CN218274550U

CN218274550U - Wafer conveying device

Info

Publication number: CN218274550U
Application number: CN202222571413.8U
Authority: CN
Inventors: 李连超; 林晓晖; 赵森
Original assignee: TSMC China Co Ltd; Taiwan Semiconductor Manufacturing Co TSMC Ltd
Current assignee: TSMC China Co Ltd; Taiwan Semiconductor Manufacturing Co TSMC Ltd
Priority date: 2022-09-27
Filing date: 2022-09-27
Publication date: 2023-01-10
Anticipated expiration: 2032-09-27
Also published as: WO2024065862A1

Abstract

The application relates to a wafer handling device includes: cylinder assembly and lid subassembly. The cylinder assembly comprises a cylinder body and a lifting rod movably connected to the cylinder body along the longitudinal direction. The cover body assembly is sleeved on the air cylinder assembly and connected to the lifting rod, and the cover body assembly follows up with the lifting rod in the air cylinder assembly operation mode and can cover the periphery of the connecting part of the lifting rod and the cylinder body at least from beginning. The embodiment of the application can effectively restrain the scattering direction of particles, improve the space utilization rate of the cover body assembly, miniaturize the cover body assembly and further improve the reliability of the wafer carrying device.

Description

Wafer conveying device

Technical Field

The application relates to the field of photoelectric technology, in particular to a wafer handling device.

Background

With the rapid development of the optoelectronic technology, the demand of the wafer is also becoming more and more. In many wafer manufacturing processes, it is necessary to prevent foreign materials from adhering to the wafer.

However, some processing machines in some processes still have to be used as standard-compliant machines after a long time of operation, but these processing machines may generate fine impurities such as particles during operation, which may cause contamination of wafers and thus decrease of wafer yield

Disclosure of Invention

The wafer carrying device provided by the embodiment of the application can effectively avoid the influence of impurities generated by a processing machine on the wafer in the process of manufacturing the wafer, thereby improving the yield of the wafer.

In one aspect, an embodiment of the present application provides a wafer handling device including: cylinder assembly and lid subassembly. The cylinder assembly comprises a cylinder body and a lifting rod movably connected to the cylinder body along the longitudinal direction. The cover body assembly is sleeved on the air cylinder assembly and connected to the lifting rod, and the cover body assembly follows up with the lifting rod in the air cylinder assembly operation mode and can cover the periphery of the connecting part of the lifting rod and the cylinder body at least from beginning.

According to an aspect of the embodiment of the application, the cover body assembly comprises a top cover and a plurality of side walls connected to the top cover, and the top cover is connected with one end, facing away from the cylinder body, of the lifting rod.

According to one aspect of the embodiment of the application, the device further comprises a load assembly connected with the lifting rod.

According to an aspect of the embodiment of the present application, at least one of the side walls includes a first opening, and the partial load device is fixedly connected to the lifting rod through the first opening.

According to an aspect of the embodiment of the present application, the sidewall further includes a second opening, and the second opening and the first opening are located at opposite sidewalls, respectively.

According to one aspect of an embodiment of the present application, a dimension of the sidewall in the longitudinal direction is less than or equal to a dimension of the cylinder assembly in the longitudinal direction.

According to one aspect of an embodiment of the present application, the first opening is located on a side of the sidewall adjacent the top cover.

According to an aspect of the embodiment of the application, the cylinder assembly comprises a guide rod, the cylinder body comprises a guide hole, the guide rod is located in the guide hole, one end of the guide rod, which is back to the cylinder body, is at least partially connected with one end of the lifting rod, which is back to the cylinder body, and the extending direction of the guide rod is parallel to the extending direction of the lifting rod.

According to an aspect of the embodiment of the present application, the wafer handling device further includes a fixing assembly located on a side of the cylinder assembly facing away from the cover assembly.

According to an aspect of the embodiment of the present application, the fixing member includes a first through hole penetrating the fixing member in the longitudinal direction, the first through hole being provided corresponding to the guide hole.

According to an aspect of the embodiment of the present application, the fixing member further includes a second through hole extending along the first direction, the first through hole communicates with the second through hole, and the first direction intersects with the longitudinal direction.

