CN218125227U - Multiphase coupling phase change heat transfer device for hot spot suppression - Google Patents
Multiphase coupling phase change heat transfer device for hot spot suppression Download PDFInfo
- Publication number
- CN218125227U CN218125227U CN202221943499.6U CN202221943499U CN218125227U CN 218125227 U CN218125227 U CN 218125227U CN 202221943499 U CN202221943499 U CN 202221943499U CN 218125227 U CN218125227 U CN 218125227U
- Authority
- CN
- China
- Prior art keywords
- phase change
- heat
- liquid phase
- vapor
- change layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/14—Thermal energy storage
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a multiphase coupling phase change heat transfer device for hot spot suppression. The heat conduction skeleton array distributes inside solid-liquid phase transition layer, and the skeleton is inside to be hollow structure and with vapour-liquid phase transition layer UNICOM. The liquid working medium enters the vapor-liquid phase change layer, is heated to generate phase change to form a vapor-liquid two-phase working medium, the vapor enters the heat conduction framework under the action of the buoyancy lift force to exchange heat with the solid-liquid phase change layer, and the condensed liquid working medium flows back to the vapor-liquid phase change layer under the action of gravity. Aiming at the electronic equipment with higher temperature-equalizing requirement, the temperature equalizing property of the device is enhanced through the coupling of vapor-liquid phase change and solid-liquid phase change, and in addition, for the electronic equipment with impact heat flow, the multi-phase coupled evaporator can effectively inhibit the instantaneous temperature rise of the electronic equipment. The invention utilizes the multiphase coupling heat dissipation technology, can effectively improve the temperature uniformity of the electronic equipment, inhibit the temperature rise caused by transient thermal shock of the equipment and enhance the reliability and stability of the equipment.
Description
Technical Field
The invention belongs to the technical field of electronic equipment heat dissipation.
Background
With the continuous development of heat dissipation technology, the electronic device no longer needs to control its maximum temperature, which also puts higher demands on temperature uniformity. Particularly, for equipment with high temperature uniformity requirements such as radars, microwave detection devices and the like, the detection precision level can be greatly improved along with the reduction of the temperature gradient. In recent years, vapor-liquid phase change heat exchange technologies represented by heat pipes are widely applied due to high temperature uniformity and high thermal conductivity, theoretically, the dryness of a working medium is increased and the temperature is basically unchanged after the working medium absorbs heat in an evaporator, but in the actual working process, due to the influence of on-way resistance loss and local resistance loss, the pressure head of a fluid along a heat dissipation section is reduced, the generated pressure difference causes temperature difference, and a local area generates superheated steam and gathers along with the temperature rise, so that the temperature rise of the area forms a hot spot, and the temperature uniformity performance of the evaporator is reduced.
In addition, most chips have low standby heat productivity and large heat productivity during operation, instant temperature rise is fast, thermal shock can be formed, the transient thermal shock can cause working medium in a local area to be quickly vaporized, a large amount of steam can not be timely dissipated, and the steam is gathered at a hot spot to cause the temperature to be further raised, so that vicious circle is formed, and the performance and the service life of the device are reduced.
For devices with high heat flux density, hot spots are more likely to form on the surface, resulting in temperature non-uniformity. Researchers have conducted many studies on a heat dissipation device suitable for a high heat flow density device, and document 1 (in new york; xu, miao Jian; manguanlong; chenling; wangdei. A pump-driven two-phase loop device for heat dissipation of a high heat flow electronic device CN 107454797B) proposes a pump-driven two-phase loop device for heat dissipation of a high heat flow electronic device, which collects and transports heat by utilizing the evaporation heat absorption and condensation heat release processes of a working medium in the circulation flow process, wherein an evaporator comprises microchannels and fins, microchannels are adopted in a high heat flow region for heat dissipation, so that the heat exchange coefficient of a local region is increased, fins are adopted in a low heat flow region for heat dissipation, and due to the large area difference between the microchannel region and the fin region in the evaporator, when the working medium in the microchannels enter the fin region, the volume rapidly expands, so that the temperature of the working medium is reduced, thereby facilitating the heat dissipation of the device in the fin region. The invention adopts different structures to match and utilizes smaller resource cost to solve the heat dissipation problem of devices with different power levels, but does not relate to a method for inhibiting hot spots and improving the temperature uniformity, and for electronic equipment with higher temperature uniformity requirement or transient thermal shock, the evaporator of the device has no space capable of timely dissipating a large amount of instantaneously formed steam, so that local hot spots can be formed and the temperature is uneven. Document 2 (zhangjiajie; yin yaixiang; maxia; royal epitaxy. An array jet flow and solid-liquid phase change coupled electronic device heat dissipation method CN 107567247B) proposes an array jet flow and solid-liquid phase change coupled electronic device heat dissipation method, aiming at solving the high heat flow density heat dissipation problem of a high-power electronic device, and the structure for implementing the method is an array jet flow structure; the flowing working medium for implementing the method is phase-change nano-capsule suspension, and the phase-change nano-capsule suspension exchanges heat with a target object to realize the temperature control of the target object. The phase-change nanocapsule suspension is used for immersed array jet impact heat exchange, wherein the solid-liquid phase-change heat exchange of the phase-change capsule core and the turbulence effect of nanocapsule particles can obviously improve the heat exchange performance of the array jet, and the heat dissipation requirement of a target object under the condition of high heat flow density is realized. Document 3 (handsome macro. Vapor chamber and heat pipe combination structure and combination method CN 107664452A) proposes a vapor chamber and heat pipe combination structure and combination method, which utilize the penetration connection and fixation of heat pipe and vapor chamber to connect the capillary structure inside the heat pipe and vapor chamber, to increase the reflux speed of liquid working fluid, but the invention does not propose a method for suppressing the temperature of local hot spots, and still have vapor gathered in the local hot spot area, to reduce the temperature uniformity.
