CN218037318U - Laser transmitter and laser radar - Google Patents

Abstract

The utility model provides a laser emission device and laser radar, wherein, laser emission device includes: a transmitting circuit board; the radiating component and the conductive component are arranged on the same surface of the transmitting circuit board at intervals; and the light-emitting component is arranged on the heat radiating component and is electrically connected with the transmitting circuit board at least through the conductive component. By adopting the scheme, the loop inductance of the control loop where the luminous part is located can be reduced under the condition of improving the heat dissipation performance of the laser emitting device, so that the reliability, the service life and the signal quality of the laser emitting device can be improved.

Description

Laser transmitter and laser radar

Technical Field

The specification relates to the technical field of laser radars, in particular to a laser emitting device and a laser radar.

Background

In a lidar, a laser emitting device is used to generate a laser signal to enable the lidar to perform environmental sensing. A light emitting part in a laser emitting apparatus, as a semiconductor device, has poor stability in operation at high temperature, and thus needs to be heat-dissipated to ensure that it operates at a stable lower temperature. However, the conventional laser emitting device has poor heat dissipation performance, and as the service life of the light emitting part is increased, the operating temperature of the light emitting part gradually rises, which causes adverse effects on related hardware inside the laser emitting device, and reduces the reliability and service life of the conventional laser emitting device.

For example, as shown in fig. 1, in a conventional laser light emitting apparatus FA, a light emitting part 01 is directly mounted on an emission circuit board 02, and the light emitting part 01 is electrically connected to the emission circuit board 02 through a bonding wire 0 a. Since the heat conduction of the light emitting part 01 is poor, the heat of the light emitting part 01 is hardly dissipated, and as the operation time increases, the operation temperature of the light emitting part 01 itself increases, and the stability of the light emitting part 01 is deteriorated. In addition, since the light emitting part 01 and the emission circuit board 02 are made of different materials, when the operating temperature of the light emitting part 01 rises, the coefficient of expansion of the material between the light emitting part 01 and the emission circuit board 02 is not adapted, so that stress is generated, and when the stress is too large, the light emitting part 01 and the emission circuit board 02 are deformed, which easily causes hardware failure. Thereby, the reliability and the service life of the laser emitting device FA are reduced.

With the increasing requirements of laser radars on measuring distance and dot frequency, the emission power of the light-emitting component is also correspondingly and greatly increased, thereby further reducing the service life and reliability of the existing laser emission device. In particular, on the one hand, an increase in the emission power causes the light emitting component to generate more heat during operation, resulting in a rapid increase in the operating temperature of the light emitting component. On the other hand, in order to increase the emission power of the light emitting part, the size of the light emitting part is also increased, so that when the operating temperature of the light emitting part is changed, the influence of the deformation between the light emitting part and the emission circuit board is further increased, and the risk of connection failure between the light emitting part and the emission circuit board is increased.

In order to improve the heat dissipation performance of the laser emitting device, in the current solution, as shown in fig. 2, a heat dissipation component 03 is added to a laser emitting device FB, a light emitting component 01 is disposed on the heat dissipation component 03, and the light emitting component 01 is electrically connected to an emitting circuit board 02 through a bonding wire 0 b. The light emitting component 01 can dissipate heat through the heat dissipating component 03, reduce the junction temperature of the light emitting component 01 (i.e., the highest working temperature that the light emitting component 01 may reach when working), and avoid the risk of deformation caused by the mismatch of thermal expansion coefficients between the light emitting component 01 and the transmitting circuit board 02.

However, the heat dissipation component may increase the distance between the light emitting component and the transmitting circuit board, thereby increasing the circuit trace length related to the light emitting component (for example, the length of the bonding wire 0b in fig. 2 is significantly greater than the length of the bonding wire 0a in fig. 1), resulting in an increase in loop inductance of the control loop where the light emitting component is located, increasing the obstruction to the electrical signal flowing through the light emitting component, causing a significant decrease in the pulse peak value of the detection beam emitted by the light emitting component, thereby reducing the signal quality of the laser emitting device, and causing a very adverse effect on the lidar remote measurement.

Therefore, how to reduce the loop inductance of the control loop where the light emitting component is located in the situation of improving the heat dissipation performance of the laser emitting device needs to be solved by those skilled in the art.

SUMMERY OF THE UTILITY MODEL

In view of this, embodiments of the present disclosure provide a laser emitting device and a laser radar, which can reduce loop inductance of a control loop where a light emitting component is located under the condition of improving heat dissipation performance of the laser emitting device, so as to improve reliability, service life, and signal quality of the laser emitting device.

An embodiment of the present specification provides a laser emission device, including:

a transmitting circuit board;

the radiating component and the conductive component are arranged on the same surface of the transmitting circuit board at intervals;

and the light-emitting component is arranged on the heat radiating component and is electrically connected with the transmitting circuit board at least through the conductive component.

Optionally, the first surface of the conductive component is opposite to the first surface of the heat dissipation component, and the structures of the first surface of the conductive component and the first surface of the heat dissipation component are matched.

Optionally, the heat dissipation component further comprises: and a third surface contacting the light emitting part, wherein the second surface of the heat dissipating part has an area smaller than that of the third surface of the heat dissipating part.

Optionally, the conductive component further comprises: a second surface electrically connected with the light emitting part, and a third surface contacting the emission circuit board, wherein an area of the second surface of the conductive member is larger than an area of the third surface of the conductive member.

Optionally, a height of a second surface of the heat dissipating member contacting the light emitting part from the emission circuit board is not greater than a height of a second surface of the conductive member electrically connected to the light emitting part from the emission circuit board.

Optionally, the light emitting part is also electrically connected to the emission circuit board through the heat dissipating part.

Optionally, the light emitting part includes: a first electrode and a second electrode that are different; wherein: the first electrode is electrically connected with the heat dissipation component; the second electrode is electrically connected to the conductive member.

Optionally, the heat dissipation component comprises any one of:

the conductive carrier is electrically connected with the first electrode and the transmitting circuit board respectively;

a thermally conductive carrier and an electrically conductive sub-assembly; the heat conducting carrier is made of a heat conducting non-conductive material and is fixedly connected with the light emitting component and the transmitting circuit board respectively; the conductive sub-elements are electrically connected with the first electrode and the transmitting circuit board respectively.

Optionally, the thermally conductive carrier comprises a through hole; the through hole is suitable for communicating the light emitting component and the transmitting circuit board and is filled with the conductive sub-component.

Optionally, the conductive member comprises any one of:

the conductive base body is electrically connected with the second electrode and the transmitting circuit board respectively;

the non-conductive substrate is fixedly connected with the transmitting circuit board, and the conductive layer is electrically connected with the second electrode and the transmitting circuit board respectively.

Optionally, the light emitting part includes: a light emitting sub-member and a conductive plate member; the light-emitting sub-component comprises a first electrode and a second electrode which are different in polarity, the first electrode is electrically connected with the conductive component through the conductive plate component, and the second electrode is electrically connected with the conductive component.

Optionally, the conductive plate member is located between the first electrode and the heat dissipation member.

Optionally, the conductive member comprises any one of:

two conductive substrates, wherein one conductive substrate is electrically connected with the conductive plate, and the other conductive substrate is electrically connected with the second electrode;

the conductive structure comprises a non-conductive substrate and two conductive layers, wherein the two conductive layers cover the surface of the same non-conductive substrate at intervals, or the two conductive layers cover different non-conductive substrates respectively; one of the two conductive layers is electrically connected to the conductive plate member, and the other is electrically connected to the second electrode.

Optionally, the laser emitting device includes a plurality of conductive parts separated from each other, and the conductive parts are disposed around the non-light-emitting surface of the light emitting part.

Optionally, the plurality of conductive parts are disposed on the same side or opposite sides of the heat dissipation part.

Alternatively, at least a part of the conductive members among the plurality of conductive members is electrically connected to the same light emitting part.

Optionally, the laser emitting device comprises a plurality of light emitting components adapted to be arranged in an array.

Optionally, the plurality of light emitting members are staggered.

Optionally, at least part of the plurality of light emitting parts are electrically connected to the same conductive member.

Optionally, the total number of said electrically conductive members is related to lighting requirements, said lighting requirements comprising at least one of: the number of light emitting parts that emit light synchronously; a total number of groups of light emitting parts; the type of light emitting component.

Alternatively, a plurality of the light emitting parts are adapted to emit light in groups, and the total number of the heat radiating parts corresponds to the total number of the groups of the plurality of the light emitting parts.

Optionally, the conductive member is electrically connected to the light emitting part by at least one bonding wire.

An embodiment of the present specification provides a laser radar, including:

the laser transmitter according to any of the above embodiments, adapted to generate a probe beam;

the optical assembly is suitable for shaping the detection light beam, wherein the laser emitting device is arranged on a focal plane of the optical assembly;

a scanning device adapted to emit the shaped detection light beam into an external environment;

a detection device adapted to receive a probe beam reflected by an object in an external environment; and

and the processing device is coupled with the laser emitting device, the scanning device and the detection device and is suitable for obtaining detection information.

Optionally, the scanning device comprises any one of:

a two-dimensional scanning mirror;

two one-dimensional scanning mirrors.

