CN217991284U - Laser processing apparatus - Google Patents

Abstract

The utility model discloses a laser processing equipment. The utility model discloses a laser processing equipment includes processing platform and laser beam machining device. Wherein, the processing platform is used for placing the workpiece to be processed. The laser processing device comprises a first laser assembly and a second laser assembly, the first laser assembly comprises a first laser head, the first laser head is used for generating infrared laser beams, the second laser assembly comprises a second laser head, the second laser head is used for generating ultraviolet laser beams, the first laser assembly is used for processing and forming a first processing area on the surface of a workpiece, and the second laser assembly is used for processing and forming a second processing area on the first processing area. The infrared laser beam machining speed is high but the machining precision is low, the ultraviolet laser beam machining speed is slower than that of the infrared laser beam but the machining precision is high, the first laser assembly and the second laser assembly are combined to perform machining successively, and the laser machining efficiency can be considered on the premise of ensuring the laser machining quality.

Description

Laser processing apparatus

Technical Field

The utility model relates to a laser beam machining field especially relates to a laser beam machining equipment.

Background

The laser etching process is a non-contact processing method by using high-beam laser to focus the surface of material and using instantaneously gasified material, and its process is simple, so that it can be extensively used. The laser processing is generally realized by using a laser head to carry out laser processing on an article to be processed, the existing photoetching technology such as chemical photoetching can pollute water resources, patterns can be geometrically distorted on a large curved surface area, the processing quality and the processing efficiency of the laser etching technology are difficult to be considered, and inconvenience is brought to mass production.

SUMMERY OF THE UTILITY MODEL

The utility model discloses aim at solving one of the technical problem that exists among the prior art at least. Therefore, the utility model provides a laser processing equipment can guarantee under the prerequisite of laser beam machining quality, compromises laser beam machining efficiency.

According to the utility model discloses a laser beam machining equipment of first aspect embodiment, including processing platform and processingequipment. The processing platform is used for placing a workpiece to be processed; the laser processing device comprises a first laser assembly and a second laser assembly, wherein the first laser assembly comprises a first laser head, the first laser head is used for generating infrared laser beams, the second laser assembly comprises a second laser head, and the second laser head is used for generating ultraviolet laser beams; the first laser assembly is used for processing a first processing area on the surface of the workpiece, and the second laser assembly is used for processing a second processing area on the first processing area.

According to the utility model discloses laser processing equipment has following beneficial effect at least: the processing platform is used for fixing a workpiece to be processed, the first laser head can generate an infrared laser beam to roughly process the workpiece to be processed to form a first processing area, the second laser head can generate an ultraviolet laser beam to finely process the first processing area, the processing speed of the infrared laser beam is high, but the precision is low, the processing speed of the ultraviolet laser beam is lower than that of the infrared laser beam, but the precision is high, the infrared laser beam and the ultraviolet laser beam are combined to process successively, and the laser processing efficiency is considered on the premise that the laser processing quality can be guaranteed.

According to some embodiments of the utility model, first laser subassembly still includes first mirror module and the first focusing module of shaking, first focusing module includes first focus mirror and first adjustment mechanism, first focus mirror sets up on first adjustment mechanism's the output, first adjustment mechanism is used for adjusting first focus mirror with distance between the first laser head, and first focus mirror distance between the first mirror module of shaking, the light path of infrared laser beam passes through first focus mirror with first mirror module of shaking.

According to some embodiments of the utility model, first mirror module that shakes includes first mirror and the first field lens of shaking, follows infrared laser beam's transmission direction, first mirror with the first field lens sets gradually shakes.

According to the utility model discloses a some embodiments, second laser subassembly still includes second galvanometer module and second focusing module, the second focusing module includes second focusing mirror and second adjustment mechanism, the second focusing mirror sets up on the output of second adjustment mechanism, second adjustment mechanism is used for adjusting the second focusing mirror with distance between the second laser head, and the second focusing mirror with distance between the second galvanometer module that shakes, the light path of ultraviolet laser beam passes through the second focusing mirror with the second galvanometer module that shakes.

According to some embodiments of the utility model, the second mirror module that shakes includes that the second shakes mirror and second field lens, follows the transmission direction of ultraviolet laser beam, the second shake the mirror with the second field lens sets gradually.

According to some embodiments of the utility model, still include first actuating mechanism and second actuating mechanism, first actuating mechanism includes first drive assembly and second drive assembly for the drive first laser subassembly removes along X axle and Z axle direction, second actuating mechanism is used for the drive second laser subassembly removes along X axle and Z axle direction.

