CN218099400U - Power amplifier temperature power compensation coefficient testing arrangement - Google Patents
Power amplifier temperature power compensation coefficient testing arrangement Download PDFInfo
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- CN218099400U CN218099400U CN202221420773.1U CN202221420773U CN218099400U CN 218099400 U CN218099400 U CN 218099400U CN 202221420773 U CN202221420773 U CN 202221420773U CN 218099400 U CN218099400 U CN 218099400U
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Abstract
The utility model discloses a power amplifier temperature power compensation coefficient testing device, which comprises a signal source, a switch and attenuation network unit, a temperature detecting device, a temperature box, a power detecting unit, a compensation coefficient testing unit and a singlechip; the corresponding compensation coefficient is directly called only by the baseband signal processor without adding any additional circuit, so that the linearity and stability of the signal are not influenced, and the timely test of the power is realized; this application incubator is provided with the arch, and the influence of temperature in the more accurate realization incubator to power amplifier avoids power amplifier local temperature to feel lags.
Description
Technical Field
The utility model relates to the control field, concretely relates to power amplifier temperature power compensation coefficient testing arrangement.
Background
In the prior art, as the power of a signal is continuously enhanced, the frequency spectrum is used more closely, and the situation of adjacent channel interference or harmonic interference is more obvious. Due to the physical characteristics of the semiconductor device, the power amplifier may exhibit different signal amplification gains at different temperatures, which makes power control of the transmitter system more difficult.
To prevent interference with other communication channels, it becomes important to tightly control the transmit power of each communication system.
Usually, a rf front-end power amplifier is independently developed by a special company or department, so that it is difficult for a hardware system engineer to know the temperature characteristics of the amplifier in a short time during design, and design a circuit capable of automatically adjusting the gain to ensure that a transmitter can output a stable power at different temperatures.
In the prior art, an analog mode is mainly to use the temperature characteristic of a thermistor to build a bias voltage power supply circuit of an amplifier, and when the temperature changes, the voltage division of the thermistor can change, so that the bias voltage of the amplifier is changed, and the effect of changing the gain of the amplifier is achieved. The method has a simple structure, but the best value is difficult to find in actual debugging, so that the control precision of the method is extremely poor. Since the control is continuous with the temperature, the uniformity of the thermistor, amplifier or other components affects the control accuracy of the output power. And the bias voltage will change with the temperature, which is unacceptable for the communication system with high linearity and stability requirement.
The digital mode mainly utilizes the output power of a coupling circuit coupling part transmitter, converts coupling echoes into voltage through a detection circuit, converts the voltage into digits with certain digits through an ADC (analog to digital converter), and outputs an instruction to control a digital attenuator after the digits are calculated and compared so as to meet the requirement of controlling the power. The method has high control precision, can stabilize the power within a certain interval, but has complex structure and high cost. And this method has a fatal drawback that all the controls have hysteresis. I.e. the control system is only active after a signal has been sent that does not meet the power level requirement. This is not possible in some circumstances where it is desirable to send safe, urgent information.
In the prior art, CN200920136152, a method for applying a temperature compensation device of a power amplifier, is similar to that of this example, but the technique mainly uses a digital method to calculate and store a temperature compensation coefficient, and then adjusts the voltage of the gate voltage of the amplifier through the temperature compensation coefficient, thereby achieving the effect of power compensation. This approach is costly and requires a computational unit, a memory unit and a digital-to-analog conversion unit. And other performance indexes of the signal, such as linearity and efficiency, are influenced due to the direct control of the amplifier gate voltage.
In the prior art, an electronic system, a power amplifier and a temperature compensation method thereof (CN 201210462462-) and a temperature compensation circuit based on a radio frequency power amplifier (CN 201911099560) directly compensate the power of the amplifier in a mode of analog circuit feedback. The main drawback of this method is that it is impossible to individually and accurately control each chip, and all chips use the same compensation circuit, so that it is difficult to ensure that the gains of different chips are completely consistent when in actual use, that is, the same compensation value will have obvious difference on different chips, so that the final output power of the power amplifier will have larger deviation. Meanwhile, another disadvantage of the analog control mode is that the compensation value continuously jumps in real time along with the change of the temperature, and the mode is not suitable for being used in the occasions with high requirements on signal linearity and stability.
