CN218216097U

CN218216097U - Offset semiconductor laser device

Info

Publication number: CN218216097U
Application number: CN202222390012.2U
Authority: CN
Inventors: 陈晓华; 王柳; 郎超; 于振坤
Original assignee: BWT Beijing Ltd
Current assignee: BWT Beijing Ltd
Priority date: 2022-09-08
Filing date: 2022-09-08
Publication date: 2023-01-03
Anticipated expiration: 2032-09-08

Abstract

The utility model provides an offset type semiconductor laser device, include: the heat sink comprises a tube shell, wherein the bottom inside the tube shell is provided with a step surface, and two heat sinks are arranged on the step surface; the first laser chip is arranged on one heat sink and is used for emitting light beams along a first direction; the second laser chip is arranged on the other heat sink and is used for emitting light beams along a second direction, and the first laser chip and the second laser chip are provided with independent power supply input ends respectively; and the collimation focusing unit is used for collimating and focusing the light beam emitted along the first direction or the second direction and is coupled to the output optical fiber. The utility model discloses a continuous work of laser instrument device has solved among the laser instrument device in case power decline or harm appear, needs the maintenance to cause the problem of delaying the use.

Description

Offset semiconductor laser device

Technical Field

The utility model relates to a laser instrument technical field especially relates to an offset type semiconductor laser device.

Background

Semiconductor lasers are increasingly used in laser pumping, laser processing, laser medical treatment, laser display, military applications and other fields. In recent decades, with the further maturity of single-tube semiconductor laser products, the output power can reach several watts or even dozens of watts through optical fiber coupling, and the requirements in the fields of medical treatment, industrial processing, laser ranging, military and the like are greatly increased.

In the prior art, the pump source of the laser product is a single laser chip packaged in a laser device.

In the process of implementing the present invention, the inventor finds that there are at least the following problems in the prior art: in the long-term working process, the situation that a laser chip fails may occur in the laser device, and at the moment, the pumping source needs to be suspended, and the laser device needs to be returned to a factory for maintenance, so that the normal use of a laser product can be delayed.

SUMMERY OF THE UTILITY MODEL

The present invention aims at solving at least one of the technical problems in the related art to a certain extent.

Therefore, an object of the present invention is to provide a semiconductor laser device capable of prolonging the service life and shortening the time for maintaining the failure product.

To achieve the above object, the present invention provides an offset semiconductor laser device, including:

the heat sink comprises a tube shell, wherein the bottom inside the tube shell is provided with a step surface, and two heat sinks are arranged on the step surface;

the first laser chip is arranged on one heat sink and used for emitting light beams along a first direction;

the second laser chip is arranged on the other heat sink and used for emitting light beams along a second direction, wherein the first laser chip and the second laser chip are provided with independent power input ends;

and the collimation focusing unit is used for collimating and focusing the light beam emitted along the first direction or the second direction and is coupled to an output optical fiber.

According to the utility model discloses a semiconductor laser device, two laser chip have been installed in the tube, semiconductor laser device is at the during operation, only a laser chip stimulated irradiation, reserve laser chip does not emit laser, when inefficacy such as chamber face burning point appears in operation laser chip long-term work or long-term work normal attenuation, need not dismantle whole semiconductor laser device maintenance, only need add power to reserve laser chip, the laser chip of replacement inefficacy or decay, the maintenance duration has been practiced thrift, guarantee whole semiconductor laser device's continuation work, the life of laser product has been improved.

According to an embodiment of the present invention, the collimating and focusing unit is a self-focusing lens.

According to an embodiment of the invention, the first direction and the second direction are not parallel to each other.

According to the utility model discloses an embodiment, still include first to third electrode pin, first laser chip with the positive negative pole of second laser chip with first to third electrode pin is connected.

According to the utility model discloses an embodiment, first laser chip with the second laser chip is located same one side of the axis of self-focusing lens.

According to the utility model discloses an embodiment, first laser chip with the second laser chip is located respectively the both sides of the axis of self-focusing lens.

According to the utility model discloses an embodiment, first laser chip with the second laser chip is followed the bilateral symmetry setting of the axis of self-focusing lens.

