CN218218043U

CN218218043U - PCB fixing structure, laser transceiving module and laser radar

Info

Publication number: CN218218043U
Application number: CN202222480882.9U
Authority: CN
Inventors: 游云兵; 卢盘; 杨迪; 毛威成; 黄周敏; 范帆
Original assignee: Suteng Innovation Technology Co Ltd
Current assignee: Suteng Innovation Technology Co Ltd
Priority date: 2022-09-19
Filing date: 2022-09-19
Publication date: 2023-01-03
Anticipated expiration: 2032-09-19

Abstract

The application relates to a PCB fixing structure, a laser transceiver module and a laser radar. The PCB fixing structure comprises a PCB assembly, wherein the PCB assembly comprises a PCB and a structural part fixed on the PCB, the PCB is provided with a connecting layer, and the structural part is fixed on the connecting layer; the base is provided with an installation part, and the installation part is used for installing the structural part; and the connecting piece is used for fixedly connecting the structural piece with the base so as to fix the PCB on the base. The scheme that this application provided can make PCB be fixed in the base more stably, has guaranteed the positional stability of PCB's light source subassembly, and then makes the light path can not deviate the design route.

Description

PCB fixing structure, laser transceiving module and laser radar

Technical Field

The application relates to the technical field of sensors, in particular to a PCB fixing structure, a laser transceiver module and a laser radar.

Background

The transmitting and receiving module of the laser radar includes a transmitting module for emitting laser, and in order to prevent the emitted laser from deviating, a Printed Circuit Board (PCB) needs to be stably fixed on the connecting socket structure.

In the related art, the PCB of the emission assembly is generally made of a specific material, which is inconvenient to fix through the opening; when the screw is used for fixing, the screw can bring stress to the PCB, so that the PCB is easy to deform in the using process, and the position of the emission opening deviates.

SUMMERY OF THE UTILITY MODEL

For solving or partly solving the problem that exists among the correlation technique, this application provides a PCB fixed knot constructs, laser transceiver module and laser radar, can make PCB be fixed in the base more stably, has guaranteed the positional stability of PCB's light source subassembly, and then makes the light path can not deviate the design route.

The present application in a first aspect provides a PCB fixing structure, including:

the PCB assembly comprises a PCB and a structural part fixed on the PCB, wherein the PCB is provided with a connecting layer, and the structural part is fixed on the connecting layer;

the base is provided with an installation part, and the installation part is used for installing the structural part;

and the connecting piece is used for fixedly connecting the structural piece with the base so as to fix the PCB on the base.

In one embodiment, the connecting layer is made of a thermally conductive material.

In one embodiment, the base is provided with a cavity, the PCB assembly is accommodated in the cavity, the mounting portion comprises a mounting hole formed in a side wall of the base, the connecting piece comprises a limiting end and a connecting end, the connecting end penetrates into the base through the mounting hole and is fixedly connected with the structural piece, and the limiting end abuts against the outer surface of the side wall.

In one embodiment, the shape of the mounting hole is matched with the shape of the structural member, the structural member is at least partially embedded into the mounting hole, and the structural member is in limit fit with the mounting hole through a limit structure.

In one embodiment, the limiting structure comprises a limiting step arranged in the mounting hole, and the structural part is in limiting fit with the limiting step.

In one embodiment, the PCB comprises a substrate, one side of the substrate is used for arranging electronic components, the connecting layer is arranged on the other side of the substrate, a plane structure is formed on the other side of the substrate, and the PCB is attached to the inner surface of the side wall of the base through the plane structure.

In one embodiment, the substrate is made of ceramic.

In one embodiment, the connecting layer is made of metal, and the structural member is fixed to the connecting layer by welding; and/or

The connecting piece is a threaded connecting piece, and the connecting piece is in threaded connection with the structural part.

A second aspect of the present application provides a laser transceiver module, including:

a substrate; and

install in the laser emission subassembly and the laser receiving assembly of base member, laser emission subassembly and/or laser receiving assembly are equipped with as above first aspect PCB fixed knot construct.

A third aspect of the application provides a lidar comprising a laser transceiver module as described in the second aspect above.

