CN218352985U - Heat dissipation structure, memory assembly and electronic equipment - Google Patents

Abstract

The application provides a heat dissipation structure, a memory component and an electronic device. The heat dissipation structure comprises a plurality of first heat conduction pieces, a plurality of second heat conduction pieces and a plurality of heat dissipation pieces. A plurality of first heat-conducting pieces are distributed at intervals along a first direction, an accommodating space is limited between two adjacent first heat-conducting pieces, and the accommodating space is used for accommodating the heating piece. The second heat-conducting piece is arranged on at least part of the first heat-conducting piece and used for locking the heating piece, and the first heat-conducting piece is used for contacting the heating piece and conducting heat of the heating piece to the second heat-conducting piece. The heat dissipation piece is arranged on one side, deviating from the first heat conduction pieces, of the second heat conduction piece and used for dissipating heat conducted to the second heat conduction piece. The beneficial effects of this application are that first heat-conducting piece can be with the heat conduction to the second heat-conducting piece of the piece that generates heat, and the second heat-conducting piece can be with heat conduction to the heat-dissipating piece in order to realize the heat derivation of the piece that generates heat, reduces the temperature of the piece that generates heat, can also be fixed with the locking of the piece that generates heat, avoids the piece that generates heat to rock.

Description

Heat dissipation structure, memory assembly and electronic equipment

Technical Field

The present application relates to the field of electronic device technologies, and in particular, to a heat dissipation structure, a memory module, and an electronic device.

Background

The known electronic equipment chassis is internally provided with a plurality of electronic elements, the heat generated by each electronic element in the operation process is large, a plurality of electronic elements are required to be arranged and stacked, the space in the chassis is limited, the heat dissipation spaces are mutually blocked, and the known heat dissipation structure cannot take into consideration the arrangement and fixation of the electronic elements and achieve a good heat dissipation effect.

SUMMERY OF THE UTILITY MODEL

The application provides a heat dissipation structure, a memory component and an electronic device, which aim to solve the technical problems.

The embodiment of the application is realized as follows:

in a first aspect, the present application provides a heat dissipation structure, including: the heat-conducting device comprises a plurality of first heat-conducting pieces, a plurality of second heat-conducting pieces and a plurality of heat-conducting pieces, wherein the first heat-conducting pieces are distributed at intervals along a first direction, an accommodating space is defined between every two adjacent first heat-conducting pieces, and the accommodating space is used for accommodating a heating piece; a second heat conduction member provided to at least a part of the first heat conduction member and locking the heat generating member, the first heat conduction member being adapted to contact the heat generating member and conduct heat of the heat generating member to the second heat conduction member; the heat dissipation piece is arranged on one side, away from the plurality of first heat conduction pieces, of the second heat conduction piece and used for dissipating heat conducted to the second heat conduction piece.

A plurality of accommodation spaces that distribute along first direction are injectd to a plurality of first heat-conducting pieces, and the back in the accommodation space is located to heating elements such as DRAM, memory, generate heat the piece and can transmit the heat to first heat-conducting piece in the both sides homoenergetic of first direction. The second heat conduction piece is arranged on at least part of the first heat conduction pieces, so that the second heat conduction piece can receive heat of the heating pieces received by the first heat conduction pieces, the first heat conduction pieces can also play a role in compressing and locking at least part of the first heat conduction pieces, and the plurality of heating pieces are locked on the case through the plurality of first heat conduction pieces, so that when the case vibrates, the plurality of heating pieces cannot fall off, and the stability of the heating pieces connected with other electronic elements is ensured. The heat dissipation piece can dissipate heat conducted to the second heat conduction piece, so that heat of all the heating pieces can be conducted to the outer side of the case to dissipate heat, and the temperature of the heating pieces is reduced.

Therefore, the first heat-conducting piece and the second heat-conducting piece of the embodiment of the application both play a role in conducting heat and fixing the heating piece, and compared with the known simple heat-radiating structures such as a heat-radiating fin or a fin radiator, the heat-radiating fin has higher integration level and faster heat-radiating effect, and the arrangement fixing requirements of the heating pieces are effectively taken into consideration.

