TWM634538U - RF radiation package structure - Google Patents

Abstract

This work discloses a radio frequency radiation packaging structure, which includes a multi-layer conductive wiring substrate, multiple dual-frequency and dual-polarization radio frequency radiation structures, multiple high-frequency transmitting radio frequency integrated circuit chips and multiple low-frequency receiving radio frequency integrated circuits wafer. The multilayer conductive wiring substrate includes multiple dielectric layers, conductive traces, a first group of conductive vias and a second group of conductive vias. The dual-frequency and dual-polarization radio frequency radiation structure is arranged on the bottom surface of the multilayer conductive wiring substrate and embedded in the multilayer conductive wiring substrate, and the chip is arranged on the top surface of the multilayer conductive wiring substrate. The high-frequency transmitting radio frequency integrated circuit chip is electrically connected to the first group of conductive vias, so as to electrically connect the dual-band and dual-polarization radio frequency radiation structures respectively. The low frequency receiving radio frequency integrated circuit chip is electrically connected to the second group of conductive vias, so as to be electrically connected to the dual frequency and dual polarization radio frequency radiation structure respectively.

Description

RF radiation package structure

The present invention relates to a packaging structure, and in particular to a radio frequency radiation packaging structure.

Industrial applications such as low/medium/high-orbit satellite ground terminals, 5G frequency range (FR2) millimeter-wave base stations, radar and long-distance communications, point-to-point microwave links and communication system fronthaul networks, etc., have long-distance and different azimuth coverage. Features, the active array antenna is constructed to achieve the dual functions of high gain and intelligent beam scanning operation. In view of the needs of communication and the planning of industrial frequency bands, the requirements for co-constructing dual-band and dual-polarized antenna characteristics are an important feature.

Traditional antenna architectures implement dual-band antennas by using two separate array antennas, or combining a single antenna architecture but sharing the same polarized ports. In the implementation of the array antenna, if a single antenna group is used, a dual-band antenna unit needs to be designed, and the dual-band operation shares one input and output port. In view of the broadband demand, the antenna characteristics will reduce the problem, and the single antenna unit structure Creating a dual-band structure cannot generate different body-in ports to separate the dual-band separate RF module feeds. When using a dual-band antenna unit, it is necessary to use a set of duplexers or connect a radio frequency circulator, But this will increase system complexity, increase loss and increase cost, and its isolation is also difficult. However, if two sets of separate array antennas are used to feed in two frequency bands, such as low-orbit satellites using dual frequency bands for uplink and downlink data transmission, two sets of antennas need to be constructed when constructing an array antenna, which results in a larger volume and area.

Therefore, this creation is aimed at the above problems, and proposes a radio frequency radiation packaging structure, especially for the application of active array antennas, so as to solve the problems caused by the prior art.

This creation provides a radio frequency radiation packaging structure, which is constructed with multiple input and output ports. Different frequency bands and different polarization directions correspond to different output and output ports. Different output and output ports are connected to different antenna metal patches for independent operation. And reduce the dependence on duplexers and circulators, and through the existence of different frequency band antenna patches to generate isolation, it can produce the effect of increasing the isolation between adjacent and same frequency band antenna radio frequency units. In addition, the metal patches of the transmitting antenna and the metal patch of the receiving antenna of different frequency bands are arranged in a staggered manner, and are physically separated to improve the isolation and reduce the generation of cross polarization.

In one embodiment of the present invention, a radio frequency radiation package structure includes a multilayer conductive wiring substrate, multiple dual-frequency and dual-polarized radio frequency radiation structures, multiple high-frequency transmitting radio frequency integrated circuit chips, and multiple low-frequency receiving radio frequency Integrated circuit chip. The multilayer conductive wiring substrate includes multiple dielectric layers, conductive traces, a first group of conductive vias and a second group of conductive vias, wherein the conductive traces electrically connect the first group of conductive vias and the second group of conductive vias hole. All dual-frequency and dual-polarization radio frequency radiation structures are arranged on the bottom surface of the multilayer conductive wiring substrate and embedded in the multilayer conductive wiring substrate. Each high frequency transmitting radio frequency integrated circuit chip and each low frequency receiving radio frequency integrated circuit chip are arranged on the top surface of the multilayer conductive wiring substrate. Each high-frequency emitting radio frequency integrated circuit chip is electrically connected to the first group of conductive vias through the first conductive structure, so as to electrically connect all the dual-band and dual-polarization radio frequency radiation structures respectively. All the low frequency receiving radio frequency integrated circuit chips are electrically connected to the second group of conductive vias through the second conductive structure, so as to electrically connect all the dual frequency and dual polarization radio frequency radiation structures respectively.

