SUMMERY OF THE UTILITY MODEL
The purpose of this application embodiment is to provide a cooling system, solves in order to carry the cooling water to the bottle-making machine, and the return water that cooling pipeline can meet is laid in the bottle-making workshop is not smooth, and the construction degree of difficulty is big, technical problem that construction cost is high.
In order to solve the above technical problem, an embodiment of the present application provides the following technical solutions:
the application provides a cooling system for cooling a plurality of equipment of treating heat dissipation, includes: a water replenishing pipeline; and
a plurality of heat abstractor, heat abstractor's quantity with treat the heat abstractor the same, and with treat the heat abstractor one-to-one, heat abstractor includes:
the top of the water tank is communicated with a first water pipe and is communicated with a water supplementing pipeline through the first water pipe;
the circulating pipeline is respectively communicated with the equipment to be radiated and the water tank; and
and the water pump is communicated with the circulating pipeline and is positioned at the bottom of the water tank.
In some modified embodiments of the present application, the circulation line includes:
the two ends of the water inlet pipe are respectively communicated with the water outlet of the water pump and the water inlet of the device to be cooled, and the water inlet of the water pump is communicated with the water tank; and
and the two ends of the water return pipe are respectively communicated with the water outlet of the equipment to be cooled and the water tank.
In some modified embodiments of the present application, the method further comprises: the first temperature sensor is arranged in the water return pipe; and
the controller is arranged on the side part of the water tank;
the temperature sensor and the water pump are respectively electrically connected with the controller, and the controller is used for receiving the temperature signal of the first temperature sensor and controlling the water pumping speed of the water pump according to the temperature signal.
In some modified embodiments of the present application, the method further comprises: and the second temperature sensor is arranged on the water inlet pipe and is electrically connected with the controller.
In some variations of the present application, at least some of the return pipes are metal pipes and are corrugated.
In some modified embodiments of the present application, the method further includes: and the heat exchanger is arranged between the water tank and the equipment to be cooled and is communicated with the water return pipe.
In some modified embodiments of the present application, the method further includes: and the filtering piece is arranged at the water outlet of the water return pipe and is detachably connected with the water return pipe.
In some modified embodiments of the present application, the method further includes: the observation window is arranged on the side part of the water tank and made of transparent materials, and the observation window longitudinally extends from the bottom to the top of the water tank.
In some modified embodiments of the present application, a heat dissipation liquid is stored in the water tank, and the water outlet of the water return pipe is located in the heat dissipation liquid.
In some modified embodiments of the present application, the method further includes: a drain line;
the bottom of the water tank is communicated with a second water pipe and is communicated with a drain pipeline through the second water pipe.
Compared with the prior art, the cooling system provided by the application is provided with a heat dissipation device corresponding to each device to be dissipated, each heat dissipation device is provided with a water tank, a water pump and a circulation pipeline, the circulation pipeline communicates the water tanks with the devices to be dissipated, heat dissipation is carried out through heat dissipation liquid in the water tanks, the heat dissipation devices and the heat dissipation devices are in one-to-one correspondence, water inlet and water return operation of one device to be dissipated can be completed without long time of the circulation pipeline, process pipelines for cooling water inlet and water return can be prevented from being arranged in a whole workshop, the technical problems of poor water return and pipeline inflation caused by overlong return water pipelines can be solved, the return water pipelines do not need to be embedded in the whole workshop, and the technical problems that construction difficulty is high and construction cost is high due to the fact that the return water pipelines are laid in the whole workshop area can be solved.
Detailed Description
Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.
It is to be noted that, unless otherwise specified, technical or scientific terms used herein shall have the ordinary meaning as understood by those skilled in the art to which this application belongs.
Examples
Referring to fig. 1 and 2, an embodiment of the present invention provides a cooling system for cooling a plurality of devices to be cooled 1, including: a water supply pipeline 2 and a plurality of heat dissipation devices 3; the quantity of heat abstractor 3 is the same with treating heat abstractor 1, and with treating heat abstractor 1 one-to-one, and heat abstractor 3 includes: the water pump comprises a water tank 31, a circulating pipeline 33 and a water pump 34, wherein the top of the water tank 31 is communicated with a first water pipe 32 and is communicated with a water supplementing pipeline 2 through the first water pipe 32; the circulating pipeline 33 is respectively communicated with the equipment to be radiated 1 and the water tank 31; the water pump 34 is in communication with the circulation line 33 and is located at the bottom of the water tank 31.