The technical scheme provided by the application can comprise the following beneficial effects:

the PCB fixing structure comprises a PCB assembly, wherein the PCB assembly comprises a PCB and a structural member fixed on the PCB, the PCB is provided with a connecting layer, and the structural member is fixed on the connecting layer; the base is provided with a mounting part, and the mounting part is used for mounting a structural part; and the connecting piece is used for fixedly connecting the structural piece with the base so as to fix the PCB on the base. The scheme that this embodiment provided enables PCB and is fixed in the base more stably, has guaranteed the positional stability of PCB's light source subassembly, and then makes the light path can not deviate from the design route.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application.

Drawings

The foregoing and other objects, features and advantages of the application will be apparent from the following more particular descriptions of exemplary embodiments of the application as illustrated in the accompanying drawings wherein like reference numbers generally represent like parts throughout the application.

FIG. 1 is a schematic diagram of a transmit assembly according to an embodiment of the present application;

FIG. 2 is an exploded view of the PCB mounting structure shown in the embodiment of FIG. 1;

FIG. 3 is a side view of the PCB mounting structure shown in the embodiment of FIG. 1;

FIG. 4 isbase:Sub>A cross-sectional view taken along A-A of FIG. 3;

fig. 5 is a schematic structural diagram of a laser transceiver module according to an embodiment of the present disclosure;

reference numerals: 100. a transmitting assembly; 110. a base; 120. a PCB; 130. a structural member; 140. a connecting member; 111. a cavity; 112. a laser outlet; 113. a side wall; 1131. mounting holes; 131. a first connection portion; 132. a second connecting portion; 1311. a threaded hole; 121. a connecting layer; 141. a connecting end; 142. a limiting end; 1312. and a limiting step.

Detailed Description

Embodiments of the present application will be described in more detail below with reference to the accompanying drawings. While embodiments of the present application are illustrated in the accompanying drawings, it should be understood that the present application may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

It should be understood that although the terms "first," "second," "third," etc. may be used herein to describe various information, these information should not be limited to these terms. These terms are only used to distinguish one type of information from another. For example, first information may also be referred to as second information, and similarly, second information may also be referred to as first information, without departing from the scope of the present application. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.

In the description of the present application, it is to be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientation or positional relationship indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and are not to be considered limiting of the present application.

Unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and encompass, for example, both fixed and removable connections or integers; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

In the related art, the PCB of the emission assembly is generally made of a specific material, so that it is inconvenient to fix the emission assembly through the opening; when the screw is used for fixing, the screw can bring stress to the PCB, so that the PCB is easy to deform in the using process, and the position of the emission opening is deviated.

To solve the above problem, the embodiment of the present application provides a PCB fixing structure, so that the PCB is more stably fixed on the base, and the position stability of the light source assembly of the PCB is ensured.

The technical solutions of the embodiments of the present application are described in detail below with reference to the accompanying drawings.

FIG. 1 is a schematic diagram of a transmitting assembly according to an embodiment of the present application; fig. 2 is an exploded view of the PCB securing structure shown in the embodiment of fig. 1.

Referring to fig. 1 and 2, the PCB fixing structure provided in the present application includes a PCB assembly, where the PCB assembly includes a PCB120 and a structural member 130 fixed to the PCB120, where the PCB120 is provided with a connection layer 121, and the structural member 130 is fixed to the connection layer 121; a base 110 provided with a mounting portion for mounting the structural member 130; and a connector 140 for fixedly connecting the structural member 130 with the base 110 so as to fix the PCB120 to the base 110. The solution provided in this embodiment enables the PCB120 to be more stably fixed to the base 110, and ensures the position stability of the light source assembly of the PCB120, so that the light path does not deviate from the designed path.

In this embodiment, the base 110 has a cavity 111, the pcb assembly is accommodated in the cavity 111, the base 110 has a laser outlet 112, and the laser emitted from the light source assembly of the pcba 120 can be emitted from the laser outlet 112.

Referring to fig. 2, the mounting portion is disposed on the sidewall 113 of the base 110, the mounting portion includes a mounting hole 1131 disposed on the sidewall 113, the connecting member 140 includes a limiting end 142 and a connecting end 141, the connecting end 141 penetrates into the base 110 from the mounting hole 1131 and is fixedly connected to the structural member 130, and the limiting end 142 abuts against the outer surface of the sidewall 113.

