CN218281234U - Novel semiconductor refrigeration dehumidifier - Google Patents

Abstract

The utility model discloses a novel semiconductor refrigeration dehumidifier, the problem that influences dehumidification efficiency is put forward to current semiconductor refrigeration dehumidifier with the radiating part in semi-closed space, it includes the box, be formed with the condensation dehumidification passageway in the box, be provided with the refrigeration dehumidification system in the condensation dehumidification passageway, the refrigeration dehumidification system carries out dehumidification processing to the air current that flows through in the condensation dehumidification passageway, the refrigeration dehumidification system includes semiconductor refrigeration dehumidification component, fin and water collection sheet, semiconductor refrigeration dehumidification component includes cold terminal surface and hot terminal surface, the cold terminal surface sets up downwards and lies in the water collection sheet top, the hot terminal surface is connected with the fin that lies in the box outside; the dehumidifier also comprises a commutator used for changing the current direction of the semiconductor refrigeration and dehumidification element, so that the functions of the cold end face and the hot end face are interchanged. The utility model discloses set up the radiating part outside the casing, cooperate heat pipe and commutator simultaneously, can also realize the self-cleaning effect of cold end face when improving the radiating efficiency.

Description

Novel semiconductor refrigeration dehumidifier

Technical Field

The utility model relates to a refrigeration dehumidification equipment field specifically is a novel semiconductor refrigeration dehumidifier.

Background

A dehumidifier (dehumidifier) is a device which sucks in treated air, and after condensation, the dehumidifier realizes cooling and dehumidification. The dehumidifier is mainly divided into a compressor type and a dehumidifying wheel type, and a mixed form of the two types.

The dehumidifier is mainly applied to places for storing materials or precise instruments in industrial enterprises, the application field of the dehumidifier is continuously expanded to the civil field along with the increasing requirement of consumers on the storage of articles, and for example, the dehumidifier is provided with dehumidifying equipment in a cabinet body for storing articles such as antique calligraphy and painting, famous and precious leather (bags), red wine and the like, so that the semiconductor refrigeration type dehumidifier which is suitable for the places with smaller space, high reliability requirement and no refrigerant pollution is produced.

In order to achieve overall aesthetic appearance, the conventional semiconductor refrigeration type dehumidifier is provided with a heat dissipation end or a heat dissipation part of a semiconductor refrigeration piece in a semi-closed box body. Because the semiconductor refrigerating sheet is a thermocouple formed by connecting N-type and P-type semiconductor materials, when current passes through the semiconductor refrigerating sheet, heat transfer can be generated between the two ends only when the cold end and the hot end reach a certain temperature difference, and the heat can be transferred from one end to the other end, so that the temperature difference is generated to form the cold end and the hot end. The heat dissipation device is arranged in the box body, so that the heat dissipation effect is influenced, in order to achieve temperature difference, a fan is usually adopted for cooling the heat dissipation device, but because the fan generates heat during working, the temperature in the box body is raised in the mode, and heat transfer is influenced. Therefore, the heat dissipation device is disposed in the casing, which obviously affects the overall dehumidification efficiency of the dehumidifier.

In addition, when the existing semiconductor refrigeration dehumidifier is used, water drops are always attached to the condensation end of the dehumidifier, so that bacteria are easy to breed and mildew on the surface of the fins at the condensation end.

Disclosure of Invention

In order to solve the problem that current semiconductor refrigeration dehumidifier is located semi-enclosed space with the radiating part and influences dehumidification efficiency, the utility model provides a novel semiconductor refrigeration dehumidifier sets up the radiating part outside the casing, cooperates heat pipe and commutator simultaneously, can also realize the self-cleaning effect of cold end face when improving radiating efficiency.

