CN218385200U

CN218385200U - Base island embedded packaging structure

Info

Publication number: CN218385200U
Application number: CN202222861436.2U
Authority: CN
Inventors: 马磊
Original assignee: Chengdu Fujin Power Semiconductor Technology Development Co ltd
Current assignee: Chengdu Fujin Power Semiconductor Technology Development Co ltd
Priority date: 2022-10-28
Filing date: 2022-10-28
Publication date: 2023-01-24
Anticipated expiration: 2032-10-28

Abstract

The utility model discloses a base island buries packaging structure belongs to the semiconductor package field, including chip, base island and the first plastic-sealed body, the chip sets up the base island top, the overall structure that chip and base island formed is buried underground in the first plastic-sealed body, the below on base island is equipped with first heat dissipation layer, the top on base island is equipped with the second heat dissipation layer, be equipped with the metal inner leg in the first plastic-sealed body, the metal inner leg pass through the lead wire with the chip is connected. The utility model discloses a preparation heat dissipation channel from top to bottom at the chinampa for bury chinampa packaging structure and effectively dispel the heat, the heat of chip dispels the heat fast through two heat dissipation channels from top to bottom at the chinampa, has very strong practicality.

Description

Base island embedding and packaging structure

Technical Field

The utility model relates to a semiconductor package field especially relates to a packaging structure is buried to base island.

Background

The packaging technology is a technology for packaging a semiconductor integrated circuit chip by using an insulating plastic or ceramic material, and is necessary and important because the chip must be isolated from the outside so as to prevent the chip from being corroded by impurities in the air and causing electrical performance degradation, but the chip generates heat in the using process, and how to discharge the heat becomes a difficult problem.

The traditional heat dissipation mode of the chip packaging form mainly adopts a metal base island below a chip as a heat dissipation conduction tool or way, the metal base island is in the traditional packaging form, in order to pursue the reliability and safety of a packaging body, the metal base island is almost buried in the packaging body, the metal base island is fixed or supported by thin supporting rods at the left and right or four corners, and the heat absorbed by the metal base island from the chip can not be quickly conducted out from the thin supporting rods due to the characteristics of the thin supporting rods, so the heat of the chip can not be quickly conducted to the outside of the packaging body, and the service life of the chip can be quickly aged, even burnt or burnt.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to overcome the heat dissipation problem of the embedded type encapsulation of base island among the prior art, a base island buries packaging structure is provided.

The purpose of the utility model is realized through the following technical scheme:

the island embedded packaging structure comprises a chip, an island and a first plastic package body, wherein the chip is arranged above the island, the integrated structure formed by the chip and the island is embedded in the first plastic package body, a first heat dissipation layer is arranged below the island, a second heat dissipation layer is arranged above the chip, a metal inner pin is arranged in the first plastic package body, and the metal inner pin is connected with the chip through a lead.

In one example, a base island embedding packaging structure is provided, wherein a third plastic packaging body is connected above a first plastic packaging body, and a second plastic packaging body is connected below the first plastic packaging body.

In one example, the first heat dissipation layer includes a plurality of first heat dissipation channels, and the first heat dissipation channels penetrate through the lower half part of the first plastic package body and are connected with the bottom of the base island.

In one example, the second heat dissipation layer comprises a plurality of second heat dissipation channels, and the second heat dissipation channels penetrate through the upper half part of the first plastic package body and are connected with the top of the base island.

In one example, the lower end of the first heat dissipation layer is horizontal to the lower end of the second plastic package body.

In one example, the upper end of the second heat dissipation layer is horizontal to the upper end of the third plastic package body.

In one example, the first heat dissipation channel is a round hole, a square hole or an elliptical hole.

In one example, the second heat dissipation channel is a round hole, a square hole or an elliptical hole.

In one example, the metal inner pins are respectively arranged in the first plastic packaging bodies on two sides of the chip.

In one example, a base island embedded package structure, an adhesive layer is disposed between a chip and a base island.

It should be further noted that the technical features corresponding to the above options can be combined with each other or replaced to form a new technical solution without conflict.

