CN218385225U - Laminated light-emitting chip and display device - Google Patents
Laminated light-emitting chip and display device Download PDFInfo
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- CN218385225U CN218385225U CN202222583136.2U CN202222583136U CN218385225U CN 218385225 U CN218385225 U CN 218385225U CN 202222583136 U CN202222583136 U CN 202222583136U CN 218385225 U CN218385225 U CN 218385225U
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Abstract
The utility model discloses a stromatolite luminescence chip and display device, the stromatolite luminescence chip includes ruddiness chip, blue light chip and green glow chip, and ruddiness chip is including openly and the back, and the front of ruddiness chip is provided with first electrode. The blue light chip is arranged on the front side of the red light chip, and the back side of the blue light chip is bonded on the first electrode on the front side of the red light chip. The green light chip and the blue light chip are arranged on the front side of the red light chip side by side, and the back side of the green light chip is bonded on the first electrode on the front side of the red light chip. The euphotic layer is arranged between the blue light chip and the red light chip and between the green light chip and the red light chip, the blue light chip and the green light chip which are arranged above the red light chip can be prevented from shielding the red light chip by the euphotic layer, the effective light-emitting area of the red light chip is increased, the actual area or size of the red light chip is reduced, the occupied area of each pixel in the display device is also reduced, and the display resolution is increased.
Description
Technical Field
The utility model relates to a semiconductor display device technical field, concretely relates to stromatolite luminescence chip and display device.
Background
With the gradual development of LED display screens, people have increasingly strict requirements on the visual sensation, contrast, brightness, service life and the like of LED packaging devices, and as is well known, with the reduction of the dot pitch of LED packaging devices applied to a display screen, the resolution, brightness, contrast and service life of the display screen are significantly improved.
In the prior art, three monochromatic LEDs, namely red, green and blue, which are arranged side by side in the horizontal direction generally form pixels of a micro LED display screen, and the area of each monochromatic LED is smaller than 1/3 of the area of the pixel. The advantage of this arrangement is that the bonding process is relatively simple, and the chip assembly is completed by a single bond, but the disadvantages are: the pixel density increase of the process is limited by the limit of the single-layer process, that is, the resolution of the display screen can only reach one third of the limit of the single-layer process of the device.
In order to solve the technical problem of low resolution in the single layer process, in the prior art, light emitting chips of three colors are stacked to reduce the size of the chip and obtain high resolution. However, the chip stacked on the upper layer can shield the light emitting area of the chip on the lower layer, and the light emitting area of the chip on the lower layer needs to be large enough to ensure the effective light emitting area, so that the further improvement of the resolution ratio is restricted by the factor.
SUMMERY OF THE UTILITY MODEL
In view of the above-mentioned shortcomings of the prior art, the present invention provides a stacked light emitting chip and a display device, so as to further reduce the size of the stacked chip and improve the display resolution.
In order to achieve the above objects and other related objects, the present invention provides a laminated light emitting chip, including:
the red light chip comprises a front surface and a back surface, and the front surface of the red light chip is provided with a first electrode;
the blue light chip is arranged on the front side of the red light chip, and the back side of the blue light chip is bonded on the first electrode on the front side of the red light chip;
the green light chip and the blue light chip are arranged on the front side of the red light chip side by side, and the back side of the green light chip is bonded on the first electrode on the front side of the red light chip;
and light transmitting layers are arranged between the blue light chip and the red light chip and between the green light chip and the red light chip.
Optionally, the red light chip is a flip chip, and the red light chip includes:
the first electrode of the red light chip extends from the back surface of the red light chip to one end of the front surface of the red light chip along the side surface of the red light chip;
and the second electrode of the red light chip is arranged on the back surface of the red light chip.