According to an embodiment of the present invention, the side of the tube is provided with a sleeve through, the self-focusing lens and the coupling area of the output optical fiber are installed in the sleeve.

According to an embodiment of the invention, the sleeve is fixed to the tube by a fastener.

According to the utility model discloses an embodiment still includes and prevents the reverse side, prevent that the reverse side sets up the place ahead of collimation focusing unit's incident surface.

Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.

Drawings

Various additional advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the invention. Also, like reference numerals are used to refer to like parts throughout the drawings. Wherein:

fig. 1 is a schematic structural diagram of an offset semiconductor laser device according to an embodiment of the present invention.

Fig. 2 is a schematic structural diagram of an offset semiconductor laser device according to another embodiment of the present invention.

Description of reference numerals:

1-a first laser chip, 2-a second laser chip, 3-a heat sink, 4-a tube shell, 5-a mounting hole, 6-a self-focusing lens, 7-an output optical fiber, 8-a first electrode pin, 9-a second electrode pin, 10-a third electrode pin, 11-a sleeve, 12-a fastener and 13-an anti-reflection sheet.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention. On the contrary, the embodiments of the invention include all changes, modifications and equivalents coming within the spirit and terms of the claims appended hereto.

With reference to fig. 1 and fig. 2, an embodiment of the present invention provides an offset semiconductor laser device, which includes a tube 4, a first laser chip 1, a second laser chip 2, a collimating and focusing unit, and an output fiber 7. The biasing is in the utility model discloses there is the contained angle in two laser chip's of middle finger the central axis.

The package 4 is a housing that protects the internal optical components from reliable operation. The bottom inside the tube shell 4 is provided with a step surface, and two heat sinks 3 are arranged on the step surface. In one embodiment, the envelope 4 is a cuboid. The outer wall of the housing 4 has mounting holes 5 at opposite corners.

The first laser chip 1 is arranged on a heat sink 3 for emitting a light beam in a first direction. The second laser chip 2 is arranged on the other heat sink 3 and used for emitting light beams along the second direction, and the first laser chip 1 and the second laser chip 2 are provided with independent power supply input ends. In one embodiment, the first laser chip 1 and the second laser chip 2 are both edge-emitting lasers. It can be understood that, when the first laser chip 1 and the second laser chip 2 are manufactured, coupling debugging is performed, and only 1 of them is finally used in laser product application. The double laser chips are coupled, the single laser chip is output, and the laser chip is reserved, so that the reliability of the laser device is improved. By way of example and not limitation, the first direction and the second direction are not parallel to each other, and an angle exists between the first direction and the second direction. The device of the embodiment has no reflector, and the light beams in the first direction and the second direction are directly transmitted into the collimation and focusing unit without passing through the reflector. The device of the embodiment omits a reflector, and the volume of the device can be further reduced.

And a collimation focusing unit for collimating and focusing the light beam emitted along the first direction or the second direction, and coupling to the output optical fiber 7. The incident end face of the collimating and focusing unit should ensure that the beams emitted from the first laser chip 1 and the second laser chip 2 can be irradiated simultaneously.

In some embodiments, the collimating focusing unit is a self-focusing lens 6. The common focusing lens converges light into a point by controlling the curvature of the lens surface and utilizing the generated optical path difference. The material of the self-focusing lens 6 can refract the light propagating axially, and the distribution of the refractive index is gradually reduced along the radial direction, so that the emergent light rays are smoothly and continuously converged to one point. The side of the envelope 4 is provided with a sleeve 11 through which the coupling region of the self-focusing lens 6 and the output optical fiber 7 is mounted. The sleeve 11 is fixed to the housing 4 by means of fasteners 12. In one example, the sleeve 11 is made of metal, the sleeve 11 is bonded to the housing 4, the fastening member 12 is made of plastic, one end of the fastening member 12 is bonded to the outer wall of the housing 4, and the other end is bonded to the outer surface of the housing 4.

