CN218328824U - Constant temperature cabinet and semiconductor device - Google Patents

Abstract

The utility model discloses a constant temperature cabinet and semiconductor device, this constant temperature cabinet include the cabinet body, semiconductor refrigeration piece, first radiator and second radiator, and the cabinet body is injectd thermostatic chamber, temperature channel and heat dissipation exocoel, and temperature channel sets up with thermostatic chamber intercommunication, and heat dissipation exocoel and external environment intercommunication, semiconductor refrigeration piece are established at the cabinet internally, and first radiator is established in one side of semiconductor refrigeration piece and is located temperature channel, and the second radiator is established at the opposite side of semiconductor refrigeration piece and is located the heat dissipation exocoel. The constant temperature cabinet occupies a small space, and is low in manufacturing cost and maintenance cost.

Description

Constant temperature cabinet and semiconductor device

Technical Field

The utility model relates to a temperature regulating equipment technical field especially relates to a constant temperature cabinet and semiconductor device.

Background

The constant temperature cabinet on the prior market is a field source generating constant temperature, can be used for heating or refrigerating objects to reach the equipment with preset temperature, and in the field of semiconductor manufacturing, the constant temperature equipment for storing gas cylinders mostly consists of a compressor, a condenser, an evaporator and a fan on a temperature control assembly, so that the occupied space of the assembly is large and the maintenance cost is high.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a constant temperature cabinet, this constant temperature cabinet's occupation space is less, and manufacturing cost and maintenance cost are all less.

A second object of the present invention is to provide a semiconductor device, which can better ensure constant temperature of the product, and has a lower manufacturing cost and a lower maintenance cost.

For realizing the above technical effect, the technical scheme of the utility model as follows:

the utility model discloses a constant temperature cabinet, include: the cabinet body is provided with a constant temperature cavity, a temperature control channel and a heat dissipation outer cavity, the temperature control channel is communicated with the constant temperature cavity, and the heat dissipation outer cavity is communicated with the external environment; the semiconductor refrigeration piece is arranged in the cabinet body; the first radiator is arranged on one side of the semiconductor refrigerating sheet and is positioned in the temperature control channel; and the second radiator is arranged on the other side of the semiconductor refrigerating sheet and is positioned in the heat radiating outer cavity.

In some embodiments, a thermostatic chamber plate is arranged in the thermostatic cabinet, the thermostatic chamber plate defines the thermostatic cavity, the thermostatic chamber plate is arranged at an interval with the inner side wall of the cabinet body, a circulating air duct is defined between the thermostatic chamber plate and the inner side wall of the cabinet body, the circulating air duct is communicated with the temperature control channel, and each thermostatic chamber plate is provided with an air equalizing hole; and/or:

the bearing plate is arranged in the constant-temperature cavity and used for bearing products, and an air passing hole is formed in the bearing plate.

In some specific embodiments, a temperature control chamber plate is arranged in the constant temperature cabinet, a temperature control channel is defined between the temperature control chamber plate and the inner side wall of the cabinet body, and the constant temperature cabinet further comprises a circulating fan which is arranged in the temperature control channel to promote the circulation of air flow between the temperature control channel and the constant temperature cavity.

In some specific embodiments, the carrying plate is provided with a plurality of carrying plates, and the plurality of carrying plates divide the thermostatic chamber into a plurality of sub-chambers; the air equalizing holes are multiple groups, and each group of air equalizing holes communicates one sub-cavity with the circulating air duct).

In some specific embodiments, the constant temperature cabinet is further provided with a partition plate, the partition plate is arranged between the constant temperature chamber plate and the inner side wall of the cabinet body, and is arranged at an interval with the constant temperature chamber plate and the inner side wall of the cabinet body, and a heat insulation layer is filled in a gap between the partition plate and the inner side wall of the cabinet body.

In some embodiments, a temperature detecting member is disposed in the thermostatic chamber.