According to the utility model provides a wafer handling device, the lid subassembly is established to the cover on the cylinder subassembly, and the lid subassembly can cover down the lifter and the cylinder body connecting portion all the time under cylinder subassembly operation mode to avoid the particulate matter that lifter and cylinder body friction produced to scatter to wafer operation platform on, can effectively retrain the scattering direction of particulate matter. And the cover body assembly moves along with the lifting rod, so that a large opening for connecting and moving the lifting rod and other parts is prevented from being formed in the cover body, the space utilization rate of the cover body assembly is improved, the cover body assembly is miniaturized, and the reliability of the wafer carrying device is further improved.

Drawings

Features, advantages and technical effects of exemplary embodiments of the present application will be described below with reference to the accompanying drawings.

FIG. 1 is a schematic view of a wafer handler according to an embodiment of the present disclosure;

FIG. 2 is a schematic view of another exemplary embodiment of a wafer handler;

fig. 3 is a schematic view illustrating a structure of a cover assembly of a wafer handler according to an embodiment of the disclosure;

fig. 4 is a schematic view illustrating a cover assembly of the wafer handler according to another embodiment of the present disclosure;

fig. 5 is a schematic view illustrating a structure of a fixing member of the wafer handler according to an embodiment of the present disclosure;

fig. 6 is a schematic side view of another wafer handler according to an embodiment of the present disclosure.

Description of the labeling:

1. a wafer handling device;

10. a cylinder assembly; 11. a cylinder body; 111. a guide hole; 112. sealing the hole; 12. a lifting rod; 13. a guide bar; 14. a connecting member;

20. a cover assembly; 21. a top cover; 22. a side wall; 221. a first opening; 222. a second opening;

30. a load device;

40. a fixing assembly; 41. a bearing part; 42. a limiting part; 43. a fixed part; 44. a first through hole; 45. a second through hole;

x, longitudinal direction; y, a first direction.

In the drawings, like parts are provided with like reference numerals. The figures are not drawn to scale.

Detailed Description

Features and exemplary embodiments of various aspects of the present application will be described in detail below, and in order to make objects, technical solutions and advantages of the present application more apparent, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are intended to be illustrative only and are not intended to be limiting. It will be apparent to one skilled in the art that the present application may be practiced without some of these specific details. The following description of the embodiments is merely intended to provide a better understanding of the present application by illustrating examples thereof.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrases "comprising 8230; \8230;" comprises 8230; "does not exclude the presence of additional like elements in a process, method, article, or apparatus that comprises the element.

For a better understanding of the present application, the first aspect is described in detail below with reference to fig. 1 to 6 according to an embodiment of the present application.

Fig. 1 is a schematic structural diagram of an operation mode of a wafer handler according to an embodiment of the present disclosure. Fig. 2 is a schematic structural diagram of another operation mode of the wafer handling device according to the embodiment of the present disclosure.

As shown in fig. 1 and 2, an embodiment of the present application provides a wafer handling device 1 including: a cylinder assembly 10 and a cover assembly 20. The cylinder assembly 10 includes a cylinder block 11 and a lift rod 12 movably connected to the cylinder block 11 in a longitudinal direction X. The cover assembly 20 is sleeved on the cylinder assembly 10, is connected to the lifting rod 12, and follows the lifting rod 12 in the operation mode of the cylinder assembly 10 and can at least cover the periphery of the connection part between the lifting rod 12 and the cylinder body 11.

In some optional embodiments of the present application, the wafer handling device 1 may be applied to a processing machine for wafers, and the cylinder on the processing machine is shielded, so as to prevent impurities generated by friction between the lifting rod 12 and the cylinder 11 in the operation mode from scattering onto the operation platform for wafers.

