CN218080966U - Combined vibrating mirror three-dimensional laser etching and detecting equipment - Google Patents

Abstract

The utility model relates to a modular three-dimensional laser etching of mirror and check out test set vibrate in mirror, including fixed braced system, optical system, go up mirror processing system and the mirror processing system that shakes of vibrating, be provided with the motion module on the fixed braced system, fixed braced system includes the marble base, and the marble base is provided with the marble crossbeam along one side of Y axle negative direction, and the marble crossbeam sets up and just passes through marble column mouting on the marble base along X axle direction. The utility model discloses optical system's laser instrument gets into through beam splitting module beam splitting and shakes the mirror perpendicularly and the mirror that shakes horizontally, and cooperation multiaxis combination motion platform realizes the three-dimensional cubical space's of high accuracy polyhedron microfabrication.

Description

Combined vibrating mirror three-dimensional laser etching and detecting equipment

Technical Field

The utility model relates to a relevant technical field of display processing especially relates to a modular galvanometer three-dimensional laser etching and check out test set.

Background

The electronic information industry is a key basic industry for high-quality development and digital transformation of economy and society. The method is a fourteen-five planning method for strengthening original leading scientific and technological customs, and aims to establish and implement strategic scientific plans and scientific projects in the basic core field of national security and development global of customs. Among them, a new display field is an important one.

In the novel display field, micro LED display has the characteristics of self-luminescence, high efficiency, low power consumption, high stability and the like, is an important choice of the next generation mainstream display technology, and has the potential of replacing the prior art in numerous fields. The Micro LED array can reach ultra-high density pixels and has the self-luminous characteristic, compared with an OLED and an LCD, the Micro LED array has higher luminous efficiency, longer service life and higher brightness, has the advantages of lightness, thinness, electricity saving and all-weather use, and can be widely applied to the field of display.

Traditional conductive silver paste transfer printing or line screen printing is difficult to reach the requirement of Micro LED high resolution to the circuit in precision and density. The common three-dimensional etching equipment on the market is realized by using a five-axis platform and a Z-axis galvanometer, the manufacturing cost is high, the five-axis motion precision is poor, and the effect is difficult to call when the etching requirement of high precision (the processing precision reaches plus or minus 1 micron) is met.

The laser engraving process of the three-side drive circuit of the display becomes an indispensable ring in the Micro LED process, and the drive circuits in the unit area of the display are required to be denser in order to realize higher pixel density, smaller display frame and splicing gap. Through the mode of trilateral circuit of laser sculpture, can realize higher drive circuit density, through the mode of trilateral sculpture concatenation, will drive the route display surface of line and remove to the demonstration back simultaneously, realized the demonstration scheme of utmost point narrow frame, utmost point narrow piece.

In view of the above-mentioned defects, the present designer is actively making research and innovation to create a combined galvanometer three-dimensional laser etching and detecting device, so that the combined galvanometer three-dimensional laser etching and detecting device has industrial utilization value.

SUMMERY OF THE UTILITY MODEL

In order to solve the technical problem, the utility model aims at providing a modular galvanometer three-dimensional laser etching and check out test set.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

combination formula galvanometer three-dimensional laser etching and check out test set, including fixed braced system, optical system, go up galvanometer processing system and side galvanometer processing system, be provided with the motion module on the fixed braced system, fixed braced system includes the marble base, the marble base is provided with the marble crossbeam along one side of Y axle negative direction, the marble crossbeam sets up and installs on the marble base through the marble stand along the X axle direction, the motion module includes Y axle removal module, rotatory module, first X axle removal module, first Z axle removal module, second Z axle removal module and second X axle removal module, Y axle removal module sets up on the marble base, the drive end of Y axle removal module top is connected the setting with the rotatory module of top along Y axle direction drive, the drive end of rotatory module top is connected the setting with the adsorption platform drive of top, be provided with first X axle removal module on the marble crossbeam bottom and the marble base that is close to marble crossbeam along Y axle positive direction one side, the drive end of first X axle removal module top is connected the setting with the second Z axle removal module along X axle direction drive of X axle removal module, drive end on the second Z axle removal module and the Z axle removal module on the Z axle removal module of Z axle removal module set up and the X axle removal system drive module, the drive end of Z axle removal module of shaking on the Z axle removal module and the Z axle removal system is connected the Z axle removal module.