Specifically, the device 1 to be cooled may be a bottle making and forming machine, when a bottle making operation is performed by the bottle making and forming machine, a bottle mouth mold of the bottle making and forming machine needs to be cooled, the bottle mouth mold may have a cooling pipeline for water cooling, a cooling liquid is input into a water inlet of the cooling pipeline of the bottle mouth mold, the cooling liquid can absorb heat in the bottle mouth mold, and then the cooling liquid flows out from a water outlet of the cooling pipeline of the bottle mouth mold and takes away the heat, so as to achieve a heat dissipation effect, and the cooling liquid is used as a heat dissipation medium, usually liquid water is used, because the specific heat capacity of water is high, and the liquid water is easy to obtain, and the cost is low; the heat dissipation device 3 is a water cooling device, each heat dissipation device 3 is provided with a water tank 31, a circulation pipeline 33 and a water pump 34, the water tank 31 can be a rectangular box body with an opening at the top, the water pump 34 can be a bottom suction type submersible pump 34, heat dissipation liquid in the water tank 31 can be pumped into the equipment 1 to be dissipated through the circulation pipeline 33, the water tank 31 can be uniformly replenished through a water replenishing pipeline, the water tank 31 can be independently replenished, the heat dissipation device 3 and the equipment 1 to be dissipated are arranged in a one-to-one correspondence mode, the independent heat dissipation device 3 can realize water inlet and water return of the equipment 1 to be dissipated, the equipment 1 to be dissipated is close to a water source, the length of the circulation pipeline 33 can be reduced in a short range, a water inlet pipeline 331 and a water return pipeline 332 are not required to be arranged in the whole workshop, the problems of unsmooth water return caused by a process pipeline, gas filling and the like can be avoided, and the problem that the problem of pre-buried pipeline in the whole workshop is not required, the construction difficulty is greatly simplified, and the construction cost is saved.
When the cooling operation of the heat dissipation device 1 is performed, the water tank 31 of the plurality of heat dissipation devices 3 may be supplemented with the heat dissipation liquid through the water supplement pipeline 2, then the cooling pipeline of the heat dissipation device 1 is communicated with the corresponding circulation pipeline 33 of the heat dissipation device 3, the water pump 34 is started, the heat dissipation liquid may be pumped from the water tank 31 to the heat dissipation device 1, and then the heat dissipation liquid is collected in the water tank 31, so that the heat dissipation device 1 is rapidly cooled, each heat dissipation device 1 corresponds to one heat dissipation device 3, and the heat dissipation device 1 may be cooled simultaneously without arranging a cooling water inlet and a water return pipe 332 in the whole production workshop.
According to the aforesaid, the embodiment of the utility model provides a cooling system, it all is provided with a heat abstractor 3 to correspond each heat-dissipating equipment 1 of treating, heat abstractor 3 has water tank 31, water pump 34 and circulation pipeline 33, circulation pipeline 33 is with water tank 31 and the heat-dissipating equipment 1 intercommunication of treating, and dispel the heat through the radiating liquid in the water tank 31, owing to treat heat-dissipating equipment 1 and heat abstractor 3 one-to-one, so circulation pipeline 33 need not do very long just can accomplish one and treat the intaking and the return water operation of heat-dissipating equipment 1, can avoid arranging the process pipeline that cooling intake and return water were used in whole workshop, can solve the return water that the return water pipeline overlength leads to not smooth and the gas filled technical problem of pipeline, and no longer need be at the pre-buried return water pipeline in whole workshop, can solve the construction degree of difficulty that the return water pipeline caused in whole workshop region laying, technical problem that construction cost is high.
In some embodiments, referring to fig. 1 and 2, in a specific implementation, the circulation line 33 includes: the water inlet pipe 331 and the water return pipe 332, two ends of the water inlet pipe 331 are respectively communicated with a water outlet of the water pump 34 and a water inlet of the device to be cooled 1, and a water inlet of the water pump 34 is communicated with the water tank 31; both ends of the return pipe 332 are respectively communicated with the water outlet of the device to be cooled 1 and the water tank 31.