The cylinder assembly 10 is composed of a cylinder block 11 and a movable lift rod 12, and the lift rod 12 moves in the longitudinal direction X in the cylinder block 11 to drive other components for work. Alternatively, the cylinder assembly 10 may be placed perpendicular to a horizontal plane in a wafer processing machine to allow the lift pins 12 to move vertically with respect to the horizontal plane. The cylinder assembly 10 may also be placed parallel to a horizontal plane in a wafer processing machine to allow the lift pins 12 to move horizontally relative to the horizontal plane. The cylinder assembly 10 may also be positioned at an angle to the horizontal in a wafer processing machine to move the lift pins 12 in a predetermined direction. In order to improve the driving force of the cylinder assembly 10, a plurality of lift pins 12 may be provided in the cylinder assembly 10.

The present embodiment is not limited to the type of cylinder assembly 10, and the cylinder assembly 10 is, for example, a single-acting cylinder, a double-acting cylinder, or other cylinders. It should be noted that the cylinder assembly 10 in the drawings of the present application shows only a part of the structure of the cylinder assembly 10.

The cover assembly 20 is sleeved on the cylinder assembly 10 and used for shielding the peripheral side area of the connecting part of the lifting rod 12 and the cylinder body 11 in the cylinder assembly 10. As some alternative embodiments, the cover assembly 20 covers all of the peripheral sides of the cylinder assembly 10. As other alternative embodiments, the cover assembly 20 reserves a certain area on the peripheral side of the cylinder assembly 10, so that particulate matters generated by abrasion of the lifting rod 12 can escape through the reserved area, impurities can be effectively collected, and the impurities are prevented from influencing the surrounding environment of the operation.

The cover assembly 20 is connected to the lifting rod 12 and moves along with the lifting rod 12, and optionally, the cover assembly 20 may be fixedly connected to the lifting rod 12 by bolts, welding, adhesion, or the like.

The cover assembly 20 moves with the lifting rod 12, in some optional examples, the part driven by the cylinder assembly 10 may be fixedly connected with the lifting rod 12, an opening capable of extending the part driven by the cylinder assembly 10 into the space of the cover assembly 20 is formed in the cover assembly 20, and the part driven by the cylinder is fixedly connected with the lifting rod 12 and the cover assembly 20, so as to increase the connection strength between the part driven by the cylinder assembly 10 and the cylinder assembly 10. In other alternative examples, the components driven by the cylinder assembly 10 may be fixedly attached to the cover assembly 20 to avoid providing an escape opening in the cover assembly 20.

It will be appreciated that the lifting rod 12 has a predetermined distance of travel in the working mode, and that the cover assembly 20 has a dimension in the longitudinal direction X that exceeds the connection between the lifting rod 12 and the cylinder 11 when the lifting rod 12 is lifted to its maximum travel, thereby effectively blocking this area.

As some optional embodiments, when the wafer transportation apparatus 1 is used in a machine for wafer exposure process, the cover assembly 20 may be subjected to an electrophoretic polishing process and pure black treatment on its outer surface, so as to avoid light reflection and meet the light shielding requirement of the wafer exposure unit.

According to a wafer handling device 1 that this application provided, cover body assembly 20 is established to the cover on cylinder assembly 10, and cover body assembly 20 can cover the

lifter

12 and 11 connecting portion of cylinder body all the time under cylinder assembly 10 mode of operation to avoid the particulate matter that lifter 12 and 11 frictions of cylinder body produced to scatter to the wafer work platform on, can effectively retrain the scattering direction of particulate matter. And the cover assembly 20 moves along with the lifting rod 12, so that a large opening for connecting and moving the lifting rod 12 and other components is avoided, and the reliability of the wafer carrying device 1 is further improved.

Fig. 3 is a schematic view of a cover assembly of a wafer handler according to an embodiment of the present disclosure.

As shown in fig. 1 to 3, the cover assembly 20 includes a top cover 21 and a plurality of side walls 22 connected to the top cover 21, and the top cover 21 is connected to an end of the lift rod 12 facing away from the cylinder 11.

In some alternative embodiments of the present application, the top cover 21 encloses a plurality of side walls 22 to limit the escape of particulate matter generated in the cylinder assembly 10 from the upper side and the peripheral side of the cylinder assembly 10.