Compared with the prior art, the utility model discloses beneficial effect is:

the utility model discloses a incite somebody to action the overall structure that chip and base island formed buries underground in the first plastic-sealed body, form the base island and bury the type encapsulation, be in simultaneously the below of base island is equipped with first heat dissipation layer, is equipped with the second heat dissipation layer in the top of base island for all there is heat dissipation channel from top to bottom of base island, makes to bury base island packaging structure and effectively dispel the heat, and the heat of chip carries out quick heat dissipation through two heat dissipation channels from top to bottom in the base island, has improved the radiating efficiency greatly, prolongs the life-span of chip, has very strong practicality.

Drawings

Fig. 1 is a schematic diagram of a base island embedded package structure according to an embodiment of the present invention;

fig. 2 is a schematic view of a channel structure of a first heat dissipation layer according to an embodiment of the present invention;

fig. 3 is a schematic structural diagram of a second heat dissipation layer according to an embodiment of the present invention.

In the figure: 1. a chip; 2. a base island; 3. a first plastic package body; 4. a first heat dissipation layer; 5. a second heat dissipation layer; 6. a metal inner leg; 8. a third plastic package body; 7. a second plastic package body; 41. a first heat dissipation channel; 51. a second heat dissipation channel; 9. and (6) bonding layers.

Detailed Description

The technical solution of the present invention will be described clearly and completely with reference to the accompanying drawings, and obviously, the described embodiments are some, but not all embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it should be noted that the directions or positional relationships indicated by "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like are the directions or positional relationships indicated on the basis of the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element indicated must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it should be noted that, unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood as a specific case by those skilled in the art.

Furthermore, the technical features mentioned in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

The utility model discloses mainly all set up heat radiation structure through the top and bottom at base island 2 for bury base island packaging structure and effectively dispel the heat, the heat of chip dispels the heat fast through two heat dissipation channel about the base island, has improved the radiating efficiency greatly, prolongs the life-span of chip, has very strong practicality.

In an exemplary embodiment, a base island embedded package structure is provided, as shown in fig. 1, the package structure includes a chip 1, a base island 2, and a first plastic package body 3, the chip 1 is disposed above the base island 2, an integrated structure formed by the chip 1 and the base island 2 is embedded in the first plastic package body 3, a first heat dissipation layer 4 is disposed below the base island 2, a second heat dissipation layer 5 is disposed above the chip 1, a metal inner pin 6 is disposed in the first plastic package body 3, and the metal inner pin 6 is connected to the chip 1 through a lead 61.

Specifically, the chip 1 is fixed on the base island 2 by means of bonding and the like, the first plastic package body 3 is wrapped on the chip 1, and the second heat dissipation layer 5 is wrapped on the first plastic package body 3 on the chip 1, so that the chip 1 and the base island 2 form an integral structure which is embedded in the first plastic package body 3, the packaging reliability and the packaging safety are guaranteed, the chip is protected by the wrapping effect of the second heat dissipation layer 5, and the heat dissipation effect of the chip is guaranteed. Meanwhile, the first heat dissipation layer 4 is arranged in the first plastic package body 3 below the base island 2, so that heat generated by the chip 1 can be dissipated from the lower portion of the base island 2, and the heat dissipation efficiency is greatly improved.

In another example, in a base island embedded package structure, a third plastic package body 8 is connected above the first plastic package body 3, and a second plastic package body 7 is connected below the first plastic package body 3, so that the safety and reliability of the package structure are further ensured.

In another example, in a base-embedded package structure, as shown in the bottom view of fig. 2, the first heat dissipation layer 4 includes a plurality of first heat dissipation channels 41, and the first heat dissipation channels 41 penetrate through the lower half of the first molding compound 3 and are connected to the bottom of the base 2. The main body of the first heat dissipation layer 4 is square and has other structures, and then a plurality of first heat dissipation channels 41 penetrating through the first plastic package body 3 are formed in the main body layer. The number of the first heat dissipation channels 41 may be selected according to actual requirements, and is not limited herein.