SUMMERY OF THE UTILITY MODEL
The utility model aims at the prior art problem, disclose a power amplifier temperature power compensation coefficient testing arrangement, can show the gating of decay network through the high low level of singlechip, through the compensation coefficient that corresponds under the different temperatures of baseband signal processor direct call power amplifier, can not produce the condition that sends the too big power signal earlier and adjust again.
The technical scheme of the application is as follows:
a power amplifier temperature power compensation coefficient testing device comprises a signal source, a switch and attenuation network unit, a temperature detecting device, a temperature box, a power detecting unit, a compensation coefficient testing unit and a single chip microcomputer;
the signal source comprises signal generating equipment and a baseband signal processor;
the switch and attenuation network comprises a plurality of radio frequency switches and attenuation circuits, the radio frequency switches control different attenuation paths, and the radio frequency switches and the attenuation circuits are in one-to-one correspondence to form a radio frequency switch array;
the output end of the compensation coefficient test unit is connected with the radio frequency switch; an output pin of the singlechip is configured to be a high level and a low level, the high level and the low level control the opening or closing of the radio frequency switch, and an attenuation path is selected;
the input end of the switch and attenuation network unit is connected with the signal source, and the output end of the switch and attenuation network unit is connected with the input end of the power amplifier to be tested;
the detection head of the temperature detection device is arranged in the incubator.
The singlechip controls high and low levels to switch on and off radio frequency signals by using the basic IO function of the singlechip;
preferably, the attenuation circuit comprises a resistor R1, a resistor R2 and a resistor R3, the resistor R1 and the resistor R2 are connected in series, one end of the resistor R3 is connected with the resistor R1 and the resistor R2, and the other end of the resistor R3 is grounded.
Preferably, R1=6.2 Ω; r2=6.2 Ω; r3=215 Ω.
The power detection unit comprises a resistor RE1, a resistor RE2, a resistor RE3, a resistor RE4, an inductor LE, a diode UE and a capacitor CE;
two ends of the resistor RE2 are respectively connected with the resistor RE1 and the resistor RE3, the other ends of the resistor RE1 and the resistor RE3 are grounded, one end of the inductor LE is connected with the resistor RE1, the resistor RE2 and the diode UE, the other end of the inductor LE is grounded, the resistor RE4 and the capacitor CE are connected with the diode UE, the other ends of the resistor RE4 and the capacitor CE are grounded, and the diode UE is conducted from the resistor RE2 to the resistor RE 4.
RE1＝430Ω；RE2＝12Ω；RE3＝430Ω；RE4＝10kΩ；LE＝10nH；CE＝2pF。
The detection head of the temperature detection device is arranged at a position close to the power amplifier to be detected in the incubator. The number of the detection heads is several.
The temperature box is provided with a wiring board, is provided with a plurality of lotus-shaped wires and a plurality of USB lines on the wiring board, is provided with the arch on the bottom plate of temperature box, detect the head setting on the bottom plate of temperature box, be provided with the display screen that is used for showing the temperature on the curb plate of temperature box. A groove is formed in the bottom plate of the incubator.
The power detection unit is a power meter or a frequency spectrograph with a communication function and can be communicated with the compensation coefficient test unit.
Compared with the prior art, the utility model discloses following beneficial effect has:
the application discloses power amplifier temperature power compensation coefficient testing arrangement can show the gating of decay network through singlechip high-low level, when this amplifier is used in specific communication system, only need baseband signal processor direct call corresponding compensation coefficient can. When the power of the baseband signal changes according to the temperature compensation coefficient, no extra circuit is needed to be added at the front end of the external radio frequency, and meanwhile, the situation that an overlarge power signal is sent and then adjusted cannot occur due to the fact that the input power is processed on the baseband signal. There is no situation where the power varies continuously with temperature, so that the linearity and stability of the signal are affected.
The power detection unit realizes timely test of power, is provided with the protective capacitor and realizes safety test.
The incubator is provided with the arch, realizes the influence of temperature in the incubator to power amplifier more accurately, avoids power amplifier local temperature to respond to the hysteresis.
Drawings
FIG. 1 is a schematic diagram of a power amplifier temperature power compensation coefficient testing apparatus according to the present application
FIG. 2 is a circuit diagram of a switching and attenuation network unit according to the present invention;
FIG. 3 is a circuit diagram of a temperature sensing unit according to the present application;
fig. 4 is a schematic structural view of the incubator of the present application.
