CN218173504U - Material conveying device of LED lamp bead wire welding machine - Google Patents
Material conveying device of LED lamp bead wire welding machine Download PDFInfo
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- CN218173504U CN218173504U CN202221794816.2U CN202221794816U CN218173504U CN 218173504 U CN218173504 U CN 218173504U CN 202221794816 U CN202221794816 U CN 202221794816U CN 218173504 U CN218173504 U CN 218173504U
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Abstract
The utility model relates to the technical field of LED chip processing, and discloses a material conveying device of an LED lamp bead welding wire machine, wherein a feeding frame comprises a feeding area and a feeding area, a first lifting driver drives a first support frame of a material box to lift up and down between the feeding area and the feeding area, and a material pusher can push a chip frame to be processed in the material box to enter the LED chip welding wire machine; the first box pushing device can push empty material boxes on the first supporting frame to enter the empty box conveying mechanism, the material returning frame comprises a material returning area and a material discharging area, the second lifting driver can drive the second supporting frame to lift up and down between the material returning area and the material discharging area, the empty box conveying mechanism sends the empty material boxes into the second supporting frame located on the material returning area, and the material discharging end of the LED chip wire welding machine is matched with the material boxes on the second supporting frame. The utility model discloses enable the empty magazine on the feeding mechanism and can get into feed back mechanism automatically and collect the worker's chip piece frame that loads processing, degree of automation is high, realizes continuous material loading, effectively improves production efficiency.
Description
Technical Field
The utility model relates to a LED chip processing technology field especially relates to a material conveyor of LED lamp pearl bonding machine.
Background
At present, the wire bonding process of the LED lamp bead wire bonding mainly comprises the steps of feeding chip frames to be processed in a material box loaded with the chip frames to be processed into an LED lamp bead wire bonding machine one by one, discharging the processed chip frames from a discharge end of the LED lamp bead wire bonding machine, and then feeding the processed chip frames into a material box loaded with the processed chip frames; and load and treat in the magazine of processing chip frame treat in the chip frame of processing chip all load and treat that processing chip frame send into LED lamp pearl bonding wire machine after, need artifical empty magazine of retrieving, then receive the material with empty magazine setting in one side of the discharge end of LED lamp pearl bonding wire machine again, nevertheless whole process all needs manual handling, production efficiency is low.
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the utility model is: the utility model provides a material conveyor of LED lamp pearl bonding machine can make the empty magazine on the feeding mechanism can get into feed back mechanism automatically and collect and load the worker's chip frame that has processed, and degree of automation is high, realizes continuous material loading, effectively improves production efficiency.
In order to solve the technical problem, the utility model provides a material conveying device of an LED lamp bead wire welding machine, which comprises a frame, an LED chip wire welding machine, a feeding mechanism, an empty box conveying mechanism and a feed back mechanism,
the feeding mechanism is arranged at the first end of the rack, the return mechanism is arranged at the second end of the rack, and the empty box conveying mechanism is arranged on the rack and is positioned between the feeding mechanism and the return mechanism;
the feeding mechanism comprises a feeding frame, a first lifting driver, a first supporting frame, a material pusher and a first box pusher; the feeding frame comprises a feeding area and a feeding area, the first lifting driver is connected with the first support frame and can drive the first support frame for loading a material box of a chip frame to be processed to lift up and down between the feeding area and the feeding area, and the material pusher is arranged on the feeding frame and can push the chip frame to be processed in the material box to enter the feeding end of the LED chip wire welding machine;
the first box pushing device is arranged on the feeding frame and can push empty material boxes on the first support frame positioned on the feeding area to enter the first end of the empty box conveying mechanism,
the material returning mechanism comprises a material returning frame, a second lifting driver and a second supporting frame; the feed back frame includes feed back district and ejection of compact district, second lifting drive ware with the second support frame is connected and can drives the magazine that is used for loading processed chip sheet frame the second support frame be in go up and down between feed back district and the ejection of compact district, empty box conveying mechanism's second end is hugged closely the feed back district just empty box conveying mechanism sends into empty magazine and is located on the feed back district on the second support frame, the worker's chip sheet frame of having processed is followed the discharge end of LED chip bonding machine gets into in the magazine that is used for loading processed chip sheet frame on the second support frame.
As the utility model discloses preferred scheme, be equipped with the storage platform in the frame, it pushes away box ware to be equipped with the second on the work or material rest to return, the second pushes away box ware and can promote to be located on the ejection of compact district the magazine of loading chip sheet frame has been processed on the second support frame gets into the storage platform.
As the utility model discloses preferred scheme, empty box conveying mechanism includes conveyer belt and propelling movement subassembly, the propelling movement subassembly is including setting up first cylinder in the frame is in with the setting the second cylinder of the output of first cylinder, the direction of stretching out of the push rod of first cylinder with the direction of delivery of conveyer belt is mutually perpendicular, the direction of stretching out of the push rod of second cylinder with the direction of delivery of conveyer belt is unanimous.
