CN218004771U - Coil height adjusting device for improving etching rate of etching center plate - Google Patents
Coil height adjusting device for improving etching rate of etching center plate Download PDFInfo
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- CN218004771U CN218004771U CN202222052257.4U CN202222052257U CN218004771U CN 218004771 U CN218004771 U CN 218004771U CN 202222052257 U CN202222052257 U CN 202222052257U CN 218004771 U CN218004771 U CN 218004771U
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Abstract
The utility model provides a coil height adjustment device for improving etching center piece etching rate, coil height adjustment device includes: the inner ring column is used for being fixed on a matcher of the etching machine; the outer ring column is sleeved outside the inner ring column, and electric signal transmission can be carried out between the outer ring column and the inner ring column; the lifting adjusting assembly is arranged between the inner ring column and the outer ring column and used for enabling the outer ring column to move axially along the inner ring column, the lifting adjusting assembly is connected with an inner coil of an etching machine, and the inner coil and the outer ring column move synchronously. The coil height adjusting device has a simple structure, and can conveniently adjust the height of the inner coil of the etching machine.
Description
Technical Field
The utility model relates to a semiconductor equipment technical field especially relates to a coil height adjusting device for improving etching center piece etching rate.
Background
The etching refers to removing the protective film of the area to be etched after exposure plate making and development, and contacting with chemical solution during etching to achieve the effect of dissolution and corrosion and form the effect of concave-convex or hollow forming. The method can be used for manufacturing copper plate, zinc plate and other printing concave-convex plates at the earliest.
The basic principle of the ICP etcher is that under vacuum low pressure, radio frequency generated by an ICP radio frequency power supply is output to a toroidal coupling coil, mixed etching gas in a certain proportion generates high-density plasmas through coupled glow discharge, the plasmas bombard the surface of a substrate under the action of RF radio frequency of a lower electrode, chemical bonds of semiconductor materials in a substrate pattern area are broken, volatile substances are generated with the etching gas and are separated from the substrate in a gas form, and the volatile substances are pumped away from a vacuum pipeline.
For the current common ICP etcher, the heights of the inner coil and the outer coil are generally kept consistent, and the height of the inner coil cannot be adjusted. In the research of the applicant, it is found that the inner coil and the outer coil with the same height may cause the etching rate of the central wafer and the edge wafer to be non-uniform, and therefore how to conveniently adjust the height of the coil to improve the uniformity of the etching rate of the wafer is an urgent technical problem to be solved.
SUMMERY OF THE UTILITY MODEL
In view of the above, the present invention provides a coil height adjusting device for improving the etching rate of an etching center piece, so as to solve one or more technical problems in the prior art.
According to an aspect of the utility model, a coil height adjusting device for improving etching center piece etching rate is disclosed, this coil adjusting device includes:
the inner ring column is used for being fixed on a matcher of the etching machine;
the outer ring column is sleeved outside the inner ring column, and electric signal transmission can be carried out between the outer ring column and the inner ring column;
the lifting adjusting assembly is arranged between the inner ring column and the outer ring column and used for enabling the outer ring column to move axially along the inner ring column, the lifting adjusting assembly is connected with the inner coil of the etching machine, and the inner coil and the outer ring column move synchronously.
In some embodiments of the present invention, the lifting adjusting assembly includes a rack and a gear, the rack is vertically disposed, the rack is fixed on the inner ring column, the gear is disposed on the outer ring column, and the gear is rotated to lift the outer ring column; or
The lifting adjusting component is a magnetic gear transmission mechanism.
In some embodiments of the present invention, the outer surface of the inner ring column is in direct and complete contact with the inner surface of the outer ring column.
The utility model discloses an in some embodiments, coil height adjusting device still includes copper bar and first spliced pole, the one end of copper bar with the top of outer loop post is fixed, the both ends of first spliced pole respectively with the copper bar reaches the first end of interior coil is connected.
The utility model discloses an in some embodiments, coil height adjusting device still includes ground copper bar, the second end of interior coil with ground copper bar connects, just interior coil for ground copper bar liftable moves.
In some embodiments of the present invention, the coil height adjusting device further includes a second connecting column, the ground copper bar is connected to the inner coil through the second connecting column.
In some embodiments of the present invention, the coil height adjusting device further comprises an auxiliary connecting member, and the second connecting column is connected to the ground copper bar through the auxiliary connecting member.