As a further improvement, the optical system includes that laser instrument, a plurality of beam splitting module, a plurality of optics go up mirror and a plurality of optics side mirror that shakes, and the laser instrument shakes the mirror through a plurality of beam splitting module, a plurality of optics and a plurality of optics side mirror that shakes and falls into the processing light beam of two tunnel with laser and enter into respectively on shake mirror processing system and the side mirror processing system that shakes.

As a further improvement of the present invention, the optical system further includes a plurality of optical shutters.

As the utility model discloses a further improvement, the beam split module includes motor frame, spectroscope and beam split frame, and motor frame and beam split frame set up side by side, and the position that first side is close to the bottom is provided with servo motor on the motor frame, and servo motor's drive end and motor frame go up the action wheel drive that the second side is close to the bottom position and be connected the setting, and the action wheel is connected from the driving wheel of belt and top, is connected from the driving wheel with the spectroscope of installing on the beam split frame.

As a further improvement of the utility model, go up the mirror system of shaking and include the mirror support that shakes on, go up the mirror support that shakes and be connected with the drive end on the first Z axle removal module, go up and be provided with first speculum, go up mirror and the last field lens that shakes on shaking the mirror support, the bottom of going up the field lens is provided with the mirror dust collection box that shakes on, is provided with the location CCD camera on the mirror support that shakes on going up field lens one side.

As the utility model discloses a further improvement, side mirror processing system that shakes includes the side mirror support that shakes, and the side mirror support that shakes is connected with the drive end on the second Z axle removal module, is provided with the second mirror on the mirror support that shakes, side mirror and side field lens, is provided with the side mirror dust collection box that shakes on the side field lens, is provided with on the side mirror support that shakes of side field lens one side and rectifies the image CCD camera.

As the utility model discloses a further improvement still includes detecting system, and the motion module still includes third X axle and removes the module, and third X axle removes the module setting in marble crossbeam along one side of Y axle negative direction, and the drive end on the third X axle removes the module is connected the setting with detecting system along X axle direction drive.

As the utility model discloses a further improvement, detecting system is including detecting the support, and the drive end that detects on support and the third X axle removal module is connected, and the position that is close to the top on the detection support is provided with the field of vision camera, and the position that is close to the middle part on the detection support is provided with the side field of vision camera, and the position that is close to the bottom on the detection support is provided with down the field of vision camera, all installs the corner mirror of degree of rotation on last field of vision camera, side field of vision camera and the down field of vision camera.

As a further improvement, the detection end of the upper visual field camera and the detection end of the side visual field camera are both towards one side of the Z-axis direction, and the detection end of the lower visual field camera is towards one side of the Y-axis direction.

As the utility model discloses a further improvement still is provided with on the detection support and is used for the Z axial adjustment slip table that upward field of vision camera removed in Z axle direction, still is provided with the XYZ triaxial adjustment slip table that is used for offside field of vision camera and downward field of vision camera to remove in X, Y and Z direction on the detection support.

Borrow by above-mentioned scheme, the utility model discloses at least, have following advantage:

1. the laser of the optical system is split by the light splitting module and enters the vertical vibrating mirror and the horizontal vibrating mirror, and the polyhedron micromachining of a high-precision three-dimensional space is realized by matching with the multi-axis combined motion platform;

2. the multi-axis combined motion module and the processing mode of carrying out precision correction and contraposition on the processing galvanometer by matching the upper image and the side image system.