In order to achieve the above purpose, the utility model discloses a following technical scheme realizes:

a novel semiconductor refrigeration dehumidifier comprises a box body, wherein a condensation dehumidification channel is formed in the box body, a refrigeration dehumidification system is arranged in the condensation dehumidification channel, the refrigeration dehumidification system is used for dehumidifying airflow flowing through the condensation dehumidification channel, the refrigeration dehumidification system comprises a semiconductor refrigeration dehumidification element, radiating fins and a water collecting plate, the semiconductor refrigeration dehumidification element comprises a cold end surface and a hot end surface, the cold end surface is arranged downwards, the hot end surface is connected with the radiating fins positioned outside the box body, and the water collecting plate is positioned below the cold end surface and used for collecting water drops dropping after the airflow is condensed through the cold end surface; the dehumidifier also comprises a commutator used for changing the current direction of the semiconductor refrigeration and dehumidification element, and the functions of the cold end face and the hot end face are interchanged.

Preferably, a heat insulation plate is arranged in the box body, the heat insulation plate divides the box body into a heat dissipation cavity located at the upper part and a condensation cavity located at the lower part, the condensation dehumidification channel is located in the condensation cavity, the hot end face of the semiconductor refrigeration dehumidification element is located in the heat dissipation cavity, and the cold end face of the semiconductor refrigeration dehumidification element is located in the condensation dehumidification channel.

Preferably, the heat end face and the heat sink realize heat transfer through a heat pipe.

Preferably, the cold end face is provided with fins formed by a plurality of metal plates arranged in parallel at intervals, and the arrangement direction of the metal plates is the same as the flow direction of the airflow.

Preferably, at least one inclined through groove is processed on the fin.

Preferably, the commutator is a double-pole double-throw switch, two groups of stationary contact groups and one group of movable contact group are arranged on the double-pole double-throw switch, each contact group comprises two contacts, the movable contact group is electrically connected with the semiconductor refrigeration and dehumidification element, the contacts in the two groups of stationary contact groups are in cross connection, and the power supply provides required electric energy for one group of stationary contact groups.

Preferably, the commutator is replaced by an air switch and a contactor which are used together.

Preferably, the opposite side walls of the box body are respectively provided with an air inlet and an air outlet, a ventilation fan and a semiconductor refrigeration dehumidifying element are arranged between the air inlet and the air outlet, and external air flow enters the box body from the air inlet and the ventilation fan and is discharged from the air outlet after heat exchange of the semiconductor refrigeration dehumidifying element, so that a condensation dehumidifying channel is formed in the box body.

Preferably, the water collection sheet is communicated with a drain pipe for draining the water collected in the water collection sheet from the cabinet.

The utility model has the advantages that:

1. the utility model discloses a set up the radiating part outside the box, the problem that current dehumidifier radiating part radiating efficiency is low has effectively been solved, and conventional fan cooling's mode has been abandoned, the noise of equipment has not only been reduced, the heat that produces when still having reduced electronic equipment uses, and simultaneously, change the direction of the semiconductor refrigeration dehumidification component current of flowing through addding the commutator, make the function realization of cold end face and hot terminal surface exchange, can effectively solve the dehumidifier condensation end and breed bacterium and mycotic problem easily, thereby reach the self-cleaning purpose of cold end face.

2. The utility model discloses the commutator of addding has that the volume is less, simple structure, design benefit, practicality are strong, be suitable for extensive characteristics in place.

3. The utility model discloses an to the improved design of fin on the cold end face, make the air current flow through behind the semiconductor refrigeration dehumidification component condensation drop more easily on the water-collecting plate to avoided the drop of water from the excessive probability of air exit, effectively improved the efficiency of dehumidification.

Drawings

FIG. 1 is a three-dimensional block diagram of the present invention;

FIG. 2 is a right side view of FIG. 1;

FIG. 3 is a left side view of FIG. 1;

fig. 4 is an internal cross-sectional view of the present invention;

FIG. 5 is a diagram of the position relationship between the cooling and dehumidifying system and the air outlet;

FIG. 6 is a diagram illustrating the position relationship between the cooling and dehumidifying system, the ventilating fan and the air inlet;

FIG. 7 is a left side view of FIG. 6;

FIG. 8 is an exploded view of FIG. 6;

FIG. 9 is a structural view of the fins on the cold end face;

FIG. 10 is a top view of FIG. 9;

FIG. 11 is a schematic diagram of a commutator;

wherein: 1. a box body; 2. a condensing and dehumidifying channel; 3. a refrigeration dehumidification system; 31. a semiconductor refrigeration dehumidifying element; 311. a cold end face; 312. a hot end face; 32. a heat sink; 33. a water collection plate; 4. an air inlet; 5. an air outlet; 6. a ventilation fan; 7. a heat pipe; 8. a commutator; 81. a stationary contact group; 82. a movable contact group; 9. an air switch; 10. a contactor; 11. a through groove.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.

