CN217981935U

CN217981935U - Electronic board and switching device

Info

Publication number: CN217981935U
Application number: CN202221829994.4U
Authority: CN
Inventors: 陈明煊
Original assignee: Alibaba China Co Ltd
Current assignee: Alibaba China Co Ltd
Priority date: 2022-06-11
Filing date: 2022-07-15
Publication date: 2022-12-06
Anticipated expiration: 2032-07-15

Abstract

The application discloses electron board and exchange equipment can improve the radiating efficiency. The electronic board includes: the first optical module layer, the second optical module layer and the first liquid cooling plate; the first liquid cooling plate is arranged between the first optical module layer and the second optical module layer and used for dissipating heat of the first optical module layer and the second optical module layer.

Description

Electronic board and switching device

Technical Field

The application relates to the field of electronic equipment, in particular to an electronic board and a switching device.

Background

A switch is a network device used for the forwarding of electrical (optical) signals. It may provide an exclusive electrical signal path for any two network nodes accessing the switch. The switch may include a processor and a plurality of connectors. The processor is used for forwarding the switch data transmitted to the processor by any one of the connectors to other connectors in the connectors. In the switch, the connector can be connected with the optical module. The optical module is used for performing photoelectric and/or electro-optical conversion.

Chip technology and communication technology are continuously developed, the processing capacity of a processor of the switch is continuously enhanced, more connectors can be connected, the forwarding flow of the switch is continuously increased, and the forwarding speed is also increased. The heat dissipation efficiency of the optical module in the switch becomes an important factor affecting the working stability and reliability of the switch.

To reduce the space occupation, the optical modules may be stacked. The stacked optical modules further increase the difficulty of heat dissipation of the optical modules.

SUMMERY OF THE UTILITY MODEL

The application provides an electronic board and exchange equipment, which can improve the heat dissipation efficiency of an optical module.

The embodiment of the application provides a heat dissipation device of electronic equipment, which comprises a first optical module layer, a second optical module layer and a first liquid cooling plate;

the first liquid cooling plate is arranged between the first optical module layer and the second optical module layer and used for dissipating heat of the first optical module layer and the second optical module layer.

Optionally, the first optical module layer is provided with a first housing, the second optical module layer is provided with a second housing, the first liquid cooling plate is disposed between the first housing and the second housing, and each of the first housing and the second housing is used for inserting at least one optical module.

Optionally, a length of the first liquid cold plate is greater than or equal to a length of the first enclosure, and a length of the first liquid cold plate is greater than or equal to a length of the second enclosure.

Optionally, the electronic board further includes a substrate, a bottom of the first housing is fixed to the substrate, the second housing is located on a side of the first housing away from the substrate, and the second housing is provided with a supporting portion fixed to the substrate.

Optionally, the electronic board further comprises a connector array comprising a plurality of connectors, the connectors being electrically connected with the light modules;

the supporting part is fixed on the substrate in the area where the connector array is located.

Optionally, the electronic board further comprises a heat sink located on a side of the second housing away from the first liquid cold plate.

Optionally, the electronic board further includes a third liquid cooling plate, and the third liquid cooling plate is located on a side of the second housing away from the first liquid cooling plate, and is configured to dissipate heat of the second optical module layer.

Optionally, the electronic board further includes a connector array including a plurality of connectors electrically connected to the light module, and the first liquid cooling plate and the connector array have a contact surface.

Optionally, the first optical module layer is provided with a first housing, the second optical module layer is provided with a second housing, the first liquid cooling plate is disposed between the first housing and the second housing, and each of the first housing and the second housing is used for inserting at least one optical module;

and a second boss is arranged on the first shell and/or the second shell, and the first liquid cooling plate is positioned between the connector array and the second boss.

Optionally, the first liquid cooling plate is provided with a first protruding portion, and a surface of the first housing and/or the second housing, which is close to the first liquid cooling plate, is provided with a recessed portion, into which the first protruding portion can be inserted; alternatively, the first and second electrodes may be,

the first liquid cooling plate is provided with the depressed part, and the first raised part is arranged on the surface, close to the first liquid cooling plate, of the first shell and/or the second shell.

Optionally, the electronic board further includes a pipe, and the pipe is connected to the first liquid-cooled board and used for conveying and recovering the cooling liquid for the first liquid-cooled board;

the pipeline is fixed on the first liquid cooling plate, and the first shell and/or the second shell are/is provided with a fixing part which is used for fixing the pipeline.

Optionally, the electronic board further includes a processing chip and a second liquid cooling plate, and the second liquid cooling plate is used for dissipating heat of the processing chip.

Optionally, the electronic board further comprises a duct;

the pipeline comprises a conveying section, a recovery section, a first transmission section and a second transmission section;

a first end of the conveying section is connected with a coolant flow outlet, and a second end of the conveying section is connected with the second liquid cooling plate;

the first end of the first transmission section is connected with the second liquid cooling plate, and the second end of the first transmission section is connected with the first liquid cooling plate;

the first end of the second transmission section is connected with the first liquid cooling plate, and the second end of the second transmission section is connected with the second liquid cooling plate;

the first end of the recycling section is connected with the second liquid cooling plate, and the second end of the recycling section is connected with the cooling liquid recycling port.