As some alternative embodiments, the plurality of sidewalls 22 may enclose to form a rectangular frame, a square frame, a circular frame, or other shaped frame. The plurality of side walls 22 may be fixed by bolts, welding, bonding, or the like, and similarly, the fixing may be performed between the top cover 21 and the plurality of side walls 22 and between the top cover 21 and the lift pins 12.

Alternatively, the cover assembly 20 needs to move along with the lifting rod 12, the top cover 21 is used as a part for following the movement, and the top cover 21 and the end of the lifting rod 12 opposite to the cylinder 11 can be arranged in an abutting mode. The top cover 21 and the end of the lifting rod 12 opposite to the cylinder 11 can be arranged at intervals, and a space is reserved for clamping components driven by the air discharging cylinder assembly 10.

It should be noted that the side wall 22 is used for shielding the circumferential side of the cylinder assembly 10, and a certain gap is formed between the side wall 22 and the circumferential side of the cylinder assembly 10, so as to prevent the side wall 22 and the cylinder assembly 10 from rubbing during the movement of the cover assembly 20, and reduce the possibility that the side wall 22 may damage the cylinder assembly 10. Optionally, the gap between the sidewall 22 and the cylinder assembly 10 is 0.1 mm-2 cm.

As shown in fig. 1, a loading device 30 is further included and is connected to the lifting rod 12.

As some alternative embodiments, a larger area end is provided on the lifter 12, and the load assembly is fixedly connected to the end of the lifter 12. As other alternative embodiments, a through hole or a threaded hole is provided in the load module such that one end of the lifting rod 12 protrudes into the through hole or the threaded hole, thereby reducing the assembly space.

In some alternative embodiments of the present application, the loading device 30 is used for carrying or loading wafers. The loading device 30 is fixedly connected to the lifting rod 12 so that the loading device 30 can move along with the lifting rod 12.

As shown in fig. 1 to 3, at least one of the side walls 22 includes a first opening 221, and the partial load device 30 is fixedly connected to the lifting rod 12 through the first opening 221.

Alternatively, the first opening 221 may be provided on one side wall 22; the first openings 221 may be provided on the plurality of side walls 22, and the first openings 221 on the plurality of side walls 22 may be communicated.

In some alternative embodiments of the present application, the partial-load device 30 enters the inner space of the cover assembly 20 through the first opening 221 and is fixedly connected to the lifting rod 12. It can be understood that the maximum profile of the loading device 30 extending into the first opening 221 is similar to the profile of the first opening 221, so as to reduce the gap between the loading device 30 and the first opening 221, and further improve the reliability of the wafer handling device 1.

Fig. 4 is a schematic view of another perspective structure of a cover assembly of a wafer handling device according to an embodiment of the disclosure.

As shown in fig. 1, 2 and 4, the sidewall 22 further includes a second opening 222, and the second opening 222 and the first opening 221 are respectively located on the opposite sidewall 22.

As some alternative embodiments, the shape of the second opening 222 includes a polygon such as a rectangle, a circle, a diamond, and the like.

It should be noted that a transparent plate that can be opened or closed may be disposed over second opening 222 to prevent particles generated by wear of cylinder assembly 10 from escaping through second opening 222.

In some alternative embodiments of the present application, the second opening 222 in the side wall 22 may be used as a viewing window for maintenance personnel; the second opening 222 in the side wall 22 may also be used as a service window for service personnel. The first opening 221 and the second opening 222 are oppositely arranged, so that a maintenance worker can not interfere with the operation platform of the wafer when examining or observing the operation condition of the cylinder assembly 10.

In some alternative embodiments, the second opening 222 may be provided at a position where the lift rod 12 is moved in order to facilitate the operation of a service worker, so as to observe whether particles are generated at the connection portion of the lift rod 12 and the cylinder 11.

As shown in fig. 1 and 2, the dimension of the side wall 22 in the longitudinal direction X is equal to or less than the dimension of the cylinder assembly 10 in the longitudinal direction X to avoid interference of the side wall 22 with surrounding components when the cylinder assembly 10 is not in the operating mode.