In some embodiments, the cabinet body is provided with an air inlet and an air outlet which are communicated with the heat dissipation outer cavity, and the constant temperature cabinet further comprises a heat dissipation fan, wherein the heat dissipation fan is arranged in the cabinet body and is communicated with the air flow of the air inlet so as to promote the air flow to sequentially flow through the air inlet, the heat dissipation outer cavity and the air outlet.

In some specific embodiments, the heat dissipating outer chamber defines a heat dissipating channel and an outer chamber body, the second heat sink is disposed in the heat dissipating channel, an air outlet end of the heat dissipating channel is communicated with the air outlet, an air inlet end of the heat dissipating channel is communicated with the outer chamber body, the outer chamber body is communicated with the air inlet, and the outer chamber body is used for accommodating an electric control element.

In some more specific embodiments, the heat dissipation fan is disposed at least one of the air inlet, the air outlet, the air exhaust end of the heat dissipation channel, and the air inlet end of the heat dissipation channel.

The utility model discloses a beneficial effect of constant temperature cabinet: the semiconductor refrigeration sheet, the first radiator and the second radiator are adopted to replace a heat pump system in the prior art, so that the structure of the constant temperature cabinet is simplified, and the volume of the constant temperature cabinet is reduced.

The utility model discloses a semiconductor device's beneficial effect: due to the constant temperature cabinet, the semiconductor device can better ensure the constant temperature of the product, and the manufacturing cost and the maintenance cost are lower.

Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.

Drawings

Fig. 1 is a schematic structural diagram of a constant temperature cabinet according to an embodiment of the present invention;

fig. 2 is a schematic view of the internal structure of the constant temperature cabinet according to the embodiment of the present invention;

fig. 3 is a schematic view of a partial structure of the constant temperature cabinet according to the embodiment of the present invention.

Fig. 4 is an enlarged schematic view of fig. 3 at circle a.

Reference numerals are as follows:

1. a cabinet body; 11. a body; 12. a cabinet door; 101. a constant temperature cavity; 102. a temperature control channel; 103. a heat dissipation outer cavity; 1031. a heat dissipation channel; 10311. an air outlet; 1032. an outer cavity body; 10321. an air inlet; 104. a circulating air duct; 2. a semiconductor refrigerating sheet; 3. a first heat sink; 4. a second heat sink; 5. a weighing assembly; 6. a partition plate; 7. a thermostatic chamber plate; 71. air equalizing holes; 8. a temperature control chamber plate; 81. a circulating tuyere; 9. a circulating fan; 10. a heat radiation fan; 20. a support frame; 30. a carrier plate; 301. air passing holes; 40. a thermal insulation layer; 50. an air flow gap.

Detailed Description

In order to make the technical problem solved by the present invention, the technical solution adopted by the present invention and the technical effect achieved by the present invention clearer, the technical solution of the present invention will be further explained by combining the drawings and by means of the specific implementation manner.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", and the like, indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

Furthermore, features defined as "first" and "second" may explicitly or implicitly include one or more of the features for distinguishing between descriptive features, non-sequential, non-trivial and non-trivial. In the description of the present invention, "a plurality" means two or more unless otherwise specified.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood as a specific case by those skilled in the art.

The specific structure of the constant temperature cabinet according to the embodiment of the present invention is described below with reference to fig. 1 to 3.

The utility model discloses a constant temperature cabinet, as shown in fig. 1-fig. 3, the constant temperature cabinet of this embodiment includes cabinet body 1, semiconductor refrigeration piece 2, first radiator 3, second radiator 4 and weighing component 5, cabinet body 1 is injectd thermostatic chamber 101, temperature control channel 102 and heat dissipation exocoel 103, temperature control channel 102 sets up with thermostatic chamber 101 intercommunication, heat dissipation exocoel 103 and external environment intercommunication, semiconductor refrigeration piece 2 is established in cabinet body 1, first radiator 3 is established in one side of semiconductor refrigeration piece 2 and is located thermostatic chamber 102, second radiator 4 is established at the opposite side of semiconductor refrigeration piece 2 and is located heat dissipation exocoel 103.

