipation coating 201, thereby achieving heat dissipation.
As shown in fig. 2, as a preferred embodiment, based on the above manner, further, the heat dissipation coating 201 is carbon paste, the carbon paste is carbon paste with strong oxidation resistance, the thickness can be 25um or less, and the heat dissipation coating 201 covers the bending region 102;
the carbon paste is a composite material composed of binder, solvent and adjuvant, and is a mixture of noble metal powder, base metal powder, glass powder and synthetic resin, and is coated on the required position of substrate by screen printing or other methods, and then is fired at 400-1000 deg.C to form the body, mainly used for wiring of thick film integrated circuit, electrodes of ceramic capacitor, etc. and lead wire of mixed integrated circuit.
As shown in fig. 1, in addition to the above-described embodiment, in a preferred embodiment, the heat conducting portion is a graphite sheet 202, and one surface of the graphite sheet 202 close to the FPC main body 101 is connected to the heat dissipation coating 201, and since the carbon brush coating layer cannot be directly connected to the IC on the back surface of the glass, the heat dissipation coating 201 is attached to the glass IC from the IC position on the back surface of the glass via the graphite sheet 202, and the glass IC is connected to the heat dissipation coating 201, and then the heat of the IC is transferred to the heat dissipation coating 201 via the graphite sheet 202, and finally dissipated.
As shown in fig. 1 and 2, in addition to the above-mentioned manner, in a preferred embodiment, the graphite sheet 202 is located on the side of the bending region 102 close to the connecting end 103, and the graphite sheet 202 is located away from the bending region 102, so that the graphite sheet 202 is prevented from being affected by the graphite sheet 202 when the FPC main body 101 is bent from the bending region 102 by avoiding the bending region 102.
As shown in fig. 4 and 5, in addition to the above-mentioned manner, as a preferred embodiment, the present invention further includes a plurality of reinforcing structures 3, each of the plurality of reinforcing structures 3 is disposed between the graphite sheet 202 and the heat dissipation coating 201, and the plurality of reinforcing structures 3 can reinforce the connection between the graphite sheet 202 and the heat dissipation coating 201.
As shown in fig. 4 and 5, in addition to the above-mentioned manner, as a preferred embodiment, the reinforcing structure 3 further includes a heat conduction reinforcing portion, the heat conduction reinforcing portion is disposed between the graphite sheet 202 and the heat dissipation coating 201, an isolation portion is disposed on the heat conduction reinforcing portion, the isolation portion is located on one side of the graphite sheet 202 away from the heat dissipation coating 201, and the isolation portion can isolate the heat conduction reinforcing portion, so as to reduce the contamination of the heat conduction reinforcing portion before use.
Example 3:
the schemes of example 1 and example 2 are further described below in conjunction with specific working examples, which are described in detail below:
as shown in fig. 1, 2, 3 and 4, the present embodiment provides an FPC structure with easy heat dissipation, including an FPC assembly 1, the FPC assembly 1 includes an FPC main body 101, a bending region 102 is disposed on a front surface of the FPC main body 101, a heat dissipation structure 2 is disposed between the bending region 102 and the FPC main body 101, the heat dissipation structure 2 includes a flexible heat dissipation portion disposed on the FPC main body 101 and corresponding to the bending region 102, a heat conduction portion is connected to one side of the front surface of the flexible heat dissipation portion, the heat conduction portion can transfer heat of an IC to the flexible heat dissipation portion, the position of the flexible heat dissipation portion corresponds to the position of the bending region 102, and due to the adoption of the flexible heat dissipation portion, when the FPC main body 101 is bent from the bending region 102, the problem of excessive hardness of the bending region 102 can be solved.
As shown in fig. 3, in addition to the above-mentioned mode, as a preferred embodiment, further, one end of the FPC main body 101 is provided with a connection terminal 103, the connection terminal 103 is located near the bending region 102, and the connection terminal 103 is used for connecting the FPC assembly 1 and the display module.
As shown in fig. 1, 2 and 3, as a preferred embodiment, in addition to the above-mentioned embodiment, the flexible heat dissipation portion is a heat dissipation coating 201, the heat dissipation coating 201 is coated on the front surface of the FPC main body 101, and heat transferred from the heat conduction portion can be dissipated through the heat dissipation coating 201, thereby achieving heat dissipation.
