CN218333839U

CN218333839U - LED package

Info

Publication number: CN218333839U
Application number: CN202222595032.3U
Authority: CN
Inventors: 郭生树; 林德顺; 翁平; 杨永发; 陈华云
Original assignee: Hongli Zhihui Group Co Ltd
Current assignee: Hongli Zhihui Group Co Ltd
Priority date: 2022-09-29
Filing date: 2022-09-29
Publication date: 2023-01-17
Anticipated expiration: 2032-09-29

Abstract

The utility model provides a LED package, includes support and LED chip, and the surface of support functional area is equipped with the silvered film, the LED chip sets firmly in the functional area, be equipped with the high reflection plastic layer on the silvered film in the bowl cup, it is equipped with first through-hole to correspond LED chip department on the high reflection plastic layer, corresponds pad department on the high reflection plastic layer and is equipped with the second through-hole, be equipped with fluorescence glue film on the high reflection plastic layer. The utility model discloses the principle: the surface of the silvered layer is additionally provided with the high-reflection plastic layer which covers the silvered layer, so that the silvered layer can be prevented from undergoing a vulcanization reaction, and the reflection efficiency of the silvered layer is ensured.

Description

LED package

Technical Field

The utility model belongs to the technical field of the LED field and specifically relates to a LED encapsulation.

Background

At present, because of high requirements on the heat dissipation performance of raw materials, the TOP LED mainly adopts high-molecular organic silicon as an external sealing adhesive of the white light LED, but because the silica gel flute has high moisture and oxygen permeability, when the LED contacts sulfur-containing substances, sulfur element can permeate into a support functional area to perform chemical reaction with silver plating on a support, and a vulcanization phenomenon is generated.

The sulfuration phenomenon refers to a process that sulfur (S) and silver with a valence of-1 react with sulfur with a valence of-2 to generate black Ag2S under certain temperature and humidity conditions. In the LED device, the holding cavity surface of the LED support can be covered with a silver coating, the silver coating is used for reflecting light emitted by the LED chip, the light utilization rate of the LED device is improved, sulfur in the air enters the LED device and reacts with the silver coating on the holding cavity surface after vulcanization, the vulcanized LED can blacken the support functional area, the luminous flux is seriously reduced, obvious color temperature drift occurs, along with long-time ignition, the temperature is increased, the conductivity of silver sulfide is increased, the electric leakage phenomenon can also occur, the LED can completely lose efficacy, and the lamp death phenomenon occurs.

Disclosure of Invention

The utility model aims to solve the technical problem that a LED encapsulation is provided, prevents that the silvered film from blackening, promotes LED product reliability.

In order to solve the technical problem, the technical scheme of the utility model is that: an LED package comprises a support and an LED chip, wherein the support comprises a plate electrode and a plastic frame, the plate electrode and the plastic frame are enclosed to form a bowl cup, an area enclosed by the bowl cup on the plate electrode is a functional area, a bonding pad is arranged on the functional area, and an electrode of the LED chip is electrically connected with the bonding pad through a gold thread; the surface of functional area is equipped with the silvered film, the LED chip sets firmly in the functional area, be equipped with the high reflection plastic layer on the silvered film in the bowl cup, it is equipped with first through-hole to correspond LED chip department on the high reflection plastic layer, corresponds pad department on the high reflection plastic layer and is equipped with the second through-hole, be equipped with the fluorescence glue film on the high reflection plastic layer. The utility model discloses the principle: the surface of the silvered layer is additionally provided with the high-reflection plastic layer which covers the silvered layer, so that the silvered layer can be prevented from undergoing a vulcanization reaction, and the reflection efficiency of the silvered layer is ensured.

As an improvement, the high-reflection plastic layer is a PCT plastic layer or a PPA plastic layer.

As an improvement, the shape of the first through hole is similar to that of the LED chip, and the LED chip is arranged in the first through hole.

As an improvement, the high-reflection plastic layer is not higher than the LED chip.