In some embodiments of the present invention, the ground copper bar is vertically provided with a guide groove, and the auxiliary connecting member can be moved along the guide groove.
In some embodiments of the present invention, the outer ring column is an open ring column, the rack is fixed on the outer surface of the inner ring column, and the gear is located between the openings of the outer ring column.
In some embodiments of the present invention, the coil height adjusting device further comprises a locking screw for locking the opening of the outer ring column.
Through utilizing the utility model discloses a coil height adjusting device for improving etching center piece etching rate in the embodiment, the beneficial effect that can obtain at least with:
the coil height adjusting device for improving the etching rate of the etching center piece can enable the outer ring column and the coil connected with the outer ring column to be synchronously lifted based on the lifting adjusting assembly, so that the inner coil of the etching machine is higher than the outer coil, and the time rate of the center piece source is kept consistent with that of the edge piece source. The coil height adjusting device is simple in structure and can conveniently adjust the height of the coil.
In addition to the above, the outer surface of the inner ring column is in direct and complete contact with the inner surface of the outer ring column, so that the accuracy of electrical signal transmission can be ensured even when the height of the inner coil is adjusted, thereby ensuring the etching precision.
Additional advantages, objects, and features of the invention will be set forth in part in the description which follows and in part will become apparent to those having ordinary skill in the art upon examination of the following or may be learned from practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.
It will be appreciated by those skilled in the art that the objects and advantages that can be achieved with the present invention are not limited to the details set forth above, and that these and other objects that can be achieved with the present invention will be more clearly understood from the following detailed description.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the invention and together with the description serve to explain the principles of the invention. The components in the figures are not necessarily to scale, emphasis instead being placed upon illustrating the principles of the invention. For convenience in illustrating and describing some portions of the present invention, corresponding parts of the drawings may be exaggerated, i.e., may be larger, relative to other components in an exemplary device actually manufactured according to the present invention. In the drawings:
fig. 1 is a schematic structural diagram of a coil height adjusting device for improving an etching rate of an etching center piece according to an embodiment of the present invention.
Fig. 2 is a schematic structural diagram of a coil height adjusting device for improving an etching rate of an etching center piece according to another embodiment of the present invention.
FIG. 3 is a diagram illustrating simulation results of the wafer source etching rate.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the embodiments of the present invention are described in further detail below with reference to the accompanying drawings. The exemplary embodiments and descriptions of the present invention are provided to explain the present invention, but not to limit the present invention.
It should be noted that, in order to avoid obscuring the present invention with unnecessary details, only the structures and/or processing steps closely related to the solution according to the present invention are shown in the drawings, and other details not so related to the present invention are omitted.
It should be emphasized that the term "comprises/comprising/comprises/having" when used herein, is taken to specify the presence of stated features, elements, steps or components, but does not preclude the presence or addition of one or more other features, elements, steps or components.
It should be noted that the terms of orientation and orientation used in the present specification are relative to the position and orientation shown in the drawings; the term "coupled" herein may mean not only directly coupled, but also indirectly coupled, in which case intermediates may be present, if not specifically stated. A direct connection is one in which two elements are connected without the aid of intermediate elements, and an indirect connection is one in which two elements are connected with the aid of other elements.
Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In the drawings, like reference characters designate the same or similar parts throughout the several views.
Fig. 1 is a schematic structural diagram of a coil height adjusting device for improving an etching rate of an etching center piece according to an embodiment of the present invention, as shown in fig. 1, the coil height adjusting device at least includes an inner ring column 110, an outer ring column 120, and a lifting adjusting assembly. The inner ring column 110 is used for being fixed on a matcher of an etching machine; the outer ring column 120 is sleeved outside the inner ring column 110, and electric signal transmission can be performed between the outer ring column 120 and the inner ring column 110; the lifting adjusting assembly is arranged between the inner ring column 110 and the outer ring column 120, the lifting adjusting assembly is used for enabling the outer ring column 120 to move along the axial direction of the inner ring column 110, the lifting adjusting assembly is connected with an inner coil 400 of the etching machine, and the inner coil 400 and the outer ring column 120 move synchronously. The coil height adjusting device can realize the synchronous lifting of the inner coil and the outer ring column 120 by adjusting the lifting adjusting component, so that the coil height adjusting device can conveniently adjust the height of the inner coil 400 of the etching machine.