Example 1

As shown in fig. 1 to 8, the utility model provides a novel semiconductor refrigeration dehumidifier, including box 1 be equipped with air inlet 4 and air exit 5 on the corresponding position of box 1 outer wall, be equipped with in air inlet 4 and inhale box 1 inside ventilator 6 with the outside air current of box 1, establish the refrigeration dehumidification system 3 that plays the condensation dehumidification effect to the air current in the passageway that forms between air inlet 4 and air exit 5 to make the interior condensation dehumidification passageway 2 that forms of box 1.

As shown in fig. 4, the refrigeration and dehumidification system 3 includes a semiconductor refrigeration and dehumidification element 31 located in the condensation and dehumidification channel 2, a heat sink 32 located outside the box 1, and a water collection plate 33 located below the semiconductor refrigeration and dehumidification element 31, in order to further optimize the flow of gas and enable the cold and hot gas flows not to interfere with each other, in this embodiment, a heat insulation plate is horizontally arranged in the box 1, the box 1 is divided into an upper chamber and a lower chamber by the heat insulation plate, that is, the upper chamber is a heat dissipation chamber, the lower chamber is a condensation chamber, and the condensation and dehumidification channel 2 is located in the condensation chamber of the lower part.

The semiconductor refrigeration dehumidifying element 31 is embedded on the heat insulation board and comprises a cold end surface 311 and a hot end surface 312, wherein the cold end surface 311 is positioned in the condensation dehumidifying channel 2 and is used for realizing condensation of air flow flowing in the condensation dehumidifying channel 2 through heat exchange, so that the aim of dehumidification is fulfilled. Preferably, in order to improve the condensation effect of the cold end surface 311, a fin formed by a plurality of metal plates arranged in parallel at intervals is attached to the cold end surface 311, and in order to avoid the fin on the cold end surface 311 from blocking the airflow in the condensation dehumidification channel 2, the arrangement direction of the metal plates in the fin is the same as the flow direction of the airflow in the condensation dehumidification channel 2. The water collecting plate 33 is located in the condensation and dehumidification channel 2 and right below the cold end surface 311, and is used for collecting water drops dropping after the cold end surface 311 is condensed, collecting the water drops and discharging the water drops from the box body 1 through a drain pipe. The hot end face 312 is located in the heat dissipation chamber and is connected to the heat sink 32 to carry away heat through the heat sink 32. In order to improve the heat dissipation efficiency of the hot end face 312, preferably, heat transfer is realized between the hot end face 312 and the heat dissipation fins 32 through a heat pipe 7, the heat pipe 7 is in the prior art, the heat pipe 7 is located at one end (i.e., the hot end) of the hot end face 312, liquid in a wick in the heat pipe is heated and vaporized, vaporized saturated vapor flows to one end (i.e., the cold end) of the heat dissipation fins 32, the saturated vapor is condensed at the cold end to release heat, the condensed liquid returns to the hot end under the capillary force of the wick to continue heat absorption and vaporization, and the heat exchange is repeated in this way, so as to achieve the purposes of improving the heat conduction speed, accelerating the efficiency of condensation and dehumidification, saving energy and reducing consumption. In order to increase the stability of the position of the heat pipe 7 on the hot end face 312, a fixing cap is provided on the heat pipe 7, said fixing cap fixing the hot end face 312. The heat sink 32 located outside the box 1 is also preferably in a fin structure, and the cold end of the heat pipe 7 is inserted and fixed in the heat sink 32.

Semiconductor refrigeration dehumidification component 31 and power electricity federation, in this embodiment, the power is for being located the outside solar panel of box 1, converts light energy into the electric energy through solar panel, then provides required electric energy for semiconductor refrigeration dehumidification component 31 again to reach energy-conserving loss reduction, green's purpose.

