CN218006626U - Radio frequency amplifier welded structure - Google Patents
Radio frequency amplifier welded structure Download PDFInfo
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- CN218006626U CN218006626U CN202221612502.6U CN202221612502U CN218006626U CN 218006626 U CN218006626 U CN 218006626U CN 202221612502 U CN202221612502 U CN 202221612502U CN 218006626 U CN218006626 U CN 218006626U
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- radio frequency
- frequency amplifier
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- ceramic substrate
- soldering
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Abstract
The utility model belongs to the technical field of radio frequency amplifier, a radio frequency amplifier welded structure is disclosed, ceramic substrate in locating the encapsulation tube is equipped with conductive adhesive layer on the ceramic substrate, is equipped with the pottery switching piece on the conductive adhesive layer, is equipped with the soldering tin layer on the pottery switching piece, is equipped with discrete device on the soldering tin layer, is equipped with the connection gold wire on the ceramic substrate. The utility model provides a radio frequency amplifier welded structure, ceramic switching piece can form the take the altitude, forms effective isolation with gold wire bonding and soldering solder joint, can effectively solve the technology application problem of different technologies on the pad that shares.
Description
Technical Field
The utility model belongs to the technical field of the radio frequency amplifier, concretely relates to radio frequency amplifier welded structure.
Background
For a radio frequency amplifier product, along with the development requirements of small volume and high integration level packaging, the integration and interconnection of a plurality of devices in the product are required to be carried out in a tiny space, and great challenges are brought to the product assembly process.
Because the product integration is high, multiple processes are adopted inside, the product utilization space is small, and the resistance welding design can not be adopted for part of bonding pads to carry out resistance welding isolation on the two processes. Then interference of the two processes during welding will result in product failure and reduced reliability.
SUMMERY OF THE UTILITY MODEL
The utility model discloses aim at solving above-mentioned technical problem to a certain extent at least. Therefore, the utility model aims to provide a radio frequency amplifier welded structure.
The utility model discloses the technical scheme who adopts does:
the utility model provides a radio frequency amplifier welded structure, is equipped with the conducting resin layer including locating the ceramic substrate in the encapsulation tube shell on the ceramic substrate, is equipped with the pottery keysets on the conducting resin layer, is equipped with the soldering tin layer on the pottery keysets, is equipped with discrete device on the soldering tin layer, is equipped with the connection gold wire on the ceramic substrate.
Preferably, the ceramic patch comprises an alumina black porcelain carrier, a printed circuit arranged on the alumina black porcelain carrier and a gold-plated thin film layer arranged on the surface of the alumina black porcelain carrier.
Preferably, the thickness of the ceramic transition piece is 0.2mm-0.3mm.
The beneficial effects of the utility model are that:
the utility model provides a radio frequency amplifier welded structure, ceramic switching piece can form the take the altitude, forms effective isolation with gold wire bonding and soldering solder joint, can effectively solve the technology application problem of different technologies on the pad that shares.
Drawings
Fig. 1 is a schematic structural diagram of the rf amplifier of the present invention.
Fig. 2 is a schematic structural diagram of the welding structure of the radio frequency amplifier of the present invention.
Fig. 3 is a schematic structural diagram of the ceramic patch of the present invention.
In the figure: 1-packaging a tube shell; 2-a ceramic substrate; 3-a conductive adhesive layer; 4-ceramic switching piece; 41-alumina black porcelain carrier; 42-gold plating thin film layer; 5-soldering tin layer; 6-discrete devices; 7-connecting gold wire.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present invention, and should not be construed as limiting the present invention. The components of embodiments of the present invention, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations.
In the description of the embodiments of the present invention, it should be noted that the indication of the position or the positional relationship is based on the position or the positional relationship shown in the drawings, or the position or the positional relationship which is usually placed when the product of the present invention is used, or the position or the positional relationship which is conventionally understood by those skilled in the art, and is only for the convenience of describing the present invention and simplifying the description, but it is not to indicate or suggest that the indicated device or element must have a specific position, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements.
The invention will be further described with reference to the accompanying drawings and specific embodiments.
As shown in fig. 1, in a radio frequency amplifier of a certain type, a 4 × 4mm package tube case 1 is used as a package carrier outside, an area of 2 × 2mm is effectively utilized in an inner core area, a ceramic substrate is used as an inner carrier, a circuit pattern is designed on the ceramic substrate according to design requirements, the ceramic substrate is bonded on the package tube case by conductive adhesive, then internal interconnection is performed by processes such as soldering, cleaning, bonding, conductive adhesive bonding, re-bonding and the like on the ceramic substrate, and parallel sealing and testing are performed after completion to form a final product.