3. The side vibrating mirror is compatible with the processing of oversized products by increasing the X axis.

The above description is only an overview of the technical solution of the present invention, and in order to make the technical means of the present invention clearer and can be implemented according to the content of the description, the following detailed description is made with reference to the preferred embodiments of the present invention and accompanying drawings.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

Fig. 1 is a schematic structural view of the combined galvanometer three-dimensional laser etching and detecting device of the present invention;

FIG. 2 is a schematic diagram of the motion module of FIG. 1;

FIG. 3 is a schematic diagram of the optical system of FIG. 1;

FIG. 4 is a schematic structural diagram of the optical splitter module shown in FIG. 3;

FIG. 5 is a schematic diagram of the upper galvanometer machining system of FIG. 1;

FIG. 6 is a schematic diagram of the side-galvanometer machining system of FIG. 1;

fig. 7 is a schematic diagram of the detection system of fig. 1.

In the drawings, the meanings of the reference numerals are as follows.

1. Marble base 2 marble column

3. Marble crossbeam 4 optical system

5. 6 side galvanometer processing systems of upper galvanometer processing system

7. 8Y-axis moving module of detection system

9. Limit switch 10 rotating module

11. First X-axis moving module of adsorption platform 12

13. First Z-axis moving module 14 and second Z-axis moving module

15. Second X-axis moving module 16 and third X-axis moving module

17. Laser 18 beam splitting module

19. Switch-off 20 optical upper vibrating mirror

21. Optical side-vibrating mirror 22 motor frame

23. Servo motor 24 spectroscope

25. Driving wheel 26 belt

27. Driven wheel 28 inductor

29. Upper vibrating mirror bracket of beam splitter 30

31. First mirror 32 upper vibrating mirror

33. CCD camera with upper field lens 34 positioning

35. Upper vibrating mirror dust collection box 36 side vibrating mirror bracket

37. Second reflector 38 side galvanometer

39. CCD camera with side field lens 40 for correcting image

41. Side vibrating mirror dust collection box 42 detection bracket

43. Top view camera 44 side view camera

45. 46 corner mirror of lower visual field camera

Detailed Description

The following detailed description of the embodiments of the present invention is made with reference to the accompanying drawings and examples. The following examples are intended to illustrate the invention, but are not intended to limit the scope of the invention.

In order to make the technical solutions of the present invention better understood, the attached drawings in the embodiments of the present invention are combined below to clearly and completely describe the technical solutions in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. The components of embodiments of the present invention, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiment of the present invention, all other embodiments obtained by those skilled in the art without creative efforts belong to the protection scope of the present invention.

Examples

As shown in figures 1 to 7 of the drawings,

the utility model provides a three-dimensional laser etching of modular galvanometer and check out test set, including fixed braced system, optical system 4, go up galvanometer processing system 5 and side galvanometer processing system 6, be provided with the motion module on the fixed braced system, fixed braced system includes marble base 1, marble base 1 is provided with marble crossbeam 3 along one side of the negative direction of Y axle, marble crossbeam 3 sets up and installs on marble base 1 through marble stand 2 along the X axle direction, the motion module includes Y axle removal module 8, rotatory module 10, first X axle removal module 12, first Z axle removal module 13, second Z axle removal module 14 and second X axle removal module 15, Y axle removal module 8 sets up on marble base 1, the drive end at Y axle removal module 8 top is connected the setting along the drive of Y axle direction with the rotatory module 10 of top, the drive end at rotatory module 10 top is connected the setting with the absorption platform 11 drive of top, marble crossbeam 3 bottom and be close to be provided with first X axle removal module 12 on marble base 1 of Y axle removal module one side along the drive end of Y axle and the drive module of second X axle removal module 14 and the drive module on the drive end of Z axle removal module and the second X axle removal system 13, marble crossbeam is connected along the drive module on the drive module of Z axle removal module of X axle removal system 13 and the drive of Z axle removal module on the drive end of Z axle removal module set up along the positive direction on the Z axle removal of Z axle removal system 13, marble crossbeam setting on the drive system of Z axle removal module 3 top and the drive system of Z axle removal module on the Z axle removal module 3 bottom and the Z axle removal of marble base 1 of Y axle removal of marble beam 3 one side of Y axle removal module 3, marble beam 3.