In some embodiments, the connector 140 may not be provided, and the PCB assembly may be fixed to the base 110 by welding or bonding.

In the related art, since electronic components (e.g., light source assemblies) on the PCB120 generate heat during operation, the temperature of the PCB120 is increased, and in order to maintain the normal operation of the PCB120, the PCB120 needs to be effectively and rapidly cooled, and in the related art, a heat conductive coating is generally disposed on the PCB120 for cooling, which is complex in process and high in cost.

In this embodiment, the connection layer 121 is made of a thermal conductive material, and heat generated by the electronic component on the PCB120 can be dissipated more quickly through the connection layer 121, which is beneficial to reducing the use of a thermal conductive coating on the PCB120 and reducing the cost and the complexity of the process.

In some embodiments, the connection layer 121 is made of metal, and the structural member 130 is fixed to the connection layer 121 by welding, so that the structural member 130 and the PCB120 form an integral structure, and after the connection member 140 is fixed to the base 110, the PCB120 and the base 110 can be fixed.

In addition, since the soldering material has high thermal conductivity, the heat dissipation effect of the PCB120 can be further improved by soldering, and two functions of heat conduction and fixation are realized.

In some embodiments, the connection layer 121 may be formed by a metal component disposed inside the substrate, and a hole structure may be reserved in a predetermined region of the surface of the substrate, where a portion of the metal component in the substrate exposed in the hole structure is used for fixedly connecting with the structural member 130; alternatively, the connection layer 121 may also be a metal member fixed to the outside of the PCB 120; alternatively, the connection layer 121 may also be a metal member for constituting the PCB 120.

In one implementation, the substrate may be made of ceramic, but is not limited thereto.

FIG. 3 is a side view of the PCB mounting structure shown in the embodiment of FIG. 1; fig. 4 isbase:Sub>A cross-sectional view taken alongbase:Sub>A-base:Sub>A in fig. 3.

Referring to fig. 3 and 4, in some embodiments, the shape of the mounting hole 1131 is configured to fit the shape of the structural member 130, the structural member 130 is at least partially inserted into the mounting hole 1131, and the structural member 130 is in a position-limiting fit with the mounting hole 1131 through a position-limiting structure. The position of the structural member 130 and the base 110 can be kept relatively stable by the limiting structure, so that the PCB120 is more stably installed in the base 110.

The limiting structure comprises a limiting step 1312 arranged in the mounting hole 1131, the shape of the structural part 130 is matched with the limiting step 1312, the structural part 130 can be in limiting fit with the limiting step 1312, and under the limiting effect of the limiting step 1312, the position of the structural part 130 in the mounting hole 1131 cannot deviate, so that the position stability of the structural part 130 is ensured.

Connecting layer 121 can set up in PCB 120's preset position, connecting layer 121 is planar structure, structure 130 can be through face contact's mode and PCB120 fixed connection, in some embodiments, the both sides that structure 130 carried on the back mutually are equipped with first connecting portion 131 and second connecting portion 132 respectively, first connecting portion 131 are equipped with the arch, this arch be used for with the spacing cooperation of stair structure, second connecting portion 132 are equipped with the plane, this plane is used for laminating with connecting layer 121.

The PCB120 includes a substrate, one side of which is used for disposing electronic components, and the connection layer 121 is disposed on the other side of the substrate, and the other side of the substrate forms a planar structure, and the planar structure is attached to the inner surface of the sidewall 113 of the base 110.

In this embodiment, the size of the PCB120 is configured to match the shape of the cavity 111 of the base 110, and when the connecting element 140 is connected to the structural element 130 at the outer side of the base 110, the side of the connecting layer 121 of the PCB120 abuts against the inner surface of the base 110, so as to improve the mounting stability of the PCB120 in the base 110.

