CN218225001U - Novel circuit board is with automatic point tin cream device - Google Patents
Novel circuit board is with automatic point tin cream device Download PDFInfo
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- CN218225001U CN218225001U CN202222595351.4U CN202222595351U CN218225001U CN 218225001 U CN218225001 U CN 218225001U CN 202222595351 U CN202222595351 U CN 202222595351U CN 218225001 U CN218225001 U CN 218225001U
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- tin cream
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Abstract
The utility model relates to a novel circuit board is with automatic point tin cream device, including the master control platform, the support is installed to the master control platform. The utility model discloses a set up a plurality of point tin cream guns and conveyer pipe, set up the tin cream that a plurality of point tin cream guns of storage need be used of storage box storage, deliver through the conveyer pump, the front and back running gear drives processing platform and top circuit board and moves forward and backward, and upper and lower running gear drives some tin cream guns and goes up and down, can satisfy some tin cream work of a plurality of circuit boards once, the effectual some tin cream work efficiency who improves the circuit board; the storage box is arranged to store the solder paste used by the plurality of the point solder paste guns, and only one-time replacement is needed without replacing the plurality of the point solder paste guns, so that the time for replacing the solder paste is not greatly increased while the efficiency of the plurality of the point solder paste guns for adding the solder paste to the circuit board is improved; the positions of a plurality of point solder paste guns can be adjusted by arranging the adjusting assembly, so that the solder paste operation of each position on the top of the circuit board is met.
Description
Technical Field
The utility model relates to a circuit board processing technology field specifically is a novel circuit board is with automatic point tin cream device.
Background
The Circuit board can be called as a Printed Circuit board or a Printed Circuit board, a PCB (Flexible Printed Circuit board) FPC Circuit board (the FPC Circuit board is also called as a Flexible Circuit board which is a Flexible Printed Circuit board which is made of polyimide or polyester film as a base material and has high reliability and excellent flexibility; the solder paste is a paste mixture formed by mixing solder powder, soldering flux and other surfactants, thixotropic agents and the like, and is mainly used for welding electronic components such as PCB surface resistance, capacitance, IC and the like in the SMT industry; the automatic solder paste dispensing device comprises a workbench, a numerical control unit and a solder paste dispensing unit, wherein the numerical control unit comprises an X-axis travelling mechanism, a Y-axis travelling mechanism, a Z-axis travelling mechanism and a driving mechanism, the workbench is arranged on the X-axis travelling mechanism, the solder paste dispensing unit is arranged on the driving mechanism, the uniformity of the solder paste is good, the efficiency is 30 times of that of manual operation, the requirement on the proficiency of workers is low, the labor intensity is reduced, the published patent No. CN 1699285U discloses the automatic solder paste dispensing device which comprises a shell, the inner side wall of the shell is fixedly connected with a first step motor linear guide rail, the surface of the first step motor linear guide rail is connected with a first through stepping motor in a sliding manner, first run-through step motor's last fixed surface is connected with the operation panel, the equal fixedly connected with fixed block of front and back side of edgewise on the casing, two the opposite face fixedly connected with second step motor linear guide of fixed block, second step motor linear guide's surperficial sliding connection has second run-through step motor. The automatic solder paste dispensing device is convenient for extruding the piston ring uniformly by the extruding cylinder, the solder paste barrel, the piston ring and the gun head, so that the solder paste in the solder paste barrel is uniformly coated on the surface of a workpiece by the gun head, and the gun head can move in three axes, thereby the automatic solder paste dispensing device not only dispenses the solder paste more uniformly, but also greatly increases the working efficiency;
in summary, in the two patents, both the two patents have a walking function, but a single solder paste dispensing gun is also adopted, and during the solder paste dispensing process, the single solder paste dispensing gun is only used for solder paste dispensing operation, which cannot meet the solder paste dispensing operation of a plurality of circuit boards at one time, so that the solder paste dispensing efficiency of the device is low, and therefore, the solder paste dispensing efficiency of the device to the circuit boards is still to be improved;
therefore, in order to solve the problems mentioned above, a novel automatic solder paste dispensing device for circuit boards is proposed.
SUMMERY OF THE UTILITY MODEL
The utility model discloses to the technical problem who exists among the prior art, provide a novel circuit board is with automatic some tin cream device, solved present circuit board and adopted single some tin cream rifle to carry out the problem that some tin cream is inefficient with full-automatic some tin cream device.