As the utility model discloses preferred scheme, the first support frame is the same with the structure of second support frame and all includes the backplate and connects the bottom plate of the bottom of backplate, the backplate with the bottom plate is mutually perpendicular.
As the utility model discloses preferred scheme, first lift driver all includes that elevator motor and lead screw are vice with second lift driver, elevator motor's output with the vice lead screw of lead screw is connected, the vice nut of lead screw of first lift driver with the backplate of first support frame is connected, the vice nut of lead screw of second lift driver with the backplate of second support frame is connected.
As the utility model discloses preferred scheme, the feed end of LED chip bonding wire machine and the discharge end of LED chip bonding wire machine all include the connecting plate and set up drive belt on the connecting plate.
As the preferred proposal of the utility model, the material pusher and the first box pusher are electric push rods or cylinders.
As the preferred scheme of the utility model, the second pushes away the box ware and is electric putter or cylinder.
The embodiment of the utility model provides a material conveyor of LED lamp pearl bonding machine compares with prior art, and its beneficial effect lies in:
the first support frame is positioned in the feeding area for feeding, a material box fully loaded with a chip frame to be processed is placed on the first support frame, then the first support frame is driven to gradually rise through the first lifting driver, a material pusher pushes the chip frame to be processed in the material box loaded with the chip frame to be processed one by one into the feeding end of the LED chip welding wire machine for welding processing, and then a second support frame at the second end of the rack gradually descends through the second lifting driver for collecting and loading the processed chip frame; and rise to the pay-off district at first support frame, wait to process chip sheet frame in the magazine on first support frame and have all sent into LED chip bonding wire machine and process, then through first box pusher with above-mentioned empty magazine propelling movement to empty box conveying mechanism on, empty box conveying mechanism sends into empty magazine again and collects the worker's chip sheet frame that the discharge end processing of LED chip bonding wire machine was accomplished on the second support frame that is located the feed back district, visibly, the utility model provides an empty magazine on the feeding mechanism can get into feed back mechanism automatically and collect and load the worker's chip sheet frame that has processed, and degree of automation is high, realizes material loading in succession, effectively improves production efficiency.
Drawings
Fig. 1 is a schematic structural view of a material conveying device of an LED lamp bead wire welding machine according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of an empty box conveying mechanism provided by the embodiment of the present invention;
in the figure, 1 is a frame; 2 is an LED chip wire bonding machine; 31 is a feeding frame; 32 is a first support frame; 33 is a pusher; 34 is a first box pushing device; a feeding area is 35; 36 is a feeding area; 41. is a material returning frame; 42 is a second support frame; 43 is a feed back zone; 44 is a discharge zone; 45 is a second box pusher; 5 is an empty box conveying mechanism; 51 is a conveying belt; 52 is a first cylinder; 53 is a second cylinder; 6 is a containing table; and 7 is a material box.
Detailed Description
The following detailed description of the embodiments of the present invention is provided with reference to the accompanying drawings and examples. The following examples are intended to illustrate the invention, but are not intended to limit the scope of the invention.
In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, which indicate the orientation or positional relationship, are used in the present invention as being based on the orientation or positional relationship shown in the drawings, and are used only for convenience of description and simplification of the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
As shown in fig. 1 and fig. 2, a preferred embodiment of a material conveying device of an LED lamp bead wire bonding machine according to a preferred embodiment of the present invention includes a frame 1, an LED chip wire bonding machine 2, a feeding mechanism, an empty box conveying mechanism 5 and a material returning mechanism,
the feeding mechanism is arranged at the first end of the rack 1, the feeding back mechanism is arranged at the second end of the rack 1, and the empty box conveying mechanism 5 is arranged on the rack 1 and is positioned between the feeding mechanism and the feeding back mechanism;
the feeding mechanism comprises a feeding frame 31, a first lifting driver, a first supporting frame 32, a material pusher 33 and a first box pusher 34; the feeding frame 31 comprises a feeding area 35 and a feeding area 36, the first lifting driver is connected with the first support frame 32 and can drive the first support frame 32 of the material box 7 for loading the chip frames to be processed to lift up and down between the feeding area 35 and the feeding area 36, and the material pusher 33 is arranged on the feeding frame 31 and can push the chip frames to be processed in the material box 7 to enter the feeding end of the LED chip bonding machine 2;
the first box pusher 34 is arranged on the feeding rack 31 and can push the empty boxes 7 on the first supporting frame 32 on the feeding area 36 into the first end of the empty box conveying mechanism 5,
the material returning mechanism comprises a material returning frame 41, a second lifting driver and a second supporting frame 42; the material returning frame 41 comprises a material returning area 43 and a material discharging area 44, the second lifting driver is connected with the second support frame 42 and can drive the second support frame 42 used for loading the material box 7 of the processed chip frame to lift up and down between the material returning area 43 and the material discharging area 44, the second end of the empty box conveying mechanism 5 is tightly attached to the material returning area 43, the empty box conveying mechanism 5 conveys the empty material box 7 to the second support frame 42 positioned on the material returning area 43, and the processed chip frame enters the material box 7 used for loading the processed chip frame on the second support frame 42 from the material discharging end of the LED chip bonding machine 2. The structure of the magazine 7 is the same as that of the magazine 7 for loading the chip frame, and is not described herein.
