CN217983381U

CN217983381U - Micro LED chip

Info

Publication number: CN217983381U
Application number: CN202220995575.1U
Authority: CN
Inventors: 庄文荣; 卢敬权
Original assignee: Dongguan HCP Technology Co Ltd
Current assignee: Dongguan HCP Technology Co Ltd
Priority date: 2022-04-27
Filing date: 2022-04-27
Publication date: 2022-12-06
Anticipated expiration: 2032-04-27

Abstract

The utility model belongs to the technical field of the chip, a Micro LED chip is disclosed, include: the chip body, the chip body includes the play plain noodles, be equipped with the convex lens body of a plurality of array on the play plain noodles. When the LED light source works, the chip body operates to generate light, the light is emitted from the light emitting surface, part of the light is emitted into the convex lens body, and the convex lens body plays a role in increasing the light penetration rate and enhancing the light emitting efficiency; on the other hand, the convex lens body plays a role of changing a light path, diffused light rays are emitted through the convex lens body, and light uniformity is improved.

Description

Micro LED chip

Technical Field

The utility model relates to a chip technology field especially relates to a Micro LED chip.

Background

Micro LEDs are also called Micro light emitting diodes, and refer to high-density integrated LED arrays, the distance between LED pixel points in the arrays is 10 microns, and each LED pixel can self-emit light. Micro LED as a new generation display technology has significant advantages compared with the existing liquid crystal display and OLED display, such as low energy consumption, long service life, no screen burning, high color gamut, etc.

The conventional patterned substrate is mainly designed based on a forward chip and a flip chip, and in the forward chip, a reflecting layer (usually a Distributed Bragg Reflector (DBR)) is usually manufactured on the back of the substrate, so that the reflection efficiency of light is enhanced, and the emergent efficiency of the light from the front of an LED is further enhanced. However, in the flip chip, the back surface of the substrate is a light emitting surface, and the light emitting efficiency is reduced by the strong reflection of the patterned substrate.

In view of this, it is necessary to improve the chip structure in the prior art to solve the technical problem of low light emitting efficiency of the flip chip.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a Micro LED chip solves above technical problem.

To achieve the purpose, the utility model adopts the following technical proposal:

a Micro LED chip, comprising:

the chip body, the chip body includes the play plain noodles, be equipped with the convex lens body of a plurality of array on the play plain noodles.

Optionally, the convex lens body is a plano-convex lens, the convex lens body includes a flat surface and a convex surface, and the flat surface is attached to the light emitting surface.

Optionally, the chip body includes an intrinsic layer, an n-type layer, a light emitting layer, an electron blocking layer, and a p-type layer stacked in sequence;

the light emitting surface is an end surface of the intrinsic layer far away from the n-type layer.

Optionally, the convex lens body and the intrinsic layer are integrally formed.

Optionally, the electronic device further comprises a circuit layer, wherein the circuit layer is arranged on one end face, away from the electron blocking layer, of the p-type layer and on one end face, away from the intrinsic layer, of the n-type layer;

the circuit layer comprises a p electrode and an n electrode.

Optionally, the display device further comprises a transparent conductive layer and a reflective layer sequentially stacked on the p-type layer.

Optionally, the p-electrode sequentially penetrates through the reflective layer and the transparent conductive layer and is connected with the p-type layer; the n-electrode penetrates through the reflecting layer and is connected with the n-type layer.

Optionally, the convex lens body is one of a hemisphere and a square.

Compared with the prior art, the utility model discloses following beneficial effect has: when the chip works, the chip body operates to generate light, the light is emitted from the light emitting surface, part of the light is emitted into the convex lens body, and the convex lens body plays a role in increasing the light transmittance and enhancing the light emitting efficiency; on the other hand, the convex lens body plays a role in changing a light path, diffused light is emitted through the convex lens body, and light uniformity is improved.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without inventive exercise.

The structure, ratio, size and the like shown in the drawings of the present specification are only used for matching with the content disclosed in the specification, so as to be known and read by people familiar with the technology, and are not used for limiting the limit conditions which can be implemented by the present invention, so that the present invention does not have the substantial significance in the technology, and any structure modification, ratio relationship change or size adjustment should still fall within the scope which can be covered by the technical content disclosed by the present invention without affecting the efficacy which can be produced by the present invention and the achievable purpose.

FIG. 1 is a schematic structural view of the present Micro LED chip and a transfer substrate;

fig. 2 to 5 are schematic views of the manufacturing process structure of the Micro LED chip.

Illustration of the drawings: the light emitting diode chip comprises a chip body 100, a light emitting surface 101, an intrinsic layer 120, an n-type layer 130, a light emitting layer 140, an electron blocking layer 150, a p-type layer 160, a transparent conductive layer 170, a reflecting layer 180, a p electrode 191 and an n electrode 192;

convex lens body 200, processing substrate 300, relay substrate 400.

Detailed Description

In order to make the objects, features and advantages of the present invention more obvious and understandable, the drawings in the embodiments of the present invention are combined below to clearly and completely describe the technical solutions in the embodiments of the present invention, and obviously, the embodiments described below are only some embodiments of the present invention, but not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

In the description of the present invention, it is to be understood that the terms "upper", "lower", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention. It should be noted that when one component is referred to as being "connected" to another component, it can be directly connected to the other component or intervening components may also be present.

The technical solution of the present invention is further explained by the following embodiments with reference to the accompanying drawings.

With reference to fig. 1, the utility model provides a Micro LED chip, include:

the chip body 100 includes a light emitting surface 101, and a plurality of arrays of convex lens bodies 200 are disposed on the light emitting surface 101.

The utility model discloses a theory of operation does: when the chip works, the chip body 100 operates to generate light, the light is emitted from the light emitting surface 101, part of the light is emitted into the convex lens body 200, and the convex lens body 200 plays a role in increasing the light transmittance and enhancing the light emitting efficiency; on the other hand, the convex lens body 200 plays a role of changing a light path, and diffused light is emitted through the convex lens body 200 to increase light uniformity.

In this embodiment, the convex lens body 200 is a plano-convex lens, and the convex lens body 200 includes a flat surface and a convex surface, and the flat surface is disposed to be attached to the light emitting surface 101.

It should be noted that the flat surface of the convex lens body 200 is disposed in close contact with the light emitting surface 101, that is, the light of the light emitting surface 101 is directly emitted into the convex lens body 200, so that the loss of light emission is reduced, and the light emitting efficiency is improved.

Specifically, the chip body 100 includes an intrinsic layer 120, an n-type layer 130, a light emitting layer 140, an electron blocking layer 150, and a p-type layer 160, which are sequentially stacked;

the light emitting surface 101 is an end surface of the intrinsic layer 120 away from the n-type layer 130.

As a preferred embodiment of the present invention, the lenticular lens body 200 and the intrinsic layer 120 are integrally formed. As shown in fig. 3, the intrinsic layer 120 is formed on the machining surface of the machining substrate 300, and since the machining surface is provided with grooves arranged in an array, the surface of the intrinsic layer 120 forms protrusions arranged in an array matching with the grooves, i.e., the convex lens body 200. The convex lens body 200 and the intrinsic layer 120 are integrally formed, the refractive indexes of the two layers are the same, light can directly irradiate the convex lens body 200, the light emergent loss is reduced, and the light emergent efficiency is improved.

Optionally, the Micro LED chip further includes a circuit layer, where the circuit layer is disposed on an end surface of the p-type layer 160 away from the electron blocking layer 150;

the circuit layer comprises a p electrode 191 and an n electrode 192

Optionally, the Micro LED chip further includes a transparent conductive layer 170 and a reflective layer 180 sequentially stacked on the p-type layer 160;

the p-electrode 191 penetrates the reflective layer 180 and the transparent conductive layer 170, and is connected to the p-type layer 160. The n-electrode 192 penetrates the reflective layer 180 and is connected to the n-type layer 130.

As an alternative of the present embodiment, the convex lens body 200 may be, but not limited to, one of a hemispherical shape and a square shape. The shape of the convex lens body 200 can be flexibly adjusted according to the imaging requirements of the chip in actual production.

With reference to fig. 2 to 5 and the sequence shown in fig. 1, a schematic flow chart of the fabrication of the Micro LED chip in the present embodiment is shown;

the specific manufacturing steps are as follows:

as shown in fig. 2, which is a schematic diagram of the first step, the first step specifically includes: providing a processing substrate 300, wherein the processing surface of the processing substrate 300 is provided with an array of grooves (or pits), and the diameter of each groove is less than 0.5 μm;

as shown in fig. 3, which is a schematic diagram of the second step, the second step specifically includes: performing epitaxial growth on the handle substrate 300 to form an epitaxial structure including a buffer layer (not shown), an intrinsic layer 120, an n-type layer 130, a light emitting layer 140, an electron blocking layer 150, and a p-type layer 160, which are sequentially stacked;

as shown in fig. 4, it is a schematic diagram of step three, and step three specifically includes: etching the epitaxial structure to process a chip initial blank with the shape of a chip, and forming a transparent conducting layer 170, a reflecting layer 180, a p electrode 191 and an n electrode 192 on the chip initial blank; to produce a chip body 100;

as shown in fig. 5, the schematic diagram of step four, the step four specifically includes: the chip body 100 is bonded or attached to the relay substrate 400. The relay substrate 400 plays a role of temporary bearing so as to allow the subsequent processing procedure of the Micro LED chip to be performed.

It should be noted that, the scheme adopts a mode of inverting the Mini LED chip and processing the substrate 300; but not limited to the upside-down mode, and the inclined installation mode can also be adopted according to the working requirement.

As shown in fig. 1, the schematic diagram of step five specifically includes: the processing substrate 300 is removed by laser lift-off to produce Micro LED chips with a lens array.

The above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications or substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A Micro LED chip, comprising:

the chip comprises a chip body (100), wherein the chip body (100) comprises a light-emitting surface (101), and a plurality of array convex lens bodies (200) are arranged on the light-emitting surface (101);

the chip body (100) comprises an intrinsic layer (120), an n-type layer (130), a light-emitting layer (140), an electron blocking layer (150) and a p-type layer (160) which are sequentially stacked;

the light emitting surface (101) is an end surface of the intrinsic layer (120) far away from the n-type layer (130);

the lenticular bodies (200) are integrally formed with the intrinsic layer (120).

2. A Micro LED chip according to claim 1, wherein the convex lens body (200) is a plano-convex lens, the convex lens body (200) comprises a flat surface and a convex surface, and the flat surface is disposed to be attached to the light emitting surface (101).

3. A Micro LED chip according to claim 1, further comprising a circuit layer disposed on an end of the p-type layer (160) distal from the electron blocking layer (150) and an end of the n-type layer (130) distal from the intrinsic layer (120);

the circuit layer comprises a p electrode (191) and an n electrode (192).

4. A Micro LED chip according to claim 3, further comprising a transparent conductive layer (170) and a reflective layer (180) laminated in sequence to the p-type layer (160).

5. A Micro LED chip according to claim 4, characterized in that said p-electrode (191) penetrates sequentially through said reflective layer (180) and said transparent conductive layer (170) and is connected to said p-type layer (160); the n-electrode penetrates the reflective layer (180) and is connected to the n-type layer (130).

6. A Micro LED chip according to claim 1, wherein the lenticular body (200) is one of hemispherical, square shaped.