In one possible embodiment: the heat conducting parts comprise bearing heat conducting parts, cover heat conducting parts and at least one interlayer heat conducting part, the bearing heat conducting parts comprise bearing parts, the cover heat conducting parts comprise cover parts, the interlayer heat conducting parts comprise cover parts and bearing parts, the bearing heat conducting parts and the cover heat conducting parts are distributed at intervals in a first direction, the interlayer heat conducting parts are distributed at intervals in the first direction between the bearing heat conducting parts and the cover heat conducting parts, the bearing parts of the first heat conducting parts and the first heat conducting parts of two adjacent first heat conducting parts jointly limit the accommodating space, and the second heat conducting parts are at least arranged on the cover parts of the interlayer heat conducting parts.

In one possible embodiment: the cover is provided with heat conducting pieces, the cover-arranged parts of all the interlayer heat conducting pieces are distributed at intervals along the second direction, and along the first direction deviating from the bearing heat conducting pieces, the distance between the cover-arranged parts and the heat radiating pieces in the second direction is gradually reduced, and an included angle is formed between the first direction and the second direction.

In one possible embodiment: the second heat-conducting member is provided at least in the covering portion of all the interlayer heat-conducting members.

In one possible embodiment: the heat sink includes: the heat dissipation plate, one side of the said heat dissipation plate is connected with said second heat-conducting member; and the plurality of radiating fins are arranged on one side of the radiating plate, which deviates from the second heat conducting piece, at intervals.

In one possible embodiment: the heat dissipation structure further comprises a third heat conduction piece, one end of the second heat conduction piece is connected with one side wall of the third heat conduction piece, the other side wall of the third heat conduction piece is attached to the heat dissipation piece, and the third heat conduction piece is provided with a first communication hole for fixing the third heat conduction piece.

In one possible embodiment: and a second communication hole is formed in one end, away from the third heat-conducting piece, of the second heat-conducting piece and used for fixing the second heat-conducting piece.

In one possible embodiment: the heat radiation structure further comprises a handle, and the handle is rotatably arranged on one side, away from the first heat conduction piece, of the second heat conduction piece.

In a second aspect, the present application provides a memory assembly comprising: the heat dissipation structure described above; the heating device comprises a plurality of heating pieces, wherein each heating piece can be arranged in one accommodating space in a drawing mode.

In a third aspect, the present application provides an electronic device, comprising: a housing defining a receiving slot; the circuit board is arranged on the bottom wall of the accommodating groove; in the memory module, the first heat-conducting element of the heat-dissipating structure is disposed on the circuit board, the second heat-conducting element of the heat-dissipating structure is detachably connected to the bottom wall of the accommodating groove, the second heat-conducting element is disposed on the circuit board, the heat-dissipating member of the heat-dissipating structure is disposed on the outer sidewall of the housing, and the second heat-conducting element penetrates through the outer sidewall of the housing and is connected to the heat-dissipating member.

The heat radiation structure, the memory component and the computer device are in contact with the memory component through the heat conduction pieces, heat generated by the memory component is conducted to the heat radiation pieces to be radiated, heat conduction of the memory component is achieved, the temperature of the memory component can be effectively reduced, the plurality of heating pieces are locked on the case through the plurality of first heat conduction pieces, and the stability of the heating pieces and other elements is guaranteed.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained from the drawings without inventive effort.

Fig. 1 is a schematic structural diagram of a heat dissipation structure according to an embodiment of the present application;

FIG. 2 is a schematic diagram of a memory device according to an embodiment of the present application;

FIG. 3 is a second schematic diagram of a memory device according to an embodiment of the present application;

FIG. 4 is a schematic view of the first and second heat-conducting members according to an embodiment of the present application;

fig. 5 is a schematic structural diagram of an electronic device according to an embodiment of the present application;

fig. 6 is a schematic partial structure diagram of an electronic device according to an embodiment of the present application.

