CN218041981U - Pressing assembly and pressing device - Google Patents
Pressing assembly and pressing device Download PDFInfo
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- CN218041981U CN218041981U CN202221526175.2U CN202221526175U CN218041981U CN 218041981 U CN218041981 U CN 218041981U CN 202221526175 U CN202221526175 U CN 202221526175U CN 218041981 U CN218041981 U CN 218041981U
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- substrate
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Abstract
A press-fit assembly comprises a first jig and a second jig, wherein the first jig comprises a first substrate and a first blocking part, and the first blocking part is arranged on one side of the first substrate to form a first accommodating groove in an enclosing mode. The second jig comprises a second substrate and a second blocking portion, and the second blocking portion is arranged on one side of the second substrate to form a second accommodating groove in a surrounding mode. The pressing assembly comprises a pressing state, and the pressing state comprises: one side of the first blocking part, which is far away from the first substrate, is closely connected with one side of the second blocking part, which is far away from the second substrate, and the first accommodating groove is communicated with the second accommodating groove to form an accommodating space. The application provides a pressfitting subassembly can block that the glue solution is excessive. In addition, this application still provides a compression fittings.
Description
Technical Field
The application relates to a circuit board processingequipment especially relates to a lamination assembly and compression fittings.
Background
The multi-layer circuit board needs to be heated, pressurized and vacuum-bonded with the prepreg in the laminating process section so as to adhere the multi-layer circuit board. The resin in the prepreg is melted into a flowing state in the heating and pressurizing process, flows to four sides under the action of pressure and overflows to the outside of an effective area, sometimes even flows to the back of a mirror steel plate, a copper foil and the like of a precision die, and after bonding and curing, a plurality of factors which are not beneficial to efficient production, such as failure of a board detaching process, difficulty in cleaning of the precision die and the like are easily caused, and meanwhile, the problems of uneven thickness, thinned edge and the like of a multilayer circuit board are caused.
SUMMERY OF THE UTILITY MODEL
In view of the above, it is desirable to provide a pressing fixture to solve the above problems.
In addition, it is necessary to provide a laminating device.
A press-fit assembly comprises a first jig and a second jig, wherein the first jig comprises a first substrate and a first blocking part, and the first blocking part is arranged on one side of the first substrate to form a first accommodating groove in an enclosing mode. The second jig comprises a second substrate and a second blocking portion, and the second blocking portion is arranged on one side of the second substrate to form a second accommodating groove in a surrounding mode. The pressing assembly comprises a pressing state, and the pressing state comprises: one side of the first blocking part, which is far away from the first substrate, is closely connected with one side of the second blocking part, which is far away from the second substrate, and the first accommodating groove is communicated with the second accommodating groove to form an accommodating space.
Further, the first blocking portion includes a first inner surface, a first outer surface and a first connecting surface, the first connecting surface is connected between the first inner surface and the first outer surface, the first inner surface faces the first receiving groove, a portion of the first connecting surface is recessed to form a first slot, and the first slot penetrates through the first inner surface and the first outer surface. The second blocking portion comprises a second inner surface, a second outer surface and a second connecting surface, the second connecting surface is connected between the second inner surface and the second outer surface, the second inner surface faces the second accommodating groove, a part of the second connecting surface is recessed inwards to form a second groove, and the second groove penetrates through the second inner surface and the second outer surface. The press-fit state further includes: the first open groove is communicated with the second open groove to form a through hole, and the through hole is communicated with the accommodating space and the external environment.
Further, the through hole is square or round.
Further, the distance between the side of the first blocking portion departing from the first accommodating groove and the edge of the first substrate is greater than 200 micrometers, and the distance between the side of the second blocking portion departing from the second accommodating groove and the edge of the second substrate is greater than 200 micrometers.
Furthermore, the first jig further comprises a third blocking portion, the third blocking portion is arranged on one side, away from the first blocking portion, of the first substrate to form a third accommodating groove in a surrounding mode, the third blocking portion corresponds to the first blocking portion, and the third accommodating groove corresponds to the first accommodating groove. The second jig further comprises a fourth blocking portion, the fourth blocking portion is arranged on one side, away from the second blocking portion, of the second substrate to form a fourth accommodating groove in a surrounding mode, the fourth blocking portion corresponds to the second blocking portion, and the fourth accommodating groove corresponds to the second accommodating groove.
Furthermore, the first substrate and the second substrate are made of steel, manganese alloy and nickel alloy, and the first blocking part and the second blocking part are made of rubber.
Furthermore, the press-fit assembly further comprises a first bonding layer and a second bonding layer, the first bonding layer is arranged on one side, away from the first substrate, of the first blocking portion, and the second bonding layer is arranged on one side, away from the second substrate, of the second blocking portion.
A pressing device comprises a base, a pressing driving piece arranged on the base and the pressing assembly, wherein the pressing driving piece drives a first jig and/or a second jig to move in opposite directions or in opposite directions.
Further, still include vacuum generator, vacuum generator communicates the accommodation space.
Further, still include the heater, the heater is located the base, the heater is used for heating first tool and/or the second tool.
The application provides a compression fittings sets up second fender portion through setting up first fender portion respectively on first base plate on the second base plate for the dynamic adhesive linkage that flows can by first fender portion and second fender portion separate the fender, can not flow and spill over to the four sides.
Drawings
Fig. 1 is a schematic view of a laminating device according to an embodiment of the present application.
Fig. 2 is a schematic view of a first fixture of the pressing device shown in fig. 1.
Fig. 3 is another angle schematic view of the first fixture shown in fig. 1.
Fig. 4 is a schematic cross-sectional view illustrating the pressing assembly shown in fig. 1 pressing a circuit board to be pressed.
Fig. 5 is a schematic view of a first fixture according to another embodiment of the present application.
Fig. 6 is a schematic cross-sectional view illustrating a circuit board to be bonded being bonded by a bonding assembly according to another embodiment of the present application.
Description of the main elements
Press-fit device 100
Press-fit driving member 20
Press-fit assembly 30
First jig 31, 31'
First blocking part 312
First inner surface 312a
First outer surface 312b
The first accommodation groove 313
Third blocking part 314
Second blocking part 322
Second inner surface 322a
Second outer surface 322b
The second receiving groove 323
Fourth stopping part 324
The fourth receiving groove 325
Through hole 33
First adhesive layer 34
Pressing state A
Open state B
Receiving space R
Distance D1
The following detailed description will further illustrate the present application in conjunction with the above-described figures.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only some embodiments of the present application, and not all embodiments.
Referring to fig. 1, an embodiment of the present application provides a pressing apparatus 100, where the pressing apparatus 100 includes a base 10, and a pressing driving member 20 and a pressing assembly 30 disposed on the base 10. The pressing driving member 20 drives the pressing assembly 30 to clamp the circuit board 200 to be pressed, the circuit board 200 to be pressed comprises a circuit layer (not marked), a substrate layer (not marked) and a bonding layer (not marked) arranged between the substrate layer and the circuit layer, the bonding layer is pressed to be in a flowing state, the pressing assembly 30 stops pressing, and after the flowing bonding layer is solidified, the substrate layer and the circuit layer are bonded to obtain the pressed circuit board (not marked). Specifically, the bonding layer includes a prepreg.
Referring to fig. 1 and fig. 2, the pressing assembly 30 includes a first jig 31 and a second jig 32 disposed corresponding to the first jig 31. The first fixture 31 includes a first substrate 311 and a first blocking portion 312. The first blocking portion 312 is disposed at one side of the first substrate 311 to form a first receiving groove 313 (see fig. 4). Referring to fig. 4, the second fixture 32 includes a second substrate 321 and a second blocking portion 322, and the second blocking portion 322 is disposed on a side of the second substrate 321 facing the first substrate 311 to form a second receiving groove 323. The first substrate 311 is disposed corresponding to the second substrate 321, the first blocking portion 312 is disposed corresponding to the second blocking portion 322, and the first receiving groove 313 is disposed corresponding to the second receiving groove 323. The pressing assembly 30 includes a pressing state a and an open state B (see fig. 1). The press-fit state A comprises: one side of the first blocking portion 312 departing from the first substrate 311 is closely attached to one side of the second blocking portion 322 departing from the second substrate 321, the first receiving groove 313 communicates with the second receiving groove 323 to form a receiving space R (see fig. 4), and the circuit board 200 to be pressed is disposed in the receiving space R. The open state B includes: the first blocking portion 312 is separated from the second blocking portion 322, so that the circuit board 200 to be bonded is taken and placed in the first receiving groove 313 or the second receiving groove 323.
The pressing assembly 30 provided by the present application sets the first blocking portion 312 on the first substrate 311 and the second blocking portion 322 on the second substrate 321 respectively, so that the dynamic adhesive layer can be blocked by the first blocking portion 312 and the second blocking portion 322, and cannot flow to four sides and overflow.
Referring to fig. 1 again, in the present embodiment, the laminating device 100 further includes a heater 50, the heater 50 is disposed on the base 10, and the heater 50 is used for heating the laminating assembly 30. The compression assembly 30 conducts heat to the adhesive layer, thereby accelerating the adhesive layer to a flow state.
Referring to fig. 1, fig. 2 and fig. 4, in the present embodiment, the laminating device 100 further includes a vacuum generator 40, and the vacuum generator 40 is used for generating vacuum. The first blocking portion 312 includes a first inner surface 312a, a first outer surface 312b opposite to the first inner surface 312a, and a first connecting surface 312c. The first connecting surface 312c is connected between the first inner surface 312a and the first outer surface 312b. The first inner surface 312a faces the first receiving groove 313. A portion of the first connecting surface 312c is recessed to form a first slot 312d, and the first slot 312d extends through the first inner surface 312a and the first outer surface 312b.
The second blocking portion 322 includes a second inner surface 322a, a second outer surface 322b opposite to the second inner surface 322a, and a second connection surface 322c. The second connecting surface 322c is connected between the second inner surface 322a and the second outer surface 322b. The second inner surface 322a faces the second receiving groove 323. A second slot 322d is formed by partially recessing the second connecting surface 322c, and the second slot 322d penetrates the second connecting surface 322c and the second outer surface 322b. When the pressing assembly 30 is in the pressing state a, the first opening groove 312d communicates with the second opening groove 322d to form a through hole 33. One end of the through hole 33 is communicated with the accommodating space R, and the other end is communicated with the vacuum generator 40. When the press-fit assembly 30 presses the circuit board 200 to be pressed, the vacuum generator 40 starts to pump air, so that the flowing adhesive layer fills and fills the gap between the circuit layer and the substrate layer, and bubbles between the circuit layer and the substrate layer are reduced. It is understood that in other embodiments of the present application, if the adhesion between the bonding layer and the circuit layer or the substrate layer is good and no air bubbles are generated, the vacuum generator 40 and the through hole 33 may be omitted.
Referring to fig. 2, in the present embodiment, the through hole 33 is substantially square, that is, the first slot 312d and the second slot 322d are also substantially square, and the shape of the through hole 33 matches with the joint 41 of the vacuum generator 40. In other embodiments of the present application, the through hole 33 may also be circular, i.e., the first slot 312d and the second slot 322d are semicircular.
Referring to fig. 3, in the present embodiment, a distance D1 between the first outer surface 312b (i.e., a side of the first blocking portion 312 facing away from the first receiving groove 313) and an edge of the first substrate 311 is greater than 200 micrometers, so that there is enough space for installing the vacuum generator 40. A distance (not shown) between the second outer surface 322b (i.e., a side of the second blocking portion 322 facing away from the second receiving groove 323) and an edge of the second substrate 321 is greater than 200 μm, so that there is enough space for installing the vacuum generator 40.
Referring to fig. 5 and 6, in another embodiment of the present application, the first fixture 31' further includes a third blocking portion 314. The third blocking portion 314 is disposed on a side of the first substrate 311 away from the first blocking portion 312 to form a third receiving groove 315. The third blocking portion 314 is disposed corresponding to the first blocking portion 312, the third receiving groove 315 is disposed corresponding to the first receiving groove 313, and the third blocking portion 314 is disposed so that both sides of the first substrate 311 can receive the circuit board 200 to be bonded. Similarly, the second fixture 32' further includes a fourth blocking portion 324. The fourth blocking portion 324 is disposed on a side of the second substrate 321 away from the second blocking portion 322 to form a fourth receiving groove 325. The fourth blocking portion 324 is disposed corresponding to the second blocking portion 322, and the fourth receiving groove 325 is disposed corresponding to the second receiving groove 323, so that both sides of the second substrate 321 can receive the circuit board 200 to be pressed, and a plurality of the first jigs 31 and a plurality of the second jigs 32 can be stacked, thereby completing the pressing operation of the circuit boards 200 to be pressed at one time.
Referring to fig. 3 and 5, in the present embodiment, the first substrate 311 and the second substrate 321 are made of steel, manganese alloy, or nickel alloy. The first blocking portion 312, the second blocking portion 322, the third blocking portion 314, and the fourth blocking portion 324 are made of rubber. That is, the first substrate 311 and the second substrate 321 are made of rigid materials, and the first blocking portion 312, the second blocking portion 322, the third blocking portion 314, and the fourth blocking portion 324 are made of flexible materials, so that in the pressing process of the pressing assembly 30, the first blocking portion 312, the second blocking portion 322, the third blocking portion 314, and the fourth blocking portion 324 can deform, which is beneficial to increasing the pressing stroke of the first jig 31 and the second jig 32, and the pressing assembly 30 is suitable for pressing multi-layer boards with different thicknesses.
Referring to fig. 3, in the present embodiment, the pressing assembly 30 further includes a first adhesive layer 34 and a second adhesive layer (not shown). The first adhesive layer 34 is disposed on a side of the first blocking portion 312 away from the first substrate 311. The second adhesive layer is disposed on a side of the second blocking portion 322 away from the second substrate 321. The first adhesive layer 34 and the second adhesive layer are release films, and the first adhesive layer 34 and the second adhesive layer are used for increasing the adhesion between the first blocking part 312 and the second blocking part 322.
In addition, other changes may be made by those skilled in the art within the spirit of the application, and it is understood that such changes are encompassed within the scope of the invention as claimed.
Claims (10)
1. A compression assembly, comprising:
the first jig comprises a first substrate and a first blocking part, and the first blocking part is arranged on one side of the first substrate to form a first accommodating groove in an enclosing manner;
the second jig comprises a second substrate and a second blocking part, and the second blocking part is arranged on one side, facing the first blocking part, of the second substrate to form a second accommodating groove in a surrounding mode;
one side of the first blocking part, which is far away from the first substrate, is closely connected with one side of the second blocking part, which is far away from the second substrate, so that the first accommodating groove is communicated with the second accommodating groove to form an accommodating space.
2. The pressing assembly of claim 1, wherein the first stop includes a first inner surface, a first outer surface, and a first connecting surface connected between the first inner surface and the first outer surface, the first inner surface faces the first receiving groove, a portion of the first connecting surface is recessed to form a first slot, and the first slot extends through the first inner surface and the first outer surface;
the second blocking portion comprises a second inner surface, a second outer surface and a second connecting surface, the second connecting surface is connected between the second inner surface and the second outer surface, the second inner surface faces the second accommodating groove, a part of the second connecting surface is recessed inwards to form a second groove, and the second groove penetrates through the second inner surface and the second outer surface;
the first open groove is used for communicating the second open groove to form a through hole, and the through hole is communicated with the accommodating space and the external environment.
3. The compression assembly of claim 2, wherein the through-hole is square or circular.
4. The pressing assembly as claimed in claim 1, wherein a distance between a side of the first blocking portion facing away from the first receiving groove and an edge of the first substrate is greater than 200 μm, and a distance between a side of the second blocking portion facing away from the second receiving groove and an edge of the second substrate is greater than 200 μm.
5. The pressing assembly according to claim 1, wherein the first fixture further includes a third blocking portion disposed on a side of the first substrate away from the first blocking portion to define a third receiving groove, the third blocking portion is disposed corresponding to the first blocking portion, and the third receiving groove is disposed corresponding to the first receiving groove;
the second jig further comprises a fourth blocking portion, the fourth blocking portion is arranged on one side, away from the second blocking portion, of the second substrate to form a fourth accommodating groove in a surrounding mode, the fourth blocking portion corresponds to the second blocking portion, and the fourth accommodating groove corresponds to the second accommodating groove.
6. The pressing assembly of claim 1, wherein the first and second substrates are made of steel, manganese alloy or nickel alloy, and the first and second stops are made of rubber.
7. The pressing assembly of claim 1, further comprising a first adhesive layer disposed on a side of the first blocking portion facing away from the first substrate, and a second adhesive layer disposed on a side of the second blocking portion facing away from the second substrate.
8. A pressing device, comprising a base, a pressing driving member disposed on the base, and the pressing assembly of any one of claims 1 to 7, wherein the pressing driving member drives the first jig and/or the second jig to move toward or away from each other.
9. The laminating device of claim 8, further comprising a vacuum generator, wherein the vacuum generator is in communication with the receiving space.
10. The laminating device according to claim 8, further comprising a heater disposed on the base, wherein the heater is used for heating the first jig and/or the second jig.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221526175.2U CN218041981U (en) | 2022-06-17 | 2022-06-17 | Pressing assembly and pressing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221526175.2U CN218041981U (en) | 2022-06-17 | 2022-06-17 | Pressing assembly and pressing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218041981U true CN218041981U (en) | 2022-12-13 |
Family
ID=84376967
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221526175.2U Active CN218041981U (en) | 2022-06-17 | 2022-06-17 | Pressing assembly and pressing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218041981U (en) |
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2022
- 2022-06-17 CN CN202221526175.2U patent/CN218041981U/en active Active
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