CN218385212U - Pressing plate for packaging - Google Patents

Abstract

The utility model discloses a clamp plate is used in encapsulation, including the clamp plate framework, the chip perforation has been seted up at the middle part in the clamp plate framework outside, and the clamp plate framework has been seted up the chip with the inboard of chip perforation junction and has been detained the limit indent, and one side of clamp plate framework is rotated and is connected with the upset depression bar, and the both ends in the clamp plate framework outside are all fixed to be provided with and are detained the subassembly, and two are detained the subassembly and all include main preforming and elasticity and press the knot, and the one end of main preforming is all fixed to be provided with elasticity and press the knot, and the pin indent of a plurality of evenly distributed is seted up to the inboard periphery of clamp plate framework, the utility model relates to a clamp plate is used in encapsulation, and this encapsulation clamp plate simple structure can fix a position the chip fast, adopts the mode that the buckle formula compressed tightly to replace direct gluing to compress tightly, can put the dislocation or when squinting at the chip, lift the clamp plate again and adjust, after compressing tightly inerrableness the mistake, seals the chip again, and then has improved the fault-tolerance rate of chip encapsulation, reduces the requirement that compresses tightly the technology.

Description

Pressing plate for packaging

Technical Field

The utility model relates to a semiconductor chip packaging technology field specifically is a clamp plate is used in encapsulation.

Background

The chip packaging is that the chip body is installed in a special shell, the semiconductor chip is fixed, sealed, protected and enhanced in electric heating performance through the shell, and pins on the shell can be connected with an internal circuit of the chip, and the pins after connection are connected with other devices through wires on a printed board, so that the packaging plays an important role in the semiconductor chip and other integrated circuits. The packaging of the semiconductor chip requires a pressing plate adapted to the package frame in addition to the basic package frame, and the semiconductor chip is firmly pressed in the package frame by the pressing plate. The traditional packaging pressing plate is directly pressed into a packaging frame after the inner side of the pressing plate is coated with glue, so that the chip is packaged and formed at one time.

The conventional packaging pressing plate is low in fault-tolerant rate, cannot be loosened and adjusted again after being pressed when a chip is placed in a misplacement or deviation mode, and is high in pressing technological requirement.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a clamp plate is used in encapsulation to current encapsulation clamp plate fault-tolerant rate that proposes in solving above-mentioned background art is low, when dislocation or deviation are put to the chip, can't loosen again the adjustment after compressing tightly, compresses tightly the high problem of technological requirement.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a clamp plate is used in encapsulation, includes the clamp plate framework, the chip perforation has been seted up at the middle part in the clamp plate framework outside, the chip has been seted up with the inboard of chip perforation junction to the clamp plate framework and has been detained the limit indent, one side of clamp plate framework is rotated and is connected with the upset depression bar, the both ends in the clamp plate framework outside are all fixed to be provided with and are detained the subassembly, two detain the subassembly and all include main preforming and elasticity and press the knot, the one end of main preforming is all fixed to be provided with elasticity and presses the knot, a plurality of evenly distributed's pin indent is seted up to the inboard periphery of clamp plate framework, adopts the mode that buckle formula compressed tightly to replace direct gluing to compress tightly, can put the clamp plate again when the chip misplaces or squints, lifts the clamp plate and adjusts, after compressing tightly, seals the glue to the chip again, and then has improved the fault-tolerant rate of chip encapsulation.

Preferably, a plurality of component force pressing pieces which are uniformly distributed are fixedly arranged on two sides of the main pressing piece, so that the pressing is tight and reliable, and the stress is uniform.

Preferably, the fixed location sign that is provided with in the fenestrate one side of chip is convenient for treat the chip of encapsulation and is fixed a position, reduces the assembly degree of difficulty.

Preferably, the clamp plate frame body includes stereoplasm base plate, heat conduction silica gel layer and glass fiber net, the inboard fixed heat conduction silica gel layer that is provided with of stereoplasm base plate compresses tightly closely reliably, is rich in elasticity, can not cause the damage to the chip, still possesses good heat conductivility simultaneously.

Preferably, the fixed glass fiber net that is provided with in the junction on stereoplasm base plate and heat conduction silica gel layer can improve the holistic toughness of pressure plate frame, and difficult fracture damages.

Preferably, the chip through hole is a regular quadrangle with a round angle, and is matched with the shape of the chip.

Compared with the prior art, the beneficial effects of the utility model are that: this encapsulation clamp plate simple structure can fix a position the chip fast, and the mode that adopts the buckle formula to compress tightly replaces direct gluing to compress tightly, can put when dislocation or skew at the chip, lifts the clamp plate again and adjusts, compresses tightly errorless back, seals glue the chip again and seals, and then has improved the fault-tolerant rate of chip package, reduces the requirement that compresses tightly technology to the encapsulation, and the staff of being convenient for is operated in the hands fast.

Drawings

FIG. 1 is a schematic structural view of a pressing plate of the present invention;

FIG. 2 is a bottom cross-sectional view of the platen of the present invention;

FIG. 3 is a schematic structural view of the buckling assembly of the present invention;

fig. 4 is a front cross-sectional view of the platen frame of the present invention.