Preferably, the optical system 4 includes a laser 17, a plurality of light splitting modules 18, a plurality of optical upward vibrating mirrors 20, and a plurality of optical lateral vibrating mirrors 21, and the laser 17 splits the laser into two processing beams through the plurality of light splitting modules 18, the plurality of optical upward vibrating mirrors 20, and the plurality of optical lateral vibrating mirrors 21, and the two processing beams enter the upward vibrating mirror processing system 5 and the lateral vibrating mirror processing system 6, respectively. The light emitted from the laser 17 enters the beam splitting module 18 via the reflector, and then is reflected to the optical side vibrating mirror 21.

Preferably, the optical system 4 further comprises a plurality of shutters 19.

Preferably, the light splitting module 18 includes a motor frame 22, a light splitter 24 and a light splitter 29, the motor frame 22 and the light splitter 29 are arranged in parallel, a servo motor 23 is arranged at a position on the motor frame 22 close to the bottom, a driving end of the servo motor 23 is in driving connection with a driving wheel 25 at a position on the motor frame 22 close to the bottom at a second side, the driving wheel 25 is connected with a driven wheel 27 above through a belt 26, and the driven wheel 27 is connected with the light splitter 24 mounted on the light splitter 29. The motor mount 22 is also provided with an inductor 28. The servo motor 23 is controlled through a driver to drive a driving wheel 25, the driving wheel 25 drives a driven wheel 27 through a belt 26, the driven wheel 27 drives the spectroscope 24 to rotate, the rotation angle is controlled after a zero coordinate system is established through an induction sheet and an inductor 28, and light is split through the spectroscope 24.

Preferably, the upper galvanometer processing system 5 comprises an upper galvanometer bracket 30, the upper galvanometer bracket 30 is connected with a driving end on the first Z-axis moving module 13, a first reflecting mirror 31, an upper galvanometer 32 and an upper field lens 33 are arranged on the upper galvanometer bracket 30, an upper galvanometer dust collecting box 35 is arranged at the bottom of the upper field lens 33, and a positioning CCD camera 34 is arranged on the upper galvanometer bracket 30 on one side of the upper field lens 33. Light is emitted from the optical system 4, passes through the first reflector 31, enters the upper vibrating mirror 32, immediately starts processing work on the upper field lens 33, positions a CCD camera 34 to accurately position a product for processing, starts working on the upper vibrating mirror dust collection box 35, and absorbs smoke dust generated by processing.

Preferably, the side galvanometer processing system 6 comprises a side galvanometer bracket 36, the side galvanometer bracket 36 is connected with a driving end on the second Z-axis moving module 14, a second reflecting mirror 37, a side galvanometer 38 and a side field lens 39 are arranged on the side galvanometer bracket 36, a side galvanometer dust collecting box 41 is arranged on the side field lens 39, and a corrected image CCD camera 40 is arranged on the side galvanometer bracket 36 on one side of the side field lens 39. The machining accuracy of the side galvanometer is corrected by the image system in the side galvanometer image matching correction image CCD camera 40. The light is emitted from the optical system 4, passes through the second reflector 37, enters the side oscillating mirror 38, and then the side field lens 39 starts to perform machining operation, and the side oscillating mirror dust collecting box 41 starts to operate to absorb the smoke generated by machining.

Preferably, still include detecting system 7, the motion module still includes third X axle and moves the module 16, and third X axle moves the module 16 and sets up in the one side of marble crossbeam 3 along the negative direction of Y axle, and the drive end on the third X axle moves the module 16 and is connected the setting with detecting system 7 along the drive of X axle direction. After the product processing is finished, the Y-axis moving module 8 moves to the position right below the detection system 7, and the detection system 7 moves through the third X-axis moving module 16 to shoot photos for precision detection.