This patent is through setting up a plurality of some tin cream guns and conveyer pipe, save the tin cream through single storage box, the running gear goes up and down and the processing platform of circuit board is placed in control to running gear control point tin cream gun goes up and down carries out the back-and-forth movement about the cooperation is carried to delivery pump and conveyer pipe, can once satisfy the some tin cream work of a plurality of circuit boards, overcome present circuit board and adopted single some tin cream rifle to carry out the problem that some tin cream is inefficiency with full-automatic some tin cream device, thereby the some tin cream device of circuit board has been improved.
The utility model provides an above-mentioned technical problem's technical scheme as follows: the utility model provides a novel circuit board is with automatic some tin cream device, includes the master control platform, the support is installed to the master control platform, one side of support is equipped with adjusting part, running gear around adjusting part's bottom is equipped with, running gear about one side of support still is equipped with, running gear's one side bolt joint has the storage box about the support is kept away from, the inside of storage box is embedded to have the baffle, the baffle be equipped with the delivery pump of storage box inner chamber bottom bolt joint, the end of drawing water and baffle intercommunication of delivery pump, the play water end of delivery pump runs through to one side and the intercommunication of baffle has a collection pipe, the surface intercommunication of collection pipe has four conveyer pipes, the conveyer pipe is kept away from the one end of collection pipe and is run through to the top of storage box and feeds through some tin cream rifle.
On the basis of the technical scheme, the utility model discloses can also do following improvement.
Furthermore, the adjusting component comprises a connecting plate, a fixing frame is arranged at the top of the connecting plate, and fixing bolts are connected to the inner threads of the fixing frame.
Furthermore, the front and rear travelling mechanisms comprise a first electric guide rail, the bottom of the first electric guide rail is installed at the top of the main control platform, a first electric sliding table is connected to the inside of the first electric guide rail in a sliding mode, and a machining platform is bolted to the top of the first electric sliding table.
Further, upper and lower running gear includes electronic guide rail two, one side that electronic guide rail two is close to the support is bolted with the support, electronic sliding connection has electronic slip table two in the inside of electronic guide rail two, one side that electronic guide rail two was kept away from is bolted with the fixed plate, one side that the fixed plate is close to the connecting plate is bolted with the connecting plate.
Furthermore, the bottom of the fixing frame is bolted with a fixing block, and the inside of the fixing block is fixedly sleeved with the surface of the solder paste dispensing gun.
Furthermore, a sliding groove is formed in one side of the connecting plate, four sliding blocks are connected to the inside of the sliding groove in a sliding mode, and one side of the inner cavity of the fixing frame is in bolted connection with the sliding blocks.
Furthermore, the top of the storage box is provided with a filling port, and a sealing plug is clamped inside the filling port.
Compared with the prior art, the technical scheme of the application has the following beneficial technical effects:
the utility model discloses a set up a plurality of point tin cream guns and conveyer pipe, set up the tin cream that a plurality of point tin cream guns of storage need be used, and deliver through the conveyer pump, the front and back running gear drive processing platform and top circuit board carry out the back-and-forth movement, the running gear drives some tin cream guns from top to bottom goes up and down, can satisfy some tin cream work of a plurality of circuit boards once, and then can effectual improvement circuit board some tin cream work efficiency;
the storage box is arranged to store the solder paste used by the plurality of the point solder paste guns, and only one-time replacement is needed without replacing the plurality of the point solder paste guns, so that the time for replacing the solder paste is not greatly increased while the efficiency of the plurality of the point solder paste guns for adding the solder paste to the circuit board is improved;
the positions of a plurality of point solder paste guns can be adjusted by arranging the adjusting assembly, so that the solder paste operation of each position on the top of the circuit board is met.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a side sectional view of the present invention;
FIG. 3 is an enlarged view of a portion A of FIG. 2 according to the present invention;
FIG. 4 is an enlarged view of a portion of FIG. 2;
figure 5 is the utility model discloses a storage box cross-sectional view.