Disclosure of Invention
In order to solve the problems that the local hot spot temperature of the electronic equipment is high and the requirement of temperature uniformity cannot be met, the invention provides a multi-phase coupling phase change heat transfer device for inhibiting hot spots.
In order to solve the technical problems, the invention is realized by the following technical scheme:
a multiphase coupled phase change heat transfer device for hot spot suppression, comprising: the device comprises a shell 1, a heat conducting framework 2, a vapor-liquid phase change layer 3, a solid-liquid phase change layer 4 and a flow channel 5; the interior of the heat-conducting framework 2 is of a hollow structure and is communicated with the flow channel 5, and the heat-conducting framework 2 is vertically distributed on the solid-liquid phase change layer 4; the bottom of the vapor-liquid phase change layer 3 is attached to a heat source, and the upper part is provided with a solid-liquid phase change layer 4; the flow channel 5 comprises a microchannel 6 and a limiting baffle 7.
Further, the surface of the hollow structure in the heat conducting framework 2 is provided with a hydrophobic coating.
Furthermore, the working medium in the flow channel 5 absorbs heat to generate phase change, and the formed working medium in a two-phase state leaves the flow channel 5 through an outlet under the driving of external force; when the temperature of the local hot spot is too high, the heat exchange at the corresponding part in the flow channel 5 is intensified, the steam generation rate is increased, the gathered steam enters the hollow structure of the heat-conducting framework 2 under the action of buoyancy lift force, the heat is released to the external solid-liquid phase change layer 4 through the heat-conducting framework 2, and the steam is condensed into liquid which flows back to the local hot spot under the action of gravity to continuously absorb the heat.
Furthermore, the phase change temperature of the working medium in the vapor-liquid phase change layer 3 can be controlled by an external cold source, the phase change temperature of the working medium in the solid-liquid phase change layer 4 is 2 ℃ higher than the phase change temperature of the working medium in the vapor-liquid phase change layer 3, the vapor-liquid phase change layer 3 works in a common operation state, and the solid-liquid phase change layer 4 participates in the work simultaneously in a local hot spot or transient thermal shock operation state.
Furthermore, the flow channel 5 is a snakelike water channel, so that heat exchange between the working medium and each heat source can be guaranteed; the micro-channel 6 in the snakelike water channel can strengthen the heat exchange between the working medium and the heat source; the limiting baffle 7 in the serpentine water channel can ensure that more working medium flows through the local hot point.
Compared with the prior art, the invention has the following remarkable advantages:
(1) According to the multiphase coupling phase change heat transfer device for hot spot suppression, the heat of the local high heat flow hot spot is absorbed through the vapor-liquid phase change layer, part of the heat is transferred to the low-temperature area of the vapor-liquid phase change layer, and part of the heat is transferred to the solid-liquid phase change layer through the hollow heat conducting framework.
(2) The multiphase coupling phase change heat transfer device for hot spot suppression can transfer heat to the internal working medium of the vapor-liquid phase change layer and the solid-liquid phase change layer which are close to a heat source for electronic equipment with transient thermal shock, can also transfer heat to the internal working medium of the solid-liquid phase change layer which is far away from the heat source through the heat conduction framework, and can transfer heat to the solid-liquid phase change layer from two dimensions of the transverse dimension and the longitudinal dimension more quickly through vapor-liquid phase change.
The present invention is described in further detail below with reference to the attached drawing figures.
Drawings
FIG. 1 is a schematic structural diagram of an embodiment of the present invention.