According to the utility model discloses a some embodiments still include locating component, locating component connect in first laser subassembly or second laser subassembly, locating component can follow the X axle direction and remove, locating component includes driving piece and probe, the driving piece can drive the probe removes along the Z axle direction, the probe is used for surveying the profile of work piece and confirm the processing initial point, first laser head with the second laser head is located behind the processing initial point right the work piece is processed.

According to the utility model discloses a some embodiments still include the reference column, reference column fixed connection in processing platform, the reference column is used for the location the probe.

According to some embodiments of the utility model, still include dust collecting device, dust collecting device includes the dust leg, the air inlet of dust leg is located one side of processing platform and orientation in processing platform, dust collecting device is used for collecting first laser subassembly and second laser subassembly are in waste gas and the waste material of work piece department processing production.

According to the utility model discloses a some embodiments still include the visual detection device, the visual detection device connect in first laser subassembly or second laser subassembly, the visual detection device is used for detecting the processingquality of work piece.

Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.

Drawings

The invention is further described with reference to the following figures and examples, in which:

fig. 1 is a schematic view of a laser processing apparatus according to an embodiment of the present invention;

fig. 2 is a schematic diagram of a first laser assembly and a second laser assembly according to an embodiment of the present invention;

fig. 3 is a schematic optical path diagram of a first laser assembly according to an embodiment of the present invention;

fig. 4 is a schematic optical path diagram of a second laser assembly according to an embodiment of the present invention;

fig. 5 is a cross-sectional view of a first laser assembly in accordance with an embodiment of the present invention;

fig. 6 is a cross-sectional view of a second laser assembly in accordance with an embodiment of the present invention;

fig. 7 is a schematic view of a positioning assembly and a vision inspection device according to an embodiment of the present invention;

fig. 8 is a schematic view of a positioning column according to an embodiment of the present invention.

Reference numerals are as follows:

a processing platform 100, a positioning column 110 and a positioning hole 111;

a first laser assembly 200, a first laser head 210;

a first galvanometer module 220, a first galvanometer 221, and a first field lens 222;

the first focusing module 230, the first focusing lens 231, the first adjusting mechanism 232, and the first driving member 2321;

the first driving mechanism 240, the first driving assembly 241, the second driving assembly 242, the second driving element 2421;

the first housing 250, the first accommodating cavity 251, the first opening 252, the second opening 253, the extension section 254, the first reflector 255 and the second reflector 256;

a second laser assembly 300, a second laser head 310;

a second galvanometer module 320, a second galvanometer 321, and a second field lens 322;

a second focusing module 330, a second focusing mirror 331, and a second adjusting mechanism 332;

a second drive mechanism 340;

positioning assembly 400, probe 410, probe 411, cover 420, third drive assembly 430;

a visual inspection device 500, a CCD camera 510;

a second fixing frame 610 and a first fixing frame 620.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are exemplary only for explaining the present invention, and should not be construed as limiting the present invention.

In the description of the present invention, it should be understood that the directional descriptions, such as the directions or positional relationships indicated by upper, lower, front, rear, left, right, etc., are based on the directions or positional relationships shown in the drawings, and are only for convenience of description and simplification of the description, but not for indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and thus should not be construed as limiting the present invention.

In the description of the present invention, a plurality of means is one or more, a plurality of means is two or more, and the terms greater than, less than, exceeding, etc. are understood as not including the number, and the terms greater than, less than, within, etc. are understood as including the number. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.

In the description of the present invention, unless there is an explicit limitation, the terms such as setting, installing, connecting, etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meaning of the terms in the present invention by combining the specific contents of the technical solution.

In the description of the present invention, reference to the description of the terms "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Referring to fig. 1 to 8, a first aspect of the present invention provides a laser processing apparatus, including a frame, a processing platform 100, and a laser processing device. The rack comprises a first fixing frame 620 and a second fixing frame 610, wherein the first fixing frame 620 and the second fixing frame 610 are connected with each other. The processing platform 100 is connected to the second fixing frame 610, and the processing platform 100 is used for placing a workpiece to be processed. The laser processing device is connected to the first fixing frame 620, the laser processing device comprises a first laser component 200 and a second laser component 300, the first laser component 200 comprises a first laser head 210, the first laser head 210 is used for generating infrared laser beams, the second laser component 300 comprises a second laser head 310, and the second laser head 310 is used for generating ultraviolet laser beams. The first laser assembly 200 is used to machine a first machined area in the surface of the workpiece and the second laser assembly 300 is used to machine a second machined area in the first machined area. The first laser head 210 can generate infrared laser beams to roughly machine a workpiece to be machined to form a first machining area, the second laser head 310 can generate ultraviolet laser beams to finely machine the first machining area, the infrared laser beams are high in machining speed but low in precision, the ultraviolet laser beams are slower than the infrared laser beams but high in precision, the infrared laser beams and the ultraviolet laser beams are combined to be machined successively, and laser machining efficiency is considered on the premise that laser machining quality can be guaranteed. The infrared laser processing step and the ultraviolet laser processing step can be carried out sequentially or simultaneously, when the infrared laser processing and the ultraviolet laser processing are carried out simultaneously, the infrared laser processes the unprocessed area of the workpiece, and the ultraviolet laser processes the processed surface of the infrared laser, so that the processing efficiency is further improved.