Preferably, the detection system 7 includes a detection bracket 42, the detection bracket 42 is connected to a driving end of the third X-axis moving module 16, an upper view camera 43 is disposed on the detection bracket 42 near the top, a side view camera 44 is disposed on the detection bracket 42 near the middle, a lower view camera 45 is disposed on the detection bracket 42 near the bottom, and corner mirrors 46 capable of rotating at 45 degrees are mounted on the upper view camera 43, the side view camera 44 and the lower view camera 45.

Preferably, the detection ends of the top view camera 43 and the side view camera 44 face one side in the Z-axis direction, and the detection end of the bottom view camera 45 faces one side in the Y-axis direction.

Preferably, the detection bracket 42 is further provided with a Z-axis adjustment sliding table for moving the upper field of view camera 43 in the Z-axis direction, and the detection bracket 42 is further provided with an XYZ triaxial adjustment sliding table for moving the opposite field of view camera 44 and the lower field of view camera 45 in the X, Y and Z directions.

The plurality of moving modules may be linear motors, and the rotating module 10 may be a conventional driving module such as a rotating table controlled by a rotating motor.

The utility model is a device applied to the lead etching processing of Mini/Micro LED or LCD with extremely narrow frame; the method is particularly applied to multi-surface processing operation of the leads of UHD (ultra high definition) and above displays, and processing is carried out according to the requirement of extremely narrow line width and line distance, so that the coincidence precision of the etching processing positions of the front surface, the back surface and the side surface is ensured.

The utility model discloses multiaxis motion platform of equipment utilization adds the super large-size microscope carrier, and in addition 2 take the Z axle to shake the mirror (1 places along Z axle direction, and 1 places along X axle direction), and the side that wherein the level was placed shakes mirror system of processing 6 and has the X axle (be convenient for process super large-size product), guarantees multiaxis motion platform precision, realizes the machining precision more easily and reaches the processing requirement of positive negative 1 micron. And after the processing is finished, detecting whether the processing precision of the product reaches the standard by using three cameras (which are respectively used for detecting the front side, the back side and the side) of the equipment.

In connection with the above problems, the present invention provides a laser etching apparatus for realizing etching processing of front, back and side surfaces of a product and ensuring coincidence accuracy of three-sided etching paths.

The utility model discloses a following technical scheme realizes:

the utility model discloses a three-dimensional laser etching equipment, characteristics are that linkage nature is high, and the precision is good, adds man-hour length, mainly contains:

an optical system 4: a laser 17 splits the laser beam into two processing beams by a beam splitting module 18.

An upper galvanometer processing system 5 processes the front and back of the product.

The upper galvanometer processing system 5 is arranged on the first Z-axis moving module 13 and used for adjusting the focus of the processing system.

And an image system, namely a positioning CCD camera 34, is used for aligning the product, the positioning CCD camera 34 and the upper galvanometer processing system 5 are arranged on the first Z-axis moving module 13 together, and the first Z-axis moving module 13 and the optical system 4 are arranged on the second X-axis moving module 15.

The second X-axis moving module 15 is installed on the marble beam 3 supported by two marble posts 2, and the marble posts 2 are installed on one marble base 1.

The Y-axis moving module 8 is arranged on the marble base and positioned between the two marble upright posts and below the marble beam.

And a side galvanometer processing system 6 for processing the side surface of the product.

The side galvanometer machining system 6 is mounted on a second Z-axis moving module 14, and the second Z-axis moving module 14 is used for adjusting the machining position of the side galvanometer machining system 6. The second Z-axis moving module 14 is axially installed on the first X-axis moving module 12, and the first X-axis moving module 12 is used for adjusting the focus of the oversized lateral part processing system.

The first X-axis moving module 12 is installed on the marble base 1.

An image system, i.e. a corrected image CCD camera 40, is fixed on the second Z-axis moving module 14, follows the side galvanometer processing system 6, and is used for focusing and positioning the side position of the product.

A vacuum suction platform 11 for holding the product.