It can be understood that, in the actual work process, semiconductor refrigeration piece 2's the both sides that set up relatively, one side heats, the opposite side is refrigerated, first radiator 3 can absorb the refrigeration capacity of semiconductor refrigeration piece 2 better, the air current is cooled when flowing through from first radiator 3, then blow in thermostatic chamber 101, make thermostatic chamber 101's temperature descend, and be in a comparatively stable state, and second radiator 4 can absorb the refrigeration capacity of semiconductor refrigeration piece 2 better, the air current flows through from second radiator 4, take away the heat on the second radiator 4, the higher air current of temperature flows out to the external environment in from heat dissipation exocoel 103. When the temperature of the heating side of the semiconductor refrigerating sheet 2 is reduced, the operation can be continued after the temperature of the cooling side is increased. In the embodiment, the semiconductor refrigerating sheet 2, the first radiator 3 and the second radiator 4 are adopted to replace a heat pump system in the prior art, so that the structure of the constant temperature cabinet is simplified, and the volume of the constant temperature cabinet is reduced.

In some embodiments, as shown in fig. 2, the thermostatic cabinet further comprises a weighing assembly 5, the weighing assembly 5 being arranged inside the thermostatic chamber 101, the weighing assembly 5 being intended to carry and weigh the product. It can be understood that because the weighing component 5 is arranged in the constant-temperature cavity 101, the weighing component 5 is used for bearing and weighing products, so that after the gas cylinder is placed on the weighing component 5, the residual gas in the gas cylinder can be judged according to the display data of the weighing component 5, and the observation is very convenient.

In some embodiments, as shown in fig. 2, a thermostatic chamber plate 7 is disposed in the thermostatic cabinet, the thermostatic chamber plate 7 defines a thermostatic chamber 101, the thermostatic chamber plate 7 is disposed at a distance from the inner side wall of the cabinet body 1, and a circulating air duct 104 is defined between the thermostatic chamber plate 7 and the inner side wall of the cabinet body 1, the circulating air duct 104 is communicated with the temperature-controlled passage 102, and each thermostatic chamber plate 7 is provided with an air-equalizing hole 71. It can be understood that if thermostatic chamber 101 only sets up an opening and temperature-controlled channel 102 intercommunication, then the phenomenon that the temperature is not even enough can appear in the actual work process, in this embodiment, adopt thermostatic chamber board 7 to surround thermostatic chamber 101, and be equipped with air equalizing hole 71 on thermostatic chamber board 7, can make the air current in temperature-controlled channel 102 flow into thermostatic chamber 101 from a plurality of directions, it is comparatively even to have guaranteed the temperature in thermostatic chamber 101, has promoted thermostatic cabinet's use reliability.

Preferably, the number of the air equalizing holes 71 is multiple, and the multiple air equalizing holes 71 are arranged in a circumferential array or in multiple rows and multiple columns. Therefore, the temperature in the constant temperature cavity 101 can be further ensured to be uniform, and the use reliability of the constant temperature cabinet is improved.

In some embodiments, as shown in fig. 2, a loading plate 30 is disposed in the thermostatic chamber 101, the loading plate 30 is used for loading a product, and the loading plate 30 is provided with an air passing hole 301. It is understood that the loading plate 30 can divide the thermostatic chamber 101 into a plurality of chambers, thereby increasing the number of products in the thermostatic chamber 101 and increasing the loading capacity of the thermostatic cabinet. The air passing holes 301 formed in the bearing plate 30 enable air flow to pass through the bearing plate 30 to reach the lower portion of the thermostatic chamber 101, so that the temperature uniformity in the thermostatic chamber 101 is improved.