In the laser emitting device according to the embodiment of the present disclosure, a heat dissipating member and a conductive member are disposed on the same surface of the emitting circuit board at an interval, and a light emitting member is disposed on the heat dissipating member and electrically connected to the emitting circuit board at least through the conductive member. By adopting the scheme, under the condition of improving the heat dissipation performance of the laser emitting device, the length of the wiring of the related circuit of the luminous component can be shortened by the conductive component with a certain height, so that the loop inductance of the control loop where the luminous component is located can be reduced, the obstruction of the electric signal flowing through the luminous component is reduced, and the detection light beam emitted by the luminous component is ensured to have an expected pulse peak value. Therefore, the laser emitting device provided by the embodiment of the specification can improve the reliability, the service life and the signal quality of the laser emitting device at the same time.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, it is obvious that the drawings in the following description are only embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a conventional laser emitting device.

Fig. 2 is a schematic structural diagram of another conventional laser emitting device.

Fig. 3 is a schematic structural diagram of a laser emitting device provided in an embodiment of the present specification.

Fig. 4 is a perspective view of a heat radiating member and a conductive member in the laser transmitter of fig. 3.

Fig. 5 is a schematic structural diagram of another laser emitting device provided in an embodiment of the present disclosure.

Fig. 6 is a schematic structural diagram of another laser emitting device provided in an embodiment of the present disclosure.

Fig. 7 is a schematic structural diagram of another laser emitting device provided in an embodiment of the present disclosure.

Fig. 8 is a schematic structural diagram of another laser emitting device provided in an embodiment of the present disclosure.

Fig. 9 is a schematic structural diagram of another laser emitting device provided in an embodiment of the present disclosure

Fig. 10 is a schematic structural diagram of another laser emitting device provided in an embodiment of the present specification.

Fig. 11 is a schematic structural diagram of another laser emitting device provided in an embodiment of the present disclosure.

Fig. 12 is a schematic diagram illustrating a comparison between an interlaced arrangement and a non-interlaced arrangement of a plurality of light emitting components according to an embodiment of the present disclosure.

Fig. 13 is a schematic structural diagram of another laser emitting device provided in an embodiment of the present disclosure.

Fig. 14 is a schematic structural diagram of another laser emitting device provided in an embodiment of the present disclosure.

Fig. 15 is a schematic structural diagram of another laser emitting device provided in an embodiment of the present specification.

Fig. 16 is a schematic structural diagram of another laser emitting device provided in an embodiment of the present disclosure.

Fig. 17 is a schematic structural diagram of another laser emitting device provided in an embodiment of the present disclosure.

Fig. 18 is a schematic structural diagram of a laser radar according to an embodiment of the present disclosure.

Detailed Description

According to the description of the background art, the addition of the heat dissipation component in the laser emission device can increase the loop inductance of the control loop where the light emitting component is located, so that the signal quality of the laser emission device is reduced, and the ranging performance of the laser radar is seriously affected.

In order to solve the above technical problem, in an embodiment of the present specification, there is provided a laser emitting apparatus, wherein a heat dissipating member and a conductive member are disposed on a same surface of the emitting circuit board with an interval therebetween, and a light emitting member is disposed on the heat dissipating member and electrically connected to the emitting circuit board at least through the conductive member. Therefore, the signal quality, the reliability and the service life of the laser emitting device can be improved at the same time.

For a better understanding and appreciation of the concepts, aspects, principles, and advantages of the embodiments described herein, reference will be made to the following detailed description of the embodiments in connection with the accompanying drawings.

Referring to fig. 3, a schematic structural diagram of a laser emitting device provided in an embodiment of the present specification is shown, in this example, the laser emitting device F1 may include:

a transmitting circuit board 11, wherein the transmitting circuit board 11 has a control circuit (not shown in fig. 3) adapted to the light emitting part;

a heat radiating member 12 and a conductive member 13 which are disposed on the same surface of the emission circuit board 11 at an interval;

and a light emitting member 14 provided on the heat radiating member 12 and electrically connected to the radiation circuit board at least through the conductive member 13.

In practical use, a control circuit may be formed between the light emitting part 14 and the transmitting circuit board 11 in the laser emitting device F1 at least by the conductive member 13. Specifically, a control circuit may be formed between the transmission circuit board 11 and the light-emitting part 14 through the conductive member 13, and a control circuit may also be formed through the conductive member 13 and other components (such as the heat-radiating member 12) in the laser emitting device F1. Thereby, the transmission circuit board 11 can control the operation timing of the light emitting part 14.

The heat dissipation part 12 in the laser emitting device F1 can dissipate heat of the light emitting part 14, and avoid that the operating temperature of the light emitting part 14 is too high, so as to reduce the junction temperature of the light emitting part 14 and ensure that the light emitting part 14 can be used at a proper operating temperature; moreover, the heat dissipation part 12 is located between the light emitting part 14 and the emitting circuit board 11, so that the light emitting part 14 is not in direct contact with the emitting circuit board 11, and the light emitting part 14 can dissipate heat through the heat dissipation part 12, thereby avoiding the deformation caused by the mismatch of the thermal expansion coefficient between the light emitting part 14 and the emitting circuit board 11, and reducing the risk of hardware failure. Therefore, the heat dissipation member 12 can improve the heat dissipation performance of the laser emitting device F1, thereby improving the reliability and the service life of the laser emitting device F1.

The conductive member 13 in the laser emitting device F1 has conductivity and is electrically connected to the light emitting member 14 and the emitting circuit board 11, respectively. The conductive member 13 may be electrically connected to the light emitting member 14 by wire bonding, conductive device bridging, or the like.

Since the circuit trace related to the light-emitting part 01 in fig. 2 is formed by the bonding wire 0b, for convenience of description and comparison, in this example, the conductive member 13 and the light-emitting part 14 shown in fig. 3 are also electrically connected by the bonding wire 1 a.

Comparing fig. 2 with fig. 3, on one hand, it can be seen that the conductive part 13 is at a certain height from the transmitting circuit board 11, so that the length of the trace between the light-emitting part 14 and the conductive part 13 is shorter, i.e. the length of the bonding wire 1a in fig. 3 is smaller than the length of the bonding wire 0b in fig. 2, and the conductive part 13 conducts electricity corresponding to a part of the line segment replacing the bonding wire 0 b. In addition, the height of the conductive member 13 from the transmitting circuit board 11 can be adjusted according to specific situations and requirements, so as to further reduce the length of the bonding wire 1a, and the length of the bonding wire 1a can be obviously smaller than that of the bonding wire 0b in fig. 2.

On the other hand, since the inductance of the conductive body (e.g., the conductive member 13, the bonding wire 1a, the bonding wire 0b, or the like) is inversely proportional to the cross-sectional width of the conductive body in the conductive direction, the larger the cross-sectional width of the conductive body in the conductive direction, the smaller the inductance of the conductive body.

However, for the bonding wires (e.g., the bonding wire 0b and the bonding wire 1 a), since the leads for electrical connection in the light emitting parts (e.g., the light emitting part 01 and the light emitting part 14) are thin, the cross-sectional width (also referred to as a cross-sectional diameter) of the bonding wire in the conductive direction is limited, the cross-sectional width of the bonding wire in the conductive direction can be adjusted only to a small extent, and the inductance of the bonding wire has a limited variation.

While for the conductive part 13, after being electrically connected with the optical part 14 through the bonding wire 1a, the cross-sectional width thereof in the conductive direction is not limited by the lead of the light emitting part 14, and the cross-sectional width of the conductive part 13 in the conductive direction may be adjusted according to specific situations and requirements, so that the inductance of the conductive part 13 is significantly reduced. Therefore, when a partial segment of the bonding wire 0b is replaced by the conductive member 13, the inductance of the conductive member 13 can be made much smaller than the inductance of the replaced segment of the bonding wire 0b by adjusting the cross-sectional width of the conductive member 13 in the conductive direction, and the inductance of the conductive member 13 and the bonding wire 1a as a whole can be made much smaller than the inductance of the bonding wire 0 b.

As can be seen from the above description, in the embodiment shown in fig. 3, compared with fig. 2, the conductive component 13 can shorten the length of the related circuit trace of the light emitting component 14, and reduce the inductance of the path from the electrode on the top of the light emitting component 14 to the transmitting circuit board 11, and the path is a part of the whole control loop of the light emitting component 14, so that the loop inductance of the control loop is reduced, thereby reducing the obstruction of the electrical signal flowing through the light emitting component 14, and ensuring that the probe beam emitted by the light emitting component has the expected pulse peak value.

In summary, by adopting the above technical scheme, under the condition of improving the heat dissipation performance of the laser emission device, the length of the wiring of the related circuit of the luminous component can be shortened through the conductive component with a certain height, so that the loop inductance of the control loop where the luminous component is located can be reduced, the obstruction of the electric signal flowing through the luminous component is reduced, and the detection light beam emitted by the luminous component is ensured to have an expected pulse peak value. Therefore, the laser emitting device provided by the embodiment of the specification can improve the reliability, the service life and the signal quality of the laser emitting device at the same time.

It should be noted that the relative structural relationship between the components of the laser emitting device may vary according to the specific circuit arrangement and design requirements, for example, in fig. 3, the heat dissipation component 12 and the conductive component 13 are both disposed on the upper surface of the emitting circuit board 11, while in other examples, the heat dissipation component and the conductive component may be disposed on the lower surface of the emitting circuit board. The present specification does not specifically limit the relative structural relationship between the components in the laser transmitter.

In practical application, the control circuit structure of the transmitting circuit board can be designed according to specific situations and requirements. For example, the control circuit may include: the controller may be implemented by a Central Processing Unit (CPU), a Field Programmable Gate Array (FPGA), or other Processing chips. For another example, the control Circuit may be implemented by an Application Specific Integrated Circuit (ASIC). For another example, the control circuit may include: one or more integrated circuits for implementing the control of the light emitting components. The present specification does not specifically limit the control circuit configuration.