In some embodiments, connector 140 is a threaded connector 140, such as a screw, and connector 140 is threadably coupled to structural member 130. The first connecting portion 131 of the structure 130 is opened with a threaded hole 1311, the limiting end 142 of the connecting member 140 can be a nut of the threaded connecting member 140, the connecting end 141 of the connecting member 140 can be a screw of the threaded connecting member 140, the screw is provided with an external thread, and the screw penetrates into the base 110 from the mounting hole 1131 and is in threaded connection with the threaded hole 1311 of the structure 130. After the connecting member 140 is screwed, the nut can abut against the outer sidewall 113 of the base 110, so that the structural member 130 is tightly fitted with the limiting step in the mounting hole 1131, and meanwhile, the PCB120 abuts against the inner sidewall 113 of the base 110.

The scheme that this embodiment provided has avoided directly leading to PCB stress concentration's problem with PCB mechanical fastening in base among the correlation technique, has avoided PCB to produce deformation for the position of the light source subassembly on the PCB can not change. In addition, the positions of the connecting layers can be flexibly arranged on the PCB, so that the design freedom degree of the PCB is increased, and the reduction of the overall dimensions of the PCB and the laser transceiver module is facilitated. In addition, the defect that the PCB is easy to deviate due to the fact that the PCB is fixed through the adhesive in the related art is avoided, and the process cost is reduced due to the fact that the PCB is fixed through the adhesive and the requirements for the process and the production environment are higher.

The PCB fixing structure provided by the application is introduced above, and correspondingly, the application also provides a laser transceiver module.

Fig. 5 is a schematic structural diagram of a laser transceiver module according to an embodiment of the present application.

Referring to fig. 5, the laser transceiver module includes a base 300; and a laser transmitter assembly 100 and a laser receiver assembly 200 mounted to the base 300, the laser transmitter assembly 100 and/or the laser receiver assembly 200 being provided with the PCB fixing structure as the above embodiment. The PCB fixing structure can refer to the description of the above embodiments, and is not described herein again.

The PCB fixing structure that this embodiment provided enables PCB and is fixed in the base more steadily, has guaranteed the positional stability of PCB's light source subassembly, and then makes the light path can not deviate from the design route.

Correspondingly, the application also provides a laser radar which comprises the laser transceiving module.

The foregoing description of the embodiments of the present application has been presented for purposes of illustration and description and is not intended to be exhaustive or limited to the embodiments disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The terminology used herein was chosen in order to best explain the principles of the embodiments, the practical application, or improvements to the technology in the marketplace, or to enable others of ordinary skill in the art to understand the embodiments disclosed herein.

Claims

1. A PCB fixation structure, comprising:

2. The PCB fixing structure of claim 1, wherein:

the connecting layer is made of a heat-conducting material.

3. The PCB fixing structure of claim 1, wherein:

the base is equipped with the cavity, the PCB subassembly accept in the cavity, the installation department is including seting up in the mounting hole of the lateral wall of base, the connecting piece includes spacing end and link, the link certainly the mounting hole penetrates in the base, and with structure fixed connection, spacing end support tightly in the surface of lateral wall.

4. The PCB fixing structure of claim 3, wherein:

the shape of the mounting hole is matched with the shape of the structural part, at least part of the structural part is embedded into the mounting hole, and the structural part is in limit fit with the mounting hole through a limit structure.

5. The PCB fixation structure of claim 4, wherein:

the limiting structure comprises a limiting step arranged in the mounting hole, and the structural part is in limiting fit with the limiting step.

6. The PCB fixing structure of claim 1, wherein:

the PCB comprises a substrate, one side of the substrate is used for arranging electronic components, the connecting layer is arranged on the other side of the substrate, a plane structure is formed on the other side of the substrate, and the PCB is tightly attached to the inner surface of the side wall of the base through the plane structure.

7. The PCB fixing structure of claim 6, wherein:

the substrate is made of ceramic.

8. A PCB fixation structure as claimed in any one of claims 1 to 7, wherein:

the connecting layer is made of metal, and the structural part is fixed on the connecting layer in a welding mode; and/or

9. A laser transceiver module, comprising:

a substrate; and

a laser transmitter assembly and a laser receiver assembly mounted to the base, the laser transmitter assembly and/or the laser receiver assembly being provided with a PCB fixing structure as claimed in any one of claims 1 to 8.

10. Lidar characterized by comprising a laser transceiver module according to claim 9.