CN218191371U - Automatic cleaning equipment for semiconductor - Google Patents

Abstract

The utility model discloses a semiconductor automatic cleaning equipment, the power distribution box comprises a box body, oxidation treatment trough, dissolving tank and deionization washing tank have from left to right set gradually on the equipment box, oxidation treatment trough with the dissolving tank with be provided with vertical baffle between deionization washing tank, the up end bilateral symmetry of equipment box is provided with two and is listed as a plurality of combination pieces, and two up ends that are listed as a plurality of combination pieces in both sides are provided with the backup pad, the lower terminal surface of backup pad just corresponds the fixed telescopic cylinder that is provided with corresponding quantity of oxidation treatment trough, dissolving tank and deionization washing tank respectively, every telescopic cylinder's bottom is provided with horizontal guide, two relatively the activity is provided with the support between horizontal guide, the inside groove bottom of support is provided with puts the magazine, and two both sides are listed as the outside upper portion of combination piece is provided with air-dry fan. The utility model discloses can realize good semiconductor silicon cleaning performance.

Description

Automatic semiconductor cleaning equipment

Technical Field

The utility model relates to a semiconductor washs relevant technical field, specifically is a semiconductor self-cleaning equipment.

Background

At present, before a semiconductor preparation process is carried out, metal ions attached to semiconductor silicon need to be cleaned, and wet cleaning and dry cleaning are common.

However, most of the wet cleaning methods are manual cleaning, and the following problems often exist in practical application: an operator is required to continuously perform repetitive mechanical movement on the operating platform, so that the working intensity of the operator is increased, and the cleaning efficiency is low; because different liquid medicine ponds need to be changed often during the washing and soak the washing, and arrange on same platform, cause the liquid medicine in different liquid medicine ponds to pollute each other easily, influence subsequent cleaning performance.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a semiconductor self-cleaning equipment to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above purpose, the utility model provides a following technical scheme: the utility model provides an automatic semiconductor cleaning equipment, includes the equipment box, oxidation treatment trough, dissolving tank and deionization washing tank have from left to right set gradually on the equipment box, oxidation treatment trough with the dissolving tank with be provided with vertical baffle between the deionization washing tank, the up end bilateral symmetry of equipment box is provided with two and is listed as a plurality of combination piece, and two up ends that are listed as a plurality of combination piece in both sides are fixed and are provided with the backup pad, the lower terminal surface of backup pad just corresponds oxidation treatment trough, dissolving tank and deionization washing tank respectively and is fixed and is provided with corresponding quantity's telescopic cylinder, every telescopic cylinder's bottom mounting is provided with horizontal guide, and two relatively the activity is provided with the support between horizontal guide, the inside groove bottom of support is provided with puts the magazine, and two both sides are listed as the outside of combination piece just is provided with the spout at equipment box terminal surface, both sides the upper end activity of spout is provided with air-dry fan.

Preferably, the lower end corner of the air drying fan is fixedly provided with a sliding block, and the sliding block is horizontally and movably arranged in the sliding groove.

Preferably, rail grooves matched with the horizontal guide rails are horizontally arranged on the inner end faces of the plurality of combination blocks in the middle of the two rows of the combination blocks on the two sides.

Preferably, a strong H2O2 oxidizer and a cleaning solution are added into the oxidation treatment tank, HCl is contained in the dissolution tank, and a large amount of deionized water is contained in the deionization cleaning tank.

Preferably, the bottom of the deionization cleaning tank is provided with an energy transducer and an ultrasonic generator, and the energy transducer and the ultrasonic generator are externally connected with a power line for electrifying.

Preferably, the bottom of the material containing box is provided with a porous structure.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the oxidation treatment tank, the dissolving tank and the deionization cleaning tank are arranged in the utility model, the semiconductor silicon to be cleaned can be placed in the oxidation treatment tank, the dissolving tank and the deionization cleaning tank in sequence for cleaning, so as to achieve good semiconductor silicon cleaning effect;

2. the utility model discloses backup pad, telescopic cylinder, horizontal guide, the air-dry fan that still set up simultaneously under their common cooperation is used, can weather the operation to the semiconductor silicon of single reaction tank department, avoid the washing liquid between adjacent reaction tanks to pollute each other, prolong the live time of washing liquid.