In a specific implementation, the light emitting component may be connected to the heat dissipating component by at least one of bonding and welding. The heat dissipation member may be connected to the emission circuit board by at least one of fixing means such as bonding and soldering, for example, in fig. 3, the heat dissipation member 12 is fixed to the emission circuit board 11 by a land 1 b. The conductive member may be connected to the circuit board by fixing means such as bonding or soldering, for example, in fig. 3, the conductive member 13 is fixed to the transmitting circuit board 11 by a pad 1c, and the conductive member 13 may be electrically connected to the transmitting circuit board 11 by the pad 1 c.

In a specific implementation, the first surface of the conductive component is opposite to the first surface of the heat dissipation component, and the structures of the first surface of the conductive component and the first surface of the heat dissipation component are matched. Wherein the structure may include at least one of an oblique direction and a shape. The first surface of the conductive member and the first surface of the heat dissipation member may be configured to be matched with each other according to specific conditions, and the configuration of the first surface of the conductive member and the configuration of the first surface of the heat dissipation member are not particularly limited in this specification. In addition, the position of the first surface of the conductive component in the conductive component and the position of the first surface of the heat dissipation component in the heat dissipation component can be determined according to specific circuit arrangement conditions and design requirements.

For example, the first surface of the conductive member may be a side surface of the conductive member, the first surface of the heat dissipation member may be a side surface of the heat dissipation member, and the first surface of the conductive member may be opposite to the first surface of the heat dissipation member.

For another example, the first surface of the conductive member may be one side surface of the conductive member, the first surface of the heat dissipation member may be one side surface of the heat dissipation member, and the first surface of the conductive member and the first surface of the heat dissipation member may be opposite to each other and may have a convex surface and a concave surface whose shapes are matched with each other.

Therefore, the distance between the conductive part and the radiating part can be reduced, the conductive part is closer to the light-emitting part, and the length of the circuit routing related to the light-emitting part is shortened.

In a specific implementation, the heat dissipation member may further include: contacting the second surface of the light emitting part, and contacting the third surface of the emission circuit board. The positions of the second surface and the third surface of the heat dissipation component in the heat dissipation component can be determined according to specific circuit arrangement conditions and design requirements. For example, referring to fig. 3 and 4, the second surface 12-2 of the heat dissipation member 12 for contacting the light emitting part 14 is an upper surface, and the third surface 12-3 of the heat dissipation member 12 for contacting the emission circuit board 11 is a lower surface.

In a specific implementation, the area of the second surface of the heat sink member may be smaller than the area of the third surface of the heat sink member. For example, with continued reference to fig. 3 and 4, the area of the second surface 12-2 of the heat sink 12 is less than the area of the third surface 12-3. Therefore, the contact area between the radiating component and the transmitting circuit board can be increased by increasing the area of the third surface in the radiating component, so that the radiating capacity of the radiating component is improved, and the reliability of fixing the radiating component on the transmitting circuit board is improved.

In a specific implementation, the conductive component may further include: a second surface electrically connected with the light emitting part, and a third surface contacting the emission circuit board. Wherein the second surface and the third surface of the conductive component are located in the conductive component according to specific circuit layout conditions and design requirements.

Optionally, in order to further shorten the length of the circuit trace related to the light emitting component, the second surface and the third surface of the conductive component may correspond to the second surface and the third surface of the heat dissipating component, respectively.

For example, referring to fig. 3 and 4, a second surface 13-2 of the conductive member 13 electrically connected to the light-emitting member 14 corresponds to a second surface 12-2 of the heat-radiating member 12, which is an upper surface of the conductive member 13; the third surface 13-3 of the conductive member 13 for contacting the transmitting circuit board 11 corresponds to the third surface 12-3 of the heat radiating member 12, and is a lower surface of the conductive member 13. Thereby, the length of the circuit trace (e.g., the bonding wire 1 a) between the light-emitting part 14 and the conductive member 13 can be further shortened.

In a specific implementation, the second surface and the third surface of the heat dissipation member may be respectively adjacent to the first surface thereof, and thus, by designing the overall structure of the heat dissipation member, the area of the second surface of the heat dissipation member may be made smaller than the area of the third surface of the heat dissipation member. For example, referring to fig. 3 and 4, the heat dissipation member 12 is a trapezoid, and the first surface 12-1 of the heat dissipation member 12 is a slope inclined from top to bottom in a direction toward the conductive member 13, so that the area of the second surface 12-2 of the heat dissipation member 12 is smaller than the area of the third surface 12-3 of the heat dissipation member 12.

Similarly, the second surface and the third surface of the conductive member may be respectively adjacent to the first surface thereof, and since the first surface of the conductive member is matched with the structure of the first surface of the heat dissipation member, the structure of the first surface of the conductive member may be designed according to the structure of the first surface of the heat dissipation member. For example, referring to fig. 3 and 4, since the first surface 12-1 of the heat dissipating member 12 is an inclined surface inclined from top to bottom in the direction of the conductive member 13, the first surface 13-1 of the conductive member 13 is an inclined surface inclined from top to bottom in the direction of the inside of the conductive member 13 in accordance with the inclination direction of the first surface 12-1 of the heat dissipating member 12.

Based on the above, in practical applications, by designing the entire structure of the conductive member, the area of the second surface of the conductive member can be made larger than the area of the third surface of the conductive member. For example, as shown in fig. 3 and 4, the conductive member 13 is a trapezoidal body, and the first surface 13-1 of the conductive member 13 is a slope inclined from top to bottom toward the inside of the conductive member 13, whereby the area of the second surface 13-2 is larger than the area of the third surface 13-3 of the conductive member 13.

In this way, the second surface of the conductive component and the second surface of the heat dissipation component can form area complementation, and the third surface of the conductive component and the third surface of the heat dissipation component can also form area complementation, so that the space occupied by the conductive component and the heat dissipation component in the laser emitting device can be effectively saved, and the utilization rate of the internal space of the laser emitting device can be improved.

In a specific implementation, a height of a second surface of the heat dissipation member contacting the light emitting part from the emission circuit board is not greater than a height of a second surface of the conductive member electrically connected to the light emitting part from the emission circuit board. For example, with continued reference to fig. 3 and 4, if the height of the second surface of the heat sink member 12 from the emitter circuit board 11 is h1 and the height of the second surface 13-2 of the conductive member 13 from the emitter circuit board 11 is h2, then h1 is not greater than h2.

By adopting the scheme, the length of the related circuit wiring of the light-emitting component can be further shortened, and the second surface distance of the heat-radiating component is arranged at the height of the transmitting circuit board and the second surface distance of the conductive component is arranged at the height of the transmitting circuit board, so that the length of the related circuit wiring of the light-emitting component is consistent with the wiring length when the light-emitting component is directly fixed on the transmitting circuit board, and even the wiring length can be smaller than the wiring length when the light-emitting component is directly fixed on the transmitting circuit board, thereby reducing the loop inductance of the control circuit.

As can be seen from the above description, the light-emitting component may also form a control loop with the transmitting circuit board through the conductive component and other components in the laser emitting device, and may also form a control loop with the transmitting circuit board through the conductive component. For ease of understanding and implementation, the following description will be made with reference to specific examples and drawings, depending on how different control loops are formed between the light emitting part and the transmitting circuit board.

In one control circuit forming method, the heat radiating member has conductivity in addition to thermal conductivity, and therefore the light emitting member may be electrically connected to the transmission circuit board through the heat radiating member in addition to the conductive member. Thus, the light-emitting part forms a control circuit with the emission circuit board through the conductive member and the heat-radiating member.

Specifically, the light emitting part may include: a first electrode and a second electrode that are distinct. Wherein the first electrode is electrically connected to the heat dissipating member, and the second electrode is electrically connected to the conductive member.

It is understood that, in practical applications, the first electrode may be determined to be a positive electrode or a negative electrode of the light emitting component, and the second electrode may be determined to be a negative electrode or a positive electrode of the light emitting component according to specific circuit arrangement conditions and design requirements.

It can also be understood that, according to the relative structural relationship between the light-emitting component and the heat dissipation component, the first electrode of the light-emitting component may be directly electrically connected and fixed to the heat dissipation component by welding, or may be electrically connected to the heat dissipation component by other conductive devices. And, the second electrode of the light emitting part may be electrically connected to the conductive member by a connection means such as wire bonding, conductive device bridging, or the like, according to a relative structural relationship of the light emitting part and the conductive member.

In a specific implementation, in order to make the heat dissipation component have both thermal conductivity and electrical conductivity, the heat dissipation component may include any one of the following:

1) And the conductive carrier is electrically connected with the first electrode and the transmitting circuit board respectively.

In practical application, the conductive material adopted by the conductive carrier is determined according to the conductive performance requirement and the process requirement. For example, the conductive material may be any one of: a metal material such as gold, silver, or copper; an alloy material synthesized from two or more metals.

Specifically, referring to fig. 3, the heat sink 12 may include a conductive carrier (not shown). The conductive carrier of the heat-radiating member 12 is electrically connected to a first electrode (not shown) of the light-emitting member 14 and the emission circuit board 11, respectively.

2) A thermally conductive carrier and an electrically conductive sub-assembly. The heat conducting carrier is made of a heat conducting non-conductive material and is fixedly connected with the light emitting component and the transmitting circuit board respectively; the conductive sub-elements are electrically connected with the first electrode and the transmitting circuit board respectively.

In practical applications, on one hand, the thermally conductive and electrically non-conductive material used for the thermally conductive carrier may be determined according to the thermal conductivity requirement and the process requirement, for example, the thermally conductive and electrically non-conductive material may be ceramic. And determining the conductive material adopted by the conductive sub-element according to the conductive performance requirement and the process requirement. For example, the conductive material may be any one of: a metal material such as gold, silver, or copper; an alloy material synthesized from two or more metals.

On the other hand, the relative structural relationship between the electrically conductive sub-element and the thermally conductive carrier may be set as the case may be, for example, the electrically conductive sub-element may be contained in the thermally conductive carrier or may be disposed around the thermally conductive carrier.

In an alternative example, as shown in fig. 5, for a schematic structural diagram of another laser emitting device provided in an embodiment of the present specification, a laser emitting device F2 includes: a transmitting circuit board 21, a heat-radiating member 22, a conductive member 23, a light-emitting member 24, a bonding wire 2a, a pad 2b, and a pad 2c. Wherein the heat sink member 22 includes a thermally conductive carrier 22-1 and an electrically conductive sub-member 22-2; the light emitting part 24 includes a first electrode (not shown) and a second electrode (not shown).

For the heat dissipation component 22, its heat conductive carrier 22-1 is fixed on the emitting circuit board 21 by the bonding pad 2b, and the heat conductive carrier 22-1 is provided with a light emitting component 24. The thermally conductive carrier 22-1 includes a through hole (not shown) that communicates the light emitting part 24 and the emission circuit board 21 and is filled with an electrically conductive sub-part 22-2. One end of the conductive sub-member 22-2 is electrically connected to the emission circuit board 21, and the other end is electrically connected to the first electrode of the light emitting part 24.

As for the conductive member 23, it is fixed to the emission circuit board 21 through the pad 2c and electrically connected to the emission circuit board 21, and the conductive member 23 is provided at a distance from the heat dissipation member 22 and electrically connected to the second electrode of the light emitting member 24 through the bonding wire 2 a. The relative structural relationship between the conductive member 23 and the heat dissipation member 22 can refer to the above description, and will not be described herein again.

In a specific implementation, in order to provide the conductive member with conductivity, the conductive member may include any one of:

1) And the conductive base body is electrically connected with the second electrode and the transmitting circuit board respectively.

In actual application, the conductive material adopted by the conductive base body is determined according to the conductive performance requirement and the process requirement. For example, the conductive material may be any one of: a metal material such as gold, silver, or copper; an alloy material composed of two or more metals.

Specifically, referring to fig. 5, the conductive member 23 may include a conductive base (not shown). The conductive base of the conductive member 23 is electrically connected to the second electrode of the light-emitting part 14 and the emission circuit board 21, respectively.

2) The transmitting circuit board comprises a non-conductive substrate and a conductive layer covering the surface of the non-conductive substrate, wherein the non-conductive substrate is fixedly connected with the transmitting circuit board, and the conductive layer is electrically connected with the second electrode and the transmitting circuit board respectively.

In practical applications, the non-conductive material used for the non-conductive substrate can be determined according to non-conductive performance requirements and process requirements, and for example, the non-conductive material can be ceramic. And the conductive material adopted by the conductive layer can be determined according to the conductive performance requirement and the process requirement. For example, the conductive material may be any one of: a metal material such as gold, silver, or copper; an alloy material synthesized from two or more metals.

On the other hand, the coverage degree of the conductive layer on the non-conductive substrate can be determined according to the conductive performance requirement and the process requirement. For example, the conductive layer may cover all surfaces of the non-conductive substrate, or may cover a portion of the surface of the non-conductive substrate. For example, the conductive layer may cover a partial region of the surface of the non-conductive substrate, or may cover the entire region of the surface of the non-conductive substrate. In addition, the conductive layer can be coated on the surface of the non-conductive substrate through a coating process.

In an alternative example, as shown in fig. 6, for a schematic structural diagram of another laser emitting device provided in the embodiments of the present specification, a laser emitting device F3 includes: a transmitting circuit board 31, a heat radiating member 32, a conductive member 33, a light emitting part 34, a bonding wire 3a, a pad 3b, and a pad 3c. Wherein the heat sink 32 includes a thermally conductive carrier 32-1 and an electrically conductive sub-assembly 32-2. The conductive member 33 includes: a non-conductive substrate 33-1 and a conductive layer 33-2.

The structural relationship, functional principle, and the like of the transmitting circuit board 31, the heat dissipating member 32, the light emitting member 34, the bonding wires 3a, and the pads 3b can be referred to the description of the relevant parts, and are not described herein again.

As for the conductive member 33, its non-conductive base 33-1 is fixed to the emitting circuit board 31 via a pad 3c, and is provided at a distance from the heat dissipating member 32; the conductive layer 33-2 may be in a "U" shape to cover the surface of the non-conductive substrate 33-1, specifically, in fig. 6, the conductive layer 33-2 covers a partial region of the upper surface, a partial region of the right side surface, and a partial region of the lower surface of the non-conductive substrate 33-1, and the portion of the conductive layer 33-2 covering the lower surface of the non-conductive substrate 33-1 is electrically connected to the emission circuit board 31 through the pad 3c and to the second electrode of the light emitting part 24 through the bonding wire 3 a. The relative structure relationship between the non-conductive substrate 33-1 and the heat dissipation component 22 can be referred to the description of the relative structure relationship between the conductive component and the heat dissipation component, and is not described herein again.

In another control loop forming manner, the light emitting part may be electrically connected to the emission circuit only through a conductive member, thereby forming a control loop. Specifically, the light emitting part may include: a light emitting sub-assembly and a conductive plate assembly. The light-emitting sub-component comprises a first electrode and a second electrode which are different in polarity, the first electrode is electrically connected with the conductive component through the conductive plate component, and the second electrode is electrically connected with the conductive component.

It is understood that, in practical applications, the first electrode may be determined to be a positive electrode or a negative electrode of the light emitting component, and the second electrode may be determined to be a negative electrode or a positive electrode of the light emitting component according to specific circuit arrangement conditions and design requirements.

It is further understood that, in practical applications, the specific position of the conductive plate of the light-emitting component may be determined according to the relative structural relationship between the light-emitting component and the heat dissipation component, for example, the conductive plate of the light-emitting component may be located between the first electrode of the light-emitting sub-component and the heat dissipation component, so as to facilitate electrical connection and fixation. And, depending on the relative structural relationship of the light emitting component and the conductive member, the first electrode of the light emitting sub-element may be electrically connected to the conductive member by a connection means such as wire bonding, conductive device bridging, etc., and the conductive plate element may be electrically connected to the conductive member by a connection means such as wire bonding, conductive device bridging, etc.

In addition, the conductive plate member of the light emitting part may be fixed between the first electrode of the light emitting sub-member and the heat dissipating member by at least one fixing means such as adhesion and welding. The conductive plate of the light-emitting component can be electrically connected and fixed with the first electrode of the light-emitting sub-component in a welding mode.

In a specific implementation, in order to make the heat dissipation component have heat conductivity, the heat dissipation component can be made of a heat-conducting non-conductive material. Wherein, the non-conductive material can be made according to the heat-conducting performance requirement and the process requirement. For example, the thermally conductive, electrically non-conductive material may be a ceramic.

In a specific implementation, in order to provide the conductive member with conductivity, the conductive member may include any one of:

1) And one of the two conductive substrates is electrically connected with the conductive plate, and the other conductive substrate is electrically connected with the second electrode.

In practical application, the conductive material adopted by the conductive substrate is determined according to the conductive performance requirement and the process requirement. For example, the conductive material may be any one of: a metal material such as gold, silver, or copper; an alloy material synthesized from two or more metals.

In an alternative example, as shown in fig. 7, for a schematic structural diagram of another laser emitting device provided in an embodiment of the present specification, a laser emitting device F4 includes: a transmitting circuit board 41, a heat-dissipating member 42, a conductive member 43, a light-emitting member 44, a bonding wire 4a, a bonding wire 4b, a pad 4c, a pad 4d, and a pad 4e. Wherein the conductive member 43 includes a conductive base 43-1 and a conductive base 43-2; the light emitting component 44 includes a light emitting sub-component 44-1 and a conductive plate component 44-2, and the light emitting sub-component 44-1 includes a first electrode (not shown) and a second electrode (not shown) with different polarities.

The heat dissipation member 42 is fixed to the emission circuit board 41 by a pad 4 c. Wherein the heat dissipation member 42 is made of a thermally conductive, electrically non-conductive material.

As for the conductive member 43, its conductive base 43-1 is fixed to the transmitting circuit board 41 through the pad 4d and electrically connected to the transmitting circuit board 41, and its conductive base 43-2 is fixed to the transmitting circuit board 41 through the pad 4e and electrically connected to the transmitting circuit board 41. The conductive substrate 43-1 and the conductive substrate 43-2 are spaced apart from each other, and the conductive substrate 43-1 and the conductive substrate 43-2 are spaced apart from the heat dissipation member 42, respectively. The relative structural relationship between the conductive substrate 43-1 and the heat dissipation member 42 and the relative structural relationship between the conductive substrate 43-2 and the heat dissipation member 42 can be described with reference to the above-mentioned relative structural relationship between the conductive member and the heat dissipation member, and are not described herein again. The conductive substrate 43-1 is electrically connected to the second electrode of the light emitting sub-assembly 44-1 through the bonding wire 4a, and the conductive substrate 43-2 is electrically connected to the conductive plate 44-2 through the bonding wire 4 b.

For the light emitting component 44, the conductive plate 44-2 is disposed on the heat dissipating component 42, the light emitting sub-component 44-1 is disposed on the conductive plate 44-2, and the first electrode of the light emitting sub-component 44-1 is electrically connected to the conductive plate 44-2, i.e., the conductive substrate 43-2 is indirectly electrically connected to the first electrode of the light emitting sub-component 44-1.

2) The conductive layer is covered on the surface of the same non-conductive substrate at intervals, or the two conductive layers are respectively covered on different non-conductive substrates; one of the two conductive layers is electrically connected to the conductive plate member, and the other is electrically connected to the second electrode.

In practical applications, the non-conductive material used for the non-conductive substrate can be determined according to non-conductive performance requirements and process requirements, and for example, the non-conductive material can be ceramic. And the conductive material adopted by the conductive layer can be determined according to the conductive performance requirement and the process requirement. For example, the conductive material may be any one of: a metal material such as gold, silver, or copper; an alloy material synthesized from two or more metals.

On the other hand, if the two conductive layers cover the surface of the same non-conductive substrate at intervals, the covering condition of the two conductive layers on the surface of the same non-conductive substrate can be determined according to specific conditions, for example, the two conductive layers can cover different areas of the same surface in the same non-conductive substrate at intervals, or can cover the same surface of the same non-conductive substrate at intervals partially and cover different surfaces of the same non-conductive substrate partially.

Further, if the two conductive layers at least partially cover different surfaces of the same non-conductive substrate, the coverage degree of the conductive layers on different surfaces of the non-conductive substrate can be determined according to the conductive performance requirement and the process requirement. For example, the conductive layer may cover a portion of the corresponding surface of the non-conductive substrate, or may cover the entire corresponding surface of the non-conductive substrate.

In another aspect, if the two conductive layers are respectively covered on different non-conductive substrates, the coverage degree of each conductive layer on the corresponding non-conductive substrate can be determined according to the conductive performance requirement and the process requirement. For example, the conductive layer may cover all surfaces of the corresponding non-conductive substrate, or may cover a portion of the surfaces of the corresponding non-conductive substrate. For example, the conductive layer may cover a partial region of the surface of the non-conductive substrate, or may cover the entire region of the surface of the non-conductive substrate.

In addition, according to the conductive performance requirement and the process requirement, the coverage areas of the two conductive layers on the surface of the non-conductive substrate can be the same, and the coverage areas can also have size difference. The conductive layer can be covered on the surface of the non-conductive substrate through a coating process.

In an alternative example, as shown in fig. 8, for a schematic structural diagram of another laser emitting device provided in the embodiments of the present specification, a laser emitting device F5 includes: a transmitting circuit board 51, a heat-dissipating member 52, a conductive member 53, a light-emitting member 54, a bonding wire 5a, a bonding wire 5b, a pad 5c, a pad 5d, and a pad 5e. Wherein the conductive member 53 comprises a non-conductive base 53-a, a conductive layer 53-1, and a conductive layer 53-2; the light emitting component 54 includes a light emitting sub-component 54-1 and a conductive plate component 54-2, and the light emitting sub-component 54-1 includes a first electrode (not shown) and a second electrode (not shown) with different polarities.

The heat dissipation member 52 is fixed to the emission circuit board 51 by a pad 5 c. Wherein the heat dissipation member 52 is made of a thermally conductive, electrically non-conductive material.

For the conductive component 53, the non-conductive base 53-a thereof is fixed to the emitting circuit board 51 through the pad 5d and the pad 5e and is disposed at a distance from the heat dissipation component 52, wherein the relative structural relationship between the non-conductive base 53-a and the heat dissipation component 52 can be described with reference to the above-mentioned relative structural relationship between the conductive component and the heat dissipation component, and is not described again here.

The conductive layers 53-1 and 53-2 of the conductive member 53 are spaced apart in a "U" shape over the surface of the non-conductive substrate 53-a. Specifically, in fig. 8, the conductive layer 53-1 and the conductive layer 53-2 are alternately covered on a partial region of the upper surface, a partial region of the right side surface, and a partial region of the lower surface of the non-conductive substrate 33-1. The part of the conductive layer 53-1 covering the lower surface of the non-conductive base 53-a is electrically connected to the emission circuit board 51 through a pad 5d and electrically connected to the second electrode of the light emitting sub-element 54-1 through a bonding wire 5a, and the part of the conductive layer 53-2 covering the lower surface of the non-conductive base 53-a is electrically connected to the emission circuit board 51 through a pad 5e and electrically connected to the conductive plate 54-2 through a bonding wire 5 b.

For the light emitting component 54, the conductive plate 54-2 is disposed on the heat dissipating component 52, the light emitting sub-component 54-1 is disposed on the conductive plate 54-2, and the first electrode of the light emitting sub-component 54-1 is electrically connected to the conductive plate 54-2, i.e., the conductive layer 53-2 is indirectly electrically connected to the first electrode of the light emitting sub-component 54-1.

In a specific implementation, if the conductive component is electrically connected to the light emitting component through bonding wires, the number of the bonding wires may be set according to a power supply requirement of the light emitting component, that is, the conductive component is electrically connected to the light emitting component through at least one bonding wire. Specifically, if a bonding wire can satisfy the power supply requirement of the light-emitting part, the light-emitting part and the conductive part can be provided with the bonding wire therebetween, and if the bonding wire cannot satisfy the power supply requirement of the light-emitting part, the number of the bonding wires between the light-emitting part and the conductive part can be increased, so that a larger current which is more uniformly distributed in the light-emitting part is supplied to the light-emitting part, and the light-emitting performance of the light-emitting part is guaranteed.

In an alternative example, as shown in fig. 9, for a schematic structural diagram of another laser emitting device provided in the embodiments of the present specification, a laser emitting device F6 includes: a transmitting circuit board 61, a heat radiating member 62, a conductive member 63, a light emitting part 64, a bonding wire 6a, a bonding wire 6b, a pad 6c, and a pad 6d.

It is to be understood that the structural relationship, functional principle, and the like of the heat dissipation member 62, the pads 6c, and the pads 6d can be referred to the above-mentioned related matters, and are not described in detail herein.

The light emitting part 64 includes first and second electrodes that are different; a first electrode of the light-emitting part 64 is electrically connected to the heat-dissipating part 62, and a second electrode of the light-emitting part 64 is electrically connected to the conductive member 63 through the bonding wires 6a and 6 b. Thereby, the bonding wires 6a and 6b may supply a larger and more evenly distributed current inside the light emitting part 64 to the light emitting part 64, thereby securing the light emitting performance of the light emitting part 64.

In a specific implementation, the type of the device having the light emitting function in the light emitting part may be determined according to specific light emitting requirements. For example, the light Emitting part may be implemented by a Laser such as an Edge Emitting Laser (EEL) or a Vertical Cavity Surface Emitting Laser (VCSEL). Specifically, in fig. 3 to 8, the light emitting part 14 to the light emitting part 54 are all implemented by the EEL, and further, the light emitting sub-piece 44-1 in the light emitting part 44 and the light emitting sub-piece 54-1 in the light emitting part 54 are all implemented by the EEL. In fig. 9, the light emitting part 64 is implemented by a VCSEL.

In a specific implementation, the conductive part may be disposed around the non-light-emitting surface of the light-emitting part. For example, as shown in fig. 3, the light emitting surface of the light emitting component 14 is a left side surface, and the probe beam generated by the light emitting component 14 can be emitted in a direction indicated by an arrow 1 d. The conductive member 13 is provided around the non-light-emitting surface of the light-emitting member 14 (i.e., the right side surface of the light-emitting member 14). For another example, as shown in fig. 9, a light emitting surface of the light emitting component 64 is an upper surface, and the probe beam generated by the light emitting component 64 can be emitted in a direction indicated by an arrow 6 e. The conductive member 63 is provided around the non-light-emitting surface of the light-emitting member 64 (i.e., the right side surface of the light-emitting member 64). In a specific implementation, there is a case where the power supply requirement of the light emitting part is high, for example, the power supply requirement of the VCSEL is higher than that of the EEL, and if the power supply requirement of the light emitting part formed by the VCSEL is provided by one conductive part, there may be problems of insufficient driving and uneven power supply. The arrangement mode of the conductive parts can be determined according to the circuit arrangement condition and the design requirement.

In an alternative example, as shown in fig. 10, for a schematic structural diagram of another laser emitting device provided in the embodiments of the present specification, a laser emitting device F7 includes: a transmitting circuit board 71, a heat dissipating part 72, a conductive member 73, a light emitting part 74, a bonding wire 7a, a bonding wire 7b, a pad 7c, a pad 7d, and a pad 7e.

The conductive member 731 and the conductive member 732 are disposed on the opposite side of the heat dissipation member 72, and both the conductive member 731 and the conductive member 732 are spaced apart from the heat dissipation member 72. Specifically, the conductive members 731 are disposed at intervals on the right side of the heat dissipation member 72, and the left side surface of the conductive members 731 (i.e., the first surface of the conductive members 731) is opposite to the right side surface of the heat dissipation member 72 (i.e., a first surface of the heat dissipation member 72), and the structures of the two are matched. Specifically, the right side surface of the heat dissipating member 72 is inclined from top to bottom toward the conductive member 731, and the left side surface of the conductive member 731 is inclined from top to bottom toward the inside of the conductive member 731.

The conductive member 732 is provided at the left side of the heat radiating member 72 with a space therebetween. The right side surface of the conductive member 732 (i.e., the first surface of the conductive member 732) is opposite to the left side surface of the heat dissipation member 72 (i.e., the other first surface of the heat dissipation member 72), and the structures of the two are matched. Specifically, the left side surface of the heat dissipating member 72 is inclined from top to bottom toward the conductive member 732, and the left side surface of the conductive member 732 is inclined from top to bottom toward the inside of the conductive member 732.

The conductive member 731 is electrically connected to the second electrode of the light-emitting part 74 through the bonding wire 7b, and is fixed to the emission circuit board 71 through the pad 7d and electrically connected to the emission circuit board 71. The conductive member 732 is electrically connected to the second electrode of the light emitting part 74 through the bonding wire 7a, and is fixed to the transmitting circuit board 71 through the pad 7c and electrically connected to the transmitting circuit board 71.

The first electrode of the light-emitting member 74 is electrically connected to the heat-dissipating member 72. The heat dissipation member 72 is fixed to the emission circuit board 71 by the pad 7e and electrically connected to the emission circuit board 71. It is to be understood that the structural relationship, the functional principle, and the like of the transmitting circuit board 71, the heat dissipating member 72, and the light emitting member 74 can refer to the description of the relevant parts, and the detailed description thereof is omitted here.

In an alternative example, as shown in fig. 11, for a schematic structural diagram of another laser emitting device provided in the embodiments of the present specification, a laser emitting device F8 includes: a transmitting circuit board 81, a heat-radiating member 82, a conductive member 83, a light-emitting member 84, a bonding wire 8a, a bonding wire 8b, a pad 8c, and a pad 8d.

The conductive member 831 and the conductive member 832 are provided at intervals on the same side of the heat dissipation member 82, and the conductive member 831 and the conductive member 832 are both spaced from the heat dissipation member 82. The left side surface of the conductive member 831 (i.e., the first surface of the conductive member 831) and the left side surface of the conductive member 832 (i.e., the first surface of the conductive member 832) are both opposed to the right side surface of the heat dissipation member 82 (i.e., the first surface of the heat dissipation member 82), and the structures of the two are matched. Specifically, the right side surface of heat radiating member 82 is inclined from top to bottom toward conductive members 831 and 832, while the left side surface of conductive member 831 is inclined from top to bottom toward the inside of conductive member 831, and the left side surface of conductive member 832 is also inclined from top to bottom toward the inside of conductive member 832.

The conductive member 831 is electrically connected to the second electrode of the light-emitting part 84 through the bonding wire 8a, the conductive member 832 is electrically connected to the second electrode of the light-emitting part 84 through the bonding wire 8b, and both the conductive member 831 and the conductive member 832 are fixed to the transmission circuit board 81 through the pad 8d and are electrically connected to the transmission circuit board 81.

The first electrode of the light-emitting member 84 is electrically connected to the heat-dissipating member 82. The heat dissipation member 82 is fixed to the emission circuit board 81 by the pad 8c and electrically connected to the emission circuit board 81. It is to be understood that the structural relationship, functional principle, and the like of the transmitting circuit board 81, the heat dissipating member 82, and the light emitting member 84 may refer to the description of the relevant portions, and will not be described herein again.

When a plurality of conductive members are present, the inclination angles of the plurality of conductive members may be the same or different. The volumes of the plurality of conductive members may be the same or different. This specification does not specifically limit this.

In a specific implementation, the laser emitting device may include at least one light emitting part and at least one conductive part. When the laser emitting apparatus includes a plurality of conductive members, at least a part of the conductive members are electrically connected to the same light emitting part, and when the laser emitting apparatus includes a plurality of light emitting parts, at least a part of the light emitting parts are electrically connected to the same conductive member. Specifically, when the laser emitting apparatus includes one light emitting part and one conductive part, the light emitting part and the conductive part are electrically connected in one-to-one correspondence; when the laser emitting apparatus includes one light emitting part and a plurality of conductive members, one light emitting part is electrically connected to the plurality of conductive members in a one-to-many manner; when the laser emitting apparatus includes a plurality of light emitting parts and one conductive member, the plurality of light emitting parts are electrically connected to the one conductive member in many-to-one electrical connection; when the laser emitting apparatus includes a plurality of light emitting parts and a plurality of conductive members, there may be a one-to-one, one-to-many, or many-to-one correspondence relationship between the plurality of light emitting parts and the plurality of conductive members, depending on the total number of light emitting parts and the total number of conductive members.

In practical applications, in order to improve the internal space utilization of the laser emitting apparatus, when the laser emitting apparatus includes a plurality of light emitting parts, the plurality of light emitting parts may be arranged in an array form. Wherein, according to specific circuit arrangement and luminous demand, a plurality of luminous components can arrange according to the form of line column, also can arrange according to the form of face array.

In a specific implementation, when the laser emitting device includes a plurality of light emitting parts, and the plurality of light emitting parts are arranged in the form of a surface array, the plurality of light emitting parts may be arranged in a staggered manner in order to improve the resolution of the laser emitting device. To facilitate an understanding of the differences between the staggered and non-staggered arrangements, a detailed description is given below with reference to the accompanying drawings.

In an alternative example, as shown in fig. 12, a schematic diagram illustrating a comparison between a staggered arrangement and a non-staggered arrangement of a plurality of light emitting components according to an embodiment of the present disclosure is provided. In sub-drawing (a) of fig. 12, a plurality of light emitting members are arranged in an area array on the heat dissipating member 121 in the first direction x and the second direction y, and the plurality of light emitting members are arranged in a staggered manner in the y direction, and the distance between two adjacent light emitting members in the y direction is h3.

In sub-drawing (b) of fig. 12, the plurality of light emitting parts are arranged only in the area array form in the first direction x and the second direction y on the heat dissipating part 121, and are not arranged in a staggered manner, and the distance between two adjacent light emitting parts in the y direction is h4.

As can be seen from a comparison of sub-drawing (a) and sub-drawing (b), the pitch between the adjacent light emitting parts staggered in the second direction y is smaller than the pitch between the adjacent light emitting parts non-staggered in the second direction y, i.e., h3 < h4. And the resolution of the laser emitting device in the second direction y can be improved by reducing the distance in the second direction y, so that the resolution of the laser emitting device in the second direction y can be improved by the plurality of light emitting parts which are arranged in the second direction y in a staggered manner.

In a specific implementation, the total number of conductive components is related to lighting requirements, wherein the lighting requirements may include at least one of: the number of light emitting parts that emit light synchronously; a total number of groups of light emitting parts; the type of light emitting component.

For example, the total number of the light emitting parts is N, and the N light emitting parts emit light simultaneously, if the light emitting parts are implemented by EEL, the total number of the conductive parts may be 1; if the light emitting part is implemented by a VCSEL, the total number of the conductive parts may be 2. Wherein N is a positive integer greater than 1. Therefore, the N light emitting components can be synchronously gated, and the N light emitting components can synchronously emit light.

For another example, the total number of the light emitting parts is P, and the P light emitting parts are divided into Q groups to emit light, that is, the total number of the P light emitting parts is Q, and if the light emitting parts are implemented by EEL, the total number of the conductive parts may be Q; if the light emitting part is implemented by a VCSEL, the total number of conductive parts may be 2Q. Wherein P and M are positive integers greater than zero, and M is less than P. Therefore, partial light emitting components in the N light emitting components can be synchronously gated, and grouping light emitting of the N light emitting components is realized.

From the above, the total number of the conductive members is determined according to the light emission requirement, so that various light emission requirements can be satisfied, the hardware cost can be reduced, and the utilization rate of the internal space of the laser emitting device can be improved.

In a specific implementation, the laser emitting apparatus may include at least one light emitting component and at least one heat dissipating component, and since a surface of the heat dissipating component for disposing the light emitting component may be flexibly adjusted, so that a size of the surface is far larger than a size of the light emitting component, the light emitting component and the heat dissipating component may be in one-to-one or many-to-one correspondence. When the light emitting part and the heat dissipation part are in a many-to-one correspondence relationship, the light emitting part can be arranged in an array form in the heat dissipation part.

In a specific implementation, if the plurality of light emitting components included in the laser emitting apparatus emit light in groups, the total number of the heat radiating components may correspond to the total number of the groups of the plurality of light emitting components. For example, if the total number of the light emitting members is J, and the J light emitting members are divided into K groups to emit light, that is, the total number of the J light emitting members is K, the total number of the heat dissipating members may be K. Therefore, crosstalk between different groups of light emitting components can be avoided, the grouped light emitting components can be independently controlled, and reliability and controllability of the laser emitting device are improved.

In order to make the correspondence among the light emitting part, the heat radiating part, and the conductive part more intuitive to those skilled in the art, the following is described in detail by specific examples.

In an alternative example, as shown in fig. 13, the laser emitting device F9 includes: a transmitting circuit board 91, a heat dissipating part 92, a conductive member 93, a light emitting part 94-1 to a light emitting part 94-8, a bonding wire 9a-1 to a bonding wire 9a-8, a pad 9b, and a pad 9c.

The heat dissipation member 92 is fixed to the emission circuit board 91 through the pad 9b and electrically connected to the emission circuit board 91. The conductive member 93 is fixed to the transmitting circuit board 91 through the pad 9c and electrically connected to the transmitting circuit board 91. The relative structural relationship between the heat dissipation member 92 and the conductive member 93 can be referred to the description of the relevant parts, and will not be described herein.

The light-emitting members 94-1 to 94-8 are arranged in a line array on the heat-dissipating member 92, and have the same structural relationship with the heat-dissipating member 92 and the conductive member 93, respectively. Taking the light-emitting part 94-1 as an example, the light-emitting part 94-1 includes a first electrode electrically connected to the heat-dissipating part 92 and a second electrode electrically connected to the conductive part 93 through the bonding wire 9 a-1. By analogy, the structural relationship of the light-emitting members 94-2 to 94-8 with the heat-dissipating member 92 and the conductive member 93, respectively, can be obtained, and will not be described herein again.

Based on the structural relationship of the light emitting components 94-1 to 94-8, the light emitting components 92 and 93 may be synchronously gated on the light emitting components 94-1 to 94-8 to achieve 8 light emitting components to emit light synchronously, for example, EEL in this example.

In an alternative example, as shown in fig. 14, the laser emitting device F10 includes: a transmitting circuit board 101, a heat radiating member 102, a conductive member 1031 and a conductive member 1032, light emitting members 1041 to 1048, bonding wires 10a-11 to bonding wires 10a-18, bonding wires 10a-21 to bonding wires 10a-28, a pad 10b, a pad 10c, and a pad 10d.

The heat dissipation member 102 is fixed to the emission circuit board 101 by the pads 10c and electrically connected to the emission circuit board 101. The conductive member 1031 is fixed to the transmitting circuit board 101 by a pad 10b and electrically connected to the transmitting circuit board 101, and the conductive member 1032 is fixed to the transmitting circuit board 101 by a pad 10d and electrically connected to the transmitting circuit board 101. The relative structural relationship among the heat dissipation member 102, the conductive member 1031 and the conductive member 1032 can refer to the description of the relevant parts, and will not be described again.

The light-emitting parts 1041 to 1048 are arranged in a linear array on the heat sink member 102, and have the same structural relationship with the heat sink member 102, the conductive member 103, and the conductive member 1032, respectively. Taking the light emitting part 1041 as an example, the light emitting part 1041 includes a first electrode electrically connected to the heat dissipating part 102 and a second electrode electrically connected to the conductive part 1031 through bonding wires 10a to 11 and to the conductive part 1032 through bonding wires 10a to 21. By analogy, the structural relationships between the light emitting parts 1042 to 1048 and the heat dissipating member 102, the conductive member 103, and the conductive member 1032, respectively, can be obtained, and will not be described again.

Based on the structural relationship of the transmitting circuit board 101, the heat dissipating member 102, the conductive member 1031, the conductive member 1032, and the light emitting components 1041 to 1048 in this example, the transmitting circuit board 101 may gate the light emitting components 1041 to 1048 synchronously through the heat dissipating member 102, the conductive member 1031, and the conductive member 1032, so as to realize synchronous light emission of 8 light emitting components, in this example, the light emitting components 1041 to 1048 are, for example, VCSELs.

In another alternative example, as shown in fig. 15, the laser emitting device F11 includes: the light emitting device includes a transmitting circuit board 111, a heat radiating member 112, conductive members 113-1 to 113-4, light emitting members 114-1 to 114-8, bonding wires 11a-1 to 11a-8, and pads 11b to 11f.

The heat dissipation member 112 is fixed to the emission circuit board 111 by the pad 11b and electrically connected to the emission circuit board 111. The same structural relationship exists between the conductive members 113-1 to 113-4 and the transmitting circuit board 111, and taking the conductive member 113-1 as an example, the conductive member 113-1 is fixed on the transmitting circuit board 111 through the pad 11c and is electrically connected to the transmitting circuit board 111, and so on, the structural relationship between the conductive members 113-2 to 113-4 and the transmitting circuit board 111 can be obtained. The relative structural relationship between the heat dissipation member 112 and the conductive member 113 can be referred to the description of the related parts, and will not be described herein.

The light emitting parts 114-1 to 114-8 are arranged in a line array on the heat dissipating part 112, and the 8 light emitting parts are sequentially divided into four groups, i.e., one group of the light emitting part 114-1 and 114-2, one group of the light emitting part 114-3 and 114-4, and so on.

The light-emitting members of the respective groups have the same structural relationship with the heat-dissipating member 112, respectively, and the light-emitting members of the respective groups have the same structural relationship with the corresponding conductive members. Taking the light emitting part 114-1 and the light emitting part 114-2 as an example, a first electrode of the light emitting part 114-1 and a first electrode of the light emitting part 114-2 are electrically connected to the heat dissipating part 112, a second electrode of the light emitting part 114-1 is electrically connected to the conductive part 113-1 through a bonding wire 11a-1, and a second electrode of the light emitting part 114-2 is electrically connected to the conductive part 113-1 through a bonding wire 11 a-1.

By analogy, the structural relationship between the other three groups of light-emitting components and the heat-dissipating component 112 and the corresponding conductive components can be obtained, and the description is omitted here.

Based on the structural relationship of the emitting circuit board 111, the heat dissipating part 112, the conductive parts 113-1 to 113-4, and the light emitting parts 114-1 to 114-8 in this example, the emitting circuit board 111 may gate at least one group of light emitting parts (e.g., 114-1 and 114-2) through the heat dissipating part 112 and the conductive parts 113-1 to 113-4, so as to realize grouping light emission of 8 light emitting parts, in this example, the light emitting parts 114-1 to 114-8 are EELs, for example.

In another alternative example, as shown in fig. 16, the laser emitting device F12 includes: a transmitting circuit board 121, a heat sink 122, conductive members 123-11 through 123-14, conductive members 123-21 through 123-24, light emitting members 1241 through 1248, bond wires 12a-11 through 12a-18, bond wires 12a-21 through 12a-28, pads 12b-11 through 12b-14, pads 12b-21 through 12b-24, and pads 12c.

The heat dissipation member 122 is fixed to the emission circuit board 121 through the pad 12c and electrically connected to the emission circuit board 121. The same structural relationship exists between the conductive member 123-11 through the conductive member 123-24 and the transmitting circuit board 121, taking the conductive member 123-11 as an example, the conductive member 123-11 is fixed on the transmitting circuit board 121 through the pad 12b-11 and is electrically connected with the transmitting circuit board 121, and so on, the structural relationship between the conductive member 123-12 through the conductive member 123-24 and the transmitting circuit board 121 can be obtained. The relative structural relationship between the heat dissipation member 122, the conductive member 123-11 and the conductive member 123-24 can be referred to the description of the related parts, and will not be described herein again.

The light-emitting parts 1241 to 1248 are arranged on the heat-dissipating part 122 in a line array form, and the 8 light-emitting parts are sequentially divided into four groups, i.e., one group of the light-emitting part 1241 and the light-emitting part 1242, one group of the light-emitting part 1243 and the light-emitting part 1244, and so on.

The light-emitting members of each group have the same structural relationship with the heat-dissipating member 122, respectively, and the light-emitting members of each group have the same structural relationship with the corresponding conductive members. Taking a light emitting part 1241 and a light emitting part 1242 as an example, a first electrode of the light emitting part 1241 is electrically connected to the heat dissipating part 122, a second electrode of the light emitting part 1241 is electrically connected to the conductive part 123-11 through bonding wires 12a-11, and a first electrode of the light emitting part 1241 is electrically connected to the conductive part 123-21 through bonding wires 12 a-21; a first electrode of the light emitting part 1242 is electrically connected to the heat sink 122, a second electrode of the light emitting part 1242 is electrically connected to the conductive parts 123-11 through the bonding wires 12a-12, and a first electrode of the light emitting part 1242 is electrically connected to the conductive parts 123-21 through the bonding wires 12 a-22. By analogy, the structural relationship between the light-emitting components 1243 to 1248 and the heat-dissipating component 122 and the corresponding conductive components can be obtained, and the description thereof is omitted.

Based on the structural relationship of the transmitting circuit board 121, the heat dissipating part 122, the conductive parts 123-11 to 123-24, and the light emitting parts 1241 to 1248 in this example, the transmitting circuit board 121 may gate at least one set of light emitting parts (such as 1241 and 1242) through the heat dissipating part 122, the conductive parts 123-11 to 123-24, and realize grouped light emission of 8 light emitting parts, in this example, the light emitting parts 1241 to 1248 are, for example, VCSELs.

In another alternative example, as shown in fig. 17, the laser emitting device F13 includes an emitting circuit board 121, a plurality of heat dissipating members (not shown), a plurality of conductive members (not shown), and a plurality of light emitting members (not shown). The surface of the transmitting circuit board 121 includes four transmitting areas, i.e., transmitting areas 13-a to 13-d, and the transmitting areas 13-a to 13-d are arranged in an area array along a first direction X and a second direction Y. The plurality of light emitting parts are divided into four groups, respectively corresponding to four emission areas of the emission circuit board 121. Thereby, the plurality of light emitting parts are arranged in an area array form in the first direction X and the second direction Y.

In any one of the emitting regions 13-a to 13-d, the corresponding light emitting component is electrically connected to a part of the heat dissipating component and a part of the conductive component, which can be referred to in fig. 16 and is not described herein again. Thus, based on the structural relationship of the transmitting circuit board 131, the plurality of heat dissipating members, the plurality of conductive members, and the plurality of light emitting components in this example, the transmitting circuit board 131 can gate at least one group of light emitting components through the plurality of heat dissipating members and the plurality of conductive members, thereby realizing the grouped light emission of the plurality of light emitting components.

It is to be understood that, although in the present example, the structural relationship between the light-emitting components of each group and the corresponding heat-dissipating components and conductive components is the one shown in fig. 16, in practical applications, the structural relationship described in the other embodiments described above may also be employed. This specification does not specifically limit this.

The present specification also provides a laser radar corresponding to the laser transmitter, and the following detailed description is made by specific embodiments with reference to the accompanying drawings. It should be understood that the contents of the laser emitting device described below may be referred to in correspondence with the contents of the laser emitting device described above.

In a specific implementation, as shown in fig. 18, a schematic structural diagram of a lidar provided in an embodiment of the present specification, in this example, the lidar LD may include: laser emitting device M1, optical assembly M2, scanning device M3, detecting device M4, processing device M5.

The laser emitting device M1 is adapted to generate a probe beam, wherein the specific structure inside the laser emitting device M1 can refer to the description of the laser emitting device part, and is not described herein again.

The optical assembly M2 is adapted to shape the probe beam, wherein the laser emitting device M1 is disposed on a focal plane of the optical assembly M2, so as to ensure that the probe beam is emitted after being collimated.

The scanning means M3 is adapted to emit the shaped detection beam into the external environment.

The detection device M4 is adapted to receive the detection beam reflected by the object W1 in the external environment.

The processing device M5, coupled to the laser emitting device M1, the scanning device M3 and the detecting device M4, is adapted to obtain detection information based on the detection beam emitted by the laser emitting device and the detection beam reflected by the object received by the detecting device M4, where the detection information may include at least one of the following: object position information; object velocity information; object shape information.

By adopting the scheme, the laser transmitting device provided by the embodiment of the specification has higher reliability, service life and signal quality, so that the reliability and the detection capability of the laser radar can be improved.

In a specific implementation, the scanning device includes any one of: a two-dimensional scanning mirror; two one-dimensional scanning mirrors. Therefore, the external environment can be scanned in three dimensions, and the resolution and the data volume are improved.

It is understood that, in practical applications, the laser radar provided in the embodiments of the present specification may further include other components according to specific scenarios and requirements, and the present specification does not specifically limit this. For example, as shown in fig. 18, the laser radar LD may further include a beam splitting device M6 adapted to transmit the probe light beam generated by the laser emitting device M1 to the scanning device M3, the scanning device M3 emits the probe light beam generated by the laser emitting device M1 into the external environment, and the probe light beam reflected by the object W1 in the external environment is transmitted to the detection device M4 through the scanning device M3, the optical assembly M2 and the beam splitting device M6, so as to be used when the processing device M5 acquires the probe information.

In specific implementation, the laser radar provided in the embodiments of the present description may be applied to an environment sensing system, and based on detection information provided by the laser radar in the embodiments of the present description, after data processing of the environment sensing system, functions such as target detection, target identification, target resolution, and target tracking may be implemented. For example, for the environmental sensing system loaded on a vehicle, based on the detection information provided by the laser radar of the embodiment of the present specification, functions such as road edge detection, obstacle identification, and real-time positioning and Mapping (SLAM) can be realized.

It should be noted that in the description of the present specification, the terms "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the referred device or element must have a specific orientation, be configured in a specific orientation, and be operated, and thus, should not be construed as limiting the present specification.

It should also be noted that reference throughout this specification to "one embodiment" or "an embodiment" means that a particular feature, structure or characteristic may be included in at least one implementation of the specification. Also, in the description of the present specification, the terms "first", "second", and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, a feature defined in terms of "first," "second," etc. may explicitly or implicitly include one or more of that feature. Moreover, the terms "first," "second," and the like are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the terms so used are interchangeable under appropriate circumstances such that the embodiments of the specification described herein are, for example, capable of operation in sequences other than those illustrated or otherwise described herein.

Although the embodiments of the present specification are disclosed above, the present specification is not limited thereto. Various changes and modifications can be made by one skilled in the art without departing from the spirit and scope of the present disclosure, and therefore, the scope of the present disclosure should be determined only by the appended claims.

Claims (24)

1. A laser transmitter, comprising:

a transmitting circuit board;

the radiating component and the conductive component are arranged on the same surface of the transmitting circuit board at intervals;

and the light-emitting component is arranged on the heat radiating component and is electrically connected with the transmitting circuit board at least through the conductive component.

2. The laser transmitter according to claim 1, wherein the first surface of the conductive member is opposite to the first surface of the heat sink member, and the first surface and the heat sink member are structurally matched.

3. The laser transmitter according to claim 2, wherein the heat sink member further comprises: and a third surface contacting the light emitting part, wherein the second surface of the heat dissipating part has an area smaller than that of the third surface of the heat dissipating part.

4. The laser emitting device according to claim 3, wherein the conductive member further comprises: a second surface electrically connected with the light emitting part, and a third surface contacting the emission circuit board, wherein an area of the second surface of the conductive member is larger than an area of the third surface of the conductive member.

5. The laser emitting apparatus according to any one of claims 1 to 4, wherein a height of the second surface of the heat dissipating member contacting the light-emitting member from the emitting circuit board is not greater than a height of the second surface of the conductive member electrically connected to the light-emitting member from the emitting circuit board.

6. The laser emitting device according to any one of claims 1 to 4, wherein the light emitting part is also electrically connected to the emitting circuit board through the heat dissipating part.

7. The laser light emitting apparatus according to claim 6, wherein the light emitting part comprises: a first electrode and a second electrode which are different; wherein: the first electrode is electrically connected with the heat dissipation component; the second electrode is electrically connected to the conductive member.

8. The laser transmitter according to claim 7, wherein the heat sink member includes any one of:

the conductive carrier is electrically connected with the first electrode and the transmitting circuit board respectively;

a thermally conductive carrier and an electrically conductive sub-assembly; the heat conducting carrier is made of a heat conducting non-conductive material and is fixedly connected with the light emitting component and the transmitting circuit board respectively; the conductive sub-elements are electrically connected with the first electrode and the transmitting circuit board respectively.

9. The laser emitting device of claim 8, wherein the thermally conductive carrier comprises a through hole; the through hole is suitable for communicating the light-emitting component and the transmitting circuit board and is filled with the conductive sub-component.

10. The laser emitting device according to claim 7, wherein the conductive member comprises any one of:

the conductive base body is electrically connected with the second electrode and the transmitting circuit board respectively;

the non-conductive substrate is fixedly connected with the transmitting circuit board, and the conductive layer is electrically connected with the second electrode and the transmitting circuit board respectively.

11. The laser emitting device according to any one of claims 1 to 4, wherein the light emitting part includes: a light emitting sub-element and a conductive plate element; the light-emitting sub-component comprises a first electrode and a second electrode which are different in polarity, the first electrode is electrically connected with the conductive component through the conductive plate component, and the second electrode is electrically connected with the conductive component.

12. The laser emitting device according to claim 11, wherein the conductive plate member is located between the first electrode and the heat dissipation member.

13. The laser emitting device according to claim 11, wherein the conductive member comprises any one of:

two conductive substrates, wherein one conductive substrate is electrically connected with the conductive plate, and the other conductive substrate is electrically connected with the second electrode;

the conductive layer is covered on the surface of the same non-conductive substrate at intervals, or the two conductive layers are respectively covered on different non-conductive substrates; one of the two conductive layers is electrically connected to the conductive plate member, and the other is electrically connected to the second electrode.

14. The laser emitting device according to any one of claims 1 to 4, wherein the laser emitting device includes a plurality of conductive members separated from each other, and disposed around the non-light-emitting surface of the light emitting member.

15. The laser transmitter according to claim 14, wherein the plurality of conductive portions are provided on the same side or opposite sides of the heat sink member.

16. The laser emitting apparatus according to claim 14, wherein at least part of the plurality of conductive members is electrically connected to the same light emitting member.

17. The laser emitting device according to any one of claims 1 to 4, comprising a plurality of light emitting components adapted to be arranged in an array.

18. The laser emitting device according to claim 17, wherein the plurality of light emitting members are arranged in a staggered manner.

19. The laser light emitting apparatus according to claim 17, wherein at least part of the plurality of light emitting parts are electrically connected to the same conductive member.

20. The laser emitting device of claim 17, wherein the total number of conductive members is related to lighting requirements, the lighting requirements including at least one of: the number of light emitting parts that emit light synchronously; a total number of groups of light emitting parts; the type of light emitting component.

21. The laser light emitting apparatus according to claim 17, wherein a plurality of the light emitting members are adapted to emit light in groups, and a total number of the heat radiating members corresponds to a total number of the groups of the plurality of the light emitting members.

22. The laser emitting device according to any one of claims 1 to 4, wherein the conductive member is electrically connected to the light emitting member by at least one bonding wire.

23. A lidar, comprising:

the laser emitting device of any one of claims 1-22, adapted to generate a probe beam;

the optical assembly is suitable for shaping the detection light beam, wherein the laser emitting device is arranged on a focal plane of the optical assembly;

a scanning device adapted to emit the shaped detection beam into an external environment;

a detection device adapted to receive a probe beam reflected by an object in an external environment; and

and the processing device is coupled with the laser emitting device, the scanning device and the detection device and is suitable for obtaining detection information.

24. The lidar of claim 23, wherein the scanning means comprises any one of:

a two-dimensional scanning mirror;

two one-dimensional scanning mirrors.

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