Optionally, the back side of the blue chip comprises: the first electrode of the blue light chip is bonded on the first electrode on the front surface of the red light chip and is electrically connected with the first electrode of the red light chip; the back side of the green chip includes: and the first electrode of the green chip is bonded on the first electrode on the front surface of the red chip and is electrically connected with the first electrode of the red chip. Optionally, the first electrodes of the red light chip, the blue light chip and the green light chip are all transparent electrodes, and the transparent electrodes are formed as light transmission layers.
Optionally, the stacked light emitting chip further comprises:
one end of the first extending metal electrode is arranged on the front surface of the red light chip and extends from the front surface of the red light chip to the back surface of the red light chip;
and the second extending metal electrode is arranged at an interval with the first extending metal electrode, and one end of the second extending metal electrode is arranged on the front surface of the red light chip and extends from the front surface of the red light chip to the back surface of the red light chip.
Optionally, the laminated light emitting chip further comprises:
the first transparent conducting layer is arranged on the front surface of the red light chip, one end of the first transparent conducting layer is connected to the second electrode positioned on the front surface of the blue light chip, and the other end of the first transparent conducting layer is electrically connected with the first extending metal electrode positioned on the front surface of the red light chip;
and the second transparent conducting layer is arranged at intervals with the first transparent conducting layer and is arranged on the front surface of the red light chip, one end of the second transparent conducting layer is connected to a second electrode positioned on the front surface of the blue light chip, and the other end of the second transparent conducting layer is electrically connected with a second extending metal electrode positioned on the front surface of the red light chip.
Optionally, the blue chip further includes on the back side: the second electrode of the blue light chip is bonded on the first extending metal electrode on the front surface of the red light chip; the back surface of the green chip also comprises: and the second electrode of the green chip is bonded on the second extending metal electrode on the front surface of the red chip.
Optionally, the first electrodes of the red light chip, the blue light chip and the green light chip, and the first extended metal electrode and the second extended metal electrode are all transparent electrodes, and the transparent electrodes are formed as light-transmitting layers.
Optionally, the front surface of the red chip is covered with a transparent insulating layer, and the transparent insulating layer is formed as a light-transmitting layer.
Optionally, the area ratio of the blue chip to the green chip on the front surface of the red chip is the same.
Optionally, the ratio of the area of the front surface of the red light chip to the occupied area of the blue light chip on the front surface of the red light chip is 2 (0.7-1), and the ratio of the area of the front surface of the red light chip to the occupied area of the green light chip on the front surface of the red light chip is 2 (0.7-1).
The utility model also provides a display device, including above-mentioned arbitrary scheme the stromatolite luminous chip.
Compared with the prior art, stromatolite luminescence chip and display device possess following beneficial effect at least:
stromatolite luminescence chip include red light chip, blue light chip and green glow chip. The red light chip comprises a front surface and a back surface, and the front surface of the red light chip is provided with a first electrode. The blue light chip is arranged on the front side of the red light chip, and the back side of the blue light chip is bonded on the first electrode on the front side of the red light chip. The green light chip and the blue light chip are arranged on the front side of the red light chip side by side, the back side of the green light chip is bonded on the first electrode on the front side of the red light chip, and in addition, light transmitting layers are arranged between the blue light chip and the red light chip and between the green light chip and the red light chip. Therefore, the utility model discloses set up blue light chip and green glow chip side by side on the surface of ruddiness chip to reduce the chip and put the space, optimize the chip and arrange. And the euphotic layers are arranged between the blue light chip and the red light chip and between the green light chip and the red light chip, so that the blue light chip and the green light chip which are positioned above the red light chip are prevented from shielding the red light chip, the effective light-emitting area of the red light chip is increased, the actual area or size of the red light chip is further reduced, the occupied area of each pixel in the display device is also reduced, and the display resolution is increased.
The display device of the present invention comprises the laminated light emitting chip, and also has the above technical effects.
