CN218336934U - Radiator and induction cooker - Google Patents
Radiator and induction cooker Download PDFInfo
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- CN218336934U CN218336934U CN202222280875.4U CN202222280875U CN218336934U CN 218336934 U CN218336934 U CN 218336934U CN 202222280875 U CN202222280875 U CN 202222280875U CN 218336934 U CN218336934 U CN 218336934U
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Abstract
The utility model discloses a radiator and electromagnetism stove. The electromagnetic oven comprises a fan and a circuit board assembly, the circuit board assembly is provided with a first heating area and a second heating area, the heat generated by the first heating area is larger than the heat generated by the second heating area, and the radiator comprises a radiating bottom plate, a first radiating part and a second radiating part; the heat dissipation bottom plate comprises a first heat dissipation plate and a second heat dissipation plate which are connected, the first heat dissipation plate is in contact with the first heating area, and the second heat dissipation plate is in contact with the second heating area; the first heat dissipation part is arranged on the first heat dissipation plate so as to absorb heat to the first heat generation area through the first heat dissipation plate; the second heat dissipation part is arranged on the second heat dissipation plate so as to absorb heat to the second heating area through the second heat dissipation plate; the first radiating part is provided with an air guide channel, and the air guide channel is positioned between the fan and the components in the first heating area so that the fan blows air to the components in the first heating area through the air guide channel. The utility model discloses technical scheme can promote the radiating effect to circuit board components.
Description
Technical Field
The utility model relates to the technical field of household appliances, in particular to radiator and electromagnetism stove.
Background
Among the prior art, the electromagnetism stove usually need set up the radiator and dispel the heat to circuit board assembly, but, the produced heat of components and parts on the circuit board assembly is inconsistent in the course of the work, leads to circuit board assembly to have the region that generates heat that produces different heats, if when evenly dispelling the heat through the radiator to each region that generates heat of circuit board assembly, can lead to the high temperature components and parts heat dissipation on the circuit board assembly not thorough for the radiating effect to circuit board assembly is poor.
SUMMERY OF THE UTILITY MODEL
The utility model mainly aims at providing a radiator aims at promoting the radiating effect to circuit board assembly.
In order to achieve the above object, the utility model provides a radiator is applied to the electromagnetism stove, the electromagnetism stove includes fan and the circuit board subassembly that the interval set up, circuit board subassembly has first heating area territory and second heating area territory, the heat that first heating area territory produced is greater than the heat that the second heating area territory produced, the radiator includes:
the heat dissipation bottom plate comprises a first heat dissipation plate and a second heat dissipation plate which are connected, the first heat dissipation plate is in contact with the first heating area, and the second heat dissipation plate is in contact with the second heating area;
a first heat dissipation portion provided to the first heat dissipation plate to absorb heat to the first heat generation region through the first heat dissipation plate;
a second heat dissipation part provided to the second heat dissipation plate to absorb heat to the second heat generation region through the second heat dissipation plate;
the first radiating part is provided with an air guide channel, and the air guide channel is positioned between the fan and the components in the first heating area, so that the fan blows air to the components in the first heating area through the air guide channel.
In an embodiment of the present invention, the first heat dissipation portion includes a plurality of first heat dissipation fins, a plurality of the first heat dissipation fins are disposed at intervals along a direction from the first heat dissipation plate to the second heat dissipation plate, and the air guiding channel is formed between any two adjacent first heat dissipation fins or between the first heat dissipation fin closest to the second heat dissipation portion and the second heat dissipation portion.
In an embodiment of the present invention, the second heat dissipation portion includes a plurality of second heat dissipation fins, the plurality of second heat dissipation fins are disposed along a direction from the first heat dissipation plate to the second heat dissipation plate at intervals, and a first heat dissipation gap is formed between two adjacent second heat dissipation fins.
In an embodiment of the present invention, the circuit board assembly further has a third heat generating region, and the heat generated by the second heat generating region is greater than the heat generated by the third heat generating region;
the heat dissipation bottom plate further comprises a third heat dissipation plate, the third heat dissipation plate is connected to one side, far away from the first heat dissipation plate, of the second heat dissipation plate, and is in contact with the third heating area; the radiator further comprises a third radiating part, and the third radiating part is arranged on the third radiating plate so as to absorb heat to the third radiating area through the third radiating plate.
In an embodiment of the present invention, the third heat sink includes a plurality of third heat fins, a plurality of the third heat fins are disposed along the direction from the second heat sink to the third heat sink at intervals, and two adjacent third heat fins have a second heat dissipation gap therebetween, and the arrangement density of the third heat fins is smaller than the arrangement density of the second heat fins.