As shown in fig. 2, as a preferred embodiment, on the basis of the above manner, further, the heat dissipation coating 201 is carbon paste, the carbon paste is carbon paste with strong oxidation resistance, the thickness can be 25um or less, and the heat dissipation coating 201 covers the bending region 102;
as shown in fig. 1, in addition to the above-described embodiment, in a preferred embodiment, the heat conducting portion is a graphite sheet 202, and one surface of the graphite sheet 202 close to the FPC main body 101 is connected to the heat dissipation coating 201, and since the carbon brush coating layer cannot be directly connected to the IC on the back surface of the glass, the heat dissipation coating 201 is attached to the glass IC from the IC position on the back surface of the glass via the graphite sheet 202, and the glass IC is connected to the heat dissipation coating 201, and then the heat of the IC is transferred to the heat dissipation coating 201 via the graphite sheet 202, and finally dissipated.
As shown in fig. 1 and 2, in addition to the above-mentioned manner, in a preferred embodiment, the graphite sheet 202 is located on the side of the bending region 102 close to the connecting end 103, and the graphite sheet 202 is located away from the bending region 102, so that the graphite sheet 202 is prevented from being affected by the graphite sheet 202 when the FPC main body 101 is bent from the bending region 102 by avoiding the bending region 102.
As shown in fig. 4 and 5, in addition to the above-mentioned manner, as a preferred embodiment, the present invention further includes a plurality of reinforcing structures 3, each of the plurality of reinforcing structures 3 is disposed between the graphite sheet 202 and the heat dissipation coating 201, and the plurality of reinforcing structures 3 can reinforce the connection between the graphite sheet 202 and the heat dissipation coating 201.
As shown in fig. 4 and 5, in addition to the above-mentioned manner, as a preferred embodiment, the reinforcing structure 3 further includes a heat conduction reinforcing portion, the heat conduction reinforcing portion is disposed between the graphite sheet 202 and the heat dissipation coating 201, an isolation portion is disposed on the heat conduction reinforcing portion, the isolation portion is located on one side of the graphite sheet 202 away from the heat dissipation coating 201, and the isolation portion can isolate the heat conduction reinforcing portion, so as to reduce the contamination of the heat conduction reinforcing portion before use.
As shown in fig. 4 and fig. 5, as a preferred embodiment, based on the above-mentioned manner, further, the heat conduction reinforcing portion is a heat conduction adhesive tape 301, the heat conduction adhesive tape 301 is adhered between the outer surfaces of the heat dissipation coating 201 and the graphite sheet 202, and one end of the heat conduction adhesive tape 301, which is far away from the heat dissipation coating 201, extends out of the graphite sheet 202, the heat conduction adhesive tape 301 can enhance the connection between the graphite sheet 202 and the heat dissipation coating 201, reduce the tilting of the joint between the graphite sheet 202 and the heat dissipation coating 201 during bending, and improve the heat transfer efficiency of the graphite sheet 202 to the heat dissipation coating 201, and after tearing off the release paper 302, one end of the heat conduction adhesive tape 301, which extends out of the graphite sheet 202, is adhered to the panel iron frame of the display module, so as to improve the connection stability between the FPC main body 101 and the display module, and improve the connection stability between the graphite sheet 202 and the IC.
As shown in fig. 4 and fig. 5, as a preferred embodiment, in addition to the above manner, further, the separating portion is a release paper 302, the release paper 302 is disposed on the back surface of the end of the heat conductive tape 301 away from the heat dissipation coating 201, the release paper 302 can protect the end of the heat conductive tape 301 extending out of the heat dissipation coating 201 before use, and the side surface of the release paper 302 extends to the outside of the heat conductive tape 301, so that the release paper 302 can be easily torn off from the heat conductive tape 301.
