CN218041384U - Array radio frequency system - Google Patents

Abstract

The utility model discloses an array radio frequency device, it includes an extensible mother circuit support plate and a plurality of submodule pieces that realize with radio frequency encapsulation radiation structure. The sub-modules are embedded into the mother circuit carrier board through a plug interface to form a replaceable and expandable structure of the mother and the son. The mother circuit carrier board receives an input intermediate frequency signal and performs frequency boosting on the input intermediate frequency signal so as to generate a plurality of first high-frequency signals. The rf package radiating structure sub-modules are embedded in the mother circuit carrier in a horizontal layout, and are arranged in a one-dimensional or two-dimensional array, and are electrically connected to the mother circuit carrier (including rf signals, power supplies, control signals, etc.). The radio frequency packaging radiation structure receives the first high-frequency signals respectively and accordingly emits a plurality of first radio frequency signals, the radio frequency packaging radiation structure receives a plurality of second radio frequency signals so as to generate a plurality of second high-frequency signals, and the mother circuit carrier plate reduces the frequency of the second high-frequency signals so as to generate an output intermediate frequency signal.

Description

Array radio frequency system

Technical Field

The present invention relates to a radio frequency system, and more particularly to a decomposable hierarchical array radio frequency system.

Background

The industrial applications of low/medium/high orbit satellite ground terminals, 5G frequency range (FR 2) base stations, radar and long-distance communication, point-to-point microwave links and communication system forwarding networks, etc., have the characteristics of long distance and different azimuth coverage, and construct active array antennas to realize the dual functions of high gain and intelligent beam scanning operation. Depending on the diversity of the application scenario planning, the required antenna characteristics must be quickly constructed, making it difficult to customize products to suit each scenario in a single scenario.

The prior art uses passive components including capacitors, resistors and antennas, beamforming chips including power amplifiers, phase shifters and low noise amplifiers, up-conversion chips, down-conversion chips, power chips and microprocessors to integrate a single system. For large array antennas, the prior art reduces the flexibility of the system and increases the complexity and uncertainty of the problem, because it cannot be mass-produced, so the maintenance cost is quite high, the risk of system failure due to single element failure may occur, and the system scalability is low, and it cannot be flexibly constructed to meet the different antenna gain requirements of each system.

Therefore, the present invention is directed to a modular, array-type radio frequency system for solving the above-mentioned problems.

SUMMERY OF THE UTILITY MODEL

The utility model provides a modularization, array radio frequency system, it is the simplified system complexity, reduces manufacturing cost and maintenance cost, increases the stability of antenna characteristic and the applied expansion degree of product, and it is connected and produces the air cavity, increases the air current heat dissipation, and reducible heat energy influences the system to compromise machinery and electronic characteristic.

In an embodiment of the present invention, an array rf system includes a mother circuit carrier and a plurality of sub-modules implemented by rf package radiation structures. The mother circuit carrier board is used for receiving an input intermediate frequency signal and performing frequency boosting on the input intermediate frequency signal so as to generate a plurality of first high-frequency signals. All the sub-modules realized by the radio frequency packaging radiation structure are embedded on the mother circuit carrier plate in a horizontal layout and are arranged into a one-dimensional or two-dimensional periodic array, and the sub-modules are electrically connected with the mother circuit carrier plate (comprising radio frequency signals, power supplies and control signals), wherein the connecting ports of the mother circuit carrier plate are arranged periodically, and the connecting ports of the sub-modules are positioned at or close to the phase center points of the radio frequency packaging radiation structure radiation electromagnetic fields of the sub-modules. All the radio frequency packaging radiation structures are divided into a plurality of radio frequency radiation module groups, and all the radio frequency radiation module groups of all the radio frequency packaging radiation structures are used for respectively receiving all the first high-frequency signals and transmitting a plurality of first radio frequency signals according to the first high-frequency signals. All the radio frequency radiation module groups of all the radio frequency packaging radiation structures are used for receiving a plurality of second radio frequency signals so as to respectively generate a plurality of second high frequency signals corresponding to all the radio frequency radiation module groups, and the mother circuit carrier plate is used for reducing the frequency of all the second high frequency signals so as to generate an output intermediate frequency signal.

In an embodiment of the present invention, the mother circuit carrier includes a dielectric plate, an intermediate frequency input port, a first power divider, a plurality of upconverters and a plurality of second power dividers. The dielectric plate is provided with a connecting port for embedding all the sub-modules realized by the radio frequency packaging radiation structure, and the intermediate frequency input port is arranged on the dielectric plate. The first power divider is disposed on the dielectric plate and electrically connected to the intermediate frequency input port. The first power divider is used for receiving an input intermediate frequency signal through the intermediate frequency input port and distributing the power of the input intermediate frequency signal according to the number of a plurality of output ends of the first power divider so as to generate a plurality of first intermediate frequency signals at all output ends of the first power divider, the output ends are input ports connected with radio frequency packaging radiation structure submodules, and the output ports are arranged in a one-dimensional or two-dimensional periodic manner. All the frequency boosters are arranged on the dielectric plate and are respectively and electrically connected with all the output ends of the first power divider. All the frequency boosters are used for receiving all the first intermediate frequency signals and boosting the first intermediate frequency signals to generate a plurality of boosted frequency signals. All the second power dividers are arranged on the dielectric plate and are respectively and electrically connected with all the frequency boosters and all the radio frequency radiation module groups of all the radio frequency packaging radiation structures. Each second power divider is used for receiving the corresponding frequency-increasing signal and distributing the corresponding frequency-increasing signal according to the number of the plurality of output ends of the second power divider so as to generate a first high-frequency signal.

In an embodiment of the present invention, the mother circuit carrier further includes a plurality of third power dividers, a plurality of down converters, a fourth power divider, and an intermediate frequency output port. All the third power dividers are arranged on the dielectric plate and are respectively and electrically connected with all the radio frequency radiation module groups of all the radio frequency packaging radiation structures. Each third power divider is used for receiving the corresponding second high-frequency signal and summing the power of the corresponding second high-frequency signal to generate a summed high-frequency signal. All the frequency demultipliers are arranged on the dielectric plate and are respectively and electrically connected with all the third power distributors. All frequency demultipliers are used for receiving the corresponding summed high-frequency signal and carrying out frequency demultiplier to generate a plurality of second intermediate-frequency signals. The fourth power divider is disposed on the dielectric plate and electrically connected to all of the frequency downconverters. The fourth power divider is used for receiving all the second intermediate frequency signals and summing the power of all the second intermediate frequency signals to generate an output intermediate frequency signal. The intermediate frequency output port is disposed on the dielectric plate and electrically connected to the fourth power divider, wherein the intermediate frequency output port is used for outputting the output intermediate frequency signal.

In an embodiment of the present invention, the mother circuit carrier further includes a plurality of first signal connection ports and a plurality of second signal connection ports. All the first signal connection ports are arranged on the dielectric plate, all the first signal connection ports are divided into a plurality of first groups, all the first groups are respectively and electrically connected with all the second power distributors and all the radio frequency radiation module groups, and each first group is electrically connected between the corresponding second power distributor and the corresponding radio frequency radiation module group. All the second signal connection ports are arranged on the dielectric plate, all the second signal connection ports are divided into a plurality of second groups, all the second groups are respectively and electrically connected with all the third power distributors and all the radio frequency radiation module groups, and each second group is electrically connected between the corresponding third power distributor and the corresponding radio frequency radiation module group.

In an embodiment of the present invention, the first signal port and the second signal port are subminiature Push-on Micro (SMPM) ports.

In an embodiment of the present invention, the mother circuit carrier further includes a plurality of first power supply ports and a plurality of second power supply ports disposed on the dielectric plate.

In an embodiment of the present invention, the first power supply port and the second power supply port are Serial Peripheral Interface (SPI) or signal control lines.

In an embodiment of the present invention, each rf package radiating structure includes a multilayer conductive wiring substrate, a plurality of rf radiating structures, a plurality of high frequency rf transmitting ic chips, a plurality of low frequency rf receiving ic chips, a transmitting signal port and a receiving signal port. The multilayer conductive wiring substrate comprises a multilayer dielectric layer, a conductive trace, a first conductive through hole and a second conductive through hole, wherein the conductive trace is electrically connected with the first conductive through hole and the second conductive through hole. All the radio frequency radiation structures are arranged at the bottom of the multilayer conductive wiring substrate and embedded in the multilayer conductive wiring substrate. All the transmitting radio frequency integrated circuit chips and all the receiving radio frequency integrated circuit chips are arranged on the top of the multilayer conductive wiring substrate. All the radio frequency emitting integrated circuit chips are electrically connected with the first conductive through holes through the first conductive structures so as to be respectively and electrically connected with all the radio frequency radiation structures. All the receiving radio frequency integrated circuit chips are electrically connected with the second conductive through holes through the second conductive structures so as to be respectively and electrically connected with all the radio frequency radiation structures. The transmitting signal connection port and the receiving signal connection port are arranged on the top of the multilayer conductive wiring substrate and are electrically connected with the mother circuit carrier plate. The transmission signal connection port is electrically connected with all the high-frequency transmission radio frequency integrated circuit chips through the conductive traces and the first conductive structures. The receiving signal connecting port is electrically connected with all the low-frequency receiving radio frequency integrated circuit chips through the conductive traces and the second conductive structure. The multilayer conductive wiring substrate and all the transmitting radio frequency integrated circuit chips are used for receiving the first transmitting signal and transmitting the first radio frequency signal through all the radio frequency radiation structures. The multilayer conductive wiring substrate and all the receiving radio frequency integrated circuit chips are used for receiving second radio frequency signals through all the radio frequency radiation structures and generating second high-frequency signals accordingly.

In an embodiment of the present invention, each rf package radiating structure further includes a first power port and a second power port. The first power supply connection port and the second power supply connection port are arranged at the top of the multilayer conductive wiring substrate and are electrically connected with the mother circuit carrier plate, the first power supply connection port is electrically connected with all high-frequency transmitting radio frequency integrated circuit chips through the first conductive through hole and the first conductive structure, and the second power supply connection port is electrically connected with all low-frequency receiving radio frequency integrated circuit chips through the second conductive through hole and the second conductive structure.

In an embodiment of the present invention, each rf radiating structure includes a first antenna layer and a second antenna layer. The first antenna layer is arranged at the bottom of the multilayer conductive wiring substrate, and the second antenna layer is embedded between the two dielectric layers closest to the bottom of the multilayer conductive wiring substrate and is electrically connected with the first conductive through hole and the second conductive through hole.

In an embodiment of the present invention, the first antenna layer includes four first transmitting antenna blocks and four first receiving antenna blocks, and the second antenna layer includes four second transmitting antenna blocks and four second receiving antenna blocks. All the first transmitting antenna blocks are respectively positioned under all the second transmitting antenna blocks, and all the first receiving antenna blocks are respectively positioned under all the second receiving antenna blocks. All the second transmitting antenna blocks are electrically connected with the corresponding first conductive structures and the high-frequency transmitting radio frequency integrated circuit chip through the first conductive through holes. All the second receiving antenna blocks are electrically connected with the corresponding second conductive structures and the low-frequency receiving radio frequency integrated circuit chip through the second conductive through holes. All the first transmitting antenna blocks and all the second transmitting antenna blocks are used for transmitting first radio frequency signals, and all the first receiving antenna blocks and all the second receiving antenna blocks are used for receiving second radio frequency signals.

In an embodiment of the present invention, all the first transmitting antenna blocks of the rf radiating structure are arranged in a first square matrix, all the first receiving antenna blocks of the rf radiating structure are arranged in a second square matrix, the rows of the first square matrix and the rows of the second square matrix are alternately arranged, and the columns of the first square matrix and the columns of the second square matrix are alternately arranged.

Based on the above, the array rf system embeds a plurality of rf package radiating structures on a mother circuit carrier in a horizontal layout, so as to simplify the system complexity and reduce the manufacturing cost, and increase the stability of the antenna characteristics and the application expansion of the product, as in the case of a common chassis used in a mainstream automobile. The array radio frequency system has a reconfigurable architecture to generate different radio frequency powers corresponding to different application situations. When the array radio frequency system has abnormal problems, part of the radio frequency packaging radiation structure can be replaced to quickly detect the fault problem and avoid the damage of the whole radio frequency system failure caused by the failure of one module so as to reduce the maintenance cost. The radio frequency packaging radiation structure is a module formed by radio frequency and an antenna, and the main circuit carrier plate mainly has the system functions of signal transmission, power supply, radio frequency signal lifting and the like. Therefore, the design of the rf package radiating structure emphasizes the co-constructed rf and antenna module with high modularity, mass production convenience, and maintenance replaceability. The mother circuit carrier plate emphasizes the expandability of the system, including the size of the array antenna, the expansion of the operating voltage, the serial-parallel connection of signal transmission and the realization of a heat dissipation mechanism. The array radio frequency system uses a universal interface to improve the sharing of the system, and an air channel is formed on the interface integrated by the radio frequency packaging radiation structure and the mother circuit carrier plate to conduct heat and dissipate heat, so that the system influence of the heat energy is reduced, and the mechanical and electronic characteristics are considered.

Drawings

Fig. 1 is a cross-sectional view of a portion of an rf package radiating structure according to an embodiment of the present invention.

Fig. 2 is a top view of an rf package radiating structure according to an embodiment of the present invention.

Fig. 3 is a bottom view of the rf package radiating structure according to an embodiment of the present invention.

Fig. 4 is a top view of a mother circuit carrier according to an embodiment of the present invention.

Fig. 5 is a circuit block diagram of an rf package radiating structure according to an embodiment of the present invention.

Fig. 6 is a circuit block diagram of an rf package radiating structure according to an embodiment of the present invention.

Fig. 7 is a circuit block diagram of a mother circuit carrier according to an embodiment of the present invention.

Fig. 8 is a circuit block diagram of a mother circuit carrier according to an embodiment of the present invention.

The reference numbers illustrate:

1 is radio frequency packaging radiation structure

10 is a multilayer conductive wiring substrate

100 is a dielectric layer

101 are conductive traces

102 is a first conductive via

103 is a second conductive via

104 is a power divider

11 is a radio frequency radiating structure

110 is a first antenna layer

1100 is a first transmit antenna block

1101 is the first receiving antenna block

111 is the second antenna layer

1110 is a second transmit antenna block

1111 is a second receiving antenna block

12 is a high frequency transmitting radio frequency integrated circuit chip

13 is a low frequency receiving radio frequency integrated circuit chip

14 is a first conductive structure

15 is a second conductive structure

16 is a transmission signal connection port

17 is a connection port for receiving signals

18 is a first power supply connection port

19 is a second power supply connection port

2 is a mother circuit carrier board

200 is a dielectric plate

201 is an intermediate frequency input port

202 is a first power divider

203 is an upconverter

204 is a second power divider

205 is a third power divider

206 is a frequency demultiplier

207 is a fourth power divider

208 is an intermediate frequency output port

209 is the first signal connection port

210 is a second signal connection port

211 is a first power supply port

212 is a second power supply port

H is a horizontally polarized signal

V is a vertically polarized signal

IM is the input intermediate frequency signal

H1 is the first high frequency signal

R1 is a first radio frequency signal

R2 is a second radio frequency signal

H2 is the second high frequency signal

OM is output intermediate frequency signal

M1 is the first intermediate frequency signal

U is an up-converted signal

TH is the sum of the high-frequency signals

M2 is the second intermediate frequency signal

Detailed Description

The embodiments of the present invention will be further explained with reference to the drawings. Wherever possible, the same reference numbers will be used throughout the drawings and the description to refer to the same or like parts. In the drawings, the shape and thickness may be exaggerated for simplicity and convenience. It is to be understood that elements not specifically shown in the drawings or described in the specification are in a form known to those skilled in the art. Various changes and modifications can be made by one skilled in the art based on the teachings of the present invention.

When an element is referred to as being "on …," it can be broadly said that the element is directly on the other element or that other elements are present in both. In contrast, when an element is referred to as being "directly on" another element, it can be directly on the other element. As used herein, the term "and/or" includes any combination of one or more of the associated listed items.

Reference throughout this specification to "one embodiment" or "an embodiment" means that a particular element, structure, or characteristic described in connection with the embodiment is included in at least one embodiment. Thus, the appearances of the phrase "one embodiment" or "an embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

The present invention is described in detail with reference to the following examples, which are intended to be illustrative only, since various changes and modifications can be made therein by those skilled in the art without departing from the spirit and scope of the invention, and it is intended that the invention be limited only by the appended claims. Throughout the specification and claims, unless the context clearly dictates otherwise, the words "a" and "an" include the word "a" and "the" includes "a" or "at least one" of the stated elements or components. Furthermore, as used in this application, the singular articles "a", "an", and "the" include plural referents unless the context clearly dictates otherwise. Also, as used in this description and in the following claims, the meaning of "in" may include "in" and "on" unless the content clearly dictates otherwise. The term (terms) used throughout the specification and claims has the ordinary meaning as commonly understood in the art, in the context of this application and in the context of particular usage, unless otherwise indicated. Certain words used to describe the invention are discussed below or elsewhere in this specification to provide additional guidance to the practitioner (practioner) in describing the invention. The use of examples anywhere throughout this specification, including any examples of words discussed herein, is intended merely to be illustrative, and certainly not to limit the scope or meaning of the invention or any exemplified words. As such, the present invention is not limited to the various embodiments set forth in this specification.

Furthermore, the terms "electrically coupled" or "electrically connected," as used herein, include any direct and indirect electrical connection. For example, if a first device is electrically coupled to a second device, that connection may be through a direct connection, or through an indirect connection via other devices and connections. In addition, as described with respect to the transmission and provision of electrical signals, those skilled in the art will appreciate that attenuation or other non-ideal changes may be accompanied in the transmission of electrical signals, but the source and the receiving end of the electrical signal transmission or provision should be regarded as substantially the same signal unless otherwise specified. For example, if an electrical signal S is transmitted (or provided) from a terminal a of the electronic circuit to a terminal B of the electronic circuit, wherein a voltage drop may occur across a source/drain of a transistor switch and/or a possible stray capacitance, but the purpose of the design is to achieve certain specific technical effects by unintentionally using attenuation or other non-ideal changes generated during the transmission (or provision), the electrical signal S should be considered to be substantially the same signal at the terminals a and B of the electronic circuit.

Unless specifically stated otherwise, conditional expressions or words, such as "can", "possibly" (result) "," perhaps (light) ", or" may ", are generally intended to convey that embodiments of the invention have, but may also be interpreted as having, features, elements, or steps that may not be required. In other embodiments, these features, elements, or steps may not be required.

It is understood that as used herein, the terms "comprising," "including," "having," "containing," "including," and the like are open-ended, i.e., meaning including but not limited to. Moreover, not all objects, advantages, or features disclosed herein are to be seen as required by the scope of any particular embodiment or claims. Furthermore, the abstract and the patent names are only used for assisting in retrieving the patent document and are not used for limiting the scope of the claims of the present invention.

The following provides a radio frequency package radiation structure, which uses a multi-layer conductive wiring substrate to construct multiple input/output ports, wherein different frequency bands and different polarization directions correspond to different input/output ports, and the different input/output ports are connected to different antenna blocks, respectively, so as to perform independent operation and reduce the dependence on duplexers and circulators. In addition, the transmitting antenna blocks and the receiving antenna blocks are arranged in a staggered mode, and the isolation is improved by physical isolation, so that the generation of cross polarization is reduced. The radio frequency packaging radiation structure can meet the requirements of an upper chain, a lower chain and a 5G Frequency Range (FR) 2 of a low-orbit satellite on double frequency, can construct the radiation requirement of double linear or double circular polarization aiming at various application requirements, and meets the antenna characteristics required by high gain and intelligent scanning when the array antenna is constructed.

Fig. 1 is a structural cross-sectional view of a portion of a radio frequency package radiation structure according to an embodiment of the present invention, fig. 2 is a top view of the radio frequency package radiation structure according to an embodiment of the present invention, and fig. 3 is a bottom view of the radio frequency package radiation structure according to an embodiment of the present invention. Referring to fig. 1, fig. 2 and fig. 3, an embodiment of the radio frequency package radiation structure 1 of the present invention is described below. The radio frequency package radiation structure 1 includes a multilayer conductive wiring substrate 10, a plurality of radio frequency radiation structures 11, a plurality of high frequency transmitting radio frequency integrated circuit chips 12, a plurality of low frequency receiving radio frequency integrated circuit chips 13, a first conductive structure 14 and a second conductive structure 15. The first conductive structure 14 and the second conductive structure 15 can be, but are not limited to, conductive solder balls. The multilayer conductive wiring substrate 10 includes a multilayer dielectric layer 100, a conductive trace 101, a first conductive via 102 and a second conductive via 103, wherein the conductive trace 101 electrically connects the first conductive via 102 and the second conductive via 103. All the radio frequency radiation structures 11 are disposed on the bottom of the multilayer conductive wiring substrate 10 and embedded in the multilayer conductive wiring substrate 10. All the high frequency transmitting rf integrated circuit chips 12 and all the low frequency receiving rf integrated circuit chips 13 are disposed on the top of the multilayer conductive wiring substrate 10, wherein all the high frequency transmitting rf integrated circuit chips 12 are electrically connected to the first conductive vias 102 through the first conductive structures 14 to electrically connect all the rf radiating structures 11, respectively, and all the low frequency receiving rf integrated circuit chips 13 are electrically connected to the second conductive vias 103 through the second conductive structures 15 to electrically connect all the rf radiating structures 11, respectively.

In some embodiments of the present invention, each rf radiating structure 11 may include a first antenna layer 110 and a second antenna layer 111. The first antenna layer 110 is disposed at the bottom of the multi-layer conductive wiring substrate 10, and the second antenna layer 111 is embedded between the two dielectric layers 100 closest to the bottom of the multi-layer conductive wiring substrate 10 and electrically connects the first conductive via 102 and the second conductive via 103.

Specifically, the first antenna layer 110 may include four first transmit antenna blocks 1100 and four first receive antenna blocks 1101, and the second antenna layer 111 may include four second transmit antenna blocks 1110 and four second receive antenna blocks 1111. All of the first transmit antenna blocks 1100, all of the first receive antenna blocks 1101, all of the second transmit antenna blocks 1110, and all of the second receive antenna blocks 1111 may be, but are not limited to, rectangular. All the first transmit antenna blocks 1100 are respectively located right below all the second transmit antenna blocks 1110, and all the first receive antenna blocks 1101 are respectively located right below all the second receive antenna blocks 1111. All the second transmitting antenna blocks 1110 are electrically connected to the corresponding first conductive structures 14 and the high-frequency transmitting rf integrated circuit chip 12 through the first conductive vias 102, and all the second receiving antenna blocks 1111 are electrically connected to the corresponding second conductive structures 15 and the low-frequency receiving rf integrated circuit chip 13 through the second conductive vias 15. For example, the first conductive vias 102 corresponding to one rf ic chip 12 can be divided into four groups, and each group of the first conductive vias 102 further includes two sub-vias for respectively transmitting the high-frequency horizontal polarization signal H and the high-frequency vertical polarization signal V. Each group of the first conductive vias 102 is electrically connected to the same second transmitting antenna block 1110. The second conductive vias 103 corresponding to one low frequency receiving rf ic chip 13 can be divided into four groups, and each group of the second conductive vias 103 includes two sub-vias for transmitting a low frequency horizontal polarization signal H and a low frequency vertical polarization signal V, respectively. Each group of the second conductive vias 103 is electrically connected to the same second receiving antenna block 1111. Each sub-via is considered as an independent input/output port, which can operate independently to reduce the interference of frequency separation and the dependence on the duplexer and circulator.

All the first transmitting antenna blocks 1100 of all the radio frequency radiating structures 11 are arranged into a first square matrix, all the first receiving antenna blocks 1101 of all the radio frequency radiating structures 11 are arranged into a second square matrix, a plurality of rows of the first square matrix and a plurality of rows of the second square matrix are alternately arranged, and a plurality of columns of the first square matrix and a plurality of columns of the second square matrix are alternately arranged. Therefore, the first square matrix and the second square matrix are arranged in a staggered mode, and the isolation degree is improved through physical isolation, so that the generation of cross polarization is reduced.

The top of the multi-layer conductive wiring substrate 10 may be provided with a transmission signal connection port 16 and a reception signal connection port 17. The transmit signal port 16 and the receive signal port 17 may be, but are not limited to, subminiature Push-on Micro (SMPM) ports. The transmission signal connection port 16 is electrically connected to all the rf ic chips 12 through the conductive trace 101 and the first conductive structure 14. The receiving signal connection port 17 is electrically connected to all the low frequency receiving rf ic chips 13 through the conductive traces 101 and the second conductive structure 15. The top of the multi-layer conductive wiring substrate 10 may further have a first power connection port 18 and a second power connection port 19. The first power port 18 and the second power port 19 may be, but not limited to, serial Peripheral Interface (SPI). The first power connection port 18 is electrically connected to all the high frequency transmitting rf ic chips 12 through the first conductive via 102 and the first conductive structure 14, and the second power connection port 19 is electrically connected to all the low frequency receiving rf ic chips 13 through the second conductive via 103 and the second conductive structure 15.

An array rf system is provided, in which a plurality of rf package radiating structures are embedded on a mother circuit carrier in a horizontal layout to simplify the system complexity and reduce the manufacturing cost, and to increase the stability of the antenna characteristics and the product expansion degree, as in the case of a common chassis used in a mainstream automobile. The array radio frequency system has a reconfigurable architecture to generate different radio frequency powers corresponding to different application situations. When the array radio frequency system has abnormal problems, part of the radio frequency packaging radiation structure can be replaced to quickly detect the fault problem and avoid the damage of the whole radio frequency system failure caused by the failure of one module so as to reduce the maintenance cost. The radio frequency packaging radiation structure is a module formed by radio frequency and an antenna, and the main circuit carrier plate mainly has the system functions of signal transmission, power supply, radio frequency signal lifting and the like. Therefore, the design of the rf package radiating structure emphasizes the co-constructed rf and antenna module with high modularity, mass production convenience and maintenance replaceability. The mother circuit carrier plate emphasizes the expandability of the system, including the size of the array antenna, the expansion of the operating voltage, the serial-parallel connection of signal transmission and the realization of a heat dissipation mechanism. The array radio frequency system uses a universal interface to improve the sharing of the system, and an air channel is formed on the interface integrated by the radio frequency packaging radiation structure and the mother circuit carrier plate to conduct heat and dissipate heat, so that the system influence of the heat energy is reduced, and the mechanical and electronic characteristics are considered.

Fig. 4 is a top view of a mother circuit carrier according to an embodiment of the present invention. Referring to fig. 4 and fig. 2, an embodiment of the array rf system is described below. The array radio frequency system comprises a mother circuit carrier 2 and a plurality of radio frequency package radiating structures 1. All the radio frequency package radiation structures 1 are embedded on the mother circuit carrier 2 in a horizontal layout, and are arranged in an array and electrically connected to the mother circuit carrier 2. All the radio frequency package radiation structures 1 are divided into a plurality of radio frequency radiation module groups. Taking fig. 4 as an example, all the rf package radiating structures 1 are arranged in a 4 × 4 array, and each rf radiating module group includes four rf package radiating structures 1 in each row of the array.

Fig. 5 and 6 are circuit block diagrams corresponding to a radio frequency package radiation structure according to an embodiment of the present invention, and fig. 7 and 8 are circuit block diagrams corresponding to a mother circuit carrier according to an embodiment of the present invention. Please refer to fig. 2, fig. 4, fig. 5, fig. 6, fig. 7 and fig. 8. In operation, the mother circuit board 2 receives an input if signal IM and performs frequency up-conversion on the input if signal IM to generate a plurality of first high frequency signals H1. The multi-layer conductive wiring substrate 10 of each rf package radiating structure 1 is provided with a power divider 104, and the power divider 104 is used for dividing or summing the power of the high frequency signal. All the rf radiating module groups of all the rf package radiating structures 1 respectively receive all the first high frequency signals H1, and accordingly emit a plurality of first rf signals R1. All the rf radiating module groups of all the rf packaging radiating structures 1 receive the plurality of second rf signals R2, so as to generate a plurality of second high frequency signals H2 corresponding to all the rf radiating module groups, respectively, and the mother circuit carrier 2 reduces the frequency of all the second high frequency signals H2, so as to generate an output intermediate frequency signal OM.

In some embodiments of the present invention, the mother circuit carrier 2 may include a dielectric plate 200, an intermediate frequency input port 201, a first power divider 202, a plurality of boosters 203, a plurality of second power dividers 204, a plurality of third power dividers 205, a plurality of downconverters 206, a fourth power divider 207, an intermediate frequency output port 208, a plurality of first signal connection ports 209, a plurality of second signal connection ports 210, a plurality of first power supply ports 211, and a plurality of second power supply ports 212. All of the first signal ports 209 and all of the second signal ports 210 may be, but are not limited to, subminiature Push-on Micro (SMPM) ports. All of the first power ports 211 and all of the second power ports 212 may be, but not limited to, serial Peripheral Interface (SPI). The IF input port 201 and the IF output port 208 may be, but are not limited to, subminiature-A (SMA) ports.

All rf package radiating structures 1, the if input port 201, the first power divider 202, all the upconverters 203, all the second power dividers 204, all the third power dividers 205, all the downconverters 206, the fourth power divider 207, the if output port 208, all the first signal ports 209, all the second signal ports 210, all the first power ports 211, and all the second power ports 212 are disposed on the dielectric plate 200. The first power divider 202 is electrically connected to the intermediate frequency input port 201, all the boosters 203 are electrically connected to the plurality of output terminals of the first power divider 202, and all the second power dividers 204 are electrically connected to all the boosters 203 and all the rf radiating module groups of the rf package radiating structure 1. All the third power dividers 205 are electrically connected to all the rf radiating module groups of all the rf package radiating structures, all the downconverters 206 are electrically connected to all the third power dividers 205, all the downconverters 206 are electrically connected to the fourth power dividers 207, and the if output port 208 is electrically connected to the fourth power divider 207.

The first power divider 202 receives the input if signal IM through the if input port 201, and divides the power of the input if signal IM according to the number of all the output terminals of the first power divider 202, so as to generate a plurality of first if signals M1 at all the output terminals of the first power divider 202. All of the upconverters 203 receive all of the first intermediate frequency signals M1 and upconvert them to generate a plurality of upconverted signals U. Each second power divider 204 receives its corresponding up-converted signal U and divides the corresponding up-converted signal U according to the number of the plurality of output terminals of the second power divider 204 to generate the first high frequency signal H1.

Each third power divider 205 receives its corresponding second high frequency signal H2 and sums the power of the corresponding second high frequency signal H2 to generate a summed high frequency signal TH. All down converters 206 receive the corresponding summed high frequency signal TH and down convert it to generate a plurality of second intermediate frequency signals M2. The fourth power divider 207 receives all the second intermediate frequency signals M2 and sums up the power of all the second intermediate frequency signals M2 to generate the output intermediate frequency signal OM. The IF output port 208 is used to output the output IF signal OM.

All the first signal connection ports 209 are divided into a plurality of first groups, all the first groups are electrically connected to all the second power distributors 204 respectively and to the transmission signal connection ports 16 of all the rf radiation module groups respectively, and each first group is electrically connected between the corresponding second power distributor 204 and the transmission signal connection port 16 of the rf radiation module group. All the second signal connection ports 210 are divided into a plurality of second groups, all the second groups are electrically connected to all the third power dividers 205 respectively and to the receiving signal connection ports 17 of all the rf radiating module groups respectively, and each second group is electrically connected between the corresponding third power divider 205 and the receiving signal connection port 17 of the rf radiating module group. In addition, all the first power supply ports 211 are electrically connected to the first power supply ports 18 of all the rf package radiating structures 1, respectively, and all the second power supply ports 212 are electrically connected to the second power supply ports 19 of all the rf package radiating structures 1, respectively.

Since the plurality of RF package radiating structures 1 are embedded on the mother circuit carrier 2 in a horizontal layout, the system complexity can be simplified, the manufacturing cost can be reduced, and the stability of the antenna characteristics and the application expansion of the product can be increased. The array radio frequency system has a reconfigurable architecture to generate different radio frequency powers corresponding to different application situations. When the array radio frequency system has abnormal problems, part of the radio frequency packaging radiation structure 1 can be replaced to quickly detect the fault problem and avoid the damage of the whole radio frequency system failure caused by the failure of one module so as to reduce the maintenance cost. The integrated interface of the radio frequency packaging radiation structure 1 and the mother circuit carrier plate 2 forms an air channel to conduct heat and radiate heat, so as to reduce the system influence of the heat energy and take mechanical and electronic characteristics into consideration.

Please refer to fig. 1, fig. 5 and fig. 6. The power divider 104 and the rf transmitting ic chip 12 of the multilayer conductive wiring substrate 10 receive the first rf signal H1, and accordingly transmit the first rf signal R1 through the rf radiating structure 11. The power divider 104 and the low frequency rf receiving ic chip 13 of the multi-layer conductive wiring substrate 10 receive the second rf signal R2 through the rf radiating structure 11, and thereby generate a second high frequency signal H2. The first transmit antenna block 1100 and the second transmit antenna block 1110 are configured to transmit the first rf signal R1, and the first receive transmit antenna block 1101 and the second receive antenna block 1111 are configured to receive the second rf signal R2.

According to the embodiment, the array radio frequency system simplifies the system complexity, reduces the manufacturing cost and the maintenance cost, increases the stability of the antenna characteristic and the application expansion degree of the product, reduces the system influence of thermal energy, and considers the mechanical and electronic characteristics.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, so that equivalent changes and modifications in the shape, structure, characteristics and spirit of the present invention are included in the claims of the present invention.

Claims (11)

1. An arrayed radio frequency system, comprising:

the circuit carrier board is used for receiving an input intermediate frequency signal and boosting the input intermediate frequency signal so as to generate a plurality of first high-frequency signals; and

the plurality of radio frequency packaging radiation structures are embedded on the mother circuit carrier plate in a horizontal layout, are arranged into an array and are electrically connected with the mother circuit carrier plate, wherein the plurality of radio frequency packaging radiation structures are divided into a plurality of radio frequency radiation module groups, the plurality of radio frequency radiation module groups of the plurality of radio frequency packaging radiation structures are used for respectively receiving the plurality of first high-frequency signals and accordingly transmitting the plurality of first radio frequency signals, the plurality of radio frequency radiation module groups of the plurality of radio frequency packaging radiation structures are used for receiving the plurality of second radio frequency signals so as to respectively generate a plurality of second high-frequency signals corresponding to the plurality of radio frequency radiation module groups, and the mother circuit carrier plate is used for carrying out frequency reduction on the plurality of second high-frequency signals so as to generate an output intermediate-frequency signal.

2. The array radio frequency system of claim 1, wherein the mother circuit carrier comprises:

a dielectric plate on which the plurality of RF package radiating structures are disposed;

an intermediate frequency input port, which is arranged on the dielectric plate;

a first power divider disposed on the dielectric plate and electrically connected to the if input port, wherein the first power divider is configured to receive the if input signal through the if input port and divide power of the if input signal according to the number of the output ports of the first power divider, so as to generate a plurality of first if signals at the output ports of the first power divider;

a plurality of upconverters disposed on the dielectric plate and electrically connected to the output terminals of the first power divider, respectively, the plurality of upconverters being configured to receive the first intermediate frequency signals and upconvert the first intermediate frequency signals to generate a plurality of upconverted signals; and

a plurality of second power dividers disposed on the dielectric plate and electrically connected to the plurality of upconverters and the plurality of rf radiating module groups of the plurality of rf package radiating structures, respectively, wherein each of the second power dividers is configured to receive the corresponding upconverted signal and divide the corresponding upconverted signal according to the number of the plurality of output terminals of the second power divider to generate the first high frequency signal.

3. The array radio frequency system of claim 2, wherein the mother circuit carrier further comprises:

a plurality of third power dividers disposed on the dielectric plate and electrically connected to the plurality of rf radiating module groups of the plurality of rf package radiating structures, respectively, wherein each of the third power dividers is configured to receive the corresponding second high-frequency signal and sum the power of the corresponding second high-frequency signal to generate a summed high-frequency signal;

a plurality of frequency downconverters disposed on the dielectric plate and electrically connected to the plurality of third power dividers, respectively, wherein the frequency downconverters are configured to receive the corresponding summed high frequency signal and downconvert the summed high frequency signal to generate a plurality of second intermediate frequency signals;

a fourth power divider disposed on the dielectric plate and electrically connected to the plurality of downconverters, wherein the fourth power divider is configured to receive the plurality of second intermediate frequency signals and sum powers of the plurality of second intermediate frequency signals to generate the output intermediate frequency signal; and

and the intermediate frequency output port is arranged on the dielectric plate and is electrically connected with the fourth power divider, wherein the intermediate frequency output port is used for outputting the output intermediate frequency signal.

4. The array radio frequency system of claim 3, wherein the mother circuit carrier further comprises:

a plurality of first signal connection ports disposed on the dielectric plate, the plurality of first signal connection ports being divided into a plurality of first groups, the plurality of first groups being electrically connected to the plurality of second power dividers and the plurality of rf radiating module groups, respectively, each of the first groups being electrically connected between the corresponding second power divider and the rf radiating module group; and

the plurality of second signal connection ports are arranged on the dielectric plate and are divided into a plurality of second groups, the plurality of second groups are respectively and electrically connected with the plurality of third power distributors and the plurality of radio frequency radiation module groups, and each second group is electrically connected between the corresponding third power distributor and the radio frequency radiation module group.

5. The arrayed radio frequency system of claim 4, wherein the first and second signal ports are subminiature push-on micro ports.

6. The array RF system of claim 4, wherein the mother circuit carrier further comprises a plurality of first power ports and a plurality of second power ports disposed on the dielectric plate.

7. The array radio frequency system of claim 6, wherein the first power ports and the second power ports are serial peripheral interfaces.

8. The arrayed radio frequency system of claim 1, wherein each of the radio frequency package radiating structures comprises:

a multilayer conductive wiring substrate comprising a multilayer dielectric layer, a conductive trace, a first conductive via and a second conductive via, wherein the conductive trace electrically connects the first conductive via and the second conductive via;

the radio frequency radiation structures are arranged at the bottom of the multilayer conductive wiring substrate and embedded in the multilayer conductive wiring substrate;

a plurality of high frequency transmitting radio frequency integrated circuit chips and a plurality of low frequency receiving radio frequency integrated circuit chips, which are arranged on the top of the multilayer conductive wiring substrate, wherein the plurality of high frequency transmitting radio frequency integrated circuit chips are electrically connected with the first conductive through holes through first conductive structures so as to be respectively electrically connected with the plurality of radio frequency radiation structures, and the plurality of low frequency receiving radio frequency integrated circuit chips are electrically connected with the second conductive through holes through second conductive structures so as to be respectively electrically connected with the plurality of radio frequency radiation structures; and

a transmitting signal connection port and a receiving signal connection port, which are arranged on the top of the multilayer conductive wiring substrate and are electrically connected with the mother circuit carrier board, wherein the transmitting signal connection port is electrically connected with the plurality of high-frequency transmitting radio frequency integrated circuit chips through the conductive trace and the first conductive structure, and the receiving signal connection port is electrically connected with the plurality of low-frequency receiving radio frequency integrated circuit chips through the conductive trace and the second conductive structure;

the multilayer conductive wiring substrate and the plurality of high-frequency transmitting radio-frequency integrated circuit chips are used for receiving the first high-frequency signal and transmitting the first radio-frequency signal through the plurality of radio-frequency radiating structures;

the multilayer conductive wiring substrate and the plurality of low-frequency receiving radio-frequency integrated circuit chips are used for receiving the second radio-frequency signals through the plurality of radio-frequency radiation structures and generating the second high-frequency signals.

9. The array rf system of claim 8, wherein each rf package radiating structure further comprises a first power port and a second power port, the first power port and the second power port are disposed on the top of the multi-layered conductive wiring substrate and electrically connected to the mother circuit board, the first power port is electrically connected to the plurality of rf transmitting ic chips through the first conductive via and the first conductive structure, and the second power port is electrically connected to the plurality of rf receiving ic chips through the second conductive via and the second conductive structure.

10. The arrayed radio frequency system of claim 8, wherein each of the radio frequency radiating structures comprises:

a first antenna layer provided on the bottom of the multilayer conductive wiring substrate; and

and the second antenna layer is embedded between the two dielectric layers closest to the bottom of the multilayer conductive wiring substrate and is electrically connected with the first conductive through hole and the second conductive through hole.

11. The array rf system of claim 10, wherein the first antenna layer comprises four first transmitting antenna blocks and four first receiving antenna blocks, the second antenna layer comprises four second transmitting antenna blocks and four second receiving antenna blocks, the first transmitting antenna blocks are respectively located under the second transmitting antenna blocks, the first receiving antenna blocks are respectively located under the second receiving antenna blocks, the second transmitting antenna blocks are electrically connected to the corresponding first conductive structures and the hf transmitting rf ic chip through the first conductive vias, the second receiving antenna blocks are electrically connected to the corresponding second conductive structures and the lf receiving rf ic chip through the second conductive vias, the first transmitting antenna blocks and the second transmitting antenna blocks are configured to transmit the first rf signals, and the first receiving transmitting antenna blocks and the second receiving antenna blocks are configured to receive the second rf signals.

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