In an embodiment of the present invention, the first heat dissipation plate includes a first plate body and a first support plate, the first support plate contacts with the first heat generation region, the first plate body is disposed on the first support plate, and a first heat dissipation space is formed between the first heat generation region, the first heat dissipation portion is disposed on the first plate body, so as to pass through the first plate body and the first support plate.
In an embodiment of the present invention, the second heat dissipation plate includes a second plate body and a second support plate, the second support plate contacts with the second heat generation region, the second plate body is disposed on the second support plate, and a second heat dissipation space is formed between the second heat generation region, the second heat dissipation portion is disposed on the second plate body, so as to pass through the second plate body and the second support plate, the second heat generation region absorbs heat.
In an embodiment of the present invention, a reinforcing rib is disposed in the air guide channel, and the reinforcing rib is connected to the first heat dissipation plate.
In an embodiment of the present invention, the reinforcing rib and the first heat dissipation plate are integrally formed.
The utility model also provides an induction cooker, including the radiator, this radiator includes:
the heat dissipation bottom plate comprises a first heat dissipation plate and a second heat dissipation plate which are connected, the first heat dissipation plate is in contact with the first heating area, and the second heat dissipation plate is in contact with the second heating area;
a first heat dissipation portion provided to the first heat dissipation plate to absorb heat to the first heat generation region through the first heat dissipation plate;
a second heat dissipation part provided to the second heat dissipation plate to absorb heat to the second heat generation region through the second heat dissipation plate;
the first heat dissipation part is provided with an air guide channel, and the air guide channel is positioned between the fan and the components in the first heating area, so that the fan blows air to the components in the first heating area through the air guide channel.
The radiator of the utility model can ensure that the first radiating part can carry out heat exchange with the first heating area through the first radiating plate by making the first radiating plate of the radiating bottom plate contact with the first heating area of the circuit board assembly so as to radiate the first heating area; meanwhile, the second heat dissipation plate of the heat dissipation bottom plate is in contact with the second heating area of the circuit board assembly, so that the second heat dissipation part can exchange heat with the second heating area through the second heat dissipation plate to dissipate heat of the second heating area; in addition, the first heat dissipation part is provided with a heat dissipation air channel, and the heat dissipation air channel is arranged between the fan and the components in the first heating area, so that the first heat dissipation part can exchange heat with the first heating area through the first heat dissipation plate to absorb heat for the components in the first heating area, and meanwhile, the fan works and can blow air for the components in the first heating area through the air guide channel to accelerate the heat dissipation efficiency of the first heating area; so, alright fully dispel the heat to producing higher thermal first heating area under the effect of first heat dissipation part and fan to avoid the high temperature components and parts heat dissipation on the circuit board components not thorough, thereby promoted the radiating effect to circuit board components.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the prior art descriptions will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a schematic view of a view angle of an embodiment of the heat sink of the present invention;
fig. 2 is a schematic structural view of another view angle of an embodiment of the heat sink of the present invention;
fig. 3 is a schematic view of a part of the structure of an embodiment of the electromagnetic oven of the present invention.
The reference numbers illustrate:
| reference numerals | Name (R) | Reference numerals | Name (R) |
| 1000 | |
20 | |
| 100 | |
21 | First radiating |
| 10 | Heat |
211 | Air guide channel |
| 11 | First |
30 | Second heat sink |
| 111 | |
31 | Second radiating |
| 112 | First supporting |
311 | First |
| 113 | Reinforcing |
40 | |
| 12 | Second |
41 | Third radiating fin |
| 121 | |
411 | Second |
| 122 | |
200 | |
| 13 | |
300 | Circuit board assembly |
| 131 | |
400 | |
| 132 | Third support plate |
The realization, the functional characteristics and the advantages of the utility model are further explained by combining the embodiment and referring to the attached drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
It should be noted that, if directional indications (such as up, down, left, right, front, back, 8230; \8230;) are provided in the embodiments of the present invention, the directional indications are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the attached drawings), and if the specific posture is changed, the directional indications are correspondingly changed.
In addition, if there is a description relating to "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.
The utility model provides a radiator 100 aims at promoting the radiating effect to circuit board assembly 300.