Detailed Description
The technical solution of the present invention will be described clearly and completely with reference to the accompanying drawings, and obviously, the described embodiments are only some embodiments, not all embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
As shown in fig. 1, a power amplifier temperature power compensation coefficient testing device includes a signal source, a switch and attenuation network unit, a temperature detecting device, a temperature box, a power detecting unit, a compensation coefficient testing unit and a single chip microcomputer;
the signal source comprises signal generating equipment and a baseband signal processor;
the switch and attenuation network unit comprises a plurality of radio frequency switches and attenuation circuits, the radio frequency switches control different attenuation paths, and the radio frequency switches and the attenuation circuits are in one-to-one correspondence to form a radio frequency switch array;
the compensation coefficient test unit controls an output pin of the single chip microcomputer to be configured into high and low levels, the high and low levels control the radio frequency switch to be opened or closed, and an attenuation path is selected;
the input end of the switch and attenuation network unit is connected with a signal source, the paths with different attenuation values are gated by switching the radio frequency switch, and the output end of the switch and attenuation network unit is connected with the input end of the power amplifier to be tested;
the detection head of the temperature detection device is arranged at a position close to the power amplifier to be detected in the incubator and is in close contact with a circuit board of the power amplifier, so that more accurate temperature can be collected, and temperature data collected by the temperature detection device is directly sent to the compensation coefficient test unit for recording. The number of the detection heads is several, so that the temperature can be measured accurately.
This application is to each specific power amplifier chip or module, records power amplifier's temperature compensation coefficient under the different temperatures, and through the baseband information of baseband signal processor control signal source, the size of realizing adjusting power output reaches the compensation of every piece all very accurate, and owing to be the signal of coming out from the baseband, so can not exert an influence to other performances of signal. The baseband signal processor adjusts the magnitude of the signal input to the power amplifier according to the existing temperature compensation coefficient table, thereby ensuring that the final output power of the power amplifier is maintained in an almost same and stable range. The common and more common compensation method for the power amplifier circuit is an analog method, and all circuits use the same compensation method without aiming at each specific chip, and the compensation values are completely the same at the same temperature, so that the compensation method inevitably generates a large-range deviation and affects other performance indexes of the signal.
The single chip microcomputer controls high and low levels to switch on and off radio frequency signals by using a basic IO function of the single chip microcomputer;
the temperature detection device comprises a plurality of temperature sensors and sends data to the compensation coefficient test unit. In the present application, an automatic test program of the compensation coefficient test unit is a common technique in the field, and a compensation coefficient table is established by measuring temperature and output data of the power amplifier.
The power detection unit is a power meter or a frequency spectrograph with a communication function and can be communicated with the compensation coefficient test unit.
As shown in fig. 2, the attenuation circuit includes a resistor R1, a resistor R2, and a resistor R3, where the resistor R1 and the resistor R2 are connected in series, one end of the resistor R3 is connected to the resistor R1 and the resistor R2, and the other end is grounded. R1=6.2 Ω; r2=6.2 Ω; r3=215 Ω.
As shown in fig. 3, the power detection unit includes a resistor RE1, a resistor RE2, a resistor RE3, a resistor RE4, an inductor LE, a diode UE, and a capacitor CE;
two ends of the resistor RE2 are respectively connected with the resistor RE1 and the resistor RE3, the other ends of the resistor RE1 and the resistor RE3 are grounded, one end of the inductor LE is connected with the resistor RE1, the resistor RE2 and the diode UE, the other end of the inductor LE is grounded, the resistor RE4 and the capacitor CE are connected with the diode UE, the other ends of the resistor RE4 and the capacitor CE are grounded, and the diode UE is conducted from the resistor RE2 to the resistor RE 4.
RE1＝430Ω；RE2＝12Ω；RE3＝430Ω；RE4＝10kΩ；LE＝10nH；CE＝2pF。
The diode UE model of this embodiment is SMS7630.
As shown in fig. 4, a wiring board is arranged in the incubator, a plurality of lotus wires 2 and a plurality of USB wires 1 are arranged on the wiring board, a protrusion 4 is arranged on a bottom plate of the incubator, the detection head 5 is arranged on the bottom plate of the incubator, and a display screen 3 for displaying temperature is arranged on a side plate of the incubator. The incubator is provided with the arch, realizes the influence of temperature in the incubator to power amplifier more accurately, avoids power amplifier local temperature to feel the response lag.
A groove 7 is formed in the bottom plate of the incubator, and the groove 7 is convenient for taking out or placing the power amplifier.