Further, as shown in fig. 3, the second heat dissipation layer 5 includes a plurality of second heat dissipation channels 51, and the second heat dissipation channels 51 penetrate through the upper half portion of the first plastic package body 3 and are connected to the top of the base island 2. Similarly, the main body of the second heat dissipation layer 5 is square and has other structures, the main bodies of the second heat dissipation layer 5 are symmetrically distributed on two sides of the chip 1, and then a plurality of second heat dissipation channels 51 penetrating through the first plastic package body 3 are formed in the main body layer. The second heat dissipation channel 51 is formed to cover the second heat dissipation layers 5 on two sides of the upper half of the first plastic package body 3. The number of the second heat dissipation channels 51 can be selected according to actual requirements, and is not limited herein.

Further, the first heat sink layer 4 and the second heat sink layer 5 are preferably copper layers.

In another example, in a base island embedded package structure, the lower end of the first heat dissipation layer 4 is horizontal to the lower end of the second molding compound 7. The upper end of the second heat dissipation layer 5 is horizontal to the upper end of the third plastic package body 8, so that the thin design of packaging is facilitated, and the miniaturization and stability of the whole packaging are guaranteed.

Further, the first heat dissipation channel 41 is a circular hole, a square hole or an elliptical hole, and the second heat dissipation channel 51 is a circular hole, a square hole or an elliptical hole. The shapes and sizes of the first heat dissipation channel 41 and the second heat dissipation channel 51 can be selected according to actual requirements, and are not limited herein.

In another example, in a base-island embedded package structure, the metal inner pins 6 are respectively arranged in the first plastic package body 3 at two sides of the chip 1. An adhesive layer 9 is arranged between the chip 1 and the base island 2, and the chip 1 and the base island 2 are fixedly connected through the adhesive layer 9.

The above detailed description is the detailed description of the present invention, and it can not be considered that the detailed description of the present invention is limited to these descriptions, and to the ordinary skilled person in the art to which the present invention belongs, without departing from the concept of the present invention, a plurality of simple deductions and replacements can be made, which should be regarded as belonging to the protection scope of the present invention.

Claims

1. The utility model provides a packaging structure is buried to island, includes chip (1), island (2) and the first plastic-sealed body (3), its characterized in that, chip (1) sets up island (2) top, the overall structure that chip (1) and island (2) formed is buried underground in the first plastic-sealed body (3), the below of island (2) is equipped with first heat dissipation layer (4), the top of chip (1) is equipped with second heat dissipation layer (5), be equipped with metal inner foot (6) in the first plastic-sealed body (3), metal inner foot (6) through lead wire (61) with chip (1) are connected.

2. The island-embedded packaging structure according to claim 1, wherein a third plastic package body (8) is connected above the first plastic package body (3), and a second plastic package body (7) is connected below the first plastic package body (3).

3. The island-in-package structure according to claim 2, wherein the first heat dissipation layer (4) comprises a plurality of first heat dissipation channels (41), and the first heat dissipation channels (41) extend through the lower half of the first molding compound (3) and are connected to the bottom of the island (2).

4. The island-in-package structure according to claim 2, wherein the second heat dissipation layer (5) comprises a plurality of second heat dissipation channels (51), and the second heat dissipation channels (51) are connected to the top of the island (2) through the upper half of the first molding compound (3).

5. The island-in-package structure according to claim 3, wherein the lower end of the first heat dissipation layer (4) is horizontal to the lower end of the second molding compound (7).

6. The island-in-package structure according to claim 4, wherein the upper end of the second heat dissipation layer (5) is horizontal to the upper end of the third molding compound (8).

7. The island-in-package structure according to claim 3, wherein the first heat dissipation channel (41) is a circular hole, a square hole or an elliptical hole.

8. The island-in-package structure according to claim 4, wherein the second heat dissipation channel (51) is a circular hole, a square hole or an elliptical hole.

9. The island-in-package structure according to claim 1, wherein the metal inner leads (6) are respectively disposed in the first molding compound (3) on both sides of the chip (1).

10. The island-embedded packaging structure according to claim 1, wherein an adhesive layer (9) is disposed between the chip (1) and the island (2).