The following will explain the specific structure of the heat sink 100 of the present invention, and take the heat sink 100 as an example of being horizontally placed:
referring to fig. 1 and fig. 2 in combination, in an embodiment of the heat sink 100 of the present invention, the heat sink 100 is applied to an induction cooker 1000, the induction cooker 1000 includes a fan 200 and a circuit board assembly 300 which are arranged at an interval, the circuit board assembly 300 has a first heat generating area and a second heat generating area, and the heat generated by the first heat generating area is greater than the heat generated by the second heat generating area; the heat sink 100 includes a heat sink base 10, a first heat sink member 20, and a second heat sink member 30; the heat dissipation base plate 10 includes a first heat dissipation plate 11 and a second heat dissipation plate 12 connected to each other, the first heat dissipation plate 11 is in contact with the first heat generation region, and the second heat dissipation plate 12 is in contact with the second heat generation region; the first heat sink 20 is provided to the first heat sink 11 to absorb heat to the first heat generation region through the first heat sink 11; the second heat sink 30 is provided to the second heat dissipation plate 12 so as to absorb heat to the second heat generation region through the second heat dissipation plate 12;
the first heat sink 20 has an air guiding channel 211, and the air guiding channel 211 is located between the fan 200 and the components in the first heat generating area, so that the fan 200 blows air to the components in the first heat generating area through the air guiding channel 211.
It can be understood that, by contacting the first heat dissipation plate 11 of the heat dissipation base plate 10 with the first heat generation region of the circuit board assembly 300, the first heat dissipation part 20 can exchange heat with the first heat generation region through the first heat dissipation plate 11 to dissipate heat of the first heat generation region; meanwhile, the second heat dissipation plate 12 of the heat dissipation base plate 10 contacts the second heat generation region of the circuit board assembly 300, so that the second heat dissipation part 30 can perform heat exchange with the second heat generation region through the second heat dissipation plate 12 to dissipate heat of the second heat generation region; in addition, the first heat dissipation part 20 is provided with a heat dissipation air duct, and the heat dissipation air duct is arranged between the fan 200 and the components in the first heat generation area, so that the first heat dissipation part 20 can exchange heat with the first heat generation area through the first heat dissipation plate 11 to absorb heat for the components in the first heat generation area, and meanwhile, the fan 200 works, and the fan 200 can blow the components in the first heat generation area through the air guide channel 211 to accelerate the heat dissipation efficiency of the first heat generation area; therefore, the first heat-generating area generating higher heat can be fully cooled under the action of the first heat-dissipating part 20 and the fan 200, so that incomplete heat dissipation of high-temperature components on the circuit board assembly 300 is avoided, and the heat-dissipating effect on the circuit board assembly 300 is improved.
In this embodiment, the component in the first heat generating region may be a choke coil; the components in the second heating area can be IGBT modules, whole bridge circuits and the like.
Further, referring to fig. 1 and fig. 2 in combination, in an embodiment of the heat sink 100 of the present invention, the first heat sink portion 20 includes a plurality of first heat dissipation fins 21, the plurality of first heat dissipation fins 21 are disposed at intervals along a direction from the first heat dissipation plate 11 to the second heat dissipation plate 12, and the air guiding channel 211 is formed between any two adjacent first heat dissipation fins 21 or between the first heat dissipation fin 21 closest to the second heat sink portion 30 and the second heat sink portion 30.
So set up, through under a plurality of first radiating fin 21 and wind-guiding passageway 211's effect, can satisfy the abundant heat absorption to first heating area, still can play the radiating effect of wind-guiding simultaneously to fully promote the radiating effect to the first heating area that produces higher heat in the circuit board assembly 300.
Specifically, the first heat radiation fins 21 may be extended in the width direction of the first heat radiation plate 11 to secure a heat radiation area to the first heat radiation area.
Further, referring to fig. 1 and fig. 2 in combination, in an embodiment of the heat sink 100 of the present invention, the second heat sink portion 30 includes a plurality of second heat dissipation fins 31, the plurality of second heat dissipation fins 31 are disposed along the direction from the first heat dissipation plate 11 to the second heat dissipation plate 12 at intervals, and a first heat dissipation gap 311 is formed between two adjacent second heat dissipation fins 31.
With the arrangement, the second heating area can be fully absorbed by the plurality of second radiating fins 31, so that the radiating effect of the second heating area is ensured; meanwhile, the heat dissipation wind blown out by the fan 200 can also be blown to the components in the second heating area through the first heat dissipation gap 311, so as to further improve the heat dissipation efficiency of the second heating area.
Specifically, the second heat dissipation fins 31 may be extended in the width direction of the second heat dissipation plate 12 to ensure the heat dissipation area to the second heat generation area.