Drawings

FIG. 1 is a perspective view of the first perspective of the present invention;

FIG. 2 is a perspective view of the second perspective of the whole structure of the present invention;

FIG. 3 is a three-dimensional structure diagram of the overall third viewing angle of the present invention;

FIG. 4 is a perspective view of the fourth view angle of the whole structure of the present invention;

fig. 5 is a side sectional plan structure view of the present invention.

In the figure: 1. an equipment box body; 2. an oxidation treatment tank; 3. a dissolving tank; 4. a deionization cleaning tank; 5. combining the blocks; 6. a support plate; 7. a telescopic cylinder; 8. a horizontal guide rail; 9. a support; 10. placing a material box; 11. a chute; 12. air drying the fan; 13. a slider; 14. a transducer; 15. an ultrasonic generator.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-5, the present invention provides a technical solution: the utility model provides a semiconductor automatic cleaning equipment, including equipment box 1, from left to right, it is equipped with oxidation treatment tank 2 to leave in proper order to open a slot on the equipment box 1, dissolving tank 3 and deionization washing tank 4, oxidation treatment tank 2 and dissolving tank 3, welding installation has vertical baffle between dissolving tank 3 and deionization washing tank 4, the up end bilateral symmetry welding of equipment box 1 installs two a plurality of combination piece 5, the up end that two a plurality of combination piece 5 in both sides have a backup pad 6 through spliced pole welded fastening, the lower terminal surface of backup pad 6 just corresponds oxidation treatment tank 2 respectively, dissolving tank 3 and deionization washing tank 4 bolt fixedly connected with corresponding quantity's telescopic cylinder 7, the bottom bolt fixed mounting of every telescopic cylinder 7 has horizontal guide rail 8, relative two horizontal guide rail 8 and at rail inslot horizontal sliding motion install support 9, the inside groove bottom of support 9 is inserted and is established the joint built-up dress magazine 10, two outside of combination piece 5 in both sides just leave at the equipment box 1 terminal surface fluting and be equipped with spout 11, the upper end sliding mounting of both sides spout 11 has air-dries fan 12.

The lower end corner of the air drying fan 12 is welded with a sliding block 13, and the sliding block 13 is connected in a horizontal sliding manner in the sliding groove 11; the inner end faces of a plurality of combined blocks 5 in the middle of two rows of the plurality of combined blocks 5 on two sides are horizontally grooved and provided with rail grooves matched with the horizontal guide rail 8, the horizontal guide rail 8 is pulled by the telescopic cylinder 7 to move to the upper end, and the rail grooves can be positioned on the same plane with the rail grooves horizontally grooved and provided on the inner end faces of the plurality of combined blocks 5 in the middle of the two rows of the plurality of combined blocks 5 on two sides, so that the support 9 and the material placing box 10 can conveniently perform horizontal linear motion; the oxidation treatment tank 2 is added with a H2O2 strong oxidant and cleaning liquid, H2O2 is used as the strong oxidant, metal ions attached to the surface of a semiconductor silicon wafer in an electroplating mode are oxidized into metal and dissolved in the cleaning liquid or adsorbed on the surface of the semiconductor silicon wafer, HCL is arranged in the dissolving tank 3 and generally used as a source of H < + >, the HCL replaces the metal ions adsorbed on the surface of the semiconductor silicon wafer and is dissolved in the cleaning liquid, so that the metal ions are removed, a large amount of deionized water is arranged in the deionization cleaning tank 4, and ultrasonic cleaning can be carried out by using a large amount of deionized water to remove the metal ions in the solution; the energy converter 14 and the ultrasonic generator 15 are installed at the bottom of the deionization cleaning tank 4, the energy converter 14 and the ultrasonic generator 15 are externally connected with a power line and are electrified, ultrasonic waves are started, and a large amount of deionized water is driven in the deionization cleaning tank 4 to remove metal ions in the solution; the bottom of the material placing box 10 is provided with a porous structure, and when the support 9 and the material placing box 10 leave the liquid level, water can be drained through the porous structure, so that the cleaned semiconductor can be taken out conveniently.