Drawings
Fig. 1 is a schematic top view of the laminated light emitting chip in embodiment 1 of the present invention;
FIG. 2 isbase:Sub>A front sectional view taken along line A-A in FIG. 1;
FIG. 3 is a front sectional view taken along line B-B in FIG. 1;
fig. 4 is a schematic bottom view of the stacked light emitting chip in embodiment 1 of the present invention;
fig. 5 is a schematic top view of the laminated light emitting chip in embodiment 2 of the present invention;
FIG. 6 is a front sectional view of A '-A' of FIG. 5;
FIG. 7 is a front sectional view of B '-B' of FIG. 5.
List of reference numbers:
100. red light chip
101. First electrode of red light chip
102. Second electrode of red light chip
103. A first extended metal electrode
104. A second extended metal electrode
200. Blue light chip
201. First electrode of blue light chip
202. Second electrode of blue light chip
300. Green light chip
301. First electrode of green chip
302. Second electrode of green chip
401. A first transparent conductive layer
402. A second transparent conductive layer
500. Transparent insulating layer
Detailed Description
The following description is given for illustrative embodiments of the present invention, and other advantages and effects of the present invention will be apparent to those skilled in the art from the disclosure of the present invention. The present invention may be embodied or carried out in other specific forms, and various modifications and changes may be made in the details within the description without departing from the spirit of the invention. It should be noted that the features in the following embodiments and examples may be combined with each other without conflict.
It should be understood that the drawings provided in the embodiments of the present invention are only for illustrating the basic concept of the present invention, and although only the components related to the present invention are shown in the drawings, not drawn according to the number, shape and size of the components in actual implementation, the form, quantity and proportion of each component may be changed at will in actual implementation, and the layout of the components may be more complicated. The structure, ratio, size and the like shown in the drawings are only used for matching with the content disclosed in the specification, so that those skilled in the art can understand and read the content, and do not limit the limit conditions that the present application can be implemented, so that the essence of the technology is not existed, and any structural modification, ratio relationship change or size adjustment should still fall within the scope that the technical content disclosed in the present application can cover without affecting the efficacy and the achievable purpose of the present invention.
Example 1
The present embodiment provides a stacked light emitting chip, which includes a red light chip, a blue light chip, and a green light chip. The red light chip comprises a front surface and a back surface, and the front surface of the red light chip is provided with a first electrode. The blue light chip is arranged on the front side of the red light chip, and the back side of the blue light chip is bonded on the first electrode on the front side of the red light chip. The green light chip and the blue light chip are arranged on the front side of the red light chip side by side, the back side of the green light chip is bonded on the first electrode on the front side of the red light chip, and in addition, light transmitting layers are arranged between the blue light chip and the red light chip and between the green light chip and the red light chip.
Specifically, the red light chip comprises a red light epitaxial structure, wherein the red light epitaxial structure comprises a first semiconductor layer, an active layer and a second semiconductor layer, the first semiconductor layer, the active layer and the second semiconductor layer are sequentially formed on the surface of a substrate, and the conductivity type of the second semiconductor layer is opposite to that of the first semiconductor layer. And sequentially etching the second semiconductor layer and the active layer to the surface of the first semiconductor layer along the surface of the second semiconductor layer to expose the first semiconductor layer, wherein the exposed first semiconductor layer is used for forming a first electrode, and the second semiconductor layer is used for forming a second electrode. Alternatively, the first semiconductor layer may be an N-type semiconductor layer, and the second semiconductor layer may be a P-type semiconductor layer. Of course, the first semiconductor layer may be a P-type semiconductor layer, and the second semiconductor layer may be an N-type semiconductor layer. Optionally, the materials of the first semiconductor layer, the active layer and the second semiconductor layer are all AlGaInP (aluminum gallium indium phosphide) materials. For example, the first semiconductor layer is an N-type confinement layer and the material is N-AlGaInP for providing electrons for composite light emission. The second semiconductor layer is a P-type limiting layer made of P-AlGaInP and used for providing holes for carrying out composite light emission. The active layer is a single quantum well or a multiple quantum well, the material composition of the active layer is AlGaInP, the active layer is used for carrying out compound luminescence of electrons and holes, and the epitaxial structure is used for radiating red light.
