CN218052051U - Resin binder fine grinding wheel for silicon wafer processing - Google Patents
Resin binder fine grinding wheel for silicon wafer processing Download PDFInfo
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- CN218052051U CN218052051U CN202221984204.XU CN202221984204U CN218052051U CN 218052051 U CN218052051 U CN 218052051U CN 202221984204 U CN202221984204 U CN 202221984204U CN 218052051 U CN218052051 U CN 218052051U
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Abstract
The utility model relates to a emery wheel technical field discloses a silicon wafer processing is with resinoid bond finish grinding emery wheel, including the emery wheel main part, the inside fixedly connected with of emery wheel main part passes the connecting axle of shell body, and the both ends difference fixedly connected with cam of connecting axle, the top fixedly connected with water tank of shell body, the downside difference fixedly connected with water-cooling chamber of water tank, water-cooling chamber intercommunication have peg graft to the inside shower of shell body, and the bottom fixedly connected with of movable rod is used for the fly leaf of the cam of contradicting, is provided with moisturizing mechanism between water-cooling chamber and the water tank. The resin bond finish grinding wheel for processing the silicon wafers is novel in structure and ingenious in conception, and water-cooling heat dissipation of the grinding wheel can be realized in the process of grinding the silicon wafers by the grinding wheel, so that the problem that the service life of the grinding wheel is affected due to the fact that the grinding wheel is in a high-temperature state for a long time in the working process is solved.
Description
Technical Field
The utility model relates to a emery wheel technical field specifically is a resin bond finish grinding emery wheel is used in silicon wafer processing.
Background
The silicon wafer is a silicon wafer used for manufacturing a silicon semiconductor circuit, which is purified by silicon element, then the pure silicon is made into a long silicon crystal bar to become a material of a quartz semiconductor for manufacturing an integrated circuit, and after processes of photoengraving, grinding, polishing, slicing and the like, polycrystalline silicon is melted and pulled out of a monocrystalline silicon crystal bar, and then the monocrystalline silicon crystal bar is cut into thin wafers.
At the present stage, in the process of grinding silicon wafers by using the resin bond finish grinding wheel, the temperature of the grinding wheel is rapidly increased due to friction with the silicon wafers, the heat is not easily and rapidly dissipated, and the resin bond is easily burnt out when the grinding wheel is in a high-temperature state for a long time, so that the service life of the resin bond finish grinding wheel is influenced.
SUMMERY OF THE UTILITY MODEL
To the above situation, for overcoming prior art's defect, the utility model provides a resin bond finish grinding wheel is used in silicon wafer processing, this resin bond finish grinding wheel is used in silicon wafer processing, novel structure thinks about ingeniously, can carry out the water-cooling heat dissipation to the emery wheel at the in-process that abrasive machining was carried out to silicon wafer to the emery wheel to solved the emery wheel and received the problem of influence because of being in the long-time life that leads to of high temperature state in the course of the work.
In order to achieve the above object, the utility model provides a following technical scheme: a resin bond finish grinding wheel for silicon wafer processing comprises a wheel main body, wherein an outer shell is arranged on the outer side of the wheel main body, the wheel main body is fixedly connected with a connecting shaft penetrating through the outer shell, and two ends of the connecting shaft are respectively and fixedly connected with cams arranged on the front side and the rear side of the outer shell;
the utility model discloses a water cooling device, including shell body, water tank, spray pipe, water chamber, piston plate, movable rod, reset spring, water cooling chamber bottom outer wall, the top fixedly connected with water tank of shell body, the downside of water tank is fixedly connected with respectively sets up the water cooling chamber of shell body front and back both sides, the water cooling chamber intercommunication have peg graft extremely the inside shower of shell body, the one end swing joint that the water cooling chamber was kept away from to the shower has the setting to be in the inside atomizer of shell body, the inside slidable ground of water cooling chamber is provided with the piston plate, the downside fixedly connected with of piston plate is worn out the outer movable rod of water cooling chamber, reset spring has been cup jointed on the movable rod, reset spring's top fixed connection is in on the outer wall of water cooling chamber bottom, the bottom fixedly connected with of movable rod is used for contradicting the fly leaf of cam, the water cooling chamber with moisturizing mechanism is provided with between the water tank.
Optionally, a water replenishing port is formed in the upper surface of the water tank.
Optionally, the outer side wall of the piston plate is provided with a sealing ring.
Optionally, moisturizing mechanism is including communicateing respectively the water-cooling chamber with a plurality of moisturizing holes of water tank, the lower extreme opening shutoff in moisturizing hole has and is located closing plate in the water-cooling chamber, the top fixedly connected with of closing plate extends to the inside connecting rod of water tank, the outside cover of connecting rod is equipped with and is located connecting spring in the water tank, the top fixedly connected with limiting plate of connecting rod.
