CN218163383U

CN218163383U - Atomizing module heat radiation structure

Info

Publication number: CN218163383U
Application number: CN202221926578.6U
Authority: CN
Inventors: 林峰章
Original assignee: Guangdong Kegao Electronics Co ltd
Current assignee: Guangdong Kegao Electronics Co ltd
Priority date: 2022-07-25
Filing date: 2022-07-25
Publication date: 2022-12-27
Anticipated expiration: 2032-07-25

Abstract

The utility model discloses an atomizing module heat radiation structure, including atomizing piece, electrically conductive copper head, gland, radiator and mount pad, the gland is established in the upper end of electrically conductive copper head, and the atomizing piece is established between gland and electrically conductive copper head, and the through-hole has been seted up at the middle part of gland, and the upper end of atomizing piece corresponds with the through-hole, and the radiator cover is established in the outside of electrically conductive copper head, and the bottom and the mount pad of electrically conductive copper head are connected, and gland and mount pad are heat conduction metal and make. This is in the outside of electrically conductive copper head through setting up the radiator, heat transfer to the atomizing piece of electrically conductive copper head work production has been avoided to heat conduction through the radiator to the gland that adopts the heat conduction metal to make and the further operating temperature that reduces the atomizing piece of conducting copper head conduction heat energy of passing through of mount pad, the high temperature work of atomizing piece has been avoided, the life of atomizing piece has been prolonged, atomization efficiency has been improved, and avoided leading to atomizing liquid smell rotten because of atomizing piece high temperature.

Description

Atomizing module heat radiation structure

Technical Field

The utility model relates to an atomizer field especially relates to an atomizing module heat radiation structure.

Background

The atomizing piece is arranged in atomizing devices such as an aromatherapy machine, directly atomizes liquid through high-frequency vibration, and is high in heating due to the fact that current required by the high-frequency vibration is large, and atomized substances in the conventional aromatherapy machine are a mixture of water and liquid (such as essential oil), and a certain heat dissipation effect is achieved by the fact that the water is heated to absorb heat which is larger than the essential oil. But directly atomize liquid through the atomizing piece in the current anhydrous champignon machine, because electrically conductive copper head operating temperature is higher, lack reliable heat radiation structure and can lead to the heat direct transfer that electrically conductive copper head produced to the atomizing piece, thereby lead to the atomizing piece to damage fracture or performance loss and reduce, and the atomizing piece is in work under the high temperature condition, can lead to liquid to produce molecular chemical reaction when atomizing piece surface temperature surpasss 60 ℃, the former molecule of destroying liquid produces the smell and becomes bad, can not protect the former smell of liquid, and then lead to the consumer to be difficult to the atomizing effect of satisfied product.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide an atomizing module heat radiation structure for the atomizing piece can directly atomize essential oil.

To achieve the purpose, the utility model adopts the following technical proposal:

the utility model provides an atomizing module heat radiation structure, includes atomizing piece, electrically conductive copper head, gland, radiator and mount pad, the gland is established the upper end of electrically conductive copper head, the atomizing piece is established the gland with between the electrically conductive copper head, the through-hole has been seted up at the middle part of gland, the upper end of atomizing piece with the through-hole corresponds, the radiator cover is established the outside of electrically conductive copper head, the bottom of electrically conductive copper head with the mount pad is connected, the gland with the mount pad is heat conduction metal and makes.

Preferably, the heat conducting layer is arranged between the radiator and the conductive copper head.

Preferably, the radiator includes holding ring and a plurality of fin, and is a plurality of fin evenly distributed is in the outside of holding ring, the inboard of holding ring is scribbled and is equipped with the heat-conducting layer, the inboard of heat-conducting layer with the outside of electrically conductive copper head is laminated mutually.

Preferably, the heat conducting layer is formed by curing heat conducting resin.

Preferably, the bottom of the conductive copper head is provided with a positioning bottom plate, the bottom of the positioning ring and the bottom of the radiating fin are both attached to the positioning bottom plate, and the bottom of the positioning bottom plate is attached to the mounting seat.

Preferably, still include the upper cover, the mount pad connect in the bottom of upper cover, the upper end of upper cover is equipped with the concave station, the concave station with form the atomizing chamber that can hold the liquid of waiting to atomize between the atomizing piece.