A Y-axis moving module 8 and a rotating module 10 for driving a vacuum suction table 11 for sucking the product.

An AOI image detection system 7 contains three detection cameras (go up field of vision camera 43, side field of vision camera 44 and field of vision camera 45 down), and the field of vision is upwards respectively, downwards, forward (in the coplanar, and perpendicular in proper order), detects product front, reverse side and side respectively, and processing completion back detection usefulness is fixed in board crossbeam back X3 epaxially, shows the trilateral etching coincidence precision of concatenation department through the software interface is audio-visual.

The utility model relates to a three-dimensional laser etching equipment's step:

(a) A vacuum adsorption platform 11 is used for adsorbing the processed product;

(b) The first Z-axis moving module 13/the second X-axis moving module 15 adjusts the focal length of the image system to identify the Mark on the product to identify the position of the product, and the Y-axis moving module 8/the rotating module 10+ the second X-axis moving module 15 corrects the position;

(c) The upper galvanometer processing system 5 carries out etching processing on the front surface of the product;

(d) After the front face machining is finished, the side galvanometer machining system 6 firstly carries out image correction and adjustment on the second Z-axis moving module 14/the first X-axis moving module 12 to carry out etching machining on the side face of a product;

(e) Turning over the product, and then putting the product on the vacuum adsorption platform 11 again;

(f) The image system repeats the action alignment of (b);

(g) The upper galvanometer processing system 5 etches and processes the back of the product;

(h) And after the machining is finished, detecting the three sides of the front side and the back side of the product by using a detection system 7.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, are not to be construed as limiting the present invention. Furthermore, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly referring to the number of technical features being indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.

In the description of the present invention, it should be noted that, unless otherwise explicitly stated or limited, the terms "mounted," "connected" and "connected" are to be construed broadly, and may be, for example, a fixed connection, a detachable connection, or an integral connection: either mechanically or electrically: the terms may be directly connected or indirectly connected through an intermediate medium, or may be a communication between two elements.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention, and it should be noted that, for those skilled in the art, a plurality of modifications and variations can be made without departing from the technical principle of the present invention, and these modifications and variations should also be regarded as the protection scope of the present invention.

Claims (10)

1. The combined vibrating mirror three-dimensional laser etching and detecting equipment is characterized by comprising a fixed supporting system, an optical system (4), an upper vibrating mirror processing system (5) and a side vibrating mirror processing system (6), wherein a movement module is arranged on the fixed supporting system, the fixed supporting system comprises a marble base (1), a marble beam (3) is arranged on one side of the marble base (1) along a Y-axis negative direction, the marble beam (3) is arranged along an X-axis direction and is installed on the marble base (1) through a marble upright post (2), the movement module comprises a Y-axis moving module (8), a rotating module (10), a first X-axis moving module (12), a first Z-axis moving module (13), a second Z-axis moving module (14) and a second X-axis moving module (15), Y axle removes module (8) and sets up on marble base (1), the drive end at Y axle removal module (8) top is connected the setting with rotation module (10) of top along Y axle direction drive, the drive end at rotation module (10) top is connected the setting with adsorption platform (11) drive of top, marble crossbeam (3) bottom just is close to marble crossbeam (3) and is provided with first X axle removal module (12) on marble base (1) of Y axle positive direction one side, the drive end at first X axle removal module (12) top and second Z axle removal module (14) of top Along X axle direction drive connection setting, drive end and side galvanometer processing system (6) on the second Z axle removes module (14) are connected along Z axle direction drive and are set up, be provided with second X axle on marble crossbeam (3) and remove module (15), the drive end and optical system (4) and first Z axle that second X axle removed the module (15) top remove module (13) and are connected the setting along X axle direction drive, drive end and last galvanometer processing system (5) on the first Z axle removes module (13) are connected the setting along Z axle direction drive.