Further, referring to fig. 1 and fig. 2 in combination, in an embodiment of the heat sink 100 of the present invention, the circuit board assembly 300 further has a third heat generating area, and the heat generated by the second heat generating area is greater than the heat generated by the third heat generating area;
the heat dissipation base plate 10 further comprises a third heat dissipation plate 13, wherein the third heat dissipation plate 13 is connected to one side of the second heat dissipation plate 12, which is far away from the first heat dissipation plate 11, and is in contact with the third heating area; the heat sink 100 further includes a third heat dissipating portion 40, and the third heat dissipating portion 40 is disposed on the third heat dissipating plate 13 to absorb heat to the third heat dissipating area through the third heat dissipating plate 13.
Because the circuit board assembly 300 further has a third heat generating region with low heat generation, the third heat dissipating plate 13 of the heat dissipating base plate 10 contacts the third heat generating region, so that the third heat dissipating portion 40 can exchange heat with the third heat generating region through the third heat dissipating plate 13 to absorb heat from the third heat generating region, and thus each heat generating region of the circuit board assembly 300 can be fully dissipated.
In some embodiments, the third heat dissipation plate 13 includes a third plate 131 and a third support plate 132, the third support plate 132 is in contact with a third heat generation area, the third plate 131 is disposed on the third support plate 132, and a third heat dissipation space is formed between the third plate 131 and the third heat generation area, and the third heat dissipation part 40 is disposed on the third plate 131 to absorb heat to the third heat generation area through the third plate 131 and the third support plate 132. With such an arrangement, when the heat dissipation structure is applied to the induction cooker 1000, a third heat dissipation space is formed between the third plate 131 of the third heat dissipation plate 13 and the third heat dissipation area of the circuit board assembly 300, so that the fan 200 can blow air to the third heat dissipation area through the third heat dissipation space, thereby accelerating the heat dissipation efficiency of the third heat dissipation area.
It should be noted that, of the heat generated by the third heat generating region, a small portion of the heat can be conducted to the third heat sink portion 40 through the third support plate 132 and the third plate 131, and a large portion of the heat can be directly conducted to the third heat sink portion 40 through a heat radiation manner, so as to sufficiently ensure the heat dissipation effect of the third heat sink portion 40 on the third heat generating region.
Further, referring to fig. 1 and fig. 2 in combination, in an embodiment of the heat sink 100 of the present invention, the third heat sink portion 40 includes a plurality of third heat dissipation fins 41, a plurality of the third heat dissipation fins 41 are disposed along the direction from the second heat dissipation plate 12 to the third heat dissipation plate 13 at intervals, a second heat dissipation gap 411 is formed between two adjacent third heat dissipation fins 41, and the arrangement density of the third heat dissipation fins 41 is smaller than the arrangement density of the second heat dissipation fins 31.
With such arrangement, the third heating area can be sufficiently absorbed by the plurality of third heat dissipation fins 41, so that the heat dissipation effect of the third heating area is ensured; meanwhile, the heat dissipation air blown out by the fan 200 can also be blown to the third heating area through the second heat dissipation gap 411, so as to further improve the heat dissipation efficiency of the third heating area; in addition, since the heat generated by the second heat generating region is greater than the heat generated by the third heat generating region, by making the arrangement density of the third heat dissipating fins 41 less than the arrangement density of the second heat dissipating fins 31, i.e. making the plurality of second heat dissipating fins 31 more densely arranged, the first heat dissipating gap 311 can be made smaller than the second heat dissipating gap 411 in a unit area, i.e. making the second heat dissipating part 30 can be provided with more second heat dissipating fins 31, so as to ensure the heat dissipating effect on the second heat generating region.
Specifically, the third heat dissipation fins 41 may be extended in the width direction of the third heat dissipation plate 13 to ensure a heat dissipation area to the third heat generation area.
Referring to fig. 1 and fig. 2 in combination, in an embodiment of the heat sink 100 of the present invention, the first heat sink 11 includes a first plate 111 and a first support plate 112, the first support plate 112 contacts with the first heat-generating region, the first plate 111 is disposed on the first support plate 112, and a first heat-dissipating space is formed between the first heat-generating region, and the first heat-dissipating portion 20 is disposed on the first plate 111 to absorb heat to the first heat-generating region through the first plate 111 and the first support plate 112.
With such an arrangement, when the electromagnetic oven 1000 is applied, a first heat dissipation space is formed between the first plate 111 of the first heat dissipation plate 11 and the first heat dissipation area of the circuit board assembly 300, so that the fan 200 can blow air to the first heat dissipation area through the first heat dissipation space, thereby increasing the heat dissipation efficiency of the first heat dissipation area.