Preferably, the air conditioner further comprises a heat dissipation fan, the heat dissipation fan is arranged below the upper cover, the air outlet end of the heat dissipation fan faces the installation seat, and an air outlet is formed in one side of the concave platform.

Compared with the prior art, the beneficial effects of the utility model are that: the utility model discloses a set up the radiator in the outside of electrically conductive copper head, the heat transfer of having avoided electrically conductive copper head work to the atomizing piece in through the heat conduction of radiator, and adopt gland and the further operating temperature that reduces the atomizing piece of electrically conductive copper head conduction heat energy of passing through of mount pad that heat conduction metal made, the high temperature work of atomizing piece has been avoided, the life of atomizing piece has been prolonged, the atomization efficiency is improved, and avoided leading to atomizing liquid smell rotten because of atomizing piece high temperature, the problem that anhydrous champignon exists among the prior art is solved.

Drawings

The accompanying drawings are provided to further illustrate the present invention, but the content in the accompanying drawings does not constitute any limitation to the present invention.

Fig. 1 is a schematic overall structure diagram of one embodiment of the present invention;

FIG. 2 is a schematic diagram of the internal structure of one embodiment of the present invention;

fig. 3 is a schematic structural diagram of an upper cover according to an embodiment of the present invention.

Wherein: atomizing piece 1, electrically conductive copper head 2, gland 3, radiator 4, mount pad 5, through-hole 31, heat-conducting layer 6, holding ring 41, fin 42, location bottom plate 31, upper cover 7, atomizing chamber 71, concave station 73, gas vent 72.

Detailed Description

The technical solution of the present invention is further explained by the following embodiments with reference to the drawings.

The utility model provides an atomizing module heat radiation structure of embodiment, refer to attached

drawing

1 and 2, including atomizing piece 1, electrically conductive copper head 2, gland 3, radiator 4 and mount pad 5, gland 3 is established in the upper end of electrically conductive copper head 2, atomizing piece 1 is established between gland 3 and electrically conductive copper head 2, through-hole 31 has been seted up at the middle part of gland 3, form the atomizing chamber 71 that can hold the liquid of treating atomizing between 3 inboard of gland and the atomizing

piece

1, 4 covers of radiator establish in the outside of electrically conductive copper head 2, the bottom and the mount pad 5 of electrically conductive copper head 2 are connected, gland 3 and mount pad 5 are heat conduction metal and make.

From this, this embodiment is in the outside of electrically conductive copper head 2 through setting up radiator 4, heat transfer to atomizing piece 1 that electrically conductive copper head 2 work produced has been avoided to heat conduction through radiator 4, and gland 3 and mount pad 5 that adopt the heat conduction metal to make further reduce atomizing piece 1's operating temperature through the electrically conductive copper head 2 conduction heat energy of contact, atomizing piece 1's high temperature work has been avoided, atomizing piece 1's life has been prolonged, atomization efficiency has been improved, and avoided leading to atomizing liquid smell rotten because of atomizing piece 1 high temperature, it has low and the rotten scheduling problem of atomizing smell to have solved among the prior art anhydrous champignon machine existence life. The heat radiation structure of this embodiment still can be used in having water aromatherapy machine to improve the heat dispersion that has water aromatherapy machine, with the life of extension atomizing piece 1, and improve atomization efficiency.

Preferably, the heat conducting layer 6 is further included, and the heat conducting layer 6 is arranged between the heat radiator 4 and the electric conduction copper head 2. Through setting up heat-conducting layer 6, improved the efficiency of heat transfer between radiator 4 and electrically conductive copper head 2, and then improved radiating effect. Further, the heat conduction layer 6 is formed by curing heat conduction resin.

Preferably, the heat sink 4 includes a positioning ring 41 and a plurality of heat dissipation fins 42, the plurality of heat dissipation fins 42 are uniformly distributed on the outer side of the positioning ring 41, the inner side of the positioning ring 41 is coated with a heat conduction layer 6, and the inner side of the heat conduction layer 6 is attached to the outer side of the conductive copper head 2. From this, realize the contact with electrically conductive copper head 2 through holding ring 41 to the heat that produces electrically conductive copper head 2 transfers, evenly arranges a plurality of fin 42 in the outside of holding ring 41, has increased the area with the air contact, has realized radiating effect.