In the drawings, the components represented by the respective reference numerals are listed below:
1. the automatic tin paste dispensing machine comprises a main control table, 2, a support, 3, an adjusting assembly, 31, a connecting plate, 32, a fixing frame, 33, a fixing bolt, 4, a front-back traveling mechanism, 41, a first electric guide rail, 42, a first electric sliding table, 43, a processing table, 5, an upper-lower traveling mechanism, 51, a second electric guide rail, 52, a second electric sliding table, 53, a fixing plate, 6, a storage box, 7, a partition plate, 8, a conveying pump, 9, a collecting pipe, 10, a conveying pipe, 11, a tin paste dispensing gun, 12, a fixing block, 13, a sliding groove, 14, a sliding block, 15 and a filling port.
Detailed Description
The principles and features of the present invention will be described with reference to the drawings, which are provided for illustration only and are not intended to limit the scope of the invention.
Referring to fig. 1-5, the present invention provides a technical solution: a novel automatic solder paste dispensing device for a circuit board comprises a main control platform 1, wherein a support 2 is installed on the main control platform 1, an adjusting component 3 is arranged on one side of the support 2, a front traveling mechanism 4 and a rear traveling mechanism 4 are arranged at the bottom of the adjusting component 3, an upper traveling mechanism 5 and a lower traveling mechanism 5 are further arranged on one side of the support 2, the main control platform 1 is used for controlling the starting and the closing of an electric guide rail I41, an electric guide rail II 51 and a conveying pump 8, the support 2 is used for supporting the upper traveling mechanism 5 and the lower traveling mechanism 5, the adjusting component 3, the front traveling mechanism 4 and the rear traveling mechanism 5 are respectively used for connecting a solder paste gun 11 with a connecting point and driving the solder paste gun 11 to move up and down and driving a processing platform 43 to move back and forth, a storage box 6 is bolted on one side of the support 2 away from the upper traveling mechanism 5 and the lower traveling mechanism, and the storage box 6 is arranged for storing solder paste, the storage box 6 is internally embedded with a partition plate 7, the partition plate 7 is arranged to avoid contact between solder paste and the delivery pump 8, the delivery pump 8 bolted to the bottom of the inner cavity of the storage box 6 is arranged on the partition plate 7, the water pumping end of the delivery pump 8 is communicated with the partition plate 7, the water outlet end of the delivery pump 8 penetrates through one side of the partition plate 7 and is communicated with a collecting pipe 9, the surface of the collecting pipe 9 is communicated with four delivery pipes 10, the delivery pump 8, the collecting pipe 9 and the delivery pipes 10 are arranged to extract the solder paste and are discharged onto a circuit board through a solder paste dotting gun 11, so that solder paste dotting work is completed, one end, far away from the collecting pipe 9, of the delivery pipe 10 penetrates through the top end of the storage box 6 and is communicated with a solder paste dotting gun 11, and the solder paste dotting gun 11 is arranged to perform solder paste dotting on the circuit board.
When the device is used, the device is electrified, a plurality of circuit boards are placed at the top of a processing table 43, a plurality of point solder paste guns 11 are respectively adjusted to the positions of the circuit boards, which need to be used for soldering paste, through an adjusting component 3, the main control table 1 sets the moving time of a first electric guide rail 41 and a first electric sliding table 42 for driving the processing table 43 in advance, the main control table 1 sets the lifting time of an upper traveling mechanism 5 and a lower traveling mechanism 5 for driving the adjusting component 3 and the soldering paste guns 11 in advance, and the main control table 1 sets the starting time and the closing time of a conveying pump 8 in advance;
then through the starting device of the main control platform 1, the processing platform 43 and the circuit board at the top of the processing platform are driven to move by the electric guide rail I41 and the electric sliding table I42 of the front and rear travelling mechanisms 4, the processing platform 43 stops for a plurality of seconds every time when moving, and in the stopping process, the upper and lower travelling mechanisms 5 drive the adjusting component 3 to lower the solder paste gun 11, the solder paste gun 11 descends to the top of the circuit board needing solder paste, the conveying pump 8 starts to extract the solder paste in the storage box 6 and inputs the solder paste gun 11 through the conveying pipe 10, and finally the solder paste reaches the top of the circuit board through the solder paste gun 11, so that the solder paste counting work is completed; the storage box is arranged to store the solder paste used by the plurality of the point solder paste guns, and only one-time replacement is needed without replacing the plurality of the point solder paste guns, so that the time for replacing the solder paste is not greatly increased while the efficiency of the plurality of the point solder paste guns for adding the solder paste to the circuit board is improved; the positions of a plurality of point solder paste guns can be adjusted by arranging the adjusting assembly, so that the solder paste operation of each position on the top of the circuit board is met.