Specifically, the water tank 31 is located at the lower side of the device to be cooled 1, and the circulation line 33 includes: the heat dissipation device comprises a water inlet pipe 331 and a water return pipe 332, the upper end of the water inlet pipe 331 is communicated with the device to be cooled 1, the lower end of the water inlet pipe 331 is communicated with a water pump 34 and a water tank 31 in sequence, the upper end of the water return pipe 332 is communicated with the device to be cooled 1, the lower end of the water return pipe 332 is communicated with the water tank 31, the water pump 34 can pump heat dissipation liquid stored in the water tank 31, the heat dissipation liquid enters the device to be cooled 1 from the water tank 31 and then enters the water tank 31 from the device to be cooled 1, circulation of the heat dissipation liquid is completed, and the device to be cooled 1 is cooled rapidly.
In some embodiments, referring to fig. 1 and 2, in an implementation, the first temperature sensor 35 and the controller 36, the first temperature sensor 35 is disposed in the water return pipe 332; the controller 36 is disposed at a side of the water tank 31; the temperature sensor and the water pump 34 are electrically connected to a controller 36, respectively, and the controller 36 is configured to receive a temperature signal from the first temperature sensor 35 and control a pumping speed of the water pump 34 according to the temperature signal.
Specifically, the second temperature sensor 37 may be, but is not limited to: PT100, the controller 36 may be but is not limited to a PLC controller 36, the first temperature sensor 35 is disposed in the water return pipe 332, and can detect the temperature of the heat dissipation liquid in the water return pipe 332 and feed back the detected temperature to the controller 36; when the heat dissipation device 3 dissipates heat to the equipment 1 to be dissipated, a return water temperature T0 can be calibrated in the controller 36, a water temperature fluctuation range T1 is set, and when the actually detected return water temperature T (i.e., the temperature of the heat dissipation liquid in the return water pipe 332) exceeds a calibrated upper limit temperature (T0 + T1), it indicates that the current circulating water circulation speed is slow, the controller 36 controls and changes the pumping speed of the water pump 34, and the cooling circulation speed is increased by changing the pumping speed; similarly, when the actually detected return water temperature T exceeds the calibrated lower limit temperature (T0-T1), the controller 36 may reduce the circulation speed of water by adjusting; through automatically adjusting the circulation speed of the heat dissipation liquid, the heat dissipation liquid entering the device to be cooled 1 keeps a relatively constant temperature, and the problem that the heat dissipation efficiency is affected due to overhigh temperature of the heat dissipation liquid or the product quality is affected due to overlarge temperature difference between the heat dissipation liquid and the device to be cooled 1 due to overlow temperature of the heat dissipation liquid is avoided.
In some embodiments, referring to fig. 1 and fig. 2, in a specific implementation, the method further includes: the second temperature sensor 37 is disposed on the water inlet pipe 331 and electrically connected to the controller 36.
Specifically, the second temperature sensor 37 may be, but is not limited to: PT100, second temperature sensor 37 sets up in inlet tube 331, can detect the temperature of the radiating liquid in inlet tube 331 and feed back to controller 36, controller 36 can monitor the temperature of the radiating liquid that enters into in treating heat radiation equipment 1 from water tank 31 through the temperature signal that second temperature sensor 37 feedbacks, when the temperature of the radiating liquid that enters into treating heat radiation equipment 1 is too high, it is too high to explain the radiating liquid in whole water tank 31, treat that the radiating effect of heat radiation equipment 1 is not enough, controller 36 can in time control water pump 34 stop work this moment, and report to the police, remind the staff to handle in time, change the radiating liquid to the temperature that reduces the radiating liquid or to the radiating liquid, avoid heat abstractor 3 invalid work, waste resources.
In some embodiments, referring to fig. 1 and 2, in an implementation, at least a portion of the return pipe 332 is a metal pipe 3321 and is wavy.