Referring to fig. 2 or 3, the red chip 100 in this embodiment is a flip chip, and electrodes are formed on the back surface of the red chip 100. Specifically, referring to fig. 4, the back surface of the red chip 100 includes a first electrode 101 of the red chip and a second electrode 102 of the red chip, and the first electrode on the back surface of the red chip 100 is connected to a first semiconductor layer (not shown) of the red epitaxial structure. The second electrode on the back of the red light chip 100 is connected to the second semiconductor layer (not shown) of the red light epitaxial structure. Also, referring to fig. 2 or 3, the first electrode 101 of the red chip extends from the back surface of the red chip 100 to one end of the front surface of the red chip 100 along the side surface of the red chip 100, and the second electrode 102 of the red chip is disposed on the back surface of the red chip 100. In this embodiment, referring to fig. 1 and fig. 2 and 3 simultaneously, a first extended metal electrode 103 and a second extended metal electrode 104 are further disposed on the red chip 100. One end of the first extended metal electrode 103 is disposed on the front surface of the red light chip 100 and extends from the front surface of the red light chip 100 to the back surface of the red light chip 100, the second extended metal electrode 104 is disposed at an interval with the first extended metal electrode 103, similarly, one end of the second extended metal electrode 104 is disposed on the front surface of the red light chip 100 and extends from the front surface of the red light chip 100 to the back surface of the red light chip 100, and the first extended metal electrode 103 and the second extended metal electrode 104 are made of conductive metal materials for electrically connecting the second electrodes of the blue light chip 300 and the green light chip 200 to the back surface of the red light chip 100, so as to facilitate bonding and mounting of the subsequent stacked light emitting chips. Optionally, in order to increase the light emitting area of the red light chip, the first extended metal electrode 103 and the second extended metal electrode 104 may also be made of a transparent conductive material. Alternatively, the transparent conductive material may be indium tin oxide, zinc oxide, aluminum zinc oxide, gallium zinc oxide, indium zinc oxide, or the like.
Referring to fig. 1 and also fig. 3, the blue chip 200 is a vertical chip, the blue chip 200 includes a blue epitaxial structure (not shown in the figure) including a first semiconductor layer, an active layer, and a second semiconductor layer stacked in this order, a first electrode 201 of the blue chip is formed on a surface of the first semiconductor layer, and a second electrode 202 of the blue chip is formed on a surface of the second semiconductor layer. The surface of the blue chip where the first electrode 201 is located is a back surface, and the surface of the blue chip where the second electrode is located is a front surface of the blue chip 200. The first electrode on the back of the blue chip 200 is bonded to the first electrode 102 of the red chip, and electrically connected to form a common electrode structure. Alternatively, the first semiconductor layer is an N-type semiconductor layer, and the second semiconductor layer is a P-type semiconductor layer. Optionally, the material of the first semiconductor layer, the active layer and the second semiconductor layer is a GaN material. For example, the first semiconductor layer is an N-InGaN layer for providing electrons for recombination light emission, and the second semiconductor layer is a P-InGaN layer for providing holes for recombination light emission. The active layer is a single or multiple quantum well with a material composition of InGaN for recombination emission of electrons and holes, and in this embodiment, the epitaxial structure radiates blue light.