FIG. 2 is a schematic view of an internal flow channel structure of a vapor-liquid phase change layer according to an embodiment of the present invention.
FIG. 3 is a schematic diagram of the internal structure of the solid-liquid phase-change layer according to the embodiment of the present invention.
Wherein, 1, a shell; 2. a thermally conductive skeleton; 3. a vapor-liquid phase change layer; 4. a solid-liquid phase change layer; 5. a flow channel; 6. a microchannel; 7. a limiting baffle.
Detailed Description
For the purpose of illustrating the technical solutions and technical objects of the present invention, the present invention will be further described with reference to the accompanying drawings and specific embodiments.
With reference to fig. 1, 2, and 3, an embodiment of the present invention includes a casing 1, a heat conducting framework 2, a vapor-liquid phase change layer 3, a solid-liquid phase change layer 4, and a flow channel 5; the interior of the heat-conducting framework 2 is of a hollow structure and is communicated with the flow channel 5, and the heat-conducting framework 2 is vertically distributed on the solid-liquid phase change layer 4; the bottom of the vapor-liquid phase change layer 3 is attached to a heat source, and the upper part is provided with a solid-liquid phase change layer 4; the flow channel 5 comprises a microchannel 6 and a limiting baffle 7.
Preferably, the surface of the hollow structure inside the heat conducting skeleton 2 is provided with a hydrophobic coating.
Preferably, the working medium in the flow channel 5 absorbs heat to perform phase change, and the formed working medium in a two-phase state leaves the flow channel 5 under driving; when local hot spot temperature was too high, the heat transfer aggravation of the inside department of correspondence of runner 5, steam generation rate increases, and the steam of gathering gets into 2 hollow structure of heat conduction skeleton under the buoyancy lift effect, releases the heat to outside solid-liquid phase change layer 4 through heat conduction skeleton 2, and the steam condensation flows back the local hot spot for liquid under the action of gravity and continues to absorb the heat to can effectively eliminate local hot spot, promote the samming performance of device.
Preferably, the phase change temperature of the working medium in the vapor-liquid phase change layer 3 can be controlled by an external cold source, the phase change temperature of the working medium in the solid-liquid phase change layer 4 is 2 ℃ higher than that of the working medium in the vapor-liquid phase change layer 3, the vapor-liquid phase change layer 3 works in a common operation state, and the solid-liquid phase change layer 4 participates in the work simultaneously in a local hot spot or transient thermal shock operation state.
With reference to fig. 2, the preferred flow channel 5 is a serpentine water channel, which can ensure that the working medium exchanges heat with each heat source; the micro-channel 6 in the snakelike water channel can strengthen the heat exchange between the working medium and the heat source; the limiting baffle 7 in the serpentine water channel can ensure that more working medium flows through the local hot point.
In some embodiments, fins are mounted on the outer surface of the heat conducting skeleton 2.
In some embodiments, fins are mounted on the outer surface of the housing 1.
In some embodiments, the inner surface of the heat conducting skeleton 2 has a capillary structure, so that the condensed liquid working medium can be more quickly pumped to a local hot spot.
In some embodiments, refrigerants such as R124, R134a, and R245fa are in the vapor-liquid phase change layer 3.
In some embodiments, the solid-liquid phase-change layer 4 is made of paraffin, crystalline hydrated salt, graphene-based phase-change energy-storage composite material, or the like.
The length of the shell is 50-200mm, the width is 50-200mm, the thickness is 2-5mm, the thickness of the vapor-liquid phase change layer is 5-15mm, the thickness of the solid-liquid phase change layer is 5-50mm, the outer diameter of the heat conducting framework is 5-10mm, the inner diameter is 3-8mm, the phase change temperature point of the vapor-liquid phase change layer is 40-60 ℃, and the phase change temperature point of the solid-liquid phase change layer is 42-62 ℃.
Claims (5)
1. A multiphase coupled phase change heat transfer device for hot spot suppression, characterized in that: comprises a shell (1), a heat-conducting framework (2), a vapor-liquid phase change layer (3) a solid-liquid phase change layer (4) and a flow channel (5); the interior of the heat-conducting framework (2) is of a hollow structure and is communicated with the flow channel (5), and the heat-conducting framework (2) is vertically distributed on the solid-liquid phase change layer (4); the bottom of the vapor-liquid phase change layer (3) is attached to a heat source, and the upper part of the vapor-liquid phase change layer is provided with a solid-liquid phase change layer (4); the flow channel (5) comprises a microchannel (6) and a limiting baffle (7).
2. The multiphase coupled phase change heat transfer device for hot spot suppression according to claim 1, wherein: the surface of the hollow structure in the heat conducting framework (2) is provided with a hydrophobic coating.