The working process is as follows:

after the semiconductor refrigeration dehumidifying element 31 is electrified to work, the hot end surface 312 conducts heat to the radiating fins 32, the heat is volatilized through the radiating fins 32, the temperature of the cold end surface 311 is reduced to a dew point, wet air is introduced into the condensation dehumidifying channel 2 through the air exchange fan 6 arranged on the air inlet 4, moisture in the wet air is subjected to heat exchange and condensation when flowing through the surfaces of the fins on the cold end surface 311, condensed water drops drip and are collected in the water collecting plate 33, then the condensed water drops are discharged out of the box body 1 through the water discharging pipe 35, and dry air subjected to condensation dehumidification is discharged from the air outlet 5 so as to achieve the purpose of dehumidification.

Example 2

In this embodiment, on the basis of embodiment 1, the commutator 8 is additionally provided, and the direction of the current flowing through the semiconductor cooling and dehumidifying element 31 can be changed by the commutator 8, so that even if the functions of the cold end surface 311 and the hot end surface 312 are exchanged, that is, the original cold end surface 311 heats and the original hot end surface 312 cools.

The commutator 8 selected in this embodiment is a double-pole double-throw switch, the double-pole double-throw switch is respectively provided with two groups of stationary contacts 81 and moving contacts 82, each group of the stationary contacts 82 comprises two contacts, the contacts in the two groups of the stationary contacts 82 are connected in a cross manner through conducting wires, and one group of the stationary contacts 82 is electrically connected with a power supply. The movable contact group 83 is a group and comprises two contacts, and the movable contact group 83 is connected with the semiconductor refrigerating and dehumidifying element 31. By connecting the double pole double throw switch with different sets of stationary contacts 82, the direction of the current flow can be changed. The installation positions of the stationary contact group 82 and the movable contact group 83 and the distance between the positions are not limited to a specific value in the case of the same circuit topology.

After the reversing heating, the original cold end surface 311 fins are attached to water drops which are not dripped into the water collecting plate 33 to be heated and dried, the bacteria breeding is reduced through heating and sterilizing the water drops, and meanwhile, the original cold end surface 311 can be dried and recycled.

Example 3

In this embodiment, on the basis of embodiment 2, the air switch 9 and the contactor 10 are used to replace the commutator 8 in embodiment 2, and the circuit switching and interlocking switching circuit driven by the electromagnetic coil is realized through the cooperation of the air switch 9 and the contactor 10.

Example 4

In the embodiment 1-3, the water collecting plate 33 is disposed below the fins on the cold end surface 311, when the wet air passes through the fins on the cold end surface 311, the water in the air condenses into water drops due to heat exchange, and flows along the direction of the metal plate toward the water collecting plate 33 under the action of gravity, and meanwhile, under the action of the ventilating fan 6, the wet air outside the box 1 is sucked into the condensation dehumidification channel 2, but because the ventilating fan 6 and the fins on the cold end surface 311 and the air outlet are in the same air flow channel, the water drops condensed on the fins on the cold end surface 311 are influenced by the ventilating fan 6 before dropping, and are blown toward the air outlet 5, and are easily blown out from the box 1, thereby influencing the dehumidification effect of the air. Therefore, in the present embodiment, based on the foregoing embodiment, the fins on the cold end surface 311 are optimized, so that the condensed water droplets can drop from the fins into the water collecting plate 33 as soon as possible, thereby avoiding the probability of blowing out the water droplets from the air outlet 5, and improving the dehumidification efficiency.

In the present embodiment, through grooves 11 are formed in the fins of the cold end surface 311 in an inclined manner, and the number of the through grooves 11 can be set according to the size of the fins. Preferably, the through grooves 11 are machined along the diagonal lines of the fins, so that each metal plate is machined with an inclined surface with a larger inclination. When the water drops flow over the surface of the metal plate, a wall attachment effect can be generated, so that when the curvature is not large, the water drops can flow downwards along the height direction of the metal plate, but the water drops flowing on the metal plate move towards the direction of the air outlet 5 in the flowing process due to the blowing of the ventilating fan 6, when the water drops move to the position of the inclined plane on the metal plate, the original flowing direction of the water drops is changed due to the sudden increase of the curvature, and according to the Newton's third law, the inclined plane on the metal plate applies a deflection force to the water drops, so that the water drops are quickly separated from the metal plate, and the water drops quickly fall into the water collecting plate 33.