Preferably, the number of the bearing plates 30 is multiple, the thermostatic chamber 101 is divided into multiple sub-chambers by the multiple bearing plates 30, the air equalizing holes 71 are multiple groups, and each group of air equalizing holes 71 communicates one sub-chamber with the temperature control channel 102. From this, in the actual work process, the refrigeration air current can get into a plurality of sub-chambeies from the equal wind hole 71 of multiunit to guarantee that the temperature in a plurality of sub-chambeies is comparatively even, ensure the reliability of constant temperature cabinet.

In some specific embodiments, as shown in fig. 2, a temperature-controlled chamber plate 8 is disposed in the thermostatic cabinet, a temperature-controlled passage 102 is defined between the temperature-controlled chamber plate 8 and the inner side wall of the cabinet body 1, and the thermostatic cabinet further includes a circulating fan 9, wherein the circulating fan 9 is disposed in the temperature-controlled passage 102 to promote the circulation of the air flow in the temperature-controlled passage 102 and the thermostatic chamber 101. It can be understood that temperature control channel 102 is defined by the inner side walls of temperature control chamber plate 8 and cabinet body 1, and circulating fan 9 is arranged inside temperature control channel 102, and circulating fan 9 can make the airflow in temperature control channel 102 flow forcibly, so as to accelerate the circulation of the airflow in temperature control channel 102 and thermostatic chamber 101, ensure that thermostatic chamber 101 is always in a relatively stable temperature range, and also can make thermostatic chamber 101 quickly adjust to a preset temperature or temperature range, thereby improving the operational reliability of the thermostatic cabinet.

Optionally, the temperature-controlled room plate 8 is provided with a circulating air port 81 communicated with the circulating air duct 104, and the circulating fan 9 is arranged corresponding to the circulating air port 81. Therefore, the circulation speed of the airflow can be increased, and the temperature control speed is increased.

In some embodiments, as shown in fig. 2, the constant temperature cabinet is provided with a partition plate 6, the partition plate 6 is respectively arranged at intervals with the constant temperature room plate 7 and the inner side wall of the cabinet body 1, a heat insulating layer is filled in a gap between the partition plate 6 and the inner side wall of the cabinet body 1, the constant temperature cavity 101 and the temperature control channel 102 are located inside a space enclosed by the partition plates 6, the semiconductor refrigeration sheet 2 is installed on the partition plate 6, and the partition plate 6 is provided with a heat dissipation groove avoiding the first heat sink 3. It can be understood that, since the heat dissipation outer cavity 103 is communicated with the external environment, and the main function of the heat dissipation outer cavity 103 is to release the heat generated by the heating side of the semiconductor cooling plate 2, no special treatment is required to be performed on the cavity plate of the heat dissipation outer cavity 103. Comparatively stable temperature is required to guarantee in the thermostatic chamber 101, in this embodiment, through setting up division board 6 and heat preservation, has greatly reduced thermostatic chamber 101 and external environment's thermal diffusivity's degree to be in comparatively stable temperature throughout in having ensured thermostatic chamber 101, and can reduce the consumption of semiconductor refrigeration piece 2.

In some embodiments, a temperature detecting member is disposed in the thermostatic chamber 101. Thereby, the temperature detection member can stably monitor the temperature of the thermostatic chamber 101.

In some embodiments, as shown in fig. 2, the cabinet body 1 is provided with an air inlet 10321 and an air outlet 10311 which are communicated with the heat dissipation outer chamber 103, and the constant temperature cabinet further includes a heat dissipation fan 10, wherein the heat dissipation fan 10 is disposed in the cabinet body 1 and is communicated with the air flow of the air inlet 10321, so as to promote the air flow to sequentially circulate through the air inlet 10321, the heat dissipation outer chamber 103 and the air outlet 10311. It can be understood that the heat dissipation fan 10 can realize forced convection of air flow in the heat dissipation outer cavity 103, thereby increasing the heat dissipation speed. It should be noted that the air inlet 10321 is formed in the heat dissipation outer cavity 103, specifically, the heat dissipation outer cavity 103 is a non-sealed cavity, and as long as the heat dissipation outer cavity 103 has a gap communicating with the outside, the air inlet 10321 can be regarded as the air inlet.