Description of the main element symbols:

heat dissipation structure 100

First heat-conducting member 10

Load-bearing heat-conducting member 11

Covered with a heat-conducting member 12

Interlayer heat-conducting member 13

Carrying part 14

Cover part 15

Accommodating space 20

Second heat-conducting member 30

Second communication hole 31

Thermally conductive cover plate 32

Heat sink 40

Heat dissipation plate 41

Heat dissipating fin 42

Third heat-conducting member 50

First through hole 51

First plate 52

Second plate 53

First bending plate 54

Second bending plate 55

Handle 60

Heat conducting structure 70

Locking member 80

Mounting member 90

Heating element 200

First direction L

Second direction M

Memory assembly 300

Case 400

Storage tank 401

Post 402

Circuit board 500

Electronic device 600

The following detailed description will further illustrate the present application in conjunction with the above-described figures.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only some embodiments of the present application, and not all embodiments.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. When an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the term "or/and" includes any and all combinations of one or more of the associated listed items.

Some embodiments of the present application are described in detail. In the following embodiments, features of the embodiments may be combined with each other without conflict.

Examples

Referring to fig. 1 and 2, the present embodiment provides a heat dissipation structure 100 including a plurality of first heat conduction members 10, second heat conduction members 30, and a heat dissipation member 40. The plurality of first heat conduction members 10 are distributed at intervals along the first direction L, an accommodating space 20 is defined between two adjacent first heat conduction members 10, and the accommodating space 20 is used for accommodating the heat generating member 200. The second heat transfer member 30 is disposed at least in part of the first heat transfer member 10 and serves to lock the heat generating member 200, and the first heat transfer member 10 serves to contact the heat generating member 200 and transfer heat of the heat generating member 200 to the second heat transfer member 30. The heat dissipation member 40 is disposed on a side of the second heat conduction member 30 away from the plurality of first heat conduction members 10, and the heat dissipation member 40 is configured to dissipate heat conducted to the second heat conduction member 30.

The heat dissipation structure 100 of the present embodiment is mounted in the housing 400 of the chassis.

A plurality of accommodating spaces 20 distributed along the first direction L are defined by the first heat-conducting members 10, and after the heat-generating members 200 such as memory bars and memories are arranged in the accommodating spaces 20, the heat-generating members 200 can transfer heat to the first heat-conducting members 10 on both sides of the first direction L. The second heat conduction member 30 is arranged on at least part of the first heat conduction members 10, so that the second heat conduction member 30 can receive heat of the heating members 200 received by the first heat conduction members 10, can also play a role in compressing and locking at least part of the first heat conduction members 10, and locks the plurality of heating members 200 on the case through the plurality of first heat conduction members 10, so that when the case vibrates, the plurality of heating members 200 cannot fall off, and the stability of connection of the heating members 200 and other electronic elements is ensured. The heat sink 40 can dissipate heat conducted to the second heat conduction member 30, that is, all heat generated by the heat generating member 200 is conducted to the outside of the case to dissipate heat, thereby reducing the temperature of the heat generating member 200.

Therefore, the first heat conducting member 10 and the second heat conducting member 30 of the embodiment of the present application both have a heat conducting effect and also have an effect of fixing the heat generating member 200, and have a higher integration level and a faster heat dissipation effect compared to a simple heat dissipation structure such as a known heat dissipation fin or a fin heat sink, and the like, and also effectively meet the requirement of arranging and fixing the plurality of heat generating members 200.

In some embodiments, referring to fig. 2 and 3, the plurality of first thermal conductive members 10 includes a carrier thermal conductive member 11, a cover thermal conductive member 12, and at least one interlayer thermal conductive member 13, the carrier thermal conductive member 11 includes a carrier portion 14, the cover thermal conductive member 12 includes a cover portion 15, the interlayer thermal conductive member 13 includes a cover portion 15 and a carrier portion 14, the carrier thermal conductive member 11 and the cover thermal conductive member 12 are spaced apart in a first direction L, the plurality of interlayer thermal conductive members 13 are spaced apart in the first direction L between the carrier thermal conductive member 11 and the cover thermal conductive member 12, the carrier portion 14 of one first thermal conductive member 10 and another first thermal conductive member 10 of two adjacent first thermal conductive members 10 together define an accommodating space 20, and the second thermal conductive member 30 is disposed at least in the cover portion 15 of the plurality of interlayer thermal conductive members 13.