Referring to fig. 1 together with fig. 2, the green chip 300 is a vertical chip, the green chip 300 includes a green light epitaxial structure (not shown) including a first semiconductor layer, an active layer, and a second semiconductor layer stacked in sequence, a first electrode 301 of the green chip is formed on a surface of the first semiconductor layer, and a second electrode 302 of the green chip is formed on a surface of the second semiconductor layer. The surface on which the first electrode 301 of the green chip is located is formed as a back surface, and the surface on which the second electrode is located is formed as a front surface of the green chip 300. The first electrode on the back side of the green chip 300 is bonded to the first electrode 102 of the red chip and is electrically connected to form a common electrode structure. In this embodiment, the first semiconductor layer may be an N-type semiconductor layer, and the second semiconductor layer may be a P-type semiconductor layer. Optionally, the material of the first semiconductor layer, the active layer and the second semiconductor layer is GaP material. For example, the first semiconductor layer is an N-GaP layer for providing electrons for recombination light emission, and the second semiconductor layer is a P-GaP layer for providing holes for recombination light emission. The active layer is a single or multiple quantum well with a material composition GaP for recombination of electrons and holes to emit light, and in this embodiment, the epitaxial structure radiates green light.
Optionally, referring to fig. 2 or 3, a transparent insulating layer 500 is further disposed on the peripheries of the epitaxial structure of the red light chip 100, the epitaxial structure of the blue light chip 200, and the epitaxial structure of the green light chip 300, where the transparent insulating layer 500 is used to electrically isolate the epitaxial structure from the electrode structure, so as to prevent a leakage phenomenon. Alternatively, the material of the transparent insulating layer 500 may be SiO 2 。
In order to avoid the shielding of the light emitting areas of the blue light chip 200 and the green light chip 300 on the red light chip 100, in this embodiment, referring to fig. 2 or 3, the first electrodes 301 of the red light chip 100, the blue light chip 200 and the green light chip are all set as transparent electrodes, the transparent electrodes are formed between the blue light chip 200 and the red light chip 100 and between the green light chip 300 and the red light chip 100, and can transmit light emitted by the red light chip 100, so that the light emitting areas of the red light chip 100 below the blue light chip 200 and the green light chip 300 are prevented from being shielded, and the effective light emitting area of the red light chip 100 is increased. Alternatively, the material of the transparent electrode may be indium tin oxide, zinc oxide, aluminum zinc oxide, gallium zinc oxide, indium zinc oxide, or the like, and in this embodiment, the material of the transparent electrode is indium tin oxide.
Alternatively, referring to fig. 1, and also referring to fig. 2 or 3, the stacked light emitting chip further includes a first transparent conductive layer 401 and a second transparent conductive layer 402, the first transparent conductive layer 401 is disposed on the front surface of the red light chip 100, one end of the first transparent conductive layer is connected to the second electrode on the front surface of the blue light chip 300, and the other end of the first transparent conductive layer is electrically connected to the first extension metal electrode 103 on the front surface of the red light chip 100. The second transparent conductive layer 402 and the first transparent conductive layer 401 are disposed at an interval, and are disposed on the front surface of the red light chip 100, one end of which is connected to the second electrode on the front surface of the blue light chip, and the other end of which is electrically connected to the second extension metal electrode 104 on the front surface of the red light chip. Alternatively, the material of the first transparent conductive layer 401 and the second transparent conductive layer 402 may be indium tin oxide, zinc oxide, aluminum zinc oxide, gallium zinc oxide, or indium zinc oxide, and in this embodiment, the material of the first transparent conductive layer 401 and the second transparent conductive layer 402 may be indium tin oxide.
Alternatively, referring to fig. 1, the blue chip 200 and the green chip 300 have the same area ratio on the front surface of the red chip 100. In addition, the blue light chip 200 and the green light chip 300 do not shield the light emitted by the red light chip 100, so that the effective light emitting area of the red light chip 100 can be ensured, the size of the red light chip 100 is further reduced, and the display resolution is improved. In this embodiment, the ratio of the area of the front surface of the red chip 100 to the area of the blue chip 200 occupied by the front surface of the red chip 100 is 2 (0.7-1), and the ratio of the area of the front surface of the red chip 100 to the area of the green chip 300 occupied by the front surface of the red chip 100 is 2 (0.7-1).