It should be noted that, of the heat generated in the first heat generating region, a small portion of the heat may be conducted to the first heat sink portion 20 through the first support plate 112 and the first plate body 111, and a large portion of the heat may be directly conducted to the first heat sink portion 20 through a heat radiation manner, so as to sufficiently ensure a heat dissipation effect of the first heat sink portion 20 on the first heat generating region.
Specifically, the first support plate 112 and the first plate 111 may be integrally formed to ensure the connection strength between the first support plate 112 and the first plate 111 and simplify the assembly process of the first support plate 112 and the first plate 111.
Similarly, referring to fig. 1 and fig. 2 in combination, in an embodiment of the heat sink 100 of the present invention, the second heat dissipation plate 12 includes a second plate 121 and a second support plate 122, the second support plate 122 contacts with the second heat generation region, the second plate 121 is disposed on the second support plate 122, and a second heat dissipation space is formed between the second plate 121 and the second heat generation region, and the second heat dissipation part 30 is disposed on the second plate 121 to absorb heat to the second heat generation region through the second plate 121 and the second support plate 122.
With such an arrangement, when the heat dissipation structure is applied to the induction cooker 1000, a second heat dissipation space is formed between the second plate 121 of the second heat dissipation plate 12 and the second heat dissipation area of the circuit board assembly 300, so that the fan 200 can blow air to the second heat dissipation area through the second heat dissipation space, thereby accelerating the heat dissipation efficiency of the second heat dissipation area.
It should be noted that, of the heat generated by the second heat generating region, a small portion of the heat can be conducted to the second heat sink portion 30 through the second support plate 122 and the second plate body 121, and a large portion of the heat can be directly conducted to the second heat sink portion 30 through a heat radiation manner, so as to sufficiently ensure the heat dissipation effect of the second heat sink portion 30 on the second heat generating region.
Specifically, the second supporting plate 122 and the second plate 121 may be integrally formed, so as to ensure the connection strength between the second supporting plate 122 and the second plate 121 and simplify the assembling process of the second supporting plate 122 and the second plate 121.
Further, referring to fig. 1 and fig. 2 in combination, in an embodiment of the heat sink 100 of the present invention, a reinforcing rib 113 is disposed in the air guiding channel 211, and the reinforcing rib 113 is connected to the first heat dissipating plate 11. So set up, alright promote the intensity of first heating panel 11 through strengthening rib 113 to prevent that first heating panel 11 from taking place deformation, simultaneously, still can increase the heat radiating area to first heat generation region through strengthening rib 113, with the further radiating effect who promotes first heat generation region.
Further, referring to fig. 1 and fig. 2, in an embodiment of the heat sink 100 of the present invention, the reinforcing ribs 113 and the first heat dissipation plate 11 are integrally formed. With this arrangement, the connection strength between the reinforcing ribs 113 and the first heat dissipation plate 11 can be ensured, and the assembling process of the reinforcing ribs 113 and the first heat dissipation plate 11 can be simplified.
With reference to fig. 3, the utility model discloses still provide an electromagnetism stove 1000, this electromagnetism stove 1000 includes as above radiator 100, the above-mentioned embodiment is referred to this radiator 100's concrete structure, because this electromagnetism stove 1000 has adopted all technical scheme of above-mentioned all embodiments, consequently has all beneficial effects that the technical scheme of above-mentioned embodiment brought at least, and the repeated description is no longer repeated here.
In this embodiment, the induction cooker 1000 may further include a housing 400, a blower 200, a circuit board assembly 300, a coil disc assembly, and the like, wherein a mounting cavity is formed in the housing 400, and the heat sink 100, the blower 200, the circuit board assembly 300, and the coil disc assembly may all be mounted in the mounting cavity of the housing 400.
The above only is the preferred embodiment of the present invention, not so limiting the patent scope of the present invention, all under the inventive concept of the present invention, the equivalent structure transformation made by the contents of the specification and the drawings is utilized, or the direct/indirect application in other related technical fields is included in the patent protection scope of the present invention.