In the figure: 1. a platen frame; 2. a crimping component; 21. performing main tabletting; 22. performing component force tabletting; 23. elastic pressing and buckling; 3. punching a chip; 4. turning over the pressure lever; 5. a hard substrate; 6. positioning the mark; 7. pressing a groove on the pin; 8. pressing a groove at the chip buckling edge; 9. a heat conductive silica gel layer; 10. a glass fiber web.

Detailed Description

The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.

Referring to fig. 1-4, the present invention provides a pressing plate for packaging, comprising a pressing plate frame 1, a chip perforation 3 is disposed at the middle of the outer side of the pressing plate frame 1, a chip edge-buckling indent 8 is disposed at the inner side of the joint of the pressing plate frame 1 and the chip perforation 3, a turning pressing rod 4 is rotatably connected to one side of the pressing plate frame 1, pressing components 2 are fixedly disposed at the two ends of the outer side of the pressing plate frame 1, each of the two pressing components 2 comprises a main pressing plate 21 and an elastic pressing buckle 23, the elastic pressing buckle 23 is fixedly disposed at one end of the main pressing plate 21, a plurality of evenly distributed pin indents 7 are disposed at the periphery of the inner side of the pressing plate frame 1, a plurality of evenly distributed component pressing plates 22 are fixedly disposed at the two sides of the main pressing plate 21, and a positioning mark 6 is fixedly disposed at one side of the chip perforation 3, the pressure plate frame body 1 comprises a hard substrate 5, a heat-conducting silica gel layer 9 and a glass fiber net 10, the heat-conducting silica gel layer 9 is fixedly arranged on the inner side of the hard substrate 5, the glass fiber net 10 is fixedly arranged at the joint of the hard substrate 5 and the heat-conducting silica gel layer 9, a chip perforation 3 is a fillet regular quadrilateral, if the chip pressing position is accurate, the chip is sealed and packaged by using sealant, if the chip pressing position has offset dislocation, elastic pressing buckles 23 can be pressed to separate from a pressing groove, the position of the chip is readjusted, and the chip is pressed again.

When the embodiment of the application is used: the pressure plate frame body 1 is installed on the packaging frame through the overturning pressure rod 4, a pressing groove which is right opposite to the elastic pressing buckle 23 is formed in the packaging frame, the pressure plate frame body 1 is lifted during packaging, a notch of a semiconductor chip is right opposite to the positioning mark 6 and is stably placed in the packaging frame, then the pressure plate frame body 1 is overturned to enable the pressure plate frame body to rotate around the overturning pressure rod 4, the chip buckling edge pressing groove 8 is enabled to be tightly attached to the periphery of the semiconductor chip, the elastic pressing buckle 23 is tightly pressed and buckled into the pressing groove, a wiring pin of the chip after being tightly pressed can be right opposite to the pin pressing groove 7, if the chip pressing position is accurate, the chip is sealed and packaged by using sealant, if the chip pressing position deviates, the elastic pressing buckle 23 can be pressed to be separated from the pressing groove, the position of the chip is readjusted, the chip is tightly pressed again, the packaging pressure plate is simple in structure, the chip can be quickly positioned, a clamping type pressing mode is adopted to replace direct gluing pressing mode, the fault tolerance rate of chip packaging is improved, the requirement on the packaging technology is reduced, and the convenience is brought for workers to quickly operate.

Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.

Claims (6)

1. The utility model provides a clamp plate is used in encapsulation, includes clamp plate frame body (1), its characterized in that: the chip punching die is characterized in that a chip punching hole (3) is formed in the middle of the outer side of the pressing plate frame body (1), a chip buckling edge pressing groove (8) is formed in the inner side of the joint of the pressing plate frame body (1) and the chip punching hole (3), one side of the pressing plate frame body (1) is rotatably connected with a turnover pressing rod (4), buckling assemblies (2) and two buckling assemblies (2) are fixedly arranged at the two ends of the outer side of the pressing plate frame body (1), each buckling assembly (2) comprises a main pressing piece (21) and an elastic pressing buckle (23), the elastic pressing buckle (23) is fixedly arranged at one end of the main pressing piece (21), and a plurality of uniformly distributed pin pressing grooves (7) are formed in the periphery of the inner side of the pressing plate frame body (1).

2. The platen for packaging according to claim 1, wherein: and a plurality of evenly distributed component force pressing sheets (22) are fixedly arranged on both sides of the main pressing sheet (21).

3. The platen for packaging according to claim 1, wherein: and a positioning mark (6) is fixedly arranged on one side of the chip perforation (3).

4. The platen for packaging according to claim 1, wherein: the pressing plate frame body (1) comprises a hard substrate (5), a heat-conducting silica gel layer (9) and a glass fiber net (10), wherein the heat-conducting silica gel layer (9) is fixedly arranged on the inner side of the hard substrate (5).

5. The platen for packaging according to claim 4, wherein: and a glass fiber net (10) is fixedly arranged at the joint of the hard substrate (5) and the heat-conducting silica gel layer (9).

6. The platen for packaging according to claim 1, wherein: the chip through hole (3) is a fillet regular quadrangle.

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