In the laminated light-emitting chip in the embodiment, the blue light chip and the green light chip are arranged on the surface of the red light chip side by side so as to reduce the chip placement space and optimize the chip arrangement. And moreover, the euphotic layers are arranged between the blue light chip and the red light chip and between the green light chip and the red light chip, so that the blue light chip and the green light chip are prevented from shielding the red light chip, the effective light-emitting area of the red light chip is increased, the actual area or size of the red light chip is further reduced, the occupied area of each pixel in the display device is also reduced, and the display resolution is improved.
Example 2
The present embodiment provides a stacked light emitting chip, where the same parts of the red light chip in the stacked light emitting chip as those in embodiment 1 are not repeated here, and the differences are as follows:
in this embodiment, referring to fig. 5 or 7, the blue chip 200 is a horizontal front-mounted chip, the back surface of the blue chip 200 further includes a second electrode 202 of the blue chip, and the second electrode 202 of the blue chip is bonded to the first extension metal electrode 103 of the red chip. Referring to fig. 5 or 6, the green chip 300 is a horizontally front-mounted chip, and a second electrode 302 of the green chip is further included on the rear surface of the green chip 300, and the second electrode 302 of the green chip is bonded to the second extended metal electrode 104 of the red chip. Moreover, the front surface of the red light chip 100 is covered with the transparent insulating layer 500, and the transparent insulating layer 500 is formed as a light transmitting layer, so that the light emitted by the red light chip 100 can be used to further improve the light extraction efficiency. Alternatively, the material of the transparent insulating layer 500 may be silicon dioxide.
In an alternative embodiment, referring to fig. 6 or 7, the first electrodes of the red chip 100, the blue chip 200, and the green chip 300, and the first extended metal electrode 103 and the second extended metal electrode 104 are all transparent electrodes, and the transparent electrodes are formed as light-transmitting layers. Furthermore, the transparent electrodes between the red light chip 100 and the blue light chip 200 and between the red light chip 100 and the green light do not shield or absorb the light emitted from the red light chip 100, thereby improving the effective light-emitting area and the light-emitting efficiency of the red light chip 100. Alternatively, the material of the transparent electrode may be indium tin oxide, zinc oxide, aluminum zinc oxide, gallium zinc oxide, indium zinc oxide, or the like, and in this embodiment, the material of the transparent electrode is indium tin oxide.
In the laminated light-emitting chip in the embodiment, the blue light chip and the green light chip are arranged on the surface of the red light chip side by side so as to reduce the chip placement space and optimize the chip arrangement. And the euphotic layers are arranged between the blue light chip and the red light chip and between the green light chip and the red light chip, so that the blue light chip and the green light chip are prevented from shielding the red light chip, the effective light-emitting area of the red light chip is increased, the actual area or size of the red light chip is reduced, the occupied area of each pixel in the display device is also reduced, and the display resolution is increased.
Example 3
The present embodiment provides a display device including the laminated light emitting chip in embodiment 1 or embodiment 2. In the display device in the embodiment, the blue light chip and the green light chip are arranged on the surface of the red light chip side by the laminated light emitting chip, so that the chip placement space is reduced, and the chip arrangement is optimized. And moreover, the euphotic layers are arranged between the blue light chip and the red light chip and between the green light chip and the red light chip, so that the blue light chip and the green light chip are prevented from shielding the red light chip, the effective light-emitting area of the red light chip is increased, the actual area or size of the red light chip is further reduced, the occupied area of each pixel in the display device is also reduced, and the display resolution is increased.
The above embodiments are merely illustrative of the principles and effects of the present invention, and are not to be construed as limiting the invention. Any person skilled in the art can modify or change the above embodiments without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which may be made by those skilled in the art without departing from the spirit and technical spirit of the present invention shall be covered by the claims of the present invention.