Referring to fig. 1, 2 and 3, the adjusting assembly 3 includes a connecting plate 31, a fixing frame 32 is disposed on the top of the connecting plate 31, and a fixing bolt 33 is threadedly connected to the inside of the fixing frame 32, and is used to connect the four solder paste dispensing guns 11 and adjust the positions of the four solder paste dispensing guns 11 through the adjusting assembly 3, so as to facilitate solder paste dispensing at different positions on the top of the circuit board.
Referring to fig. 1 and 2, the front-back traveling mechanism 4 includes a first electric guide rail 41, the bottom of the first electric guide rail 41 is mounted on the top of the main console 1, a first electric sliding table 42 is slidably connected inside the first electric guide rail 41, and a processing table 43 is bolted to the top of the first electric sliding table 42, and is configured to place a circuit board to be solder-pasted through the front-back traveling mechanism 4, and can drive the processing table 43 to drive the circuit board at the top of the processing table to move.
Referring to fig. 1 and 2, the up-down traveling mechanism 5 includes a second electric guide rail 51, one side of the second electric guide rail 51, which is close to the support 2, is bolted to the support 2, a second electric sliding table 52 is slidably connected inside the second electric guide rail 51, one side of the second electric sliding table 52, which is far away from the second electric guide rail 51, is bolted to a fixing plate 53, one side of the fixing plate 53, which is close to the connecting plate 31, is bolted to the connecting plate 31, and the up-down traveling mechanism 5 is configured to drive the dot solder paste gun 11 to move up and down.
Referring to fig. 1, 2 and 3, the fixing frame 32 has a fixing block 12 bolted to the bottom thereof, and the inside of the fixing block 12 is fixedly sleeved with the surface of the solder paste applying gun 11 and is used for limiting and fixing the solder paste applying gun 11 by the fixing block 12.
Referring to fig. 1, 2 and 3, a sliding groove 13 is formed in one side of the connecting plate 31, four sliding blocks 14 are slidably connected inside the sliding groove 13, one side of an inner cavity of the fixing frame 32 is bolted to the sliding blocks 14, and the fixing frame 32 is limited by the sliding groove 13 and the sliding blocks 14, so that the fixing frame 32 is prevented from being separated from the connecting plate 31, and the fixing frame 32 is ensured to linearly move.
Referring to fig. 2 and 4, a filling port 15 is formed at the top of the storage box 6, a sealing plug is clamped inside the filling port 15, through the arrangement of the filling port 15 and the sealing plug, the filling port 15 is used for filling solder paste into the storage box 6, and the sealing plug is used for sealing the filling port 15 to prevent dust from entering.
The working principle is as follows: when the device is used, the device is electrified, a plurality of circuit boards are placed on the top of a processing table 43, a plurality of point solder paste guns 11 are respectively adjusted to the positions of the circuit boards needing point solder paste through the adjusting component 3, the main control table 1 sets the moving time of the electric guide rail I41 and the electric sliding table I42 for driving the processing table 43 in advance, the main control table 1 sets the lifting time of the upper and lower travelling mechanism 5 for driving the adjusting component 3 and the point solder paste guns 11 in advance, and the main control table 1 sets the starting and closing time of the delivery pump 8 in advance;
then, the processing table 43 and the circuit board on the top of the processing table are driven to move by the electric guide rail I41 and the electric sliding table I42 through a starting device of the main control table 1, the processing table 43 stops for several seconds every time the processing table 43 moves, in the stopping process, the electric guide rail II 51 and the electric sliding table II 52 drive the fixing plate 53, the connecting plate 31 and the fixing block 12 to descend, so that the solder paste dispensing gun 11 descends, the solder paste dispensing gun 11 descends to the top of the circuit board, the conveying pump 8 starts to draw the solder paste in the storage box 6 and inputs the solder paste dispensing gun 11 through the conveying pipe 10, finally the solder paste reaches the top of the circuit board through the solder paste dispensing gun 11, so that the solder paste dispensing operation is completed, then the conveying pump 8 stops operating, the electric guide rail II 51, the electric sliding table II 52 and the fixing plate 53 drive the connecting plate 31, the fixing block 12 and the solder paste dispensing gun 11 to ascend, the electric guide rail I41 and the electric sliding table I42 drive the processing table 43 to move forwards again, then the processing table 43 stops for dispensing solder paste again, and the operation is repeated continuously until the solder paste dispensing operation of the whole circuit board is completed.