In this embodiment, the heat conducting member 11 may not only define the accommodating space 20 with the bottom wall of the case, but also directly locate the bottom wall of the case, the accommodating space 20 is defined by the one side of the heat conducting member 12 covered with the interlayer heat conducting member 13, the other side of the heat conducting member 12 covered with the cover may be attached to the second heat conducting member 30, or may be used to bear the heat generating member 200, and the second heat conducting member 30 may directly contact with the heat generating member 200 or contact with the heat conducting paste, therefore, the arrangement of the plurality of first heat conducting members 10 and the first heat conducting members 10 fixed by the second heat conducting member 30 in this embodiment may be determined according to the actual heat dissipation requirement, and this embodiment is not specifically defined.

In the embodiment of the present application, the covering portion 15 of the bearing heat-conducting member 11 and the interlayer heat-conducting member 13 defines the accommodating space 20, and the bearing heat-conducting member 11 may be directly disposed in the case, or may define the accommodating space 20 with the case; the covering heat conducting member 12 may only include the covering portion 15, at this time, the second heat conducting member 30 is at least disposed on the covering heat conducting member 12, the covering heat conducting member 12 may further include the covering portion 15 and the carrying portion 14, and the second heat conducting member 30 is at least simultaneously disposed on the covering portion 15 of the covering heat conducting member 12 and the heat generating member 200 disposed on the carrying portion 14.

It is understood that the second heat-conducting member 30 is disposed at least on the covering portion 15 of the plurality of interlayer heat-conducting members 13, so that the second heat-conducting member 30 can press all the heat-generating members 200 in the accommodating space 20 by pressing the covering portions 15 of the plurality of interlayer heat-conducting members 13. In other embodiments of the present application, depending on the specific arrangement of the plurality of interlayer heat-conducting members 13, the second heat-conducting member 30 may also be disposed at the bearing portion 14 of a part of the interlayer heat-conducting members 13, and may support and fix the heat-generating member 200 on the bearing portion 14.

In some embodiments, referring to fig. 1 to 2, the covering portions 15 of the covering heat-conducting members 12 and all the interlayer heat-conducting members 13 are distributed at intervals along the second direction M, and in a first direction L away from the load-bearing heat-conducting member 11, the plurality of covering portions 15 and the heat dissipation member 40 are gradually decreased in the second direction M, and an included angle is formed between the first direction L and the second direction M.

It can be understood that, through the above-mentioned structural arrangement, the plurality of first heat-conducting members 10 including the covering portion 15 and the bearing portion 14 are distributed in a trapezoidal manner, so that the distribution manner of the plurality of first heat-conducting members 10 is simplified, the second heat-conducting members 30 can also be sequentially covered on the plurality of interlayer heat-conducting members 13 in a step-like manner, and the fixing stability of the second heat-conducting members 30 to the plurality of heat-generating members 200 is improved.

In the embodiment of the present application, the first direction L is disposed substantially perpendicular to the second direction M. In other embodiments, the first direction L and the second direction M may be set at other angles, so as to meet the actual design requirement.

Specifically, in the present embodiment, the lid-provided thermal conductive member 12 and the lid-provided portion 15 of one first thermal conductive member 10 among the adjacent two first thermal conductive members 10 among all the interlayer thermal conductive members 13 are disposed opposite to the carrier portion 14 of the other first thermal conductive member 10 in the first direction L.

In other embodiments of the present application, referring to fig. 3, the covering portions 15 of the covering heat-conducting members 12 and all the interlayer heat-conducting members 13 may not be distributed at intervals in the second direction M, and the heat of all the first heat-conducting members 10 may be conducted by bending the second heat-conducting member 30.

In some embodiments, the second heat-conducting member 30 is provided at least in the covering portion 15 of all the interlayer heat-conducting members 13.