The elevation adjustment assembly may be a rack and pinion mechanism 100, in which case the rack and pinion mechanism 100 includes a rack 130 and a pinion 140, the rack 130 is vertically disposed on the inner ring column 110 as a fixed part, and the pinion 140 is disposed on the outer ring column 120 as a moving part. Referring to fig. 1 and 2, the outer ring column 120 may be provided with notches penetrating in an axial direction, widths of the rack 130 and the gear 140 are slightly smaller than widths of the notches, the gear 140 is located between the notches of the outer ring column 120, a fixing shaft of the gear 140 is supported in a shaft hole of the outer ring column 120, at this time, when the fixing shaft of the gear 140 is rotated, since the rack 130 is fixed to the inner ring column 110, and the inner ring column 110 may be fixed to a matching device of an etching machine through three legs 310, at this time, the gear 140 drives the outer ring column 120 to perform a lifting motion, and the inner coil 400 connected to the outer ring column 120 also performs a lifting motion. It should be understood that the elevation adjustment assembly is a rack and pinion mechanism 100 only as an example, and in other embodiments, the elevation adjustment assembly may be a screw mechanism or the like in addition to the rack and pinion mechanism 100; for example, in the case of a screw mechanism, the screw rod can be fixed on the inner ring column 110 as a fixed part, and the nut can be used as a movable part to drive the outer ring column 120 and the inner coil 400 to move up and down.
In another embodiment, the rack 130 in the rack and pinion mechanism 100 can be replaced with a mechanical magnetic strip, in which case the magnetic gear train acts as the lift adjustment assembly; the magnetic gear transmission mechanism is high in transmission efficiency and long in service life, the lifting range of the coil is further improved compared with that of a rack and pinion transmission mechanism, and the magnetic gear transmission mechanism can enable the coil to be lifted to 25mm.
Further, in order to ensure the accuracy of the transmission of the electrical signal between the inner ring column 110 and the outer ring column 120, the outer surface of the inner ring column 110 is in direct and complete contact with the inner surface of the outer ring column 120. The inner diameter of the outer column 120 is defined to be equal to the outer diameter of the inner column 110, so that the inner column 110 can be directly contacted with the outer column 120, and the length of the inner column 110 is set to be long enough, so that when the outer column 120 is raised to the top limit position, the top end surface of the inner column 110 is located above the top end surface of the outer column 120, and when the outer column 120 is lowered to the bottom limit position, the bottom end surface of the inner column 110 is located below the bottom end surface of the outer column 120, so that the outer column 120 can be completely contacted with the inner column 110 in various states.
Fig. 2 is a schematic structural view of a coil height adjusting device for improving etching rate of an etching center piece according to another embodiment of the present invention, referring to fig. 2, the coil height adjusting device further includes a copper bar 210 and a first connecting column 220, one end of the copper bar 210 is fixed to the top of the outer ring column 110, and two ends of the first connecting column 220 are connected to the copper bar 210 and the first end of the inner coil 400 respectively. In this embodiment, the coil and the outer ring column 120 are connected by the first connecting column 220 and the copper bar 210, at this time, the copper bar 210 is a silver-plated copper bar 210, the first connecting column 220 is also a silver-plated connecting column, the silver-plated copper bar 210 is horizontally disposed, the first connecting column 220 is vertically disposed, one end of the silver-plated copper bar 210 is connected to the top end of the outer ring column 120 by a screw or a bolt, the other end of the silver-plated copper bar 210 is fixedly connected to the bottom end of the first connecting column 220, and the top end of the first connecting column 220 is correspondingly connected to the first end of the inner coil 400.
Further, the coil height adjusting device may further include a ground copper bar 250, the second end of the inner coil 400 is connected to the ground copper bar 250, and the inner coil 400 is movable in a lifting manner with respect to the ground copper bar 250. Referring to fig. 2, the ground copper bar 250 includes a horizontal portion for connection with a ground terminal and a vertical portion further connected with the second end of the inner coil 400 by means of other auxiliary members or directly.
Further, the coil height adjusting apparatus further includes a second connecting post 230, and the ground copper bar 250 and the inner coil 400 are connected by the second connecting post 230. At this time, the second connecting column 230 is vertically arranged, the top end of the second connecting column 230 is specifically fixedly connected with the second end of the coil, and the bottom end of the second connecting column 230 is further slidably connected with the vertical portion of the ground copper bar 250, so that when the coil moves up and down, the second connecting column 230 connected with the second end of the inner coil 400 moves up and down along the ground copper bar 250 in synchronization with the inner coil 400.