It will be appreciated that the greater the dimension of the side wall 22 in the longitudinal direction X, the less likely particulate matter generated by the cylinder assembly 10 will escape from the peripheral side of the cylinder assembly 10 without exceeding the dimension of the cylinder assembly 10 in the longitudinal direction X.

As shown in fig. 1 and 2, the first opening 221 is located on a side of the side wall 22 close to the top cover 21. It will be appreciated that the closer the first opening 221 is to the top cover 21, the smaller the spacing between the load device 30 and the top cover 21, and the more convenient the fixed connection between the top cover 21 and the end of the lifter bar 12 and the load device 30.

Fig. 5 is a schematic view of a fixing element of the wafer handler according to an embodiment of the present disclosure. (cover assembly not shown)

As shown in fig. 1 and 5, the cylinder assembly 10 includes a guide rod 13, the cylinder 11 includes a guide hole 111, the guide rod 13 is located in the guide hole 111, an end of the guide rod 13 facing away from the cylinder 11 is at least partially connected to an end of the lifting rod 12 facing away from the cylinder 11, and an extending direction of the guide rod 13 is parallel to an extending direction of the lifting rod 12.

In some alternative embodiments, the cylinder assembly 10 includes the lifting rod 12 and the guide rod 13, wherein part of the lifting rod 12 is located in the closed hole 112 in the cylinder body 1, and the action of the lifting rod 12 is controlled by the flowing medium, so as to realize the regulation of the external device. Part of the guide rod 13 is located in the guide hole 111 of the cylinder 11, and guides the operation of the lift rod 12, and the guide rod 13 is controlled without a flowing medium. It should be noted that, the guide rod 13 may generate a certain degree of air pressure in the guide hole 111 during the moving process, because the guide rod 13 is connected to the lifting rod 12 and the movement of the lifting rod 12 may drive the movement of the guide rod 13, the air pressure in the guide hole 111 may hinder the movement of the lifting rod 12, and the work efficiency of the lifting rod 12 is reduced, therefore, it is desirable that the guide hole 111 is of a through hole structure, and the air pressure generated during the moving process of the guide rod 13 in the guide hole 111 may be discharged into the external environment through the through hole.

As some alternative embodiments, a check valve may be disposed inside the guide hole 111 to prevent foreign substances from entering the cylinder 11 through the guide hole 111. In some alternative embodiments, the end of the guide rod 13 facing away from the cylinder 11 and the end of the lifting rod 12 facing away from the cylinder 11 may be connected by a connecting member 14. Alternatively, the connecting member 14 is integrally formed with the end of the guide rod 13 facing away from the cylinder 11 and the end of the lifting rod 12 facing away from the cylinder 11. The connecting part 14 and one end of the guide rod 13 departing from the cylinder 11 and one end of the lifting rod 12 departing from the cylinder 11 are of a split structure.

As shown in fig. 1, 2, 5 and 6, the wafer carrying apparatus 1 further includes a fixing member 40, and the fixing member 40 is located on a side of the cylinder assembly 10 facing away from the cover assembly 20.

In some alternative embodiments of the present application, the fixing assembly 40 has a bearing portion 41 and a limiting portion 42, the bearing portion 41 of the fixing assembly 40 is used for bearing the cylinder assembly 10, and the limiting portion 42 of the fixing assembly 40 is used for limiting the installation area of the cylinder assembly 10 on the fixing assembly 40, so as to simplify the installation process of the cylinder assembly 10.

As some alternative embodiments, the fixing assembly 40 and the cylinder assembly 10 may be fixedly connected by bolts, welding, bonding, etc. As other alternative embodiments, a snap groove may be provided in the fixing member 40 to snap the cylinder member 10 into the snap groove.

When the wafer transporting apparatus 1 is applied to a wafer processing machine, the fixing component 40 further has a fixing portion 43, and the fixing component 40 can be fixedly connected to the machine through the fixing portion 43.

Optionally, the fixing component 40 may be fixedly connected to the working table of the machine table; the fixing component 40 can be fixedly connected with the side wall surface of the working table surface of the machine table; the fixing component 40 can be fixedly connected with the top surface of the machine table opposite to the working table surface.