Optionally, the upper surface of the sealing plate is provided with a gasket.
The utility model has the advantages that:
when the silicon wafer water-cooling heat dissipation device is used, the grinding wheel main body can be connected with an output shaft of the driving device through the connecting shaft, the grinding wheel main body is driven to rotate through the connecting shaft, the silicon wafer can be ground by the grinding wheel main body, in the process that the driving device drives the grinding wheel main body to rotate through the connecting shaft, the connecting shaft can also drive the cam to synchronously rotate, the movable plate is driven to reciprocate up and down through the cooperation effect of the reset spring when the cam rotates, the movable plate drives the piston plate to reciprocate up and down through the movable rod, cooling water in the water-cooling chamber can be extruded when the piston plate moves up, the cooling water is conveyed to the atomizing nozzle through the spraying pipe and is atomized and sprayed on the outer surface of the grinding wheel main body, water-cooling heat dissipation of the grinding wheel main body is achieved, the problem that the service life of the grinding wheel main body is affected due to the fact that the grinding wheel main body is in a high-temperature state for a long time is solved, when the piston plate moves down, the pressure in the water-cooling chamber is reduced, the sealing plate compresses the connecting spring and moves down through the cooperation effect of the connecting rod and the limiting plate, the water-cooling hole is not sealed by the sealing plate, and water in the water tank can flow to the inside the water-cooling chamber through the water-cooling hole.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without inventive exercise.
FIG. 1 is a front view of the overall structure of the present invention;
FIG. 2 is a side view of the overall structure of the present invention;
fig. 3 is an enlarged schematic view of a structure in fig. 2 according to the present invention.
Reference numbers in the figures: 1. a grinding wheel main body; 2. an outer housing; 3. a connecting shaft; 4. a cam; 5. a water tank; 6. a water replenishing port; 7. a water cooling chamber; 8. a spray pipe; 9. an atomizing spray head; 10. a piston plate; 11. a movable rod; 12. a return spring; 13. a movable plate; 14. water replenishing holes; 15. a sealing plate; 16. a connecting rod; 17. a connecting spring; 18. and a limiting plate.
Detailed Description
In order to make the objects, features and advantages of the present invention more obvious and understandable, the drawings in the embodiments of the present invention are combined below to clearly and completely describe the technical solutions in the embodiments of the present invention, and obviously, the embodiments described below are only some embodiments of the present invention, but not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
The technical solution of the present invention is further explained by the following embodiments with reference to the accompanying drawings.
In the description of the present invention, it should be understood that the terms "upper", "lower", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.
Example one
As shown in fig. 1-3, a resin bond fine grinding wheel for silicon wafer processing comprises a wheel body 1, an outer casing 2 is arranged on the outer side of the wheel body 1, a connecting shaft 3 penetrating through the outer casing 2 is fixedly connected to the inner part of the wheel body 1, cams 4 arranged on the front and rear sides of the outer casing 2 are respectively fixedly connected to the outer side of the connecting shaft 3, a water tank 5 is fixedly connected to the outer side of the outer casing 2, a water replenishing port 6 is arranged on the upper surface of the water tank 5, cooling water is conveniently replenished to the water tank 5 through the water replenishing port 6, water cooling chambers 7 arranged on the front and rear sides of the outer casing 2 are respectively fixedly connected to the lower side of the water tank 5, spray pipes 8 extending to the inner part of the outer casing 2 are respectively inserted and connected to the outer side of the water cooling chambers 7, and atomization nozzles 9 arranged inside the outer casing 2 are respectively movably connected to the opposite sides of the spray pipes 8, the inside of water-cooling chamber 7 is provided with piston plate 10, the downside fixedly connected with of piston plate 10 extends the movable rod 11 of water-cooling chamber 7, the outside of movable rod 11 is provided with return spring 12 of fixed connection in water-cooling chamber 7 bottom, the bottom fixedly connected with fly leaf 13 of movable rod 11, be provided with moisturizing mechanism between water-cooling chamber 7 and the water tank 5, moisturizing mechanism is including seting up the moisturizing hole 14 between water-cooling chamber 7 and water tank 5 respectively, the downside of moisturizing hole 14 is provided with closing plate 15, the upper surface of closing plate 15 is provided with the sealed pad of laminating with moisturizing hole 14, improve the closure effect to moisturizing hole 14, the top fixedly connected with of closing plate 15 extends to the inside connecting rod 16 of water tank 5, the outside of connecting rod 16 is provided with coupling spring 17, the top fixedly connected with limiting plate 18 of connecting rod 16.