For example, when a workpiece to be processed made of a metal material is processed, the infrared laser beam heats the surface of the workpiece to be processed to vaporize the metal to form a first processing region, and the poor processing precision of the infrared laser beam causes the texture formed in the first processing region to be rough, but the processing speed is high. Ultraviolet laser forms the second machining region at first machining region processing, and ultraviolet laser can directly destroy the molecular bond on material surface and make the molecule break away from the object and can not produce higher heat, can make the work piece after the processing completion have smooth edge and minimum carbonization to possess faster process velocity under the prerequisite of guaranteeing processingquality.

Referring to fig. 3 and 5, in some embodiments, the first laser assembly 200 further includes a first galvanometer module 220 and a first focusing module 230, the first focusing module 230 includes a first focusing lens 231 and a first adjusting mechanism 232, the first focusing lens 231 is disposed on an output end of the first adjusting mechanism 232, the first adjusting mechanism 232 is configured to adjust a distance between the first focusing lens 231 and the first laser head 210 and a distance between the first focusing lens 231 and the first galvanometer module 220, and an optical path of the infrared laser beam passes through the first focusing lens 231 and the first galvanometer module 220.

Referring to fig. 5, specifically, the first laser assembly 200 is further provided with a first housing 250, a first reflector 255 and a second reflector 256, the first housing 250 includes a first accommodating cavity 251, a first opening 252 and a second opening 253, the first opening 252 and the second opening 253 are both communicated with the first accommodating cavity 251, the first accommodating cavity 251 includes an extending section 254, the extending section 254 is communicated with the first opening 252 and the second opening 253, and the extending section 254 is horizontally arranged. The first reflecting mirror 255 is disposed at one end of the extending section 254 far away from the first laser head 210, the second reflecting mirror 256 is disposed at the other end of the extending section 254, and the first focusing module 230 is disposed between the first reflecting mirror 255 and the second reflecting mirror 256. The arrangement of the first reflecting mirror 255 and the second reflecting mirror 256 can increase the optical path length of the laser beam, and facilitate adjustment of parameters and properties of the laser beam during the delivery of the laser beam.

The first focusing module 230 includes a first focusing mirror 231 and a first driving member 2321, the first driving member 2321 can drive the first focusing mirror 231 to move along the length direction of the extension section 254, so as to adjust the distance between the first reflecting mirror 255 and the second reflecting mirror 256, and further adjust the focal length of the laser beam incident into the first galvanometer module 220, and the laser beam enters the accommodating cavity from the first opening 252, and is reflected by the first reflecting mirror 255 and the second reflecting mirror 256 and then enters the first galvanometer module 220.

The first galvanometer module 220 includes a first galvanometer 221 and a first field lens 222, the first galvanometer 221 and the first field lens 222 are sequentially arranged along the transmission direction of the infrared laser beam, and the laser beam is emitted from the first field lens 222 through the first galvanometer 221 and acts on the workpiece. Wherein the first galvanometer 221 is capable of adjusting the position of the laser beam in the X-Y plane and the first field lens 222 is capable of focusing the laser beam on the workpiece. The position of the laser beam acting on the workpiece can be changed without moving the position of the first laser assembly 200 within the adjusting range of the first galvanometer 221, so that the laser beam is processed in the region to be processed of the processed workpiece until the processing of the workpiece within the adjusting range of the galvanometer is completed, the position of the first laser assembly 200 is integrally moved, the first laser assembly 200 is prevented from moving for many times, and the service life of the laser processing equipment is prolonged.