3. The multiphase coupled phase change heat transfer device for hot spot suppression according to claim 1, wherein: the working medium in the flow channel (5) absorbs heat to generate phase change, and the formed working medium in a two-phase state leaves the flow channel (5) under driving; when local hot spot temperature was too high, the inside heat transfer aggravation that corresponds of runner (5), steam generation rate increase, and the steam of gathering gets into heat conduction skeleton (2) hollow structure under the buoyancy lift effect, releases the heat to outside solid-liquid phase transition layer (4) through heat conduction skeleton (2), and steam condensation is liquid and flows back to local hot spot under the action of gravity and continues to absorb the heat.
4. The multiphase coupled phase change heat transfer device for hot spot suppression according to claim 1, wherein: the phase change temperature of the working medium in the vapor-liquid phase change layer (3) can be controlled by an external cold source, the phase change temperature of the working medium in the solid-liquid phase change layer (4) is 2 ℃ higher than that of the working medium in the vapor-liquid phase change layer (3), the vapor-liquid phase change layer (3) works in a common operation state, and the solid-liquid phase change layer (4) participates in the work simultaneously in a local hot spot or transient thermal shock operation state.
5. The multiphase coupled phase change heat transfer device for hot spot suppression according to claim 1, wherein: the flow channel (5) is a snakelike water channel and ensures that the working medium exchanges heat with each heat source; the micro-channel (6) in the snakelike water channel strengthens heat exchange between the working medium and the heat source; a limiting baffle (7) in the serpentine water channel ensures that more working media flow through the local hot points.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221943499.6U CN218125227U (en) | 2022-07-27 | 2022-07-27 | Multiphase coupling phase change heat transfer device for hot spot suppression |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221943499.6U CN218125227U (en) | 2022-07-27 | 2022-07-27 | Multiphase coupling phase change heat transfer device for hot spot suppression |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218125227U true CN218125227U (en) | 2022-12-23 |
Family
ID=84520789
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221943499.6U Active CN218125227U (en) | 2022-07-27 | 2022-07-27 | Multiphase coupling phase change heat transfer device for hot spot suppression |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218125227U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115135118A (en) * | 2022-07-27 | 2022-09-30 | 中国船舶重工集团公司第七二四研究所 | Multiphase coupling phase change heat transfer device for hot spot suppression |
-
2022
- 2022-07-27 CN CN202221943499.6U patent/CN218125227U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115135118A (en) * | 2022-07-27 | 2022-09-30 | 中国船舶重工集团公司第七二四研究所 | Multiphase coupling phase change heat transfer device for hot spot suppression |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111642103B (en) | High heat flux porous heat sink flow cooling device | |
| WO2008138216A1 (en) | Uniform temperature loop heat pipe device | |
| CN102997729B (en) | Heat pipe radiator of phase change drive loop | |
| CN218125227U (en) | Multiphase coupling phase change heat transfer device for hot spot suppression | |
| CN108362148A (en) | Combined type cold plate | |
| CN113959244B (en) | Double-evaporator condenser loop heat pipe | |
| CN104406440A (en) | Silicon-based miniature loop heat pipe cooler | |
| CN103269573A (en) | Temperature equalization superconductive heat radiator | |
| CN202485512U (en) | Tank-channel type vapor chamber type heat pipe heat radiator | |
| CN102261862B (en) | A kind of Flat heat pipe heat exchanger | |
| CN204286182U (en) | A kind of silicon-base miniature loop circuit heat pipe cooler | |
| CN115135118A (en) | Multiphase coupling phase change heat transfer device for hot spot suppression | |
| CN105246302B (en) | A kind of heat-pipe radiating apparatus | |
| CN111664733A (en) | Heat radiator combining micro-channel heat exchanger with heat pipe | |
| CN213718502U (en) | Radiating temperature-uniforming plate with built-in water cooling plate | |
| CN104850197A (en) | Gravity heat pipe chip heat sink with composite bottom plate | |
| CN202076256U (en) | Return circuit type heat pipe radiator | |
| CN204576403U (en) | Gravity heat-pipe type chip radiator | |
| CN101022717A (en) | Liquid self-loop composite heat pipe radiating device used for electronic equipment | |
| CN105371676A (en) | Evaporator with double porous wicks | |
| CN103019345B (en) | There is the heat-pipe type radiator of enhanced heat exchange effect | |
| CN111336848A (en) | Loop heat pipe evaporator with composite heat sink and loop heat pipe system | |
| CN218959373U (en) | Radiator | |
| WO2022073466A1 (en) | Uniform temperature plate having built-in water-cooling plate for heat dissipation | |
| CN212158264U (en) | Loop heat pipe evaporator with composite heat sink and loop heat pipe system |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |