CN218042104U

CN218042104U - Switching power supply module with heat radiation structure

Info

Publication number: CN218042104U
Application number: CN202222181637.8U
Authority: CN
Inventors: 杨伟明
Original assignee: Guangdong Antke Technology Co ltd
Current assignee: Guangdong Antke Technology Co ltd
Priority date: 2022-08-18
Filing date: 2022-08-18
Publication date: 2022-12-13
Anticipated expiration: 2032-08-18

Abstract

This application belongs to the switching power supply field, and especially a switching power supply module with heat radiation structure, to current switching power supply shell installation with dismantle comparatively troublesome, caused inconveniently for the maintenance in later stage to switching power supply radiating efficiency is not good, accumulates the problem of dust easily, now proposes following scheme, and it includes the shell that casing and lower casing are constituteed, the equal fixedly connected with Z type piece of both sides inner wall of going up the casing, the square groove that runs through is all seted up to the both sides outer wall of going up the casing, the top inner wall of going up the casing is equipped with and is used for radiating heat dissipation mechanism, the bottom inner wall of casing is equipped with the circuit board down, in this application, can install the dismantlement to the shell fast, makes things convenient for people to overhaul switching power supply, can improve the radiating efficiency of circuit board, avoids the dust to accumulate on the circuit board surface simultaneously, can also accomodate the arrangement to the wire, avoids the wire too in a jumble.

Description

Switching power supply module with heat radiation structure

Technical Field

The application relates to the technical field of switching power supplies, in particular to a switching power supply assembly with a heat dissipation structure.

Background

A switch mode power supply, also called a switching power supply, a switching converter, is a high frequency power conversion device, which is a kind of power supply. The function is to convert a level voltage into a voltage or current required by the user terminal through different types of architectures, and the method is widely applied to various electrical equipment.

The switch power supply mainly comprises a shell, a circuit board, a switch and other structures, and has the advantages of small volume and light weight, but the existing switch power supply still has some defects;

1. the existing switch power supply shell is troublesome to install and disassemble, so that inconvenience is caused to later maintenance;

2. the existing switching power supply is poor in heat dissipation efficiency and generally depends on self passive heat dissipation, and a heat dissipation port is formed in a shell of the existing switching power supply, so that dust is easily accumulated on a circuit board.

In view of the above problems, the present document proposes a switching power supply assembly having a heat dissipation structure.

SUMMERY OF THE UTILITY MODEL

The application provides a switching power supply module with heat radiation structure, has solved and has had switching power supply shell installation among the prior art and dismantle comparatively troublesome, has caused inconvenience for the maintenance in later stage to switching power supply radiating efficiency is not good, accumulates the shortcoming of dust easily.

The application provides the following technical scheme:

a switching power supply assembly with a heat dissipation structure comprises a shell consisting of an upper shell and a lower shell, wherein Z-shaped blocks are fixedly connected to the inner walls of the two sides of the upper shell, penetrating square grooves are formed in the outer walls of the two sides of the upper shell, and a heat dissipation mechanism for dissipating heat is arranged on the inner wall of the top of the upper shell;

the inner wall of the bottom of the lower shell is provided with a circuit board, two sides of the lower shell are respectively provided with a connecting plate matched with the square groove, and one side of each of the two connecting plates is provided with a limiting assembly for limiting the upper shell;

the limiting assembly comprises an adjusting block and a connecting shell, the adjusting block penetrates through one side of the connecting plate in a sliding mode, a connecting seat is fixedly connected to one side of the adjusting block, a limiting block is fixedly connected to the inner wall of one side of the connecting seat, the connecting shell is fixedly connected to one side of the connecting plate, and two first springs are fixedly connected between the connecting seat and the connecting shell.

In a possible design, heat dissipation mechanism is including heat dissipation fan, a plurality of first ventilation hole and a plurality of second ventilation hole, heat dissipation fan fixed connection is at the top inner wall of last casing, and is a plurality of first ventilation hole all runs through the upper surface of seting up at last casing, and is a plurality of second ventilation hole runs through respectively and sets up the both sides outer wall at last casing.

In a possible design, two sliding blocks are connected between the inner walls of the two sides of the connecting shell in a sliding mode, and two second springs are fixedly connected between the adjacent sliding blocks and the connecting shell in a sliding mode.

In a possible design, a through lead hole is formed in the inner wall of one side of the lower shell, and a lead plate is fixedly connected to the inner wall of the bottom of the lower shell.

In one possible design, a plurality of first internally threaded tubes are fixedly connected to the bottom of the lower shell, wherein a part of the first internally threaded tubes are fixed to the circuit board through bolts.

In a possible design, a plurality of second internally threaded pipes fixedly penetrate through the inner wall of the bottom of the lower shell.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application.

In the application, through the matching of a plurality of structures such as the adjusting block, the connecting seat and the limiting block, when people need to overhaul a switch power supply, the upper shell can be quickly taken down, during operation, the adjusting block is firstly pushed, the adjusting block drives the connecting seat to move towards the connecting shell, when the limiting plate and the Z-shaped plate are staggered, the second spring pushes the sliding block and further pushes the Z-shaped block, the Z-shaped block drives the upper shell to pop out, during installation, the Z-shaped plate moves downwards along the inner side of the connecting seat, the Z-shaped plate drives the limiting block to move towards the connecting shell, when the bottom of the Z-shaped block is staggered with the limiting block, the first spring pushes the limiting block to limit the Z-shaped block, the operation is simple and convenient, and convenience is provided for overhaul operation of people;

in the application, through the arrangement of the heat dissipation fan, the first ventilation holes and the second ventilation holes, the heat dissipation fan can directly blow the surface of the circuit board, so that the heat dissipation efficiency of the circuit board is improved, dust on the surface of the circuit board can be blown away, and the dust is prevented from being accumulated on the surface of the circuit board;

in this application, through the setting of pin hole and lead plate, when installation switching power supply, people can restraint the lead plate with the wire in, utilize the lead plate to conclude the arrangement to the wire, avoid the wire too mixed and disorderly.

In this application, can install the dismantlement to the shell fast, make things convenient for people to overhaul switch power, can improve the radiating efficiency of circuit board, avoid the dust to accumulate on the surface of circuit board simultaneously, can also accomodate the arrangement to the wire, avoid the wire too in a jumble.

Drawings

Fig. 1 is a schematic three-dimensional structure diagram of a switching power supply assembly with a heat dissipation structure according to an embodiment of the present disclosure;

fig. 2 is a schematic structural diagram of a heat dissipation mechanism of a switching power supply assembly having a heat dissipation structure according to an embodiment of the present disclosure;

fig. 3 is a schematic diagram illustrating an internal structure of a lower case of a switching power supply assembly having a heat dissipation structure according to an embodiment of the present disclosure;

fig. 4 is a schematic diagram illustrating an internal structure of a lower case without a circuit board of a switching power supply assembly having a heat dissipation structure according to an embodiment of the present disclosure;

fig. 5 is an exploded view of a limiting component of a switching power supply assembly with a heat dissipation structure according to an embodiment of the present disclosure;

fig. 6 is a schematic diagram of a mounting structure of a Z-block of a switching power supply module with a heat dissipation structure according to an embodiment of the present disclosure.

Reference numerals:

1. an upper housing; 101. a first vent hole; 102. a second vent hole; 103. a square groove; 2. a lower housing; 201. a wire hole; 3. a heat dissipation fan; 4. a Z-shaped block; 5. a connecting plate; 6. a circuit board; 7. a first internally threaded tube; 8. a second internally threaded tube; 9. a connecting shell; 10. an adjusting block; 11. a connecting seat; 12. a limiting block; 13. a first spring; 14. a slider; 15. a second spring; 16. and a lead plate.

Detailed Description

The embodiments of the present application will be described below with reference to the drawings.

In the description of the embodiments of the present application, it should be noted that the terms "connected" and "mounted" are to be interpreted broadly, unless explicitly stated or limited otherwise, and for example, "connected" may or may not be detachably connected; may be directly connected or indirectly connected through an intermediate. Further, "communication" may be direct communication or indirect communication through an intermediary. The term "fixed" means that they are connected to each other and the relative positional relationship after the connection is not changed. The directional terms used in the embodiments of the present application, such as "inner", "outer", "top", "bottom", and the like, are used solely in the orientation with reference to the drawings, and thus, are used for better and clearer illustration and understanding of the embodiments of the present application, rather than to indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be considered limiting of the embodiments of the present application.

In the embodiments of the present application, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature.

In the embodiment of the present application, "and/or" is only one kind of association relationship describing an association object, and indicates that three relationships may exist, for example, a and/or B may indicate: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter related objects are in an "or" relationship.

Reference throughout this specification to "one embodiment" or "some embodiments," or the like, means that a particular feature, structure, or characteristic described in connection with the embodiment is included in one or more embodiments of the present application. Thus, appearances of the phrases "in one embodiment," "in some embodiments," "in other embodiments," or the like, in various places throughout this specification are not necessarily all referring to the same embodiment, but rather "one or more but not all embodiments" unless specifically stated otherwise. The terms "comprising," "including," "having," and variations thereof mean "including, but not limited to," unless expressly specified otherwise.

Example 1

Referring to fig. 1, fig. 3, fig. 5 and fig. 6, a switching power supply module with heat radiation structure, including the shell that last casing 1 and casing 2 constitute down, the equal fixedly connected with Z type piece 4 of both sides inner wall of going up casing 1, the square groove 103 that runs through has all been seted up to the both sides outer wall of going up casing 1, the top inner wall of going up casing 1 is equipped with and is used for radiating heat dissipation mechanism, the bottom inner wall of casing 2 is equipped with circuit board 6 down, the both sides of casing 2 all are equipped with and square groove 103 assorted connecting plate 5 down, one side of two connecting plates 5 all is equipped with and is used for carrying out spacing subassembly to last casing 1, spacing subassembly includes regulating block 10 and connecting shell 9, regulating block 10 slides and runs through in one side of connecting plate 5, one side fixedly connected with connecting seat 11 of regulating block 10, one side inner wall fixedly connected with stopper 12 of connecting seat 11, connecting shell 9 fixed connection is in one side of connecting plate 5, two first springs 13 of fixedly connected with between connecting seat 11 and the connecting shell 9.

Referring to fig. 2, the heat dissipation mechanism includes a heat dissipation fan 3, a plurality of first ventilation holes 101 and a plurality of second ventilation holes 102, the heat dissipation fan 3 is fixedly connected to the top inner wall of the upper housing 1, the plurality of first ventilation holes 101 are all run through the upper surface of the upper housing 1, and the plurality of second ventilation holes 102 are respectively run through the outer walls of the two sides of the upper housing 1.

The technical scheme can achieve the technical effects of improving the heat dissipation efficiency of the circuit board 6 and avoiding dust accumulation on the surface of the circuit board 6.

Example 2

Above-mentioned technical scheme can reach and make things convenient for people to install and dismantle the shell fast, makes things convenient for people to overhaul the technical effect of switch power.

Referring to fig. 5 and 6, a sliding block 14 is slidably connected between the inner walls of the two connecting shells 9, and two second springs 15 are fixedly connected between the adjacent sliding blocks 14 and the connecting shells 9.

Above-mentioned technical scheme can reach when dismantling casing 1, and second spring 15 can promote slider 14 and then pop out casing 1, makes things convenient for people to take off the casing, when installing casing 1, can cooperate stopper 12 to carry out spacing technological effect to casing 1.

Referring to fig. 4, a through-hole 201 is formed in an inner wall of one side of the lower case 2, and a lead plate 16 is fixedly connected to an inner wall of the bottom of the lower case 2.

Above-mentioned technical scheme can reach and conclude the arrangement to the wire, avoids the wire too mixed and disorderly technological effect.

Referring to fig. 3 and 4, a plurality of first internally threaded tubes 7 are fixedly connected to the bottom of the lower case 2, wherein a part of the first internally threaded tubes 7 are fixed to the circuit board 6 by bolts.

The technical scheme can achieve the technical effects of installing circuit boards 6 with different specifications and improving the application range of the shell.

Referring to fig. 3 and 4, a plurality of second internally threaded tubes 8 are fixedly inserted through the inner wall of the bottom of the lower case 2.

Above-mentioned technical scheme can reach and make things convenient for people to carry out the technological effect of installing to casing 1 down.

However, as is well known to those skilled in the art, the working principle and wiring method of the circuit board 6 are common and are conventional means or common general knowledge, and are not described herein, and those skilled in the art can make any choice according to their needs or convenience.

The working principle and the using process of the technical scheme are as follows: when people need to overhaul the switching power supply, firstly, the adjusting block 10 is pushed to move, the adjusting block 10 pushes the connecting seat 11 to move towards the direction of the connecting shell 9, the connecting seat 11 drives the limiting block 12 to move, when the limiting block 12 and the Z-shaped block 4 are staggered, the second spring 15 pushes the sliding block 14 to move at the moment, the sliding block 14 pushes the Z-shaped block 4 to move, the Z-shaped block 4 drives the upper shell 1 to pop out, then the upper shell 1 is taken down, the circuit board 6 can be overhauled, after the overhaul is finished, the upper shell 1 and the lower shell 2 are aligned, then the upper shell 1 is moved downwards, the upper shell 1 drives the Z-shaped block 4 to enter the connecting seat 11, meanwhile, the Z-shaped block 4 pushes the limiting block 12 to drive the connecting seat 11 to move towards the direction of the connecting shell 9, when the Z-shaped block 4 and the limiting block 12 are staggered, the first spring 13 pushes the limiting block 12 to finish limiting the Z-shaped block 4, then the upper shell 1 is fixed, when the switching power supply needs to dissipate heat, the heat of the heat dissipation fan 3 is opened, the surface of the heat dissipation fan 6 is directly blown away, and the surface of the circuit board 6 is provided.

The above description is only an embodiment of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily think of the changes or substitutions within the technical scope of the present application, and the changes or substitutions should be covered within the scope of the present application; the embodiments and features of the embodiments of the present application may be combined with each other without conflict. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. A switching power supply assembly with a heat dissipation structure is characterized by comprising a shell consisting of an upper shell (1) and a lower shell (2), wherein Z-shaped blocks (4) are fixedly connected to the inner walls of the two sides of the upper shell (1), square grooves (103) penetrating through the outer walls of the two sides of the upper shell (1) are formed in the outer walls of the two sides of the upper shell, and a heat dissipation mechanism for dissipating heat is arranged on the inner wall of the top of the upper shell (1);

a circuit board (6) is arranged on the inner wall of the bottom of the lower shell (2), connecting plates (5) matched with the square grooves (103) are arranged on two sides of the lower shell (2), and limiting assemblies for limiting the upper shell (1) are arranged on one sides of the two connecting plates (5);

spacing subassembly includes regulating block (10) and connects shell (9), regulating block (10) slide and run through in one side of connecting plate (5), one side fixedly connected with connecting seat (11) of regulating block (10), one side inner wall fixedly connected with stopper (12) of connecting seat (11), connect shell (9) fixed connection in one side of connecting plate (5), two first springs (13) of fixedly connected with between connecting seat (11) and the connection shell (9).

2. The switching power supply assembly with the heat dissipation structure according to claim 1, wherein the heat dissipation mechanism includes a heat dissipation fan (3), a plurality of first ventilation holes (101) and a plurality of second ventilation holes (102), the heat dissipation fan (3) is fixedly connected to an inner wall of a top portion of the upper housing (1), the plurality of first ventilation holes (101) are all formed through an upper surface of the upper housing (1), and the plurality of second ventilation holes (102) are respectively formed through outer walls of two sides of the upper housing (1).

3. Switching power supply module with heat dissipation structure according to claim 1, characterized in that a sliding block (14) is slidably connected between the inner walls of the two connection housings (9), and two second springs (15) are fixedly connected between the adjacent sliding block (14) and the connection housing (9).

4. Switching power supply module with heat dissipation structure according to any one of claims 1-3, characterized in that the lower case (2) has a through hole (201) on one side of its inner wall, and a lead plate (16) is fixed on the bottom inner wall of the lower case (2).

5. Switching power supply module with heat dissipation structure according to claim 1, characterized in that a plurality of first internally threaded tubes (7) are fixedly connected to the bottom of the lower case (2), wherein a part of the first internally threaded tubes (7) are fixed to the circuit board (6) by bolts.

6. Switching power supply module with heat dissipation structure according to claim 1, characterized in that a plurality of second internally threaded tubes (8) are fixed through the bottom inner wall of the lower case (2).