Referring to fig. 4 and 6, in some embodiments, the second laser assembly 300 further includes a second galvanometer module 320 and a second focusing module 330, the second focusing module 330 includes a second focusing mirror 331 and a second adjusting mechanism 332, the second focusing mirror 331 is disposed on an output end of the second adjusting mechanism 332, the second adjusting mechanism 332 is used for adjusting a distance between the second focusing mirror 331 and the second laser head 310 and a distance between the second focusing mirror and the second galvanometer module 320, and an optical path of the ultraviolet laser beam passes through the second focusing mirror 331 and the second galvanometer module 320. The second galvanometer module 320 includes a second galvanometer 321 and a second field lens 322, and the second galvanometer 321 and the second field lens 322 are sequentially arranged along the transmission direction of the ultraviolet laser beam. The other components of the second laser assembly 300 except the laser head are the same as those of the first laser assembly 200, and are not described herein again.

Referring to fig. 1 and 2, in some embodiments, the laser processing apparatus further includes a first driving mechanism 240 and a second driving mechanism 340, the first driving mechanism 240 includes a first driving assembly 241 and a second driving assembly 242, the first driving assembly 241 can drive the first laser assembly 200 to move along the X-axis direction, the second driving assembly 242 can drive the first laser assembly 200 to move along the Z-axis direction, the first driving assembly 241 can be selected to be a linear motor module, the second driving assembly 242 includes a second driving member 2421 and a grinding screw, the precision of the linear motor module and the grinding screw is high, and the precise positioning of the first laser assembly 200 in the Z-axis direction and the X-axis direction can be achieved. Preferably, the second driving element 2421 is a stepping motor, and the second driving mechanism 340 has the same composition as the first driving mechanism 240.

Referring to fig. 7, in some embodiments, the laser processing apparatus further includes a positioning assembly 400, the positioning assembly 400 is connected to the first laser assembly 200, the first laser assembly 200 can drive the positioning assembly 400 to move along the X-axis direction when moving, the positioning assembly 400 includes a third driving assembly 430, a probe 410 and a cover 420, the third driving assembly 430 can drive the probe 410 to move along the Z-axis direction, the probe 410 includes a probe 411, the probe 410 is used for detecting the profile of the workpiece and determining a processing origin, the probe records coordinate values after sampling a plurality of points of the profile of the workpiece and inputs the coordinate values to the industrial personal computer, the industrial personal computer processes the coordinate values and generates the spatial position of the workpiece, and provides the processing origin for the processing position of the laser head. The cover 420 serves to protect the third drive assembly and the probe 410 from impact by other objects during operation.

For example, when a spherical workpiece to be machined is machined, the probe 410 is lowered until the probe 411 and the maximum diameter of the spherical workpiece to be machined are located on the same plane, the probe 411 moves in the X-Y plane, the probe moves towards the workpiece to be machined from two directions of the X axis and two directions of the Y axis respectively until the probe contacts the workpiece to be machined, current coordinate values are recorded, namely, the center point of the workpiece to be machined can be obtained through calculation of 4 coordinate values, and therefore the position of the machining origin is determined. It can be understood that the probe 410 can sample a plurality of points on the outer surface of the workpiece to be processed, so that the outer contour of the workpiece to be processed is formed more accurately, and the laser processing precision is further improved.

Referring to fig. 8, in some embodiments, the laser processing apparatus further includes a positioning column 110, the positioning column 110 is fixedly connected to the processing platform 100, and the positioning column 110 is used for positioning the probe 410. The positioning column 110 is provided with a positioning hole 111, the position of the positioning hole 111 is a zero point position, the probe 411 can be accommodated in the positioning hole 111 and positioned, and the probe 410 needs to be positioned at the positioning hole 111 before each laser processing to ensure the accuracy of subsequent measurement of the shape of the workpiece to be processed, thereby ensuring the processing precision of the laser processing.

In some embodiments, the first laser head 210 is an infrared nanosecond laser and the second laser head 310 is an ultraviolet picosecond laser. The infrared laser energy generated by the first laser head 210 is high, and the material on the surface of the workpiece is heated and gasified, so that the purpose of removing the material is achieved, and the processing efficiency is high. The wavelength of the ultraviolet laser generated by the second laser head 310 is short, and the ultraviolet laser can directly damage the molecular bonds on the surfaces of a plurality of non-metallic materials to enable the molecules to be separated from the workpiece. In addition, the ultraviolet laser can be focused on a point of submicron order, and can process fine parts, and can obtain high energy density even at a not high pulse energy level, thereby effectively processing materials.