In addition, the coil height adjusting device may further include an auxiliary connector 240, and the second connecting column 230 is connected to the ground copper bar 250 through the auxiliary connector 240. Referring to fig. 2, the auxiliary connecting member 240 is an L-shaped plate structure, in which an end portion of a horizontal portion of the L-shaped plate is used for being fixedly connected with a bottom end of the second connecting column 230, and a vertical portion of the L-shaped plate is slidably connected with a vertical portion of the ground copper bar 250. In this embodiment, when the inner coil 400 moves up and down, the inner coil 400, the second connecting column 230 and the auxiliary connecting member 240 move up and down synchronously.
Illustratively, the ground copper bar 250 is vertically provided with a guide slot, and the auxiliary connecting member 240 can move along the guide slot. The guide groove is specifically formed on the vertical portion of the ground copper bar 250, and a sliding block or a pulley can be correspondingly arranged on the vertical portion of the auxiliary connecting piece 240. When the inner coil 400 moves up and down, the sliding block or the pulley slides in the guide groove of the ground copper bar 250, so that the up and down movement of the auxiliary connecting member 240 is realized.
Specifically, when the outer ring post 120 is an open ring post having an axially through slot, and the elevation adjustment assembly is the rack and pinion mechanism 100, the rack 130 is embedded in the slot, and the rack 130 is fixed on the outer surface of the inner ring post 110, and the gear 140 is engaged with the rack 130, and the gear 140 is located between the openings of the outer ring post 120. And, in order to further lock the opening of the outer ring post 120, the coil height adjusting means further includes a locking screw 150. Referring to fig. 1, the number of the locking screws 150 is two, and the two locking screws 150 are respectively located at upper and lower sides of the gear 140. When the height of the inner coil 400 needs to be adjusted, the locking screw 150 is firstly unscrewed, and then the gear 140 is rotated, so that the lifting motion of the outer ring column 120 drives the lifting motion of the inner coil 400; after the inner coil 400 is adjusted to a predetermined height, the locking screw 150 is further tightened, so as to prevent the outer ring post 120 and the gear 140 from falling back due to their own weight, and the stability of the coil height adjusting apparatus is further ensured by the arrangement of the locking screw 150.
In the above embodiment, the inner ring column 110 of the coil height adjusting apparatus is connected to the matching unit of the etching machine, and the further electrical signal is conducted to the inner coil 400 through the copper bar 210 and the first connecting column 220, and the other end of the inner coil 400 forms a loop ground with the ground terminal through the second connecting column 230, the auxiliary connecting member 240 and the ground copper bar 250. At this time, the terminals formed by the inner ring column 110 and the outer ring column 120 generate high frequency dissociation process gas by passing the received high frequency signal of the matching device through the coil. It should be understood that, in order to realize stable transmission of the electrical signal, the outer ring column, the inner ring column, the copper bar, the first connecting column, the second connecting column, the auxiliary connecting member and the ground copper bar may be plated with silver.
Because the inner coil 400 corresponds to the center sheet source and the outer coil corresponds to the edge sheet source at the periphery of the center sheet source during etching, the defect that the etching rate of the center sheet source is lower than that of the edge sheet source in the prior art is correspondingly overcome after the inner coil 400 is adjusted to be high by the coil height adjusting device provided by the invention. Fig. 3 is a schematic diagram of simulation results of the wafer source etching rate, and the schematic diagram of the simulation results from left to right in fig. 3 sequentially includes: a simulation diagram of the film source etching rate corresponding to the heights of the inner coil 400 and the outer coil, a simulation diagram of the film source etching rate corresponding to the heights of the inner coil 400 and the outer coil and the ACP (butterfly valve) opening valve adjusted from 75 ° to 55 °, a simulation diagram of the film source etching rate corresponding to the case where the heights of the inner coil 400 and the outer coil are consistent and the ACP opening valve is 55 ° and has a GDP (gas diverter plate), and a simulation diagram of the film source etching rate corresponding to the case where the inner coil 400 is higher than the outer coil and the ACP opening valve is 55 ° and has a GDP (gas diverter plate). The energy intensity range (e.g., 350-450, 350-400, etc.) of each wafer source is indicated in the simulation graph of each wafer source etching in FIG. 3; as can be seen from fig. 3, when the inner coil 400 and the outer coil have the same height, there is a large difference between the etching rate of the center plate and the etching rate of the edge plate, and when the inner coil 400 has a height higher than that of the outer coil, the etching rate of the center plate and the etching rate of the edge plate are substantially the same, so that it can be seen that the uniformity of the etching rates of the center plate and the edge plate is ensured after the height of the inner coil 400 is adjusted by using the coil height adjusting apparatus of the present invention. According to the experiment, when the height of the inner coil 400 is not adjusted, the difference of the etching rates of the central sheet source and the edge sheet source is larger than 0.1nm/s, and the qualification rate of the abnormal-shape batch of the central sheet is 71%; after the coil height adjusting device is adopted to adjust the height of the inner coil 400, the difference of the etching rates of the central sheet source and the edge sheet source can be reduced to be within 0.1nm/s, and the qualification rate of the central sheet in abnormal shape in batches is improved to 95%.