It can be understood that, by the above-mentioned structure, the heat generating members 200 in all the accommodating spaces 20 can transfer heat to the covering portion 15 of at least all the interlayer heat conducting members 13, so as to ensure that the heat of all the heat generating members 200 can be transferred to the second heat conducting member 30, thereby better ensuring the heat dissipation effect of all the heat generating members 200. In addition, in the present embodiment, the second heat conducting member 30 may be disposed on the covering heat conducting member 12, or may be disposed on the heat generating member 200 disposed on the covering heat conducting member 12.

In addition, in other embodiments of the present application, referring to fig. 3, the second heat conduction member 30 may be further provided on the bearing portion 14 of a part of the interlayer heat conduction member 13.

In some embodiments, referring to fig. 2, the second heat-conducting member 30 is provided to all the covering portions 15. It is understood that, in the present embodiment, since the second heat conduction member 30 is disposed on all the covering portions 15, the heat of the covering heat conduction member 12 can be directly conducted to the second heat conduction member 30, thereby further improving the heat dissipation efficiency of the heat dissipation structure 100.

In the embodiment of the application, referring to fig. 2, the covering portion 15 and the carrying portion 14 may be separately arranged, referring to fig. 3, the covering portion 15 and the carrying portion 14 may also be integrally connected, and the distribution of the covering portion 15 and the carrying portion 14 may be determined according to actual requirements; the covering portion 15 and the bearing portion 14 can be both made of heat conducting sheets, and the number of the heat conducting sheets included in the covering portion 15 and the bearing portion 14 can be determined according to actual requirements, which is not specifically limited in the embodiments of the present application.

In some embodiments, referring to fig. 1, heat sink 40 includes a heat sink plate 41 and a plurality of heat sink fins 42. One side of the heat dissipation plate 41 is connected to the second heat conductive member 30. A plurality of heat dissipation fins 42 are provided at intervals on a side of the heat dissipation plate 41 facing away from the second heat conductive member 30.

The heat dissipation plate 41 can conduct heat absorbed by the second heat conduction member 30 from the heat generation member 200 and the first heat conduction member 10 to the plurality of heat dissipation fins 42, the plurality of heat dissipation fins 42 can increase the heat dissipation area, and an airflow channel can be formed between two adjacent heat dissipation fins 42, so that the heat exchange efficiency of the plurality of heat dissipation fins 42 and air is further improved, the heat conduction efficiency of the heat generation member 200 is further improved, and the heat dissipation effect of the heat dissipation structure 100 is improved.

In some embodiments, referring to fig. 1, the heat dissipation structure 100 further includes a third heat conduction member 50, one end of the second heat conduction member 30 is connected to one sidewall of the third heat conduction member 50, the other sidewall of the third heat conduction member 50 is attached to the heat dissipation member 40, and the third heat conduction member 50 is provided with a first through hole 51 for fixing the third heat conduction member 50.

The third heat-conducting member 50 can improve the fixing reliability of the end portion of the second heat-conducting member 30, so that the second heat-conducting member 30 can stably and reliably fix the heat-generating members 200 disposed in the plurality of accommodating spaces 20, and the heat-generating members are less prone to generating small displacement when being vibrated. The first communication hole 51 can be inserted into the fastening structure to fix the third heat conduction member 50, thereby fixing the installation position of the heat dissipation structure 100 at one end of the second heat conduction member 30.

In some embodiments, referring to fig. 4, an end of the second heat-conducting member 30 facing away from the third heat-conducting member 50 is provided with a second communication hole 31 for fixing the second heat-conducting member 30. The fixing of the other end of the second heat conduction member 30 can be realized by inserting the fastening structure into the second communication hole 31, and the fixing of the front end of the third heat conduction member 50 is matched, so that the heat dissipation structure 100 can simultaneously lock and fix the heating member 200.

In some embodiments, referring to fig. 4, the second heat conducting element 30 includes a plurality of heat conducting cover plates 32 which are sequentially connected and distributed in a step-like manner along the first direction L and the second direction M, the third heat conducting element 50 includes a first plate body 52 and a second plate body 53, the first plate body 52 and the second plate body 53 are connected in a bending manner, the first plate body 52 is attached to the heat sink 40, one heat conducting cover plate 32 of the second heat conducting element 30 is attached to the second plate body 53, two ends of the second plate body 53 are respectively provided with a first bending plate 54 which is bent along the first direction L, the other end of the first bending plate 54 is provided with a second bending plate 55, and the second bending plate 55 is attached to the first plate body 52. The first communication hole 51 is provided in the first plate 52.