In some specific embodiments, as shown in fig. 2, the heat dissipating outer chamber 103 defines a heat dissipating passage 1031 and an outer chamber body 1032, the second heat sink 4 is disposed in the heat dissipating passage 1031, an air exhaust end of the heat dissipating passage 1031 is communicated with the air outlet 10311, an air inlet end of the heat dissipating passage 1031 is communicated with the outer chamber body 1032, the outer chamber body 1032 is communicated with the air inlet 10321, and the outer chamber body 1032 is used for accommodating the electric control element. It can be understood that, in this embodiment, the heat dissipation outer cavity 103 not only serves as a heat dissipation cavity for heat exchange between the second heat sink 4 and the outside, but also can be used for accommodating an electric control element and realizing heat dissipation, and the second heat sink 4 and the electric control element share the heat dissipation cavity, so that the structure of the thermostatic cabinet is relatively compact, and the miniaturized design of the thermostatic cabinet is facilitated.

Optionally, as shown in fig. 2, the heat dissipation fan 10 is disposed at least one of the air inlet 10321, the air outlet 10311, an air exhaust end of the heat dissipation channel 1031, and an air inlet end of the heat dissipation channel 1031. Therefore, the heat dissipation efficiency can be improved.

In some embodiments, the thermostatic cabinet includes a supporting frame 20, the supporting frame 20 is installed in the cabinet body 1 and located in the heat dissipation outer cavity 103, and the semiconductor cooling fin 2, the first heat sink 3 and the second heat sink 4 are all disposed on the supporting frame 20. It can be understood that, in the actual assembling process, the semiconductor refrigerating sheet 2, the first radiator 3 and the second radiator 4 can be fixed on the supporting frame 20, and then the supporting frame 20 is installed in the cabinet body 1, so that the constant temperature cabinet is convenient to assemble, and the assembling efficiency of the constant temperature cabinet is improved.

In some specific embodiments, as shown in fig. 3, the second heat sink 4 is disposed on one side of the support frame 20, the plurality of first heat sinks 3 are disposed on the other side of the support frame 20 at intervals, and a thermal insulation layer 40 and an air flow gap 50 are disposed between two adjacent first heat sinks 3. It can be understood that, since the first heat sink 3 and the second heat sink 4 are both disposed on the supporting frame 20, the addition of the thermal insulation layer 40 can reduce the heat diffusion between the first heat sink 3 and the second heat sink 4, thereby ensuring that the first heat sink 3 can cool the air flow quickly and the second heat sink 4 can dissipate the heat quickly. The air flow gap 50 between the two first radiators 3 can ensure that the air flow can stably flow through the first radiators 3, thereby ensuring that the first radiators 3 can rapidly cool the air flow.

Of course, it should be noted that, in some embodiments, the first heat sink 3 is disposed on one side of the supporting frame 20, the plurality of second heat sinks 4 are disposed on the other side of the supporting frame 20 at intervals, and the thermal insulation layer 40 and the airflow gap 50 are disposed between two adjacent second heat sinks 4. In some embodiments, the first heat sink 3 is multiple, the multiple first heat sinks 3 are disposed on one side of the supporting frame 20, the multiple second heat sinks 4 are multiple, the multiple second heat sinks 4 are disposed on the other side of the supporting frame 20 at intervals, and a thermal insulation layer 40 and an air flow gap 50 are disposed between two adjacent second heat sinks 4. An insulating layer 40 and an airflow gap 50 are also provided between two adjacent first radiators 3.

In some embodiments, as shown in fig. 1, the cabinet 1 includes a body 11 and a cabinet door 12, and the cabinet door 12 is openably and closably provided on the body 11 and is used for enclosing the thermostatic chamber 101. Therefore, the thermostatic chamber 101 can be opened through the opening and closing cabinet door 12, and a user can conveniently put a product into the thermostatic chamber 101 and take the product out of the thermostatic chamber 101.

Example (b):

as shown in fig. 1-fig. 3, the constant temperature cabinet of this embodiment includes a cabinet body 1, a semiconductor refrigeration sheet 2, a first heat sink 3, a second heat sink 4, a weighing component 5, a plurality of partition boards 6, a plurality of constant temperature chamber boards 7, a temperature control chamber board 8, a circulating fan 9, a heat dissipation fan 10, a support frame 20 and a bearing board 30, wherein a constant temperature chamber 101, a temperature control channel 102 and a heat dissipation outer chamber 103 are arranged in the cabinet body 1, the heat dissipation outer chamber 103 defines a heat dissipation channel 1031 and an outer chamber body 1032, the second heat sink 4 is arranged in the heat dissipation channel 1031, an air inlet end of the heat dissipation channel 1031 is communicated with the outer chamber body 1032, and the outer chamber body 1032 is used for accommodating an electric control element. Be equipped with the air intake 10321 that communicates with the exocoel body 1032 on the cabinet body 1 and with the air outlet 10311 of the end intercommunication of airing exhaust of radiating passage 1031, every division board 6 all sets up with the inside wall interval of the cabinet body 1, the clearance intussuseption between division board 6 and the inside wall of the cabinet body 1 is filled with the heat preservation, thermostatic chamber board 7 is established at the internal portion of cabinet and is injectd thermostatic chamber 101, thermostatic chamber board 7 sets up with division board 6 interval, and inject circulation wind channel 104 between 6 with the division board, circulation wind channel 104 and temperature-controlled passage 102 intercommunication, be equipped with a plurality of equal wind holes 71 on every division board 6, temperature-controlled passage 102 is injectd with division board 6 to temperature-controlled chamber board 8, be equipped with the circulation wind gap 81 with the intercommunication of circulation wind channel 104 on the temperature-controlled chamber board 8, circulation fan 9 is established in temperature-controlled passage 102, and correspond the setting of circulation wind gap 81. The supporting frame 20 is installed in the cabinet body 1 and located in the heat dissipation outer cavity 103, and the semiconductor cooling fin 2, the first heat sink 3 and the second heat sink 4 are all arranged on the supporting frame 20. The second heat sink 4 is disposed on one side of the supporting frame 20, the plurality of first heat sinks 3 are disposed on the other side of the supporting frame 20 at intervals, and a heat insulation layer 40 is disposed between two adjacent first heat sinks 3. The plurality of bearing plates 30 are arranged at intervals along the height direction of the constant temperature cavity 101, two weighing assemblies 5 are arranged on each bearing plate 30, and an air passing hole 301 is formed in each bearing plate 30. The heat dissipation fan 10 is disposed in the cabinet 1 and is in airflow communication with the air inlet 10321.

The utility model also discloses a semiconductor device, including the preamble constant temperature cabinet. The semiconductor device can better ensure the constant temperature of products, and has lower manufacturing cost and maintenance cost. In this embodiment, the semiconductor device may be a diffusion apparatus, an electroless plating apparatus, or other apparatuses for processing or producing semiconductors.

In the description herein, references to the description of "some embodiments," "other embodiments," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The above description is only for the preferred embodiment of the present invention, and for those skilled in the art, there are variations on the detailed description and the application scope according to the idea of the present invention, and the content of the description should not be construed as a limitation to the present invention.

Claims (10)

1. Constant temperature cabinet, its characterized in that includes:

the temperature control cabinet comprises a cabinet body (1), wherein the cabinet body (1) defines a constant temperature cavity (101), a temperature control channel (102) and a heat dissipation outer cavity (103), the temperature control channel (102) is communicated with the constant temperature cavity (101), and the heat dissipation outer cavity (103) is communicated with the external environment;

the semiconductor refrigerating piece (2), the semiconductor refrigerating piece (2) is arranged in the cabinet body (1);

the first radiator (3), the said first radiator (3) is set up in one side of the said semiconductor chilling plate (2) and located in the said temperature controlled channel (102);

the second radiator (4) is arranged on the other side of the semiconductor refrigeration piece (2) and is located in the heat dissipation outer cavity (103).

2. The constant temperature cabinet according to claim 1, characterized in that a constant temperature chamber plate (7) is arranged in the constant temperature cabinet, the constant temperature chamber plate (7) defines the constant temperature cavity (101), the constant temperature chamber plate (7) is arranged at an interval with the inner side wall of the cabinet body (1), a circulating air duct (104) is defined between the constant temperature chamber plate and the inner side wall of the cabinet body (1), the circulating air duct (104) is communicated with the temperature control channel (102), and an air equalizing hole (71) is arranged on the constant temperature chamber plate (7); and/or:

be equipped with loading board (30) in thermostatic chamber (101), loading board (30) are used for bearing the product, just be equipped with air passing hole (301) on loading board (30).

3. The constant temperature cabinet according to claim 2, characterized in that a temperature control chamber plate (8) is arranged in the constant temperature cabinet, a temperature control channel (102) is defined between the temperature control chamber plate (8) and the inner side wall of the cabinet body (1), the constant temperature cabinet further comprises a circulating fan (9), and the circulating fan (9) is arranged in the temperature control channel (102) to promote the air flow to circulate in the temperature control channel (102) and the constant temperature cavity (101).

4. The thermostatic cabinet according to claim 2, characterized in that the carrying plate (30) is in plurality, and a plurality of the carrying plates (30) divide the thermostatic chamber (101) into a plurality of sub-chambers; the air equalizing holes (71) are multiple groups, and each group of air equalizing holes (71) are used for communicating one sub-cavity with the circulating air duct (104).

5. The constant temperature cabinet according to claim 2, characterized in that the constant temperature cabinet is further provided with a partition plate (6), the partition plate (6) is arranged between the constant temperature room plate (7) and the inner side wall of the cabinet body (1), and is arranged at intervals with the constant temperature room plate (7) and the inner side wall of the cabinet body (1), and a heat insulation layer is filled in a gap between the partition plate (6) and the inner side wall of the cabinet body (1).

6. Constant temperature cabinet according to any one of claims 1 to 5, characterized in that a temperature detection member is arranged in the constant temperature cavity (101).

7. The constant temperature cabinet according to any one of claims 1 to 5, wherein the cabinet body (1) is provided with an air inlet (10321) and an air outlet (10311) which are communicated with the heat dissipation outer cavity (103), and the constant temperature cabinet further comprises a heat dissipation fan (10), and the heat dissipation fan (10) is arranged in the cabinet body (1) and is communicated with the air inlet (10321) so as to promote the air flow to sequentially circulate through the air inlet (10321), the heat dissipation outer cavity (103) and the air outlet (10311).

8. The thermostatic cabinet according to claim 7, characterized in that the heat dissipating outer chamber (103) defines a heat dissipating passage (1031) and an outer chamber body (1032), the second heat sink (4) is provided in the heat dissipating passage (1031), an air exhausting end of the heat dissipating passage (1031) communicates with the air outlet port (10311), an air inlet end of the heat dissipating passage (1031) communicates with the outer chamber body (1032), the outer chamber body (1032) communicates with the air inlet port (10321), and the outer chamber body (1032) is used for housing an electric control element.

9. The constant temperature cabinet according to claim 8, wherein the heat dissipation fan (10) is disposed at least one of the air inlet (10321), the air outlet (10311), the air exhaust end of the heat dissipation channel (1031), and the air inlet end of the heat dissipation channel (1031).

10. Semiconductor device, characterized in that it comprises a thermostatic cabinet according to any one of claims 1 to 9.

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