Features that are described and/or illustrated with respect to one embodiment may be used in the same way or in a similar way in one or more other embodiments and/or in combination with or instead of the features of the other embodiments.
The above listed embodiments show and describe the basic principles and main features of the present invention, but the present invention is not limited by the above embodiments, and the modifications, equivalent changes and modifications made by those skilled in the art without creative work should fall within the protection scope of the technical solution of the present invention.
Claims (10)
1. A coil height adjusting apparatus for improving an etching rate of an etching core, the coil height adjusting apparatus comprising:
the inner ring column is used for being fixed on a matcher of the etching machine;
the outer ring column is sleeved outside the inner ring column, and electric signal transmission can be carried out between the outer ring column and the inner ring column;
the lifting adjusting assembly is arranged between the inner ring column and the outer ring column and used for enabling the outer ring column to move along the axial direction of the inner ring column, the lifting adjusting assembly is connected with an inner coil of the etching machine, and the inner coil and the outer ring column move synchronously.
2. The coil height adjusting device for improving the etching rate of the etching center piece according to claim 1, wherein the lifting adjusting assembly comprises a rack and a gear, the rack is vertically arranged, the rack is fixed on the inner ring column, the gear is arranged on the outer ring column, and the gear is rotated to lift the outer ring column; or the like, or, alternatively,
the lifting adjusting component is a magnetic gear transmission mechanism.
3. The apparatus of claim 2, wherein the outer surface of the inner ring column is in direct and complete contact with the inner surface of the outer ring column.
4. The apparatus as claimed in claim 1, wherein the apparatus further comprises a copper bar and a first connecting post, one end of the copper bar is fixed to the top end of the outer ring post, and two ends of the first connecting post are respectively connected to the first ends of the copper bar and the inner coil.
5. The apparatus according to claim 4, further comprising a copper ground bar, wherein the second end of the inner coil is connected to the copper ground bar, and the inner coil is movable in a height direction relative to the copper ground bar.
6. The apparatus of claim 5, wherein the apparatus further comprises a second connecting post, and the ground copper bar and the inner coil are connected by the second connecting post.
7. The apparatus of claim 6, further comprising an auxiliary connector, wherein the second connecting column is connected to the ground copper bar through the auxiliary connector.
8. The apparatus of claim 7, wherein said copper ground bar is vertically provided with a guide groove, and said auxiliary connecting member is movable along said guide groove.
9. The apparatus of claim 3, wherein the outer ring column is an open ring column, the rack is fixed on the outer surface of the inner ring column, and the gear is located between the openings of the outer ring column.
10. The apparatus of claim 9, further comprising a locking screw for locking the opening of the outer ring column.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222052257.4U CN218004771U (en) | 2022-08-04 | 2022-08-04 | Coil height adjusting device for improving etching rate of etching center plate |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202222052257.4U CN218004771U (en) | 2022-08-04 | 2022-08-04 | Coil height adjusting device for improving etching rate of etching center plate |
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| CN218004771U true CN218004771U (en) | 2022-12-09 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117238744A (en) * | 2023-11-13 | 2023-12-15 | 无锡尚积半导体科技有限公司 | Two-stage diffusion radio frequency device and wafer etching equipment |
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2022
- 2022-08-04 CN CN202222052257.4U patent/CN218004771U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117238744A (en) * | 2023-11-13 | 2023-12-15 | 无锡尚积半导体科技有限公司 | Two-stage diffusion radio frequency device and wafer etching equipment |
| CN117238744B (en) * | 2023-11-13 | 2024-03-01 | 无锡尚积半导体科技有限公司 | Wafer etching equipment |
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