Preferably, the bottom of the conductive copper head 2 is provided with a positioning bottom plate 31, the bottom of the positioning ring 41 and the bottom of the heat sink 42 are both attached to the positioning bottom plate 31, and the bottom of the positioning bottom plate 31 is attached to the mounting base 5. From this, the bottom of holding ring 41 and the bottom of fin 42 all laminate mutually with location bottom plate 31, have increased the area of contact between radiator 4 and the electrically conductive copper head 2, have improved the effect of heat conduction to set up the bottom and the mount pad 5 of location bottom plate 31 and laminate mutually, utilize mount pad 5 that the heat conduction metal made, not only be used for fixed to electrically conductive copper head 2, still play the radiating action to electrically conductive copper head 2 bottom.

Preferably, referring to fig. 3, the liquid atomizer further comprises an upper cover 7, the mounting base 5 is connected to the bottom of the upper cover 7 through a bolt, a concave platform 73 is arranged at the upper end of the upper cover 7, and an atomizing cavity 71 capable of containing liquid to be atomized is formed between the concave platform 73 and the atomizing plate 1. Therefore, by arranging the upper cover 7, the atomizing cavity 71 is formed between the concave platform 73 and the atomizing sheet 1, the capacity of the atomizing cavity 71 is improved, and the phenomenon that excessive liquid in the atomizing cavity overflows easily is avoided.

Further, still include cooling fan (not shown in the drawing), cooling fan establishes the below at upper cover 7, and cooling fan's air-out end sets up towards mount pad 5, and one side of concave station 73 is equipped with the air outlet. Through set up cooling fan in the below of upper cover 7, cooling fan blows cold wind to mount pad 5 to under the blockking of upper cover 7, make cold wind and fin 42 contact and take away the heat, finally discharge from gas vent 72 hot-blastly, from this, improved radiating efficiency, further guaranteed the operating temperature of atomizing piece 1.

The technical principle of the present invention is described above with reference to specific embodiments. The description is made for the purpose of illustrating the principles of the invention and should not be construed in any way as limiting the scope of the invention. Based on the explanations herein, those skilled in the art will be able to conceive of other embodiments of the present invention without any inventive effort, which would fall within the scope of the present invention.

Claims

1. The utility model provides an atomizing module heat radiation structure, its characterized in that, includes atomizing piece, electrically conductive copper head, gland, radiator and mount pad, the gland is established the upper end of electrically conductive copper head, the atomizing piece is established the gland with between the electrically conductive copper head, the through-hole has been seted up at the middle part of gland, the upper end of atomizing piece with the through-hole corresponds, the radiator cover is established the outside of electrically conductive copper head, the bottom of electrically conductive copper head with the mount pad is connected, the gland with the mount pad is heat conduction metal and makes.

2. The atomizing module heat-dissipating structure of claim 1, further comprising a heat-conducting layer, wherein said heat-conducting layer is disposed between said heat sink and said electrically conductive copper head.

3. The atomizing module heat-dissipating structure of claim 2, wherein the heat sink includes a positioning ring and a plurality of heat-dissipating fins, the heat-dissipating fins are uniformly distributed on the outer side of the positioning ring, the heat-conducting layer is coated on the inner side of the positioning ring, and the inner side of the heat-conducting layer is attached to the outer side of the conductive copper head.

4. The atomizing module heat-dissipating structure of claim 2 or 3, wherein the heat-conducting layer is formed by curing a heat-conducting resin.

5. The atomizing module heat dissipation structure as claimed in claim 3, wherein a positioning bottom plate is disposed at the bottom of the conductive copper head, the bottom of the positioning ring and the bottom of the heat sink are both attached to the positioning bottom plate, and the bottom of the positioning bottom plate is attached to the mounting seat.

6. The heat dissipation structure of an atomization module as recited in claim 1, further comprising an upper cover, wherein the mounting base is connected to a bottom of the upper cover, a concave platform is disposed at an upper end of the upper cover, and an atomization cavity capable of containing liquid to be atomized is formed between the concave platform and the atomization sheet.

7. The atomizing module heat dissipation structure of claim 6, further comprising a heat dissipation fan, wherein the heat dissipation fan is disposed under the upper cover, an air outlet end of the heat dissipation fan is disposed toward the mounting seat, and an air outlet is disposed on one side of the concave platform.