Specifically, the water return pipe 332 has a part of metal pipe 3321, which may be but not limited to a copper pipe, so that the heat-dissipating liquid that absorbs the heat of the device 1 to be heat-dissipated can exchange heat with air more quickly, and the temperature of the heat-dissipating liquid is reduced, and the metal pipe 3321 extends in a wavy manner, so as to increase the volume of the heat-dissipating liquid in the metal pipe 3321, increase the area of the heat-dissipating liquid that exchanges heat with air, and reduce the temperature of the heat-dissipating liquid, so that the heat-dissipating liquid flowing back to the water tank 31 is not overheated, which affects the heat-dissipating effect of the device 1 to be heat-dissipated.
In some embodiments, referring to fig. 1 and fig. 2, in a specific implementation, the method further includes: and the heat exchanger 38 is arranged between the water tank 31 and the device to be cooled 1 and is communicated with the water return pipe 332.
Specifically, the heat exchanger 38 has a plurality of heat dissipation fins arranged at intervals, so that the contact area between the heat dissipation fins and air can be greatly increased, the heat dissipation liquid absorbing heat of the device to be cooled 1 enters the heat exchanger 38, heat can be exchanged with outside air through the heat exchanger 38, the temperature of the heat dissipation liquid is effectively reduced, and the heat dissipation liquid flowing back to the water tank 31 cannot be overheated, so that the heat dissipation effect of the device to be cooled 1 is affected.
In some embodiments, referring to fig. 1 and fig. 2, in a specific implementation, the method further includes: and a filtering member 39 disposed at a water outlet of the water return pipe 332 and detachably connected to the water return pipe 332.
Specifically, the filtering element 39 may be, but is not limited to, a mesh filter, and the filtering element 39 may filter the heat dissipating liquid discharged from the water return pipe 332 to retain impurities such as glass cullet in the heat dissipating liquid, so that the heat dissipating liquid circulating in the water tank 31 is kept clean, the frequency of replacing the heat dissipating liquid is reduced, resources are saved, the production cost is reduced, and a replacement of the heat dissipating liquid can be performed once in half a year under an ideal effect.
In some embodiments, referring to fig. 1 and fig. 2, in a specific implementation, the method further includes: the observation window is arranged on the side part of the water tank 31 and made of transparent materials, and the observation window longitudinally extends from the bottom to the top of the water tank 31.
Specifically, the observation window can be but not limited to a toughened glass, can follow the outside of water tank 31 through the observation window and observe the condition in the water tank 31, can observe the muddy degree of heat dissipation liquid through the observation window, when heat dissipation liquid is too muddy, can change heat dissipation liquid, avoids too muddy heat dissipation liquid radiating effect to descend and causes the pipeline impaired even.
In some embodiments, referring to fig. 1 and 2, a heat dissipating liquid is stored in the water tank 31, and the water outlet of the return pipe 332 is located in the heat dissipating liquid.
Specifically, the heat dissipation liquid may be, but is not limited to, liquid clear water, the water return pipe 332 extends into the heat dissipation liquid, that is, the liquid level of the heat dissipation liquid is higher than the water outlet of the water return pipe 332, when the water pump 34 stops working, the heat dissipation liquid will flow back along with the water return pipe 332, so that the water return pipe 332 is kept in a liquid-filled state, and it is avoided that the high-temperature liquid flows back too fast, so that the water return pipe 332 is extruded towards the inner side thereof, which causes damage and affects the service life thereof.
In some embodiments, referring to fig. 1 and 2, further comprising: a drain line;
the bottom of the water tank 31 is communicated with a second water pipe and is communicated with a drain pipeline through the second water pipe.
Specifically, the drain line can but not be limited to a sewer pipe, and the water tanks 31 of a plurality of heat abstractor 3 communicate with the drain line through the second water pipe respectively, can be when carrying out the washing maintenance of water tank 31 and radiating liquid renew, together the evacuation with the radiating liquid in the water tank 31, need not artifically scoop out radiating liquid from water tank 31 or discharge radiating liquid one by one and carry discarded radiating liquid again, reach the technological effect who uses manpower sparingly.
It should be noted that in the description of the present specification, the terms "upper", "lower", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, which are only for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention; the terms "connected," "mounted," "secured," and the like are to be construed broadly and include, for example, fixed connections, removable connections, or integral connections; may be directly connected or indirectly connected through an intermediate. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
In the description of the present specification, the description of the terms "one embodiment," "some embodiments," "specific embodiments," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The above embodiments are only specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily think of changes or substitutions within the technical scope of the present invention, and all should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.