Therefore, the first support frame 32 is located in the feeding area 35 for feeding, the magazine 7 fully loaded with the chip frames to be processed is placed on the first support frame 32, then the first support frame 32 is driven by the first lifting driver to gradually ascend, the pusher 33 pushes the chip frames to be processed in the magazine 7 loaded with the chip frames to be processed into the feeding end of the LED chip wire bonding machine 2 one by one for welding processing, and then the second support frame 42 at the second end of the rack 1 gradually descends by the second lifting driver for collecting and loading the processed chip frames; and rise to pay-off district 36 at first support frame 32, treat in the magazine 7 on first support frame 32 that the chip frame of processing has all been sent into LED chip bonding wire machine 2 and process, then through first box pusher 34 with the propelling movement of above-mentioned empty magazine 7 to empty box conveying mechanism 5 on, empty box conveying mechanism 5 sends into empty magazine 7 again and is located second support frame 42 of feed back district 43 and collects the worker chip frame of processing that LED chip bonding wire machine 2's discharge end processing was accomplished, it is visible, the utility model provides an empty magazine 7 on the feeding mechanism can get into feed back mechanism automatically and collect and load the worker chip frame of processing, and degree of automation is high, realizes continuous material loading, effectively improves production efficiency.
Illustratively, the rack 1 is provided with a receiving table 6, the material returning frame 41 is provided with a second box pushing device 45, the second box pushing device 45 can push the material box 7 loaded with the processed chip frame on the second supporting frame 42 on the material discharging area 44 to enter the receiving table 6, so that the material box 7 loaded with the processed chip frame is pushed from the material discharging area 44 to the receiving table 6 through the second box pushing device 45 for collection, manual treatment is not needed in the whole process, and the working efficiency is improved; preferably, the accommodating table 6 is provided with conveying rollers, and the material box 7 fully loaded with the processed chip frame is conveyed to a preset position through the conveying rollers.
Illustratively, the empty box conveying mechanism 5 comprises a conveying belt 51 and a pushing assembly, the pushing assembly comprises a first air cylinder 52 arranged on the rack 1 and a second air cylinder 53 arranged at an output end of the first air cylinder 52, a protruding direction of a push rod of the first air cylinder 52 is perpendicular to a conveying direction of the conveying belt 51, a protruding direction of a push rod of the second air cylinder 53 is consistent with the conveying direction of the conveying belt 51, the empty box 7 is pushed to a first end of the conveying belt 51 by the first box pushing device 34, the conveying belt 51 drives the empty box 7 to move to a second end of the conveying belt 51, then the first air cylinder 52 and the second air cylinder 53 in the pushing assembly are matched to push the empty box 7 at the second end of the conveying belt 51 to enter the second support frame 42 located on the discharging area 44, automatic material return of the empty box 7 is achieved, manual operation is reduced, and working efficiency is improved.
Illustratively, the first support frame 32 and the second support frame 42 have the same structure and each include a back plate and a bottom plate connected to the bottom of the back plate, the back plate is perpendicular to the bottom plate, and the support frames effectively support the magazine 7.
Illustratively, the first lifting driver and the second lifting driver both include a lifting motor and a screw pair, an output end of the lifting motor is connected with a screw of the screw pair, a nut of the screw pair of the first lifting driver is connected with a back plate of the first support frame 32, and a nut of the screw pair of the second lifting driver is connected with a back plate of the second support frame 42, so that the first support frame 32 can conveniently ascend step by step and descend step by step with the second support frame 42; after the material box 7 on the first support frame 32 is sent into the empty box conveying mechanism 5, the first support frame 32 descends to the material loading area 35 for loading; after the material box 7 on the second support frame 42 is pushed into the containing table 6, the second support frame 42 is lifted to the material return area 43 to be sent into the empty material box 7 by the empty box conveying mechanism 5.