Because the product has smaller package and higher internal integration level, the discrete device is welded on the printed board by adopting soldering tin in the conventional process. Or the gold/nickel-palladium-gold and other end electrode components are bonded on the ceramic chip by adopting conductive adhesive to form process interconnection.
However, the product space is small, and the gold wire bonding pad and the discrete device pad adopt a shared pad, so that the resistance welding design cannot be carried out to carry out resistance welding isolation on the two processes. If the soldering and gold wire bonding technology is directly adopted at the position of the shared bonding pad, gold is rapidly diffused into the solder in the welding process to form the phenomenon of 'gold eating' and form brittle gold-tin compounds, so that open circuit or potential reliability hazard occurs to the gold wire bonding welding point.
As shown in fig. 2 and fig. 3, the radio frequency amplifier soldering structure of the present embodiment includes a ceramic substrate 2 disposed in a package case 1, a conductive adhesive layer 3 is disposed on the ceramic substrate 2, a ceramic interposer 4 is disposed on the conductive adhesive layer 3, a soldering tin layer 5 is disposed on the ceramic interposer 4, a discrete device 6 is disposed on the soldering tin layer 5, and a connecting gold wire 7 is disposed on the ceramic substrate 2.
The ceramic interposer 4 includes an alumina black porcelain carrier 41, a printed circuit disposed on the alumina black porcelain carrier 41, and a gold-plated thin film layer 42 disposed on the surface of the alumina black porcelain carrier 41. The ceramic adapter plate is formed by adopting alumina black porcelain as a carrier, adopting metal tungsten paste on the surface for circuit printing, and carrying out high-temperature sintering and nickel-gold plating on the surface. The ceramic adaptor 4 adopts thick film sintering and surface nickel gold plating processes, so that the back surface of the ceramic adaptor can be bonded and solidified with the bottom ceramic substrate 2 by adopting conductive adhesive, and the application requirement of the process for welding the front surface of the ceramic adaptor with the discrete device 6 by adopting soldering tin can be met.
And the thickness of the ceramic adapter sheet is 0.254mm, a certain height can be formed, gold wire bonding and tin soldering welding points are effectively isolated, and the phenomenon of 'gold eating' is prevented. The process application problem that gold wire bonding and tin soldering can be carried out on the common bonding pad is effectively solved.
The present invention is not limited to the above-mentioned optional embodiments, and any other products in various forms can be obtained by anyone under the teaching of the present invention, and any changes in the shape or structure thereof, all falling within the technical solution of the present invention, all fall within the protection scope of the present invention.
Claims (3)
1. A radio frequency amplifier welded structure characterized in that: the packaging tube comprises a ceramic substrate (2) arranged in a packaging tube shell (1), wherein a conductive adhesive layer (3) is arranged on the ceramic substrate (2), a ceramic switching sheet (4) is arranged on the conductive adhesive layer (3), a soldering tin layer (5) is arranged on the ceramic switching sheet (4), a discrete device (6) is arranged on the soldering tin layer (5), and a connecting gold wire (7) is arranged on the ceramic substrate (2).
2. The radio frequency amplifier soldering structure according to claim 1, wherein: the ceramic adapter plate (4) comprises an alumina black porcelain carrier (41), a printed circuit arranged on the alumina black porcelain carrier (41) and a gold-plated thin film layer (42) arranged on the surface of the alumina black porcelain carrier (41).
3. A radio frequency amplifier soldering structure according to claim 1 or 2, wherein: the thickness of the ceramic adaptor (4) is 0.2mm-0.3mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221612502.6U CN218006626U (en) | 2022-06-27 | 2022-06-27 | Radio frequency amplifier welded structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221612502.6U CN218006626U (en) | 2022-06-27 | 2022-06-27 | Radio frequency amplifier welded structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218006626U true CN218006626U (en) | 2022-12-09 |
Family
ID=84313359
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221612502.6U Active CN218006626U (en) | 2022-06-27 | 2022-06-27 | Radio frequency amplifier welded structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218006626U (en) |
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2022
- 2022-06-27 CN CN202221612502.6U patent/CN218006626U/en active Active
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