Optionally, the first liquid cooling plate includes uniformly arranged cooling liquid flow passages.

An embodiment of the present application further provides a switching device, including the electronic board described above.

According to the embodiment of the application, the liquid cooling plate is arranged between the two stacked optical module layers, so that the heat dissipation efficiency of the optical module in the optical module layer can be improved, and the working stability and reliability of the electronic plate are improved.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the application and, together with the description, serve to explain the principles of the application.

FIG. 1 is a schematic line architecture diagram of a switch;

fig. 2 is a schematic structural diagram of a heat dissipation device of an electronic device according to an embodiment of the present disclosure;

fig. 3 is a schematic structural diagram of an electronic board provided in an embodiment of the present application;

FIG. 4 is a top view of the electronic board shown in FIG. 3;

fig. 5A is a schematic structural diagram of an electronic board provided in an embodiment of the present application;

FIG. 5B is a side view of the electronic board shown in FIG. 5A;

FIG. 6 is a schematic block diagram of an enclosure assembly provided by an embodiment of the present application;

FIG. 7 is a schematic block diagram of another housing assembly provided by embodiments of the present application;

FIG. 8 is a schematic block diagram of a housing and a liquid cooling plate provided in an embodiment of the present application;

fig. 9 is a schematic structural diagram of another housing and a liquid cooling plate provided in an embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

It is noted that the terms "first," "second," and the like in the description of the present application are used for descriptive purposes only and are not to be construed as indicating or implying relative importance, as well as a particular order or sequence. The specific meaning of the above terms in this application will be understood to be a specific case for those of ordinary skill in the art. Further, in the description of the present application, the term "plurality" means two or more unless otherwise specified. The term "and/or" describes an associative relationship of associated objects, meaning that three relationships may exist, e.g., a and/or B, may mean: a exists alone, A and B exist simultaneously, and B exists alone. The character "/" generally indicates that the former and latter associated objects are in an "or" relationship. The terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.

As used herein, the terms "over" \ 8230; "," over "\8230;" \8230 ";" over "", "" to "", "" over "\8230;", "" between "\8230"; "over"; "and" over ";" between "\8230;" over ";" and the like, may refer to the relative position of one layer with respect to other layers. One layer is "on," "over," or "on" another layer, or connected or bonded to or in "contact with" another layer may be directly in contact with the other layer or may have one or more intervening layers. A layer "between" multiple layers may be directly in contact with the multiple layers or may have one or more intervening layers.

Switching is a general term for a technology of sending information to be transmitted to a corresponding route meeting requirements by a method of manual or automatic completion of equipment according to the requirements of information transmission at two communication ends.

A switch is a network device used for forwarding electrical (optical) signals. It may provide an exclusive electrical signal path for any two network nodes accessing the switch. The most common switch is an ethernet switch. Also common are telephone voice switches, fiber optic switches, and the like.

As shown in fig. 1, the switch may include a processor 110 and a plurality of connectors (connectors) 121-125. The processor 110 is configured to forward the switch data transmitted to the processor from any one of the plurality of connectors 121-125 to other connectors 121-125.

Each of the connectors 121-125 may be used to connect optical modules. The connector may also be a socket, switch interface or header. The optical module is used for performing photoelectric and/or electro-optical conversion.

Illustratively, the optical module may receive an electrical signal transmitted by the processor 110 of the switch through the connector and convert the electrical signal into an optical signal. The optical signal may be transmitted through an optical fiber.

Alternatively, the optical module may receive an optical signal transmitted by an optical fiber, convert the optical signal into an electrical signal, and transmit the electrical signal to the processor 110 of the switch through the connector.

Chip technology and communication technology are continuously developed, the capacity of the switch processor 110 is continuously enhanced, more connectors can be arranged in the switch, and the number of optical modules connected to the switch is increased. The forwarding flow of the switch is continuously increased, and the forwarding speed is faster and faster.

The increase in the number of optical modules in the switch increases the amount of heat dissipated by the optical modules. If the optical module causes the switch to work and even the equipment is damaged due to insufficient heat dissipation, the service reliability and the stability of the switch are greatly influenced.

To reduce the space occupation, the optical modules may be stacked. That is, the switch may include a plurality of optical module layers arranged in a stack, each of which may be provided with one or more optical modules. The optical module layers are stacked, and the difficulty of heat dissipation is further increased.

In order to solve the above problem, an embodiment of the present application provides a heat dissipation device for an electronic device.

Fig. 3 is a schematic structural diagram of an electronic board provided in an embodiment of the present application. Fig. 4 is a top view of the electronic board shown in fig. 3.

The electronic board comprises a first light module layer 311, a second light module layer 312, a first liquid cold plate 321.

The first liquid cold plate 321 is disposed between the first light module layer