In some embodiments, the offset semiconductor laser device further includes first to third electrode pins (8,9, 10), and the positive and negative electrodes of the first and second laser chips 1 and 2 are connected to the first to third electrode pins (8,9, 10). The laser chip and the electrode pin are connected through a multi-strand lead. In one example, the anodes of the first laser chip 1 and the second laser chip 2 share one of the electrode pins, and the cathodes of the first laser chip 1 and the second laser chip 2 are each connected to a separate one of the electrode pins. In one example, the cathodes of the first laser chip 1 and the second laser chip 2 share one of the electrode pins, and the anodes of the first laser chip 1 and the second laser chip 2 are respectively connected with a single one of the electrode pins. That is, one electrode of the two laser chips is shared, so that only the connection of the other electrode needs to be changed during replacement, and the space and the cost are saved. For example, the first to third electrode leads (8,9, 10) are penetratingly disposed on the same side of the package 4. When the first laser chip 1 is selected to work, the anode of the first laser chip 1 is conducted with the first electrode pin 8, the cathode of the first laser chip 1 is conducted with the second electrode pin 9, the electrode pin is connected with a power line at a terminal outside the tube shell 4, and optionally, the power line is connected with the electrode pin in an inserting mode. When the first laser chip 1 fails, the anode of the second laser chip 2 needs to be connected with the third electrode pin 10, and the cathode of the second laser chip 2 needs to be connected with the second electrode pin 9.

The positions of the first laser chip 1 and the second laser chip 2 can be configured according to actual needs. In one example, the first laser chip 1 and the second laser chip 2 are located on the same side of the axis of the self-focusing lens 6. In the configuration, the light beam emitted from the first laser chip 1 or the light beam emitted from the second laser chip 2 cannot be blocked by the remaining laser chips. It is understood that the first direction is in the direction of the first laser chip central axis and the second direction is in the direction of the second laser chip central axis. The central axis of the first laser chip or the central axis of the second laser chip can also be collinear with the central axis of the focusing self-focusing lens 6. The first laser chip 1 and the second laser chip 2 are arranged such that the emitted light beams can enter the self-focusing lens 6. In another example, the first laser chip 1 and the second laser chip 2 are respectively located on both sides of the axis of the self-focusing lens 6. In one embodiment, the first laser chip 1 and the second laser chip 2 are symmetrically disposed along both sides of the axis of the self-focusing lens 6. Theoretically, the included angle of the central axis of the first laser chip or the central axis of the second laser chip is smaller than 180 degrees, but it is ensured that the light beam emitted by the laser chip can irradiate the incident end face of the self-focusing lens 6. Since the light beams entering the self-focusing lens 6 come from different directions, the parameters of the self-focusing lens 6, such as the pitch, the lens length, the refractive index distribution constant, etc., need to be optimally designed.

In some embodiments, the offset semiconductor laser device further includes an anti-reflection sheet 13, and the anti-reflection sheet 13 is disposed in front of the incident surface of the collimating and focusing unit. The anti-reflection sheet 13 can effectively prevent return light from entering the laser chip.

Two examples are given below to explain what is referred to in the above examples.

Example one

As shown in fig. 1, the package 4 is a rectangular parallelepiped, the first laser chip 1 and the second laser chip 2 are mounted in the package 4, the first laser chip 1 and the second laser chip 2 are mounted adjacent to one side wall of the package 4, and the self-focusing lens 6 is mounted on the side wall opposite to the side wall. 3 electrode leads (8,9, 10) are mounted through the side wall adjacent to the laser chip. The first laser chip 1 and the second laser chip 2 are respectively positioned at two sides of the axis of the self-focusing lens 6. The central axis of the first laser chip 1 and the axis of the self-focusing lens 6 form an included angle, and the central axis of the second laser chip 2 and the axis of the self-focusing lens 6 also form an included angle. Only one laser chip is subjected to stimulated emission during working, and when the problems of failure such as cavity surface burning point and the like or normal attenuation during long-term working occur, a spare chip is replaced for the stimulated emission. When the mirror surface of the self-focusing lens 6 is plated with the anti-reflection film, the anti-reflection film can be omitted, and the occupied space is further reduced. If the first laser chip 1 is selected to work, the light beam emitted by the first laser chip 1 along the first direction passes through the self-focusing lens 6 and is coupled into the output optical fiber 7. If the second laser chip 2 is selected to work, the light beam emitted from the second laser chip 2 along the second direction passes through the self-focusing lens 6 and is coupled into the output optical fiber 7.