In the present embodiment, by disposing the fixing member 40 on the side of the cylinder assembly 10 facing away from the cover member 20, the circumferential side of the cylinder assembly 10 has a sufficient space for the movement of the cover member 20 in the longitudinal direction X, and the possibility of interference between the cover member 20 and the fixing member 40 during the movement of the cover member 20 in the longitudinal direction X is reduced.

As shown in fig. 1, 5 and 6, the fixing member 40 includes a first through hole 44, the first through hole 44 penetrates the fixing member 40 along the longitudinal direction X, and the first through hole 44 is disposed corresponding to the guide hole 111.

The first through hole 44 of the fixing component 40 is disposed corresponding to the guiding hole 111 of the cylinder 11, so that the air pressure can be dissipated through the fixing component 40, and the distance between the air dissipation position and the cover body is increased, thereby preventing the air from blowing the external impurities into the cover body component 20.

As shown in fig. 6, the fixing assembly 40 further includes a second through hole 45, the second through hole 45 extends along a first direction Y, the first through hole 44 communicates with the second through hole 45, and the first direction Y intersects with the longitudinal direction X.

In some optional embodiments of the present application, the second through hole 45 may guide the gas in the first through hole 44 out of the fixing assembly 40, so as to reduce the possibility of forming the gas pressure in the first through hole 44, and the second through hole 45 may change the direction of the gas leaking out from the cylinder 11, so that the gas can flow in a predetermined direction, thereby further improving the reliability of the wafer carrying apparatus 1.

Alternatively, second through hole 45 may be located on a side of fixing member 40 facing away from cylinder assembly 10.

While the application has been described with reference to a preferred embodiment, various modifications may be made and equivalents may be substituted for elements thereof without departing from the scope of the application. In particular, the technical features mentioned in the embodiments can be combined in any way as long as there is no structural conflict. The present application is not intended to be limited to the particular embodiments disclosed herein but is to cover all embodiments that may fall within the scope of the appended claims.

Claims

1. A wafer handler, comprising:

the cylinder assembly comprises a cylinder body and a lifting rod movably connected to the cylinder body along the longitudinal direction;

and the cover body assembly is sleeved on the air cylinder assembly and is connected with the lifting rod, and the cover body assembly is in follow-up with the lifting rod in the operation mode of the air cylinder assembly and can at least cover the periphery of the connecting part of the lifting rod and the cylinder body from the beginning.

2. The wafer handling device of claim 1, wherein the cover assembly comprises a top cover and a plurality of side walls connected to the top cover, the top cover being connected to an end of the lift rod facing away from the cylinder.

3. The wafer handling device of claim 2, further comprising a load device coupled to the lift pins.

4. The wafer handling device of claim 3, wherein at least one of the sidewalls includes a first opening therein, and wherein a portion of the load device is fixedly coupled to the lift pins through the first opening.

5. The wafer handling device of claim 4, wherein the sidewall further comprises a second opening, the second opening and the first opening being located on the opposite sidewall.

6. The wafer handling device of claim 2, wherein a dimension of the sidewall in the longitudinal direction is less than or equal to a dimension of the cylinder assembly in the longitudinal direction.

7. The wafer handling device of claim 4, wherein the first opening is located on a side of the sidewall proximate the top cover.

8. The wafer handling device of claim 1, wherein the cylinder assembly comprises a guide rod, the cylinder body comprises a guide hole, the guide rod is located in the guide hole, an end of the guide rod facing away from the cylinder body is at least partially connected to an end of the lifting rod facing away from the cylinder body, and an extending direction of the guide rod is parallel to an extending direction of the lifting rod.

9. The wafer handling device of claim 8, further comprising a retaining assembly located on a side of the cylinder assembly facing away from the cover assembly.

10. The wafer handling device of claim 9, wherein the fixing member includes a first through hole extending through the fixing member in a longitudinal direction, the first through hole being disposed to correspond to the guide hole.

11. The wafer handling device of claim 10, wherein the mounting assembly further comprises a second through hole extending along a first direction, the first through hole communicating with the second through hole, the first direction intersecting the longitudinal direction.