Specifically, this easy radiating FPC structure is when during operation/use: firstly, brushing a layer of heat dissipation coating 201 on the front surface of the FPC main body 101 to enable the position of the heat dissipation coating 201 to cover the bending area 102, and then pasting a graphite sheet 202 on one side, close to the connecting end 103, of the top of the heat dissipation coating 201, wherein the graphite sheet 202 is not pasted and fixed with the connecting end 103;
then paste heat conduction sticky tape 301 between heat dissipation coating 201 and graphite flake 202 are positive, during the installation, be connected link 103 and display module assembly to paste graphite flake 202 on IC, tear off type paper 302 back and glue the one end that heat conduction sticky tape 301 kept away from heat dissipation coating 201 on the panel iron frame of display module assembly.
The above embodiments are only used to illustrate the present invention and not to limit the technical solutions of the present invention, and although the present invention has been described in detail with reference to the above embodiments, the present invention is not limited to the above embodiments, so that any modifications or equivalent substitutions can be made to the present invention; all the technical solutions and modifications without departing from the spirit and scope of the present invention are covered by the claims of the present invention.
Claims (10)
1. The FPC structure easy to dissipate heat comprises an FPC assembly (1) and is characterized in that the FPC assembly (1) comprises an FPC main body (101), a bending area (102) is arranged on the front face of the FPC main body (101), a heat dissipation structure (2) is arranged between the bending area (102) and the FPC main body (101), the heat dissipation structure (2) comprises a flexible heat dissipation portion which is arranged on the FPC main body (101) and corresponds to the bending area (102) in position, and a heat conduction portion is connected to one side of the front face of the flexible heat dissipation portion.
2. An FPC structure easy to dissipate heat according to claim 1, characterized in that one end of the FPC main body (101) is provided with a connection end (103), and the connection end (103) is located near the bending region (102).
3. An FPC structure easy to dissipate heat according to claim 2, characterized in that the flexible heat dissipating part is a heat dissipating coating (201), and the heat dissipating coating (201) is painted on the front surface of the FPC main body (101).
4. An FPC structure easy to dissipate heat according to claim 3, characterized in that the heat dissipation coating (201) is carbon paste, and the heat dissipation coating (201) covers the bending region (102).
5. An FPC structure with easy heat dissipation as recited in claim 4, characterized in that the thermal conduction portion is a graphite sheet (202), and one side of the graphite sheet (202) close to the FPC main body (101) is connected with the heat dissipation coating (201).
6. An FPC structure easy to dissipate heat according to claim 5, characterized in that the graphite sheet (202) is located on one side of the bending region (102) close to the connection end (103), and the graphite sheet (202) is located away from the bending region (102).
7. A heat-dissipating FPC structure according to claim 6, further comprising a plurality of reinforcing structures (3), wherein a plurality of reinforcing structures (3) are disposed between the graphite sheet (202) and the heat-dissipating coating (201).
8. An FPC structure easy to dissipate heat according to claim 7, characterized in that said reinforcing structure (3) comprises a heat conduction reinforcing portion, said heat conduction reinforcing portion is disposed between the graphite sheet (202) and the heat dissipation coating (201), and said heat conduction reinforcing portion is provided with an isolation portion, said isolation portion is located on one side of the graphite sheet (202) away from the heat dissipation coating (201).
9. An FPC structure easy to dissipate heat according to claim 8, characterized in that the thermal conduction reinforcing part is a thermal conduction adhesive tape (301), the thermal conduction adhesive tape (301) is adhered between the thermal dissipation coating (201) and the outer surface of the graphite sheet (202), and one end of the thermal conduction adhesive tape (301) far away from the thermal dissipation coating (201) extends out of the graphite sheet (202).
10. An FPC structure easy to dissipate heat according to claim 9, characterized in that the isolation portion is a release paper (302), and the release paper (302) is disposed on the back of the end of the thermal conductive tape (301) far from the heat dissipation coating (201).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222162894.7U CN218388061U (en) | 2022-08-16 | 2022-08-16 | FPC structure easy to radiate heat |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222162894.7U CN218388061U (en) | 2022-08-16 | 2022-08-16 | FPC structure easy to radiate heat |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218388061U true CN218388061U (en) | 2023-01-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222162894.7U Active CN218388061U (en) | 2022-08-16 | 2022-08-16 | FPC structure easy to radiate heat |
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| Country | Link |
|---|---|
| CN (1) | CN218388061U (en) |
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2022
- 2022-08-16 CN CN202222162894.7U patent/CN218388061U/en active Active
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