In some embodiments, referring to fig. 1, the heat dissipating structure 100 further includes a heat conducting structure 70, the heat conducting structure 70 is disposed between the second heat conducting member 30 and the third heat conducting structure 70, and the heat conducting structure 70 can improve the efficiency of the second heat conducting member 30 conducting heat to the third heat conducting member 50, so as to further improve the heat dissipating efficiency of the heat dissipating structure 100.

In some embodiments, referring to fig. 3, a heat conducting structure 70 is disposed between the third heat conducting element 50 and the heat dissipating element 40, and the heat conducting structure 70 can improve the efficiency of the third heat conducting element 50 conducting heat to the heat dissipating element 40, so as to further improve the heat dissipating efficiency of the heat dissipating structure 100.

Specifically, the heat conductive structure 70 includes a heat conductive sheet or pad.

In some embodiments, referring to fig. 1, the heat dissipation structure 100 further includes a handle 60, and the handle 60 is rotatably disposed on a side of the second heat conduction member 30 facing away from the first heat conduction member 10. The handle 60 can improve the convenience of assembling and disassembling the second heat conducting member 30, so as to improve the convenience of assembling and disassembling the heat dissipating structure 100 in the chassis.

In a second aspect, referring to fig. 2 and 3, the present application provides a memory assembly 300 including the heat dissipation structure 100 and the plurality of heat generating members 200 described above. Each of the heat generating members 200 is drawably disposed in one of the accommodating spaces 20.

The electronic device 600 includes the heat dissipation structure 100 of any of the embodiments, so that the electronic device has the beneficial effects of the heat dissipation structure 100 of any of the embodiments, which are not described herein again. The heating element 200 in the embodiment of the present application may be a memory such as a hard disk, a memory bank, or other electronic components that generate heat during operation.

In some embodiments, referring to fig. 2 and 3, the memory assembly 300 further includes a plurality of mounting members 90, each mounting member 90 is disposed at one side of one accommodating space 20 of the heat dissipating structure 100, and each heat generating member 200 is disposed in one accommodating space 20 and mounted in one mounting member 90.

In a third aspect, referring to fig. 5 and 6, the present application provides an electronic device 600 including a housing 400, a circuit board 500, and the memory assembly 300 described above. The housing 400 defines a receiving groove 401. The circuit board 500 is disposed on the bottom wall of the receiving groove 401. The first heat conduction member 10 of the heat dissipation structure 100 is disposed on the circuit board 500, the second heat conduction member 30 of the heat dissipation structure 100 is detachably connected to the bottom wall of the receiving groove 401, the second heat conduction member 30 is disposed on the circuit board 500, the heat dissipation member 40 of the heat dissipation structure 100 is disposed on the outer side wall of the housing 400, and the second heat conduction member 30 penetrates through the outer side wall of the housing 400 and is connected to the heat dissipation member 40.

The electronic device 600 includes the memory component 300 and the heat dissipation structure 100 of any of the above embodiments, so that the electronic device has the beneficial effects of the heat dissipation structure 100 of any of the above embodiments, which are not described herein again.

In some embodiments, referring to fig. 1, a heat conducting structure 70 is disposed between the heat sink 40 of the heat dissipating structure 100 and the bottom wall of the receiving groove 401 to improve the efficiency of the housing 400 in conducting heat to the heat sink 40.

In some embodiments, referring to fig. 6, the heat dissipating structure 100 further includes a locking member 80, and the locking member 80 is disposed in each of the first communicating hole 51 and the second communicating hole 31 to lock the second heat conducting member 30 and the third heat conducting member 50 to the housing 400.

In some embodiments, referring to fig. 1, the bottom wall of the casing 400 is provided with a support post 402, the circuit board 500 is provided on the support post 402, and the locking member 80 is inserted through the second heat conducting member 30 and connected to the support post 402, so as to press the plurality of heat generating members 200 against the casing 400.