Claims (12)
1. A laminated light emitting chip, comprising:
the red light chip comprises a front surface and a back surface, and the front surface of the red light chip is provided with a first electrode;
the blue light chip is arranged on the front side of the red light chip, and the back side of the blue light chip is bonded on the first electrode on the front side of the red light chip;
the green light chip and the blue light chip are arranged on the front surface of the red light chip side by side, and the back surface of the green light chip is bonded on the first electrode on the front surface of the red light chip;
and light transmitting layers are arranged between the blue light chip and the red light chip and between the green light chip and the red light chip.
2. The laminated light emitting chip of claim 1, wherein the red chip is a flip chip, the red chip comprising:
the first electrode of the red light chip extends from the back surface of the red light chip to one end of the front surface of the red light chip along the side surface of the red light chip;
and the second electrode of the red light chip is arranged on the back surface of the red light chip.
3. The laminated light emitting chip of claim 2, wherein the back side of the blue chip comprises: the first electrode of the blue light chip is bonded on the first electrode of the front side of the red light chip and is electrically connected with the first electrode of the red light chip; the back side of the green chip includes: and the first electrode of the green chip is bonded on the first electrode of the front surface of the red chip and is electrically connected with the first electrode of the red chip.
4. The laminated light-emitting chip according to claim 3, wherein the first electrodes of the red chip, the blue chip, and the green chip are transparent electrodes, and the transparent electrodes are formed as the light-transmitting layer.
5. The laminated light emitting chip of claim 2, further comprising:
one end of the first extending metal electrode is arranged on the front surface of the red light chip and extends from the front surface of the red light chip to the back surface of the red light chip;
and the second extending metal electrode is arranged at an interval with the first extending metal electrode, and one end of the second extending metal electrode is arranged on the front surface of the red light chip and extends to the back surface of the red light chip from the front surface of the red light chip.
6. The laminated light emitting chip of claim 5, further comprising:
the first transparent conducting layer is arranged on the front surface of the red light chip, one end of the first transparent conducting layer is connected to the second electrode positioned on the front surface of the blue light chip, and the other end of the first transparent conducting layer is electrically connected with the first extending metal electrode positioned on the front surface of the red light chip;
and the second transparent conducting layer is arranged at intervals with the first transparent conducting layer and is arranged on the front surface of the red light chip, one end of the second transparent conducting layer is connected to the second electrode positioned on the front surface of the blue light chip, and the other end of the second transparent conducting layer is electrically connected with the second extending metal electrode positioned on the front surface of the red light chip.
7. The laminated light emitting chip of claim 5, further comprising on the back side of the blue chip: the second electrode of the blue light chip is bonded on the first extending metal electrode on the front surface of the red light chip; the back surface of the green chip also comprises: and the second electrode of the green chip is bonded on the second extended metal electrode on the front surface of the red chip.
8. The laminated light-emitting chip according to claim 7, wherein the first electrodes of the red, blue, and green chips and the first and second extended metal electrodes are transparent electrodes, and the transparent electrodes are formed as the light-transmitting layer.
9. The laminated light-emitting chip according to claim 7, wherein a front surface of the red chip is covered with a transparent insulating layer formed as the light-transmitting layer.
10. The laminated light emitting chip of claim 1, wherein the blue chip and the green chip have the same area ratio on the front surface of the red chip.
11. The laminated light-emitting chip of claim 1, wherein the ratio of the area of the front surface of the red light chip to the area of the blue light chip on the front surface of the red light chip is 2 (0.7-1), and the ratio of the area of the front surface of the red light chip to the area of the green light chip on the front surface of the red light chip is 2 (0.7-1).
12. A display device comprising the laminated light-emitting chip according to any one of claims 1 to 11.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202222583136.2U CN218385225U (en) | 2022-09-28 | 2022-09-28 | Laminated light-emitting chip and display device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202222583136.2U CN218385225U (en) | 2022-09-28 | 2022-09-28 | Laminated light-emitting chip and display device |
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| CN218385225U true CN218385225U (en) | 2023-01-24 |
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| CN202222583136.2U Active CN218385225U (en) | 2022-09-28 | 2022-09-28 | Laminated light-emitting chip and display device |
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