When the water cooling type silicon wafer grinding device is used, the grinding wheel main body 1 can be connected with an output shaft of a driving device through the connecting shaft 3, the grinding wheel main body 1 is driven to rotate by the connecting shaft 3, the connecting shaft 3 can also drive the cam 4 to synchronously rotate, the movable plate 13 is driven to reciprocate up and down through the cooperation effect of the reset spring 12 when the cam 4 rotates, the movable plate 13 drives the piston plate 10 to reciprocate up and down through the movable rod 11, the cooling water in the water cooling chamber 7 can be extruded when the piston plate 10 moves up, the cooling water is conveyed to the atomizing nozzle 9 through the spray pipe 8 and is atomized and sprayed on the outer surface of the grinding wheel main body 1, so that the water cooling heat dissipation of the grinding wheel main body 1 is realized, the problem that the service life of the grinding wheel main body 1 is influenced due to long-time high-temperature state is solved, when the piston plate 10 moves down, the interior of the water cooling chamber 7 is reduced, the sealing plate 15 compresses the connecting spring 17 and moves down through the cooperation effect of the connecting rod 16 and the limiting plate 18 under the pressure effect, so that the water in the water cooling chamber 7 can be supplemented.
Example two
Referring to fig. 2, as another preferred embodiment, the difference from the first embodiment is that a seal ring is provided on the outer side of the piston plate 10, and the sealing performance of the piston plate 10 can be improved by providing the seal ring.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
The above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention in its corresponding aspects.
Claims (5)
1. The utility model provides a silicon wafer processing is with resin binder finish grinding emery wheel, includes emery wheel main part (1), its characterized in that: an outer shell (2) is arranged on the outer side of the grinding wheel main body (1), the grinding wheel main body (1) is fixedly connected with a connecting shaft (3) penetrating through the outer shell (2), and two ends of the connecting shaft (3) are respectively and fixedly connected with cams (4) arranged on the front side and the rear side of the outer shell (2);
the top fixedly connected with water tank (5) of shell body (2), the downside difference fixedly connected with setting of water tank (5) is in water-cooling chamber (7) of shell body (2) preceding, back both sides, water-cooling chamber (7) intercommunication have peg graft extremely spray tube (8) inside shell body (2), the one end swing joint that water-cooling chamber (7) were kept away from in spray tube (8) sets up inside atomizer (9) of shell body (2), the inside slidable of water-cooling chamber (7) is provided with piston plate (10), the downside fixedly connected with of piston plate (10) is worn out the outer movable rod (11) of water-cooling chamber (7), reset spring (12) have been cup jointed on movable rod (11), the top fixed connection of reset spring (12) is in on water-cooling chamber (7) bottom outer wall, the bottom fixedly connected with of movable rod (11) is used for fly leaf (13) of cam (4), water-cooling chamber (7) with be provided with moisturizing mechanism between water tank (5).
2. The resin bond finish grinding wheel for silicon wafer processing according to claim 1, wherein: and a water replenishing port (6) is formed in the upper surface of the water tank (5).
3. The resin bond finish grinding wheel for silicon wafer processing according to claim 1, wherein: and a sealing ring is arranged on the outer side wall of the piston plate (10).
4. The resin bond finish grinding wheel for silicon wafer processing according to claim 1, wherein: moisturizing mechanism including communicate respectively water-cooling chamber (7) with a plurality of moisturizing holes (14) of water tank (5), the lower extreme opening shutoff of moisturizing hole (14) has and is located closing plate (15) in water-cooling chamber (7), the top fixedly connected with of closing plate (15) extends to connecting rod (16) inside water tank (5), the outside cover of connecting rod (16) is equipped with and is located connecting spring (17) in water tank (5), the top fixedly connected with limiting plate (18) of connecting rod (16).
5. The resin bond finish grinding wheel for silicon wafer processing according to claim 4, wherein: and a sealing gasket is arranged on the upper surface of the sealing plate (15).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221984204.XU CN218052051U (en) | 2022-07-29 | 2022-07-29 | Resin binder fine grinding wheel for silicon wafer processing |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221984204.XU CN218052051U (en) | 2022-07-29 | 2022-07-29 | Resin binder fine grinding wheel for silicon wafer processing |
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| CN218052051U true CN218052051U (en) | 2022-12-16 |
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| CN202221984204.XU Active CN218052051U (en) | 2022-07-29 | 2022-07-29 | Resin binder fine grinding wheel for silicon wafer processing |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116100479A (en) * | 2022-12-29 | 2023-05-12 | 无锡承拓机械科技有限公司 | High-heat-dissipation diamond grinding wheel |
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2022
- 2022-07-29 CN CN202221984204.XU patent/CN218052051U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116100479A (en) * | 2022-12-29 | 2023-05-12 | 无锡承拓机械科技有限公司 | High-heat-dissipation diamond grinding wheel |
| CN116100479B (en) * | 2022-12-29 | 2023-11-07 | 无锡承拓机械科技有限公司 | High-heat-dissipation diamond grinding wheel |
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