Exemplarily, the feed end of the LED chip bonding wire machine 2 and the discharge end of the LED chip bonding wire machine 2 both include a connection plate and a transmission belt disposed thereon, so that the feed end of the LED chip bonding wire machine 2 pushes the pusher 33 out of the chip frame to be processed and then feeds the chip frame into the LED chip bonding wire machine 2 for processing, and the processed chip frame is fed into the magazine 7 of the second support frame 42 through the discharge end of the LED chip bonding wire machine 2 (the feed end of the LED chip bonding wire machine 2 and the discharge end of the LED chip bonding wire machine 2 are both provided with a connection plate and a transmission belt disposed thereon, and the chip frame to be processed is fed into the magazine 7 of the LED chip bonding wire machine 2 for processing and the processed chip frame is fed into the second support frame 42 through the transmission belt.
Preferably, the pusher 33, the first box pusher 34, and the second box pusher 45 may be electric pushers or pneumatic cylinders.
In the description of the present invention, it is to be understood that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are used in a generic sense, e.g., fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of modifications and replacements can be made without departing from the technical principle of the present invention, and these modifications and replacements should also be regarded as the protection scope of the present invention.
Claims (7)
1. A material conveying device of an LED lamp bead wire welding machine is characterized by comprising a frame, an LED chip wire welding machine, a feeding mechanism, an empty box conveying mechanism and a material returning mechanism,
the feeding mechanism is arranged at the first end of the rack, the return mechanism is arranged at the second end of the rack, and the empty box conveying mechanism is arranged on the rack and is positioned between the feeding mechanism and the return mechanism;
the feeding mechanism comprises a feeding frame, a first lifting driver, a first supporting frame, a material pusher and a first box pusher; the feeding frame comprises a feeding area and a feeding area, the first lifting driver is connected with the first support frame and can drive the first support frame for loading a material box of a chip frame to be processed to lift up and down between the feeding area and the feeding area, and the material pusher is arranged on the feeding frame and can push the chip frame to be processed in the material box to enter the feeding end of the LED chip wire welding machine;
the first box pusher is arranged on the feeding rack and can push empty material boxes on the first support frame positioned on the feeding area to enter the first end of the empty box conveying mechanism,
the feeding back mechanism comprises a feeding back frame, a second lifting driver and a second supporting frame; the feed back frame comprises a feed back area and a discharge area, the second lifting driver is connected with the second support frame and can drive a material box used for loading processed chip frames, the second support frame is lifted up and down between the feed back area and the discharge area, the second end of the empty box conveying mechanism is tightly attached to the feed back area, the empty box conveying mechanism is used for conveying empty material boxes to the position on the feed back area, the processed chip frames are driven by the discharge end of the LED chip welding machine to enter the material box used for loading the processed chip frames on the second support frame.
2. The material conveying device of an LED lamp bead wire bonding machine according to claim 1, wherein a receiving platform is disposed on the frame, and a second cassette pusher is disposed on the material returning frame, and the second cassette pusher can push a magazine loaded with processed chip frames on the second support frame on the discharging area into the receiving platform.
3. The material conveying device of the LED lamp bead wire bonding machine according to claim 1, wherein the empty box conveying mechanism includes a conveying belt and a pushing assembly, the pushing assembly includes a first cylinder disposed on the rack and a second cylinder disposed at an output end of the first cylinder, a protruding direction of a push rod of the first cylinder is perpendicular to a conveying direction of the conveying belt, and a protruding direction of a push rod of the second cylinder is consistent with the conveying direction of the conveying belt.
4. The material conveying device of the LED lamp bead wire bonding machine according to claim 1, wherein the first support frame and the second support frame have the same structure and each include a back plate and a bottom plate connected to a bottom of the back plate, and the back plate is perpendicular to the bottom plate.
5. The material conveying device of the LED lamp bead wire bonding machine according to claim 4, wherein the first and second lifting drivers each include a lifting motor and a screw pair, an output end of the lifting motor is connected to a screw of the screw pair, a nut of the screw pair of the first lifting driver is connected to the back plate of the first support frame, and a nut of the screw pair of the second lifting driver is connected to the back plate of the second support frame.
6. The material conveying device of the LED lamp bead wire bonding machine of claim 1, wherein the pusher and the first box pusher are electric push rods or air cylinders.
7. The material conveying device of the LED lamp bead wire bonding machine according to claim 2, wherein the second box pusher is an electric push rod or an air cylinder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221794816.2U CN218173504U (en) | 2022-07-12 | 2022-07-12 | Material conveying device of LED lamp bead wire welding machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221794816.2U CN218173504U (en) | 2022-07-12 | 2022-07-12 | Material conveying device of LED lamp bead wire welding machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218173504U true CN218173504U (en) | 2022-12-30 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221794816.2U Active CN218173504U (en) | 2022-07-12 | 2022-07-12 | Material conveying device of LED lamp bead wire welding machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218173504U (en) |
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2022
- 2022-07-12 CN CN202221794816.2U patent/CN218173504U/en active Active
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