2. The combined vibrating mirror three-dimensional laser etching and detecting device according to claim 1, wherein the optical system (4) comprises a laser (17), a plurality of light splitting modules (18), a plurality of optical upper vibrating mirrors (20) and a plurality of optical side vibrating mirrors (21), and the laser (17) divides laser into two processing beams through the plurality of light splitting modules (18), the plurality of optical upper vibrating mirrors (20) and the plurality of optical side vibrating mirrors (21) and enters the upper vibrating mirror processing system (5) and the side vibrating mirror processing system (6) respectively.

3. The combined galvanometer three-dimensional laser etching and detecting device according to claim 2, wherein said optical system (4) further comprises a plurality of optical shutters (19).

4. The combined type galvanometer three-dimensional laser etching and detecting device as claimed in claim 2, wherein the beam splitting module (18) comprises a motor frame (22), a beam splitter (24) and a beam splitting frame (29), the motor frame (22) and the beam splitting frame (29) are arranged in parallel, a servo motor (23) is arranged at a position, close to the bottom, of a first side on the motor frame (22), a driving end of the servo motor (23) is in driving connection with a driving wheel (25) at a position, close to the bottom, of a second side on the motor frame (22), the driving wheel (25) is connected with a driven wheel (27) above through a belt (26), and the driven wheel (27) is connected with the beam splitter (24) arranged on the beam splitting frame (29).

5. The combined galvanometer three-dimensional laser etching and detecting device as claimed in claim 1, wherein the galvanometer machining system (5) comprises a galvanometer bracket (30), the galvanometer bracket (30) is connected with a driving end of the first Z-axis moving module (13), the galvanometer bracket (30) is provided with a first reflector (31), a galvanometer (32) and a field lens (33), the bottom of the field lens (33) is provided with a galvanometer dust collecting box (35), and the galvanometer bracket (30) on one side of the field lens (33) is provided with a positioning CCD camera (40).

6. The combined galvanometer three-dimensional laser etching and detecting device as recited in claim 1, wherein the galvanometer processing system (6) comprises a galvanometer bracket (36), the galvanometer bracket (36) is connected with a driving end of the second Z-axis moving module (14), the galvanometer bracket (36) is provided with a second reflecting mirror (37), a galvanometer (38) and a side field lens (39), the side field lens (39) is provided with a galvanometer dust collecting box (41), and the galvanometer bracket (36) on one side of the side field lens (39) is provided with a CCD camera (34) for image correction.

7. The apparatus according to claim 1, further comprising a detection system (7), wherein the motion module further comprises a third X-axis moving module (16), the third X-axis moving module (16) is disposed on one side of the marble beam (3) along the negative Y-axis direction, and a driving end of the third X-axis moving module (16) is drivingly connected to the detection system (7) along the negative X-axis direction.

8. The combined galvanometer three-dimensional laser etching and detecting equipment as claimed in claim 7, wherein the detecting system (7) comprises a detecting bracket (42), the detecting bracket (42) is connected with a driving end of the third X-axis moving module (16), an upper view camera (43) is arranged on the detecting bracket (42) near the top, a side view camera (44) is arranged on the detecting bracket (42) near the middle, a lower view camera (45) is arranged on the detecting bracket (42) near the bottom, and corner mirrors (46) capable of rotating at 45 degrees are arranged on the upper view camera (43), the side view camera (44) and the lower view camera (45).

9. The combined galvanometer three-dimensional laser etching and detecting device according to claim 8, wherein the detecting ends of the upper field of view camera (43) and the side field of view camera (44) face one side in the Z-axis direction, and the detecting end of the lower field of view camera (45) faces one side in the Y-axis direction.

10. The combined galvanometer three-dimensional laser etching and detecting device recited in claim 8, wherein the detecting bracket (42) is further provided with a Z-axis adjusting slide table for moving the upper field of view camera (43) in the Z-axis direction, and the detecting bracket (42) is further provided with an XYZ three-axis adjusting slide table for moving the opposite field of view camera (44) and the lower field of view camera (45) in the X, Y and Z directions.

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