The working principle is as follows: when the utility model is used, firstly, the material placing box 10 is combined on the end surface of the bracket 9 at the oxidation treatment groove 2, the semiconductor silicon to be cleaned is placed in the inner groove of the material placing box 10, then the two rows of telescopic cylinders 7 at both sides are started, the bracket 9 and the material placing box 10 are moved down and placed below the cleaning liquid level of the inner groove of the oxidation treatment groove 2 and react for a period of time, then the H2O2 strong oxidant added through the inner groove of the oxidation treatment groove 2 oxidizes the metal ions attached to the surface of the semiconductor silicon into metal which is dissolved in the cleaning liquid or adsorbed on the surface of the semiconductor silicon wafer, then the two rows of telescopic cylinders 7 at both sides are started again, the bracket 9 and the material placing box 10 are moved up, so that the semiconductor silicon leaves the cleaning liquid level, the air drying fan 12 can be horizontally moved to the position right above the material placing box 10 through the chutes 11 at both sides when the semiconductor silicon is kept still for a period of time, the air drying fan 12 is started, blow-drying the standing semiconductor silicon, then moving a bracket 9 and a material placing box 10 to the position right above a dissolving tank 3 through two rows of horizontal guide rails 8 at two sides of the upper end of an equipment box body 1, simultaneously using a telescopic cylinder 7 corresponding to the position to move the bracket 9 and the material placing box 10 downwards below the cleaning liquid level of an inner groove of the dissolving tank 3, replacing metal ions adsorbed on the surface of a semiconductor silicon wafer by using HCL of the dissolving tank 3 as a source of H + to dissolve the metal ions in cleaning liquid so as to achieve the effect of cleaning the metal ions on the surface, performing the following operations in the same way that the semiconductor silicon leaves an oxidation treatment tank 2, finally moving the semiconductor silicon to the position above a deionization cleaning tank 4, moving the semiconductor silicon downwards under the action of the telescopic cylinder 7 corresponding to the position to be placed in the deionization cleaning tank 4, starting an energy converter 14 and an ultrasonic generator 15, ultrasonic cleaning is carried out on a large amount of deionized water to remove metal ions in the solution, and the ultrasonic cleaning device has the advantages of simple operation, convenient use and good use effect.

It should be noted that, in this document, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (6)

1. The utility model provides a semiconductor self-cleaning equipment, includes equipment box (1), its characterized in that: the air drying device is characterized in that an oxidation treatment tank (2), a dissolving tank (3) and a deionization cleaning tank (4) are sequentially arranged on the device box body (1) from left to right, the oxidation treatment tank (2) and the dissolving tank (3) are provided with vertical type partition plates between the dissolving tank (3) and the deionization cleaning tank (4), two columns of a plurality of combination blocks (5) are symmetrically arranged on the two sides of the upper end face of the device box body (1), two columns of the upper end face of the combination blocks (5) on the two sides are fixedly provided with a support plate (6), the lower end face of the support plate (6) corresponds to the oxidation treatment tank (2), the dissolving tank (3) and the deionization cleaning tank (4) and is fixedly provided with corresponding number of telescopic cylinders (7), each column of the two sides of the outer side of the combination blocks (5) is provided with a horizontal guide rail (8) and a support (9) between the horizontal guide rails (8), a material placing box (10) is arranged at the bottom of an inner groove of the support (9), and two columns of the combination blocks (5) are arranged on the end face of the device box body (1), and a fan (12) is movably provided with an air drying chute (12).

2. The automatic semiconductor cleaning device according to claim 1, wherein: the lower end corner of the air drying fan (12) is fixedly provided with a sliding block (13), and the sliding block (13) is horizontally movably arranged in the sliding groove (11).

3. The automatic semiconductor cleaning device according to claim 1, wherein: rail grooves matched with the horizontal guide rails (8) are horizontally arranged on the inner end surfaces of the plurality of combination blocks (5) positioned in the middle part in two rows of the combination blocks (5) at the two sides.

4. The automatic semiconductor cleaning device according to claim 1, wherein: the oxidation treatment tank (2) is added with a H2O2 strong oxidant and a cleaning solution, the dissolving tank (3) is filled with HCl, and the deionization cleaning tank (4) is filled with a large amount of deionized water.

5. The automatic semiconductor cleaning device according to claim 1, wherein: the bottom of the deionization cleaning tank (4) is provided with an energy converter (14) and an ultrasonic generator (15), and the energy converter (14) and the ultrasonic generator (15) are externally connected with a power line and are electrified.

6. The automatic semiconductor cleaning device according to claim 1, wherein: the bottom of the material placing box (10) is provided with a porous structure.

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