Claims (10)
1. The utility model provides a radiator, is applied to the electromagnetism stove, the electromagnetism stove includes fan and the circuit board subassembly that the interval set up, circuit board subassembly has first heat generation region and second heat generation region, the heat that first heat generation region produced is greater than the heat that the second heat generation region produced, its characterized in that, the radiator includes:
the heat dissipation bottom plate comprises a first heat dissipation plate and a second heat dissipation plate which are connected, the first heat dissipation plate is in contact with the first heating area, and the second heat dissipation plate is in contact with the second heating area;
a first heat dissipation portion provided to the first heat dissipation plate to absorb heat to the first heat generation region through the first heat dissipation plate;
a second heat dissipation part provided to the second heat dissipation plate to absorb heat to the second heat generation region through the second heat dissipation plate;
the first heat dissipation part is provided with an air guide channel, and the air guide channel is positioned between the fan and the components in the first heating area, so that the fan blows air to the components in the first heating area through the air guide channel.
2. The heat sink as claimed in claim 1, wherein the first heat dissipating portion includes a plurality of first heat dissipating fins, the plurality of first heat dissipating fins are spaced along a direction from the first heat dissipating plate to the second heat dissipating plate, and the air guiding channel is formed between any two adjacent first heat dissipating fins or between the first heat dissipating fin closest to the second heat dissipating portion and the second heat dissipating portion.
3. The heat sink of claim 1, wherein the second heat sink portion comprises a plurality of second heat dissipation fins, the plurality of second heat dissipation fins are spaced apart from each other along a direction from the first heat dissipation plate to the second heat dissipation plate, and a first heat dissipation gap is formed between two adjacent second heat dissipation fins.
4. The heat sink according to claim 3, wherein the circuit board assembly further has a third heat generation area, the second heat generation area generating heat larger than the third heat generation area;
the heat dissipation bottom plate further comprises a third heat dissipation plate, the third heat dissipation plate is connected to one side, far away from the first heat dissipation plate, of the second heat dissipation plate, and is in contact with the third heating area; the radiator further comprises a third radiating part, and the third radiating part is arranged on the third radiating plate so as to absorb heat to the third radiating area through the third radiating plate.
5. The heat sink according to claim 4, wherein the third heat sink portion includes a plurality of third heat dissipation fins, the plurality of third heat dissipation fins are spaced apart from each other along a direction from the second heat dissipation plate to the third heat dissipation plate, a second heat dissipation gap is formed between two adjacent third heat dissipation fins, and the arrangement density of the third heat dissipation fins is smaller than that of the second heat dissipation fins.
6. The heat sink according to claim 1, wherein the first heat dissipation plate comprises a first plate body and a first support plate, the first support plate is in contact with the first heat generation region, the first plate body is disposed on the first support plate, and a first heat dissipation space is formed between the first plate body and the first heat generation region, and the first heat dissipation part is disposed on the first plate body so as to absorb heat to the first heat generation region through the first plate body and the first support plate.
7. The heat sink according to claim 1, wherein the second heat dissipating plate includes a second plate body and a second supporting plate, the second supporting plate is in contact with the second heat generating region, the second plate body is disposed on the second supporting plate, and a second heat dissipating space is formed between the second plate body and the second heat generating region, and the second heat dissipating portion is disposed on the second plate body so as to absorb heat to the second heat generating region through the second plate body and the second supporting plate.
8. The heat sink as claimed in claim 1, wherein a rib is provided in the air guide passage, and the rib is connected to the first heat dissipating plate.
9. The heat sink of claim 8, wherein the ribs are integrally formed with the first heat sink.
10. An induction hob, characterized in, that it comprises a heat sink according to any one of the claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222280875.4U CN218336934U (en) | 2022-08-29 | 2022-08-29 | Radiator and induction cooker |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222280875.4U CN218336934U (en) | 2022-08-29 | 2022-08-29 | Radiator and induction cooker |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218336934U true CN218336934U (en) | 2023-01-17 |
Family
ID=84885800
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222280875.4U Active CN218336934U (en) | 2022-08-29 | 2022-08-29 | Radiator and induction cooker |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218336934U (en) |
-
2022
- 2022-08-29 CN CN202222280875.4U patent/CN218336934U/en active Active
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Address after: 528000 Floor 1, 2, 3 and 5, Building 12, Phase I, Tianfulai International Industrial City, No. 39, Changbao West Road, Rongli Community, Ronggui Subdistrict, Shunde District, Foshan City, Guangdong Province Patentee after: Guangdong Wedgwood Environmental Technology Co.,Ltd. Address before: 528000 1st Floor, 2nd Floor, 1st Floor, Building 5, Hi tech Industrial Park, Gaoli Community, Shunde District, Foshan City, Guangdong Province Patentee before: Guangdong Wedgwood Environmental Technology Co.,Ltd. |
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