Compared with the prior art, the utility model the beneficial effect who brings is:

the high reflection plastic layer is added on the surface of the silver coating, the high reflection plastic layer covers the silver coating, the silver coating can be prevented from undergoing a vulcanization reaction, the reflection efficiency of the silver coating is ensured, in addition, the reflection efficiency of the high reflection plastic layer is high, the light emitting effect on the LED chip is small, the whole light emitting efficiency is ensured, and therefore the reliability of the LED product is improved.

Drawings

Fig. 1 is a novel plan view of the present invention.

Fig. 2 is a novel sectional view.

Detailed Description

The present invention will be further described with reference to the accompanying drawings.

As shown in fig. 1 and 2, an LED package includes a support 1 and an LED chip 2. The support 1 comprises an electrode plate 12 and a plastic frame 11, the electrode plate 12 and the plastic frame 11 enclose a bowl cup, the electrode plate 12 comprises a positive plate 121, a negative plate 122 and an insulating tape 123, the insulating tape 123 insulates and isolates the positive plate 121 and the negative plate 122, the area on the electrode plate 12 enclosed by the bowl cup is a functional area, and the functional area is provided with a bonding pad 3 which is a positive bonding pad arranged on the positive plate 121 and a negative bonding pad arranged on the negative plate 122; the LED chip 2 is a positively mounted blue light chip, the positive electrode at the top of the chip is electrically connected with the positive electrode bonding pad through a gold wire, and the negative electrode is electrically connected with the negative electrode bonding pad through a gold wire. The surface of the functional area is provided with a silver coating 6, the silver coating 6 is used for reflecting and reflecting, the light emitting efficiency is improved, and the LED chip is fixedly arranged on the negative plate 122 of the functional area. A high-reflection plastic layer 7 is arranged on the silver-plated layer 6 in the bowl cup, the high-reflection plastic layer 7 is not higher than the LED chip, and the high-reflection plastic layer 7 is made of plastic with high reflection efficiency, such as a PCT plastic layer or a PPA plastic layer; a first through hole 3 is formed in the high-reflection plastic layer 7 corresponding to the LED chip, the shape of the first through hole 3 is similar to that of the LED chip, and the LED chip is arranged in the first through hole 3, so that the exposed area of the silver coating 6 is reduced as much as possible; the high-reflection plastic layer is provided with a second through hole 4 corresponding to the bonding pad, and the second through hole 4 is exposed out of the bonding pad 3 and used for bonding a wire. And a fluorescent glue layer is arranged on the high-reflection plastic layer 7.

The utility model discloses the principle: increase the high reflection plastic layer on the surface of silvered film 6, high reflection plastic layer covers silvered film 6, can prevent silvered film 6 to take place the vulcanization reaction, guarantees silvered film 6 reflection efficiency, and in addition, the reflection efficiency on high reflection plastic layer is high, and is little to the light-emitting influence of LED chip, and whole light-emitting efficiency obtains guaranteeing to promote LED product reliability.

Claims

1. An LED package comprises a support and an LED chip, wherein the support comprises a plate electrode and a plastic frame, the plate electrode and the plastic frame are enclosed to form a bowl cup, an area enclosed by the bowl cup on the plate electrode is a functional area, a bonding pad is arranged on the functional area, and an electrode of the LED chip is electrically connected with the bonding pad through a gold thread; the method is characterized in that: the surface of functional area is equipped with the silvered film, the LED chip sets firmly in the functional area, be equipped with the high reflection plastic layer on the silvered film in the bowl cup, it is equipped with first through-hole to correspond LED chip department on the high reflection plastic layer, corresponds pad department on the high reflection plastic layer and is equipped with the second through-hole, be equipped with fluorescence glue film on the high reflection plastic layer.

2. The LED package of claim 1, wherein: the high-reflection plastic layer is a PCT plastic layer or a PPA plastic layer.

3. The LED package of claim 1, wherein: the shape of the first through hole is similar to that of the LED chip, and the LED chip is arranged in the first through hole.

4. The LED package of claim 1, wherein: the high-reflection plastic layer is not higher than the LED chip.