In the description provided herein, numerous specific details are set forth. It is understood, however, that embodiments of the invention may be practiced without these specific details. In some instances, well-known structures and techniques have not been shown in detail in order not to obscure an understanding of this description.
Claims (10)
1. A testing device for temperature power compensation coefficient of power amplifier is characterized in that,
the system comprises a signal source, a switch and attenuation network unit, a temperature detection device, a temperature box, a power detection unit, a compensation coefficient test unit and a single chip microcomputer;
the signal source comprises signal generating equipment and a baseband signal processor;
the switch and attenuation network unit comprises a plurality of radio frequency switches and attenuation circuits, and the radio frequency switches and the attenuation circuits are in one-to-one correspondence to form a radio frequency switch array;
the output end of the compensation coefficient test unit is connected with the radio frequency switch; the output pin of the singlechip is connected with the radio frequency switch;
the input end of the switch and attenuation network unit is connected with a signal source, and the output end of the switch and attenuation network unit is connected with a power amplifier to be tested;
the detection head of the temperature detection device is arranged in the incubator.
2. The device for testing the temperature power compensation coefficient of a power amplifier as claimed in claim 1,
the attenuation circuit comprises a resistor R1, a resistor R2 and a resistor R3, wherein the resistor R1 and the resistor R2 are connected in series, one end of the resistor R3 is connected with the resistor R1 and the resistor R2, and the other end of the resistor R3 is grounded.
3. The device for testing the temperature power compensation coefficient of a power amplifier according to claim 2,
R1＝6.2Ω；R2＝6.2Ω；R3＝215Ω。
4. the device for testing the temperature power compensation coefficient of a power amplifier according to claim 1,
the power detection unit comprises a resistor RE1, a resistor RE2, a resistor RE3, a resistor RE4, an inductor LE, a diode UE and a capacitor CE;
two ends of the resistor RE2 are respectively connected with the resistor RE1 and the resistor RE3, the other ends of the resistor RE1 and the resistor RE3 are grounded, one end of the inductor LE is connected with the resistor RE1, the resistor RE2 and the diode UE, the other end of the inductor LE is grounded, the resistor RE4 and the capacitor CE are connected with the diode UE, the other ends of the resistor RE4 and the capacitor CE are grounded, and the diode UE is conducted from the resistor RE2 to the resistor RE 4.
5. The device for testing the temperature power compensation coefficient of a power amplifier according to claim 4,
RE1＝430Ω；RE2＝12Ω；RE3＝430Ω；RE4＝10kΩ；
LE＝10nH；
CE＝2pF。
6. the device for testing the temperature power compensation coefficient of a power amplifier as claimed in claim 1,
the detection head of the temperature detection device is arranged at a position close to the power amplifier to be detected in the incubator.
7. The device for testing the temperature power compensation coefficient of a power amplifier according to claim 6,
the number of the detection heads is several.
8. The device for testing the temperature power compensation coefficient of a power amplifier according to claim 1,
the temperature box is internally provided with a wiring board, the wiring board is provided with a plurality of lotus wires (2) and a plurality of USB wires (1), a bottom plate of the temperature box is provided with a bulge (4), the detection head (5) is arranged on the bottom plate of the temperature box, and a side plate of the temperature box is provided with a display screen (3) for displaying temperature.
9. The device for testing the temperature power compensation coefficient of a power amplifier as claimed in claim 7,
a groove (7) is formed in the bottom plate of the incubator.
10. The device for testing the temperature power compensation coefficient of a power amplifier as claimed in claim 1,
the power detection unit is a power meter or a frequency spectrograph with a communication function and can be communicated with the compensation coefficient test unit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221420773.1U CN218099400U (en) | 2022-06-07 | 2022-06-07 | Power amplifier temperature power compensation coefficient testing arrangement |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221420773.1U CN218099400U (en) | 2022-06-07 | 2022-06-07 | Power amplifier temperature power compensation coefficient testing arrangement |
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| Publication Number | Publication Date |
|---|---|
| CN218099400U true CN218099400U (en) | 2022-12-20 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221420773.1U Active CN218099400U (en) | 2022-06-07 | 2022-06-07 | Power amplifier temperature power compensation coefficient testing arrangement |
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| CN (1) | CN218099400U (en) |
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- 2022-06-07 CN CN202221420773.1U patent/CN218099400U/en active Active
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