Example two

As shown in fig. 2, the embodiment shown in fig. 2 differs from the embodiment shown in fig. 1 in that: in the embodiment shown in fig. 2, there is a reverse-preventing flap 13. The anti-reflection sheet 13 is glued inside the housing 4. If the first laser chip 1 is selected to work, light beams emitted by the first laser chip 1 along the first direction sequentially pass through the anti-reflection sheet 13 and the self-focusing lens 6 and are coupled into the output optical fiber 7. If the second laser chip 2 is selected to work, the light beam emitted from the second laser chip 2 along the second direction passes through the anti-reflection sheet 13 and the self-focusing lens 6 and then is coupled into the output optical fiber 7.

It should be noted that, in the description of the present invention, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. In addition, in the description of the present invention, "a plurality" means two or more unless otherwise specified.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; may be mechanically coupled, may be electrically coupled or may be in communication with each other; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In the present application, unless expressly stated or limited otherwise, the first feature may be directly on or directly under the second feature or indirectly via intermediate members. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

In the description of the present invention, the terms "left", "right", "front", "rear", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.

Any process or method descriptions in flow charts or otherwise described herein may be understood as representing modules, segments, or portions of code which include one or more executable instructions for implementing specific logical functions or steps of the process, and the scope of the preferred embodiments of the present invention includes other implementations in which functions may be executed out of order from that shown or discussed, including substantially concurrently or in reverse order, depending on the functionality involved, as would be understood by those reasonably skilled in the art of the embodiments of the present invention.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Although embodiments of the present invention have been shown and described, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that variations, modifications, substitutions and alterations can be made to the above embodiments by those of ordinary skill in the art without departing from the scope of the present invention.

Claims

1. An offset semiconductor laser device, comprising:

the heat sink comprises a pipe shell (4), wherein the bottom inside the pipe shell (4) is provided with a step surface, and two heat sinks (3) are arranged on the step surface;

the first laser chip (1) is arranged on one heat sink (3) and is used for emitting a light beam along a first direction;

the second laser chip (2) is arranged on the other heat sink (3) and is used for emitting light beams along a second direction, wherein the first laser chip (1) and the second laser chip (2) are provided with independent power supply input ends;

and the collimation focusing unit is used for collimating and focusing the light beam emitted along the first direction or the second direction and is coupled to an output optical fiber (7).

2. An offset semiconductor laser device according to claim 1, characterized in that the collimating and focusing unit is a self-focusing lens (6).

3. An offset semiconductor laser device according to claim 1, wherein the first direction and the second direction are not parallel to each other.

4. The offset semiconductor laser device according to claim 1, further comprising first to third electrode pins (8,9, 10), positive and negative poles of the first laser chip (1) and the second laser chip (2) being connected to the first to third electrode pins (8,9, 10).

5. Offset semiconductor laser device according to claim 2, characterized in that the first laser chip (1) and the second laser chip (2) are located on the same side of the axis of the self-focusing lens (6).

6. An offset semiconductor laser device according to claim 2, characterized in that the first laser chip (1) and the second laser chip (2) are located on either side of the axis of the self-focusing lens (6).

7. An offset semiconductor laser device according to claim 6, characterized in that the first laser chip (1) and the second laser chip (2) are symmetrically arranged along both sides of the axis of the self-focusing lens (6).

8. An offset semiconductor laser device according to claim 2, characterized in that a sleeve (11) is provided through the side of the package (4), the coupling region of the self-focusing lens (6) and the output fiber (7) being mounted in the sleeve (11).

9. An offset semiconductor laser device according to claim 8, characterized in that the sleeve (11) is fixed to the package (4) by means of fasteners (12).

10. An offset semiconductor laser device according to any of claims 1 to 9, further comprising an anti-reflection plate (13), said anti-reflection plate (13) being arranged in front of the entrance face of said collimating and focusing unit.