The above description is only a preferred embodiment of the present invention, and should not be construed as limiting the present invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included within the protection scope of the present invention.
Claims (7)
1. The utility model provides a novel circuit board is with automatic point tin cream device, includes master console (1), its characterized in that: support (2) are installed in master control platform (1), one side of support (2) is equipped with adjusting part (3), running gear (4) around the bottom of adjusting part (3) is equipped with, running gear (5) about one side of support (2) still is equipped with, one side bolt joint that running gear (5) about support (2) kept away from has storage box (6), the inside of storage box (6) is embedded to have baffle (7), be equipped with of baffle (7) with storage box (6) inner chamber bottom bolted delivery pump (8), the end of drawing water and baffle (7) intercommunication of delivery pump (8), the outlet end of delivery pump (8) runs through to one side and the intercommunication of baffle (7) have collection pipe (9), the surface intercommunication of collection pipe (9) has four conveyer pipes (10), the one end that collection pipe (9) was kept away from in conveyer pipe (10) runs through to the top of storage box (6) and communicates tin paste gun (11) a bit.
2. The novel automatic solder paste dispensing device for the circuit board as claimed in claim 1, wherein the adjusting component (3) comprises a connecting plate (31), a fixing frame (32) is arranged on the top of the connecting plate (31), and a fixing bolt (33) is connected to the inside of the fixing frame (32) through a thread.
3. The novel automatic solder paste dispensing device for the circuit board as claimed in claim 1, wherein the front and rear traveling mechanism (4) comprises a first electric guide rail (41), the bottom of the first electric guide rail (41) is mounted on the top of the main control platform (1), a first electric sliding table (42) is slidably connected inside the first electric guide rail (41), and a processing platform (43) is bolted to the top of the first electric sliding table (42).
4. The novel automatic solder paste dispensing device for the circuit board as claimed in claim 2, wherein the upper and lower traveling mechanism (5) comprises a second electric guide rail (51), one side of the second electric guide rail (51) close to the support (2) is bolted to the support (2), a second electric sliding table (52) is slidably connected inside the second electric guide rail (51), one side of the second electric sliding table (52) far away from the second electric guide rail (51) is bolted to a fixing plate (53), and one side of the fixing plate (53) close to the connecting plate (31) is bolted to the connecting plate (31).
5. The novel automatic solder paste dispensing device for the circuit board as claimed in claim 2, wherein the bottom of the fixing frame (32) is bolted with a fixing block (12), and the inside of the fixing block (12) is fixedly sleeved with the surface of the solder paste dispensing gun (11).
6. The novel automatic solder paste dispensing device for the circuit board according to claim 2, wherein a sliding groove (13) is formed in one side of the connecting plate (31), four sliding blocks (14) are slidably connected inside the sliding groove (13), and one side of an inner cavity of the fixing frame (32) is bolted to the sliding blocks (14).
7. The novel automatic solder paste dispensing device for the circuit board as recited in claim 1, wherein a filling port (15) is opened at the top of the storage box (6), and a sealing plug is clamped inside the filling port (15).
Priority Applications (1)
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CN202222595351.4U CN218225001U (en) | 2022-09-29 | 2022-09-29 | Novel circuit board is with automatic point tin cream device |
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CN202222595351.4U CN218225001U (en) | 2022-09-29 | 2022-09-29 | Novel circuit board is with automatic point tin cream device |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116408509A (en) * | 2023-04-26 | 2023-07-11 | 深圳前海振百易科技有限公司 | Electromagnetic soldering equipment and soldering method based on novel tin alloy solder |
CN117206620A (en) * | 2023-10-26 | 2023-12-12 | 江苏欣恒蕴精密零件有限公司 | Automatic solder paste dispensing machine for diode wafer module |
-
2022
- 2022-09-29 CN CN202222595351.4U patent/CN218225001U/en active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116408509A (en) * | 2023-04-26 | 2023-07-11 | 深圳前海振百易科技有限公司 | Electromagnetic soldering equipment and soldering method based on novel tin alloy solder |
CN117206620A (en) * | 2023-10-26 | 2023-12-12 | 江苏欣恒蕴精密零件有限公司 | Automatic solder paste dispensing machine for diode wafer module |
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