The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.

Claims (9)

1. The novel semiconductor refrigeration dehumidifier comprises a box body (1), wherein a condensation dehumidification channel (2) is formed in the box body (1), and a refrigeration dehumidification system (3) is arranged in the condensation dehumidification channel (2), the refrigeration dehumidification system (3) is used for dehumidifying airflow flowing through the condensation dehumidification channel (2), and the novel semiconductor refrigeration dehumidifier is characterized in that the refrigeration dehumidification system (3) comprises a semiconductor refrigeration dehumidification element (31), cooling fins (32) and a water collection plate (33), the semiconductor refrigeration dehumidification element (31) comprises a cold end surface (311) and a hot end surface (312), the cold end surface (311) is arranged downwards, the hot end surface (312) is connected with the cooling fins (32) positioned outside the box body (1), and the water collection plate (33) is positioned below the cold end surface (311) and used for collecting water drops dropping after the airflow is condensed through the cold end surface (311); the dehumidifier also comprises a commutator (8) used for changing the current direction of the semiconductor refrigeration and dehumidification element (31), and the functions of the cold end surface (311) and the hot end surface (312) are interchanged.

2. The novel semiconductor refrigeration dehumidifier as claimed in claim 1, wherein a heat insulation board is arranged in the box body (1), the heat insulation board divides the box body (1) into a heat dissipation cavity at the upper part and a condensation cavity at the lower part, the condensation dehumidification channel (2) is located in the condensation cavity, the hot end surface (312) of the semiconductor refrigeration dehumidification element (31) is located in the heat dissipation cavity, and the cold end surface (311) of the semiconductor refrigeration dehumidification element (31) is located in the condensation dehumidification channel (2).

3. A novel semiconductor refrigerated dehumidifier as claimed in claim 2 wherein the hot end face (312) and the heat sink (32) are in thermal communication via heat pipes (7).

4. A novel semiconductor dehumidifier according to claim 1 wherein the cold side (311) is provided with fins comprising a plurality of metal plates spaced side-by-side, and the direction of the metal plates is the same as the direction of the air flow.

5. A novel semiconductor refrigeration dehumidifier as claimed in claim 4 wherein at least one inclined through slot (11) is formed in the fin.

6. The novel semiconductor refrigeration dehumidifier as claimed in claim 1, wherein the commutator (8) is a double-pole double-throw switch, two groups of stationary contacts (81) and one group of moving contacts (82) are arranged on the double-pole double-throw switch, each group of contacts comprises two contacts, the moving contacts (82) are electrically connected with the semiconductor refrigeration dehumidifier element (31), the contacts in the two groups of stationary contacts (81) are cross-connected, and a power supply supplies required electric energy to one group of stationary contacts (81).

7. A novel semiconductor refrigerated dehumidifier as claimed in claim 6 wherein the commutator (8) is replaceable by cooperating air switches (9) and contactors (10).

8. The novel semiconductor refrigeration and dehumidification device according to any one of claims 1 to 7, wherein an air inlet (4) and an air outlet (5) are respectively formed on opposite side walls of the box body (1), a ventilation fan (6) and a semiconductor refrigeration and dehumidification element (31) are arranged between the air inlet (4) and the air outlet (5), external air flows enter the box body (1) from the air inlet (4) and the ventilation fan (6), and are exhausted from the air outlet (5) after heat exchange of the semiconductor refrigeration and dehumidification element (31), so that a condensation and dehumidification channel (2) is formed in the box body (1).

9. A novel semiconductor dehumidifier according to claim 8 wherein the water collection sheet (33) is in communication with a drain for draining water collected in the water collection sheet (33) from the tank (1).

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