In an embodiment of the present invention, each dual-band and dual-polarized radio frequency radiation structure includes a first antenna metal patch layer and a second antenna metal patch layer. The first antenna metal patch layer is arranged on the bottom surface of the multilayer conductive wiring substrate. The second antenna metal patch layer is embedded between the two dielectric layers closest to the bottom surface of the multilayer conductive wiring substrate, and is electrically connected to the first group of conductive vias and the second group of conductive vias.

In one embodiment of the present invention, the first antenna metal patch layer includes four first transmitting antenna metal patches and four first receiving antenna metal patches, and the second antenna metal patch layer includes four first antenna metal patches. Two transmitting antenna metal patches and four second receiving antenna metal patches. All the metal patches of the first transmitting antenna are respectively located directly under the metal patches of the second transmitting antennas, and the metal patches of all the first receiving antennas are respectively located directly below the metal patches of the second receiving antennas. All the metal patches of the second transmitting antenna are electrically connected to the corresponding first conductive structure and the high-frequency transmitting radio frequency integrated circuit chip through the first group of conductive vias, and all the metal patches of the second receiving antenna The corresponding second conductive structure and the low frequency receiving radio frequency integrated circuit chip are electrically connected through the second group of conductive via holes.

In one embodiment of this creation, all first transmitting antenna metal patches of all dual-frequency and dual-polarized radio frequency radiating structures are arranged in a periodic first square array, and all first transmitting antenna metal patches of all dual-frequency and dual-polarized radio frequency radiating structures A receiving antenna metal patch is arranged in a periodic second square array. Multiple rows of the first square matrix are arranged alternately with multiple rows of the second square matrix, and multiple columns of the first square matrix are alternately arranged with multiple columns of the second square matrix.

In an embodiment of the present invention, all the metal patches of the first transmitting antenna, all the metal patches of the first receiving antenna, all the metal patches of the second transmitting antenna and all the metal patches of the second receiving antenna are rectangular structures.

In one embodiment of the present invention, a transmitting signal input connection port and a receiving signal output connection port are provided on the top surface of the multilayer conductive wiring substrate. The transmitting signal input connection port is electrically connected to all high-frequency transmitting radio frequency integrated circuit chips with the first conductive structure through conductive traces, and the receiving signal output connection port is electrically connected to all low-frequency receiving radio frequency integrated circuit chips through conductive traces and the second conductive structure circuit chip.

In one embodiment of the present invention, the transmitting signal input port and the receiving signal output port are sub-miniature push-on micro (SMPM) ports.

In one embodiment of the present invention, a first power connection port and a second power connection port are provided on the top surface of the multilayer conductive wiring substrate. The first power connection port is electrically connected to the first conductive structure through the first group of conductive vias All high frequency transmitting radio frequency integrated circuit chips are connected, and the second power connection port is electrically connected to all low frequency receiving radio frequency integrated circuit chips through the second group of conductive vias and the second conductive structure.

In an embodiment of the present invention, the first power connection port and the second power connection port are Serial Peripheral Interface Bus (SPI).

In an embodiment of the present invention, the first conductive structure and the second conductive structure are conductive solder balls.

Based on the above, the RF radiation package structure uses a multi-layer conductive wiring substrate to construct multiple input and output ports. Different frequency bands and different polarization directions correspond to different input and output ports. Different input and output ports are connected to different antenna patch arrays for independent operation. , and reduce the dependence on duplexers and circulators. In addition, the metal patches of the transmitting antenna and the metal patches of the receiving antenna are arranged in a staggered manner, and are physically isolated to improve isolation and reduce cross-polarization.

In order to enable your review committee to have a better understanding and understanding of the structural features and the achieved effects of this creation, I would like to provide a better embodiment diagram and a detailed description, as follows:

1: RF radiation package structure

10: Multilayer conductive wiring substrate

100: dielectric layer

101: Conductive traces

102: The first group of conductive vias

103: The second group of conductive vias

104: Power splitter

11: Dual frequency and dual polarization RF radiation structure

110: The first antenna metal patch layer

1100: The metal patch of the first transmitting antenna

1101: The metal patch of the first receiving antenna

111: Second antenna metal patch layer

1110: Second transmitting antenna metal patch

1111: Second receiving antenna metal patch

12: High frequency transmitting radio frequency integrated circuit chip

13: Low frequency receiving radio frequency integrated circuit chip

14: The first conductive structure

15: Second conductive structure

16: Transmit signal input port

17: Receive signal output port

18: The first power port

19:Second power port

2: mother circuit board

200: dielectric board

201: IF input port

202: The first power splitter

203: Upconverter

204: Second power divider

205: The third power divider

206: Downconverter

207: The fourth power divider

208: IF output port

209: The first signal port

210: Second signal port

211: The first power supply port

212: Second power supply port

H: Horizontal polarization signal

V: vertically polarized signal

IM: input intermediate frequency signal

H1: the first high frequency signal

R1: the first RF signal

R2: Second RF signal

H2: Second high frequency signal

OM: output intermediate frequency signal

M1: The first intermediate frequency signal

U: up frequency signal

TH: sum high frequency signal

M2: Second IF signal

Fig. 1 is a structural cross-sectional view of a part of the RF radiation packaging structure of an embodiment of the present invention.

Figure 2 is a top view of the RF radiation package structure of an embodiment of the present invention.

Fig. 3 is a bottom view of a radio frequency radiation package structure of an embodiment of the present invention.

Fig. 4 is a top view of the mother circuit board of one embodiment of the present invention.

Fig. 5 and Fig. 6 are circuit block diagrams corresponding to a radio frequency radiation package structure of an embodiment of the present invention.

Fig. 7 and Fig. 8 are circuit block diagrams corresponding to the mother circuit board of one embodiment of the invention.

Embodiments of the invention will be further explained below with the help of related drawings. Wherever possible, the same reference numerals have been used throughout the drawings and description to refer to the same or similar components. In the drawings, the shape and thickness may be exaggerated for the sake of simplification and convenient labeling. It should be understood that elements not particularly shown in the drawings or described in the specification are forms known to those skilled in the art. Those skilled in the art can make various changes and modifications based on the content of this creation.

When an element is referred to as being "on", it may generally mean that the element is directly on other elements, or there may be other elements present in between. Conversely, when an element is referred to as being "directly on" another element, it cannot have the other element in between. As used herein, the word "and/or" includes any combination of one or more of the associated listed items.

In the following about "one embodiment" or "an embodiment" The description herein refers to a particular element, structure or feature associated with at least one embodiment. Therefore, multiple descriptions of "one embodiment" or "an embodiment" appearing in various places below do not refer to the same embodiment. Furthermore, specific components, structures and features in one or more embodiments may be combined in an appropriate manner.

The disclosure is particularly described with the following examples, which are for illustration only, since various changes and modifications may be made by those skilled in the art without departing from the spirit and scope of the disclosure, and therefore this The scope of protection of the disclosed content shall be subject to the definition of the appended patent application scope. Throughout the specification and claims, the meanings of "a" and "the" include that such description includes "one or at least one" of the element or component, unless the content clearly specifies otherwise. Furthermore, as used in the present disclosure, singular articles also include descriptions of plural elements or components, unless it is obvious from the specific context that the plural is excluded. Also, as applied in this description and all claims below, the meaning of "in" may include "in" and "on" unless the content clearly dictates otherwise. The terms (terms) used throughout the specification and patent claims generally have the ordinary meaning of each term used in this field, in the content of this disclosure and in the specific content, unless otherwise specified. Certain terms used to describe the disclosure are discussed below or elsewhere in this specification to provide practitioners with additional guidance in describing the disclosure. The use of examples anywhere throughout the specification, including examples of any terms discussed herein, is by way of illustration only and certainly not limiting of this disclosure or any example The scope and meaning of words used. Likewise, the present disclosure is not limited to the various embodiments presented in this specification.

In addition, if the term "electrical (sexual) coupling" or "electrical (sexual) connection" is used herein, it includes any direct and indirect electrical connection means. For example, if it is described that a first device is electrically coupled to a second device, it means that the first device can be directly connected to the second device, or indirectly connected to the second device through other devices or connection means. device. In addition, if you describe the transmission and provision of electrical signals, those familiar with the art should be able to understand that the transmission of electrical signals may be accompanied by attenuation or other non-ideal changes, but if the source and receiver of electrical signal transmission or provision are not special In essence, it should be regarded as the same signal. For example, if an electrical signal S is transmitted (or provided) from terminal A of the electronic circuit to terminal B of the electronic circuit, it may pass through the source and drain terminals of a transistor switch and/or possible stray capacitance. A voltage drop is generated, but if the purpose of this design is not to deliberately use the attenuation or other non-ideal changes generated during transmission (or provision) to achieve certain specific technical effects, the electrical signal S is between the terminal A and the terminal of the electronic circuit. B should be considered as substantially the same signal.

Unless otherwise specified, some conditional sentences or words, such as "can (can)", "maybe (could)", "maybe (might)", or "may" are usually intended to express that the embodiments of the present case have, However, it may also be interpreted as a feature, element, or step that may not be required. In other embodiments, these features, elements, or steps may not be required.

It will be understood that the terms "comprising", "including", "having (having)", "containing (containing)", "involving (involving)", etc., are open-ended (open-ended), which means including but not limited to. In addition, any embodiment or patent scope of this creation does not need to achieve all the purposes or advantages or characteristics disclosed in this creation. In addition, the abstract part and the title are only used to assist in the search of patent documents, and are not used to limit the patent scope of this creation.

The following will provide a radio frequency radiation packaging structure, which uses a multi-layer conductive wiring substrate to construct multiple input and output ports. Different frequency bands and different polarization directions correspond to different output and output ports, and different output and output ports are connected to different antenna metal patches. Operate independently and reduce dependence on duplexers and circulators. In addition, the metal patches of the transmitting antenna and the metal patches of the receiving antenna are arranged in a staggered manner, and physical isolation is used to improve the isolation and reduce the generation of cross polarization. The RF radiation package structure can meet the dual-frequency requirements of the uplink, downlink and 5G frequency range (FR2) of low-orbit satellites. It can construct dual-linear or dual-polarized radiation requirements for various application requirements to meet the array requirements. Antenna characteristics required for high gain and intelligent scanning during antenna construction.

Figure 1 is a structural cross-sectional view of a part of the RF radiation packaging structure of one embodiment of the invention, Figure 2 is a top view of the RF radiation packaging structure of one embodiment of the invention, and Figure 3 is an embodiment of the invention The bottom view of the RF radiation package structure. Please refer to FIG. 1 , FIG. 2 and FIG. 3 , the following introduces an embodiment of the radio frequency radiation packaging structure 1 of the present invention. The radio frequency radiation package structure 1 includes a multilayer conductive wiring substrate 10, multiple dual-frequency and dual-polarized radio frequency radiation structures 11, multiple high-frequency emitting radio frequency products A body circuit chip 12 , a plurality of low frequency receiving radio frequency integrated circuit chips 13 , a first conductive structure 14 and a second conductive structure 15 . The first conductive structure 14 and the second conductive structure 15 can be, but not limited to, conductive solder balls. The multilayer conductive wiring substrate 10 includes a multilayer dielectric layer 100, conductive traces 101, a first group of conductive vias 102 and a second group of conductive vias 103, wherein the conductive traces 101 are electrically connected to the first group of conductive vias 102 and the second group of conductive vias 103. Two groups of conductive vias 103 . All dual-frequency and dual-polarization radio frequency radiation structures 11 are arranged on the bottom surface of the multilayer conductive wiring substrate 10 and embedded in the multilayer conductive wiring substrate 10 . All high-frequency transmitting radio-frequency integrated circuit chips 12 and all low-frequency receiving radio-frequency integrated circuit chips 13 are arranged on the top surface of the multilayer conductive wiring substrate 10, wherein all high-frequency transmitting radio-frequency integrated circuit chips 12 are electrically connected through the first conductive structure 14 Connect the first group of conductive vias 102 to electrically connect all dual-frequency and dual-polarized radio frequency radiation structures 11, and all low-frequency receiving radio frequency integrated circuit chips 13 are electrically connected to the second group of conductive vias 15 through the second conductive structure 15. The through holes 103 are used to electrically connect all the dual-band and dual-polarization radio frequency radiation structures 11 respectively.

In some embodiments of the present invention, each dual-band and dual-polarized radio frequency radiation structure 11 may include a first antenna metal patch layer 110 and a second antenna metal patch layer 111 . The first antenna metal patch layer 110 is disposed on the bottom surface of the multilayer conductive wiring substrate 10, the second antenna metal patch layer 111 is embedded between the two dielectric layers 100 closest to the bottom surface of the multilayer conductive wiring substrate 10, and The first group of conductive vias 102 and the second group of conductive vias 103 are electrically connected.

Specifically, the first antenna metal patch layer 110 may include four first transmitting antenna metal patches 1100 and four first receiving antenna metal patches 1100. As the patch 1101 , the second antenna metal patch layer 111 may include four second transmitting antenna metal patches 1110 and four second receiving antenna metal patches 1111 . All first transmitting antenna metal patches 1100, all first receiving antenna metal patches 1101, all second transmitting antenna metal patches 1110 and all second receiving antenna metal patches 1111 can be all, but not limited to rectangular, or none. The shape of the notch. All first transmitting antenna metal patches 1100 are respectively located directly below all second transmitting antenna metal patches 1110 , and all first receiving antenna metal patches 1101 are respectively located directly below all second receiving antenna metal patches 1111 . All second transmitting antenna metal patches 1110 are electrically connected to their corresponding first conductive structures 14 and high-frequency transmitting radio frequency integrated circuit chips 12 through the first group of conductive vias 102, and all second receiving antenna metal patches 1111 are connected through the first group of conductive vias 102. The two groups of conductive vias 103 are electrically connected to the corresponding second conductive structure 15 and the low frequency receiving radio frequency integrated circuit chip 13 . For example, the first group of conductive vias 102 corresponding to a high-frequency transmitting radio frequency integrated circuit chip 12 can be divided into four groups, and each group of the first group of conductive vias 102 includes a transmission high-frequency level Two sets of sub-holes for the polarization signal H and the high-frequency vertical polarization signal V. Each group of the first group of conductive vias 102 is electrically connected to a second transmitting antenna metal patch 1110 . The second group of conductive vias 103 corresponding to a low-frequency receiving radio frequency integrated circuit chip 13 can be divided into four groups, and each group of the second group of conductive vias 103 includes transmission of low-frequency horizontal polarization signal H and low-frequency Two sub-holes for vertically polarized signal V. Each group of the second group of conductive vias 103 is electrically connected to a second receiving antenna metal patch 1111 . Each group of sub-vias is regarded as an independent input and output port, which can operate independently, In order to reduce the interference of frequency separation and the dependence on duplexers and circulators.

All first transmitting antenna metal patches 1100 of all dual-frequency and dual-polarized radio frequency radiation structures 11 are arranged in a periodic first square array, and all first receiving antenna metal patches 1101 of all dual-frequency and dual-polarized radio frequency radiation structures 11 The arrangement is a periodic second square matrix, the multiple rows of the first square matrix and the multiple rows of the second square matrix are arranged alternately, and the multiple columns of the first square matrix and the multiple columns of the second square matrix are alternately arranged. Therefore, the first square array and the second square array are arranged in a staggered manner, and physical isolation is used to improve the isolation, so as to reduce the generation of cross polarization.

The top surface of the multilayer conductive wiring substrate 10 can be provided with a transmitting signal input connection port 16 and a receiving signal output connection port 17 . The transmit signal input port 16 and the receive signal output port 17 may be, but not limited to, sub-miniature push-on micro (SMPM) ports. The transmission signal input connection port 16 is electrically connected to all high-frequency transmission radio frequency integrated circuit chips 12 through the conductive trace 101 and the first conductive structure 14 . The receiving signal output connection port 17 is electrically connected to all the low frequency receiving radio frequency integrated circuit chips 13 through the conductive trace 101 and the second conductive structure 15 . The top surface of the multilayer conductive wiring substrate 10 can further have a first power connection port 18 and a second power connection port 19 . The first power connection port 18 and the second power connection port 19 can be, but not limited to, serial peripheral interface (SPI) or control signal lines. The first power connection port 18 is electrically connected to all high-frequency transmitting radio frequency integrated circuit chips 12 through the first group of conductive vias 102 and the first conductive structure 14, and the second power connection port 19 is connected to the first group of conductive vias 103 through the second group of conductive vias 103. two The conductive structure 15 is electrically connected to all low frequency receiving radio frequency integrated circuit chips 13 .

The following will provide an array radio frequency system, which horizontally stacks multiple radio frequency radiation package structures on a mother circuit board to simplify system complexity and reduce manufacturing costs, and increase the stability of antenna characteristics and product application expansion. Just like mainstream cars use a common chassis. This array radio frequency system has a reconfigurable structure to correspond to different application scenarios and generate different radio frequency power. When there is an abnormality in the array RF system, part of the RF radiation packaging structure can be replaced to quickly detect the fault and avoid the damage caused by the failure of one module that will cause the failure of the entire RF system to reduce maintenance costs. The RF radiation package structure is a module co-constructed by RF and antenna, and the mother circuit board is mainly responsible for system functions such as signal transmission, power supply, and RF signal rise and fall. Therefore, the design of the RF radiation package structure emphasizes modularization, mass production convenience, and maintenance and replacement-based RF and antenna co-construction modules. The mother circuit board emphasizes the scalability of the system, including the size of the array antenna, the expansion of the operating voltage, the series and parallel connection of signal transmission, and the realization of the heat dissipation mechanism. This array RF system uses a common interface to improve the commonality of the system. The integrated interface of the RF radiation package structure and the mother circuit board forms an air channel to conduct heat and dissipate heat, so as to reduce the system impact of heat energy and take into account both mechanical and electronic characteristics.

Fig. 4 is a top view of the mother circuit board of one embodiment of the present invention. Please refer to FIG. 4 and FIG. 2 , an embodiment of an array radio frequency system is introduced below. The array radio frequency system includes a mother circuit board 2 and a plurality of radio frequency radiation package structures 1 . All RF radiation package structures 1 are stacked horizontally on on the mother circuit board 2 and arranged in an array, and electrically connected to the mother circuit board 2 . All radio frequency radiation packaging structures 1 are divided into multiple radio frequency groups. Taking FIG. 4 as an example, all radio frequency radiation packaging structures 1 are arranged in a 4×4 array, and each radio frequency group includes four radio frequency radiation packaging structures 1 in each row of the array.

Fig. 5 and Fig. 6 are circuit block diagrams corresponding to a radio frequency radiation package structure of an embodiment of the present creation, and Fig. 7 and Fig. 8 are circuit block diagrams corresponding to the mother circuit board of an embodiment of the present creation. Please refer to Figure 2, Figure 4, Figure 5, Figure 6, Figure 7 and Figure 8. In operation, the mother circuit board 2 receives an input intermediate frequency signal IM, and up-converts the input intermediate frequency signal IM, thereby generating a plurality of first high frequency signals H1. The multilayer conductive wiring substrate 10 of each radio frequency radiation package structure 1 is provided with a power divider 104, and the power divider 104 is used for distributing or summing up the power of high frequency signals. All radio frequency groups of all radio frequency radiation package structures 1 respectively receive all first high frequency signals H1, and emit a plurality of first radio frequency signals R1 accordingly. All radio frequency groups of all radio frequency radiation packaging structures 1 receive a plurality of second radio frequency signals R2, so as to generate a plurality of second high frequency signals H2 corresponding to all radio frequency groups, and the mother circuit board 2 responds to all the second high frequency signals H2 performs down-frequency to thereby generate an output intermediate frequency signal OM.

In some embodiments of the present invention, the mother circuit board 2 may include a dielectric board 200, an IF input port 201, a first power divider 202, a plurality of upconverters 203, and a plurality of second power dividers 204, a plurality of third power dividers 205, a plurality of down-converters 206, a fourth power divider 207, an intermediate frequency output port 208, a plurality of first signal connection ports 209, a plurality of second signal connection ports 210. A plurality of first power supply ports 211 and a plurality of Two power supply port 212. All the first signal connection ports 209 and all the second signal connection ports 210 may be, but not limited to, sub-miniature push-on micro (SMPM) ports. All the first power supply ports 211 and all the second power supply ports 212 can be, but not limited to, Serial Peripheral Interface Bus (SPI). The IF input port 201 and the IF output port 208 may be, but not limited to, sub-miniature-A (SMA) ports.

All radio frequency radiation packaging structures 1, intermediate frequency input port 201, first power splitter 202, all upconverters 203, all second power splitters 204, all third power splitters 205, all The down-converter 206 , the fourth power divider 207 , the IF output port 208 , all the first signal connection ports 209 , all the second signal connection ports 210 , all the first power supply ports 211 and all the second power supply ports 212 . The first power divider 202 is electrically connected to the intermediate frequency input port 201, all the up-converters 203 are electrically connected to multiple output ends of the first power divider 202, and all the second power dividers 204 are electrically connected to all up-converters device 203 and all radio frequency groups of all radio frequency radiation package structures 1 . All third power dividers 205 are electrically connected to all radio frequency groups of all radio frequency radiation packaging structures, all downconverters 206 are electrically connected to all third power dividers 205, and the fourth power divider 207 is electrically connected to all lower frequency dividers. The frequency converter 206 and the intermediate frequency output port 208 are electrically connected to the fourth power divider 207 .

The first power divider 202 receives the input intermediate frequency signal IM through the intermediate frequency input port 201, and distributes the power of the input intermediate frequency signal IM according to the number of all output terminals of the first power divider 202, so that the first power All output terminals of the distributor 202 generate a plurality of first intermediate frequency signals M1. All the upconverters 203 receive all the first intermediate frequency signals M1 and upconvert them to generate a plurality of upconverted signals U. Each second power divider 204 receives its corresponding up-converted signal U, and distributes the corresponding up-converted signal U according to the number of multiple output terminals of the second power divider 204 to generate the first high-frequency signal H1.

Each third power divider 205 receives its corresponding second high frequency signal H2 and sums the power of the corresponding second high frequency signal H2 to generate a total high frequency signal TH. All down-converters 206 receive their corresponding summed high-frequency signals TH, and down-convert them to generate a plurality of second intermediate-frequency signals M2. The fourth power divider 207 receives all the second IF signals M2 and sums the power of all the second IF signals M2 to generate an output IF signal OM. The intermediate frequency output port 208 is used to output the output intermediate frequency signal OM.

All the first signal connection ports 209 are divided into multiple first groups, and all the first groups are respectively electrically connected to all the second power distributors 204, and are respectively electrically connected to the transmission signal input ports 16 of all radio frequency groups, Each first group is electrically connected between its corresponding second power divider 204 and the transmitting signal input port 16 of the radio frequency group. All the second signal connection ports 210 are divided into multiple second groups, and all the second groups are respectively electrically connected to all the third power distributors 205, and are respectively electrically connected to the receiving signal output ports 17 of all radio frequency groups, Each second group is electrically connected between its corresponding third power divider 205 and the receiving signal output connection port 17 of the radio frequency group. In addition, all first powered port 211 The first power connection ports 18 of all the radio frequency radiation packaging structures 1 are respectively electrically connected, and all the second power supply ports 212 are respectively electrically connected to the second power connection ports 19 of all the radio frequency radiation packaging structures 1 .

Since multiple radio frequency radiation package structures 1 are horizontally stacked on the mother circuit board 2, system complexity and manufacturing cost can be simplified, and the stability of antenna characteristics and product application expansion can be increased. This array radio frequency system has a reconfigurable structure to correspond to different application scenarios and generate different radio frequency power. When there is an abnormal problem in the array radio frequency system, the part of the radio frequency radiation package structure 1 can be replaced to quickly detect the fault problem and avoid the failure of the whole radio frequency system due to the failure of one module, so as to reduce the maintenance cost. The integrated interface of the radio frequency radiation package structure 1 and the mother circuit board 2 forms an air channel to conduct and dissipate heat, so as to reduce the influence of heat energy on the system and take into account mechanical and electronic characteristics.

Please refer to Figure 1, Figure 5 and Figure 6. The power divider 104 of the multilayer conductive wiring substrate 10 and the high-frequency transmitting radio-frequency integrated circuit chip 12 receive the first high-frequency signal H1 and transmit the first radio-frequency signal R1 through the dual-band and dual-polarized radio frequency radiation structure 11 accordingly. The power divider 104 of the multilayer conductive wiring substrate 10 and the low frequency receiving radio frequency integrated circuit chip 13 receive the second radio frequency signal R2 through the dual frequency and dual polarization radio frequency radiation structure 11, and thereby generate the second high frequency signal H2. The first transmitting antenna metal patch 1100 and the second transmitting antenna metal patch 1110 are used to transmit the first radio frequency signal R1, and the first receiving and transmitting antenna metal patch 1101 and the second receiving antenna metal patch 1111 are used to receive the second radio frequency Signal R2.

According to the above-mentioned embodiments, the radio frequency radiation packaging structure is multilayered The conductive wiring substrate constructs multiple I/O ports. Different frequency bands and different polarization directions correspond to different I/O ports. Different I/O ports are connected to different antenna metal patches for independent operation and reduce the need for duplexers and loops. device dependencies. In addition, the metal patches of the transmitting antenna and the metal patches of the receiving antenna are arranged in a staggered manner, and are physically isolated to improve isolation and reduce cross-polarization.

The above is only a preferred embodiment of this creation, and it is not used to limit the scope of implementation of this creation. Therefore, all equal changes and modifications are made according to the shape, structure, characteristics and spirit described in the patent scope of this creation. , should be included in the scope of the patent application for this creation.

10: Multilayer conductive wiring substrate

100: dielectric layer

101: Conductive traces

102: The first group of conductive vias

103: The second group of conductive vias

11: Dual frequency and dual polarization RF radiation structure

110: The first antenna metal patch layer

1100: The metal patch of the first transmitting antenna

1101: The metal patch of the first receiving antenna

111: Second antenna metal patch layer

1110: Second transmitting antenna metal patch

1111: Second receiving antenna metal patch

12: High frequency transmitting radio frequency integrated circuit chip

13: Low frequency receiving radio frequency integrated circuit chip

14: The first conductive structure

15: Second conductive structure

18: The first power port

19:Second power port

Claims (9)

A radio frequency radiation packaging structure, comprising: a multilayer conductive wiring substrate, including a multilayer dielectric layer, conductive traces, a first group of conductive vias and a second group of conductive vias, wherein the conductive traces are electrically connected to the first A group of conductive vias and the second group of conductive vias; a plurality of dual-frequency and dual-polarization radio frequency radiation structures are arranged on the bottom surface of the multilayer conductive wiring substrate and embedded in the multilayer conductive wiring substrate; and a plurality of high-frequency A transmitting radio frequency integrated circuit chip and a plurality of low frequency receiving radio frequency integrated circuit chips are arranged on the top surface of the multilayer conductive wiring substrate, wherein the high frequency transmitting radio frequency integrated circuit chips are electrically connected to the first A group of conductive vias, so as to electrically connect the dual-frequency and dual-polarized radio frequency radiation structures respectively, and these low-frequency receiving radio frequency integrated circuit chips are electrically connected to the second group of conductive vias through the second conductive structure, so as to In this way, the dual-frequency and dual-polarized radio frequency radiation structures are respectively electrically connected; wherein the first conductive structure and the second conductive structure are conductive solder balls. The radio frequency radiation packaging structure as described in claim 1, wherein each of the dual-frequency and dual-polarization radio frequency radiation structures includes: a first antenna metal patch layer, which is provided on the bottom surface of the multilayer conductive wiring substrate; and a second antenna metal patch layer, embedded between the two dielectric layers closest to the bottom surface of the multilayer conductive wiring substrate, and electrically connecting the first group of conductive vias and the second group of conductive vias hole. The radio frequency radiation packaging structure as described in Claim 2, wherein the first antenna metal patch layer includes four first transmitting antenna metal patches and four first receiving antenna metal patches, and the second antenna metal patch The sheet layer includes four second transmitting antenna metal patches and four second receiving antenna metal patches, the first transmitting antenna metal patches are respectively located directly below the second transmitting antenna metal patches, and the first transmitting antenna metal patches are respectively located directly below the second transmitting antenna metal patches. A receiving antenna metal patch is located directly below the second receiving antenna metal patches, and the second transmitting antenna metal patches are electrically connected to the corresponding first conductive structure and the corresponding first conductive structure through the first group of conductive via holes. The high frequency transmitting radio frequency integrated circuit chip, the second receiving antenna metal patches are electrically connected to the corresponding second conductive structure and the low frequency receiving radio frequency integrated circuit chip through the second group of conductive vias. The radio frequency radiation packaging structure as described in claim 3, wherein the metal patches of the first transmitting antennas of the dual frequency and dual polarization radio frequency radiation structures are arranged in a first square array, and the dual frequency and dual polarization radio frequency radiation The metal patches of the first receiving antennas of the structure are arranged in a second square matrix, the rows of the first square matrix are arranged alternately with the rows of the second square matrix, and the columns of the first square matrix Alternately arranged with multiple columns of the second square matrix. The radio frequency radiation packaging structure as described in claim 3, wherein the metal patches of the first transmitting antennas, the metal patches of the first receiving antennas, the metal patches of the second transmitting antennas and the metal patches of the second receiving antennas The patches are all rectangular. The radio frequency radiation package structure as described in claim 1, wherein the top surface of the multilayer conductive wiring substrate is provided with a transmission signal input connection port and a reception signal output connection port, and the transmission signal input connection port connects with the conductive trace through the The first conductive structure is electrically connected to the high frequency transmitting radio frequency integrated circuit chips, and the receiving signal output connection port is electrically connected to the low frequency receiving radio frequency integrated circuit chips through the conductive trace and the second conductive structure. The radio frequency radiation package structure as described in Claim 6, wherein the transmitting signal input port and the receiving signal output port are sub-miniature push-on micro (Sub-Miniature Push-on Micro; SMPM) ports. The radio frequency radiation packaging structure as described in claim 1, wherein the top surface of the multilayer conductive wiring substrate is provided with a first power connection port and a second power connection port, and the first power connection port is connected through the first group of conductors The holes are electrically connected to the high frequency transmitting radio frequency integrated circuit chips with the first conductive structure, and the second power connection port is electrically connected to the low frequency receiving radio frequency integrated circuit chips with the second conductive structure through the second group of conductive vias. body circuit wafer. The radio frequency radiation package structure according to claim 8, wherein the first power connection port and the second power connection port are Serial Peripheral Interface Bus (SPI).

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