In some embodiments, the laser processing apparatus further comprises a dust collecting device (not shown) for collecting waste gases and debris generated by processing the first laser assembly 200 and the second laser assembly 300 at the workpiece. The dust collecting device includes a dust collecting pipe having an air inlet at one side of the processing platform 100. Through setting up dust collecting device, can collect the residue and the dust of production in the laser beam machining process, guarantee clean and tidy clean of environment, avoid residue and dust to cause the influence to laser beam machining's processingquality.

Referring to fig. 7, in some embodiments, a visual inspection apparatus 500 is further included, and the visual inspection apparatus 500 is used for inspecting the processing quality of the workpiece. The vision inspection device 500 is connected to the positioning assembly 400, the vision inspection device 500 comprises a CCD camera 510, the CCD camera 510 captures a picture of the processed workpiece and transmits the picture to an industrial personal computer for analysis, so as to determine whether the surface quality of the laser processed workpiece meets requirements and whether processing defects exist, and further determine the processing quality of the laser processing.

The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present invention within the knowledge of those skilled in the art. Furthermore, the embodiments of the present invention and features of the embodiments may be combined with each other without conflict.

Claims (10)

1. Laser processing apparatus, characterized by comprising:

the rack comprises a first fixing frame and a second fixing frame, and the first fixing frame and the second fixing frame are connected with each other;

the processing platform is connected to the second fixing frame and used for placing a workpiece to be processed;

the laser processing device is connected to the first fixing frame and comprises a first laser assembly and a second laser assembly, the first laser assembly and the second laser assembly are arranged in parallel, the first laser assembly comprises a first laser head, the first laser head is used for generating infrared laser beams, the second laser assembly comprises a second laser head, and the second laser head is used for generating ultraviolet laser beams;

the first laser assembly is used for processing and forming a first processing area on the surface of the workpiece, and the second laser assembly is used for processing and forming a second processing area on the first processing area.

2. The laser processing apparatus of claim 1, wherein the first laser assembly further comprises a first galvanometer module and a first focusing module, the first focusing module comprises a first focusing lens and a first adjusting mechanism, the first focusing lens is disposed at an output end of the first adjusting mechanism, the first adjusting mechanism is used for adjusting a distance between the first focusing lens and the first laser head and a distance between the first galvanometer module and the first focusing lens, and an optical path of the infrared laser beam passes through the first focusing lens and the first galvanometer module.

3. The laser processing apparatus according to claim 2, wherein the first galvanometer module includes a first galvanometer and a first field lens, and the first galvanometer and the first field lens are sequentially arranged along a transmission direction of the infrared laser beam.

4. The laser processing apparatus of claim 1, wherein the second laser assembly further comprises a second galvanometer module and a second focusing module, the second focusing module comprises a second focusing lens and a second adjusting mechanism, the second focusing lens is disposed on an output end of the second adjusting mechanism, the second adjusting mechanism is used for adjusting a distance between the second focusing lens and the second laser head and a distance between the second focusing lens and the second galvanometer module, and an optical path of the ultraviolet laser beam passes through the second focusing lens and the second galvanometer module.

5. The laser processing apparatus according to claim 4, wherein the second galvanometer module includes a second galvanometer and a second field lens, and the second galvanometer and the second field lens are sequentially arranged along a transmission direction of the ultraviolet laser beam.

6. The laser processing apparatus of claim 1, further comprising a first drive mechanism and a second drive mechanism, the first drive mechanism comprising a first drive assembly and a second drive assembly for driving the first laser assembly to move in the X-axis and Z-axis directions, the second drive mechanism for driving the second laser assembly to move in the X-axis and Z-axis directions.

7. The laser processing apparatus of any one of claims 1 to 6, further comprising a positioning assembly, wherein the positioning assembly is connected to the first laser assembly or the second laser assembly, the positioning assembly is capable of moving along an X-axis direction, the positioning assembly comprises a driving member and a probe, the driving member is capable of driving the probe to move along a Z-axis direction, the probe is used for detecting the contour of the workpiece and determining a processing origin, and the workpiece is processed after the first laser head and the second laser head are positioned at the processing origin.

8. The laser processing apparatus of claim 7, further comprising a positioning post fixedly connected to the processing platform, the positioning post being configured to position the probe.

9. The laser processing apparatus of claim 1, further comprising a dust collection device, wherein the dust collection device comprises a dust collection pipe, an air inlet of the dust collection pipe is located at one side of the processing platform and faces the processing platform, and the dust collection device is used for collecting waste gas and/or waste material generated by processing of the first laser assembly and the second laser assembly at a workpiece.

10. The laser processing apparatus of claim 1, further comprising a visual inspection device connected to the first laser assembly or the second laser assembly, the visual inspection device configured to inspect a processing quality of the workpiece.

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