Although the present application has been described in detail with reference to the preferred embodiments, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted without departing from the spirit and scope of the present application.

Claims (10)

1. A heat dissipation structure, comprising:

the heat-conducting device comprises a plurality of first heat-conducting pieces, a plurality of second heat-conducting pieces and a plurality of heat-conducting pieces, wherein the first heat-conducting pieces are distributed at intervals along a first direction, an accommodating space is defined between every two adjacent first heat-conducting pieces, and the accommodating space is used for accommodating a heating piece;

a second heat conduction member provided to at least a part of the first heat conduction member and locking the heat generating member, the first heat conduction member being adapted to contact the heat generating member and conduct heat of the heat generating member to the second heat conduction member;

the heat dissipation member is arranged on one side, away from the plurality of first heat conduction members, of the second heat conduction member and used for dissipating heat conducted to the second heat conduction member.

2. The heat dissipation structure according to claim 1, wherein: a plurality of first heat-conducting piece is including bearing heat-conducting piece, lid and establishing heat-conducting piece and at least one layer heat-conducting piece, it includes the load-bearing part to bear heat-conducting piece, the lid is established heat-conducting piece and is established the part including the lid, heat-conducting piece includes between the layer the lid establish the part with the load-bearing part, bear heat-conducting piece with the lid is established heat-conducting piece and is at first direction interval distribution, and is a plurality of heat-conducting piece along first direction interval distribution between bear heat-conducting piece and the lid is established between the heat-conducting piece, two adjacent in the first heat-conducting piece one the load-bearing part of first heat-conducting piece and another first heat-conducting piece prescribe a limit jointly the accommodation space, the second heat-conducting piece is located a plurality ofly at least the layer heat-conducting piece between the lid establish the part.

3. The heat dissipation structure according to claim 2, wherein: the cover is provided with heat conducting pieces, the cover-arranged parts of all the interlayer heat conducting pieces are distributed at intervals along the second direction, and along the first direction deviating from the bearing heat conducting pieces, the distance between the cover-arranged parts and the heat radiating pieces in the second direction is gradually reduced, and an included angle is formed between the first direction and the second direction.

4. The heat dissipation structure according to claim 2, wherein: the second heat-conducting member is provided at least in the covering portion of all the interlayer heat-conducting members.

5. The heat dissipation structure according to claim 1, wherein: the heat sink includes:

the heat dissipation plate, one side of the said heat dissipation plate is connected with said second heat-conducting element;

and the plurality of radiating fins are arranged on one side of the radiating plate, which deviates from the second heat conducting piece, at intervals.

6. The heat dissipation structure according to claim 1, wherein: the heat dissipation structure further comprises a third heat conduction piece, one end of the second heat conduction piece is connected with one side wall of the third heat conduction piece, the other side wall of the third heat conduction piece is attached to the heat dissipation piece, and the third heat conduction piece is provided with a first connecting hole for fixing the third heat conduction piece.

7. The heat dissipation structure of claim 6, wherein: and a second communication hole is formed in one end, away from the third heat-conducting piece, of the second heat-conducting piece and used for fixing the second heat-conducting piece.

8. The heat dissipation structure of claim 1, wherein: the heat radiation structure further comprises a handle, and the handle is rotatably arranged on one side, away from the first heat conduction piece, of the second heat conduction piece.

9. A memory assembly, comprising:

the heat dissipation structure of any one of claims 1-8;

the heating device comprises a plurality of heating pieces, wherein each heating piece can be arranged in one accommodating space in a drawing mode.

10. An electronic device, comprising:

a housing defining a receiving slot;

the circuit board is arranged on the bottom wall of the accommodating groove;

the memory module of claim 9, wherein the first thermal conductive element of the heat dissipation structure is disposed on the circuit board, the second thermal conductive element of the heat dissipation structure is detachably connected to a bottom wall of the receiving groove, the second thermal conductive element is disposed on the circuit board, the heat dissipation member of the heat dissipation structure is disposed on an outer sidewall of the housing, and the second thermal conductive element penetrates through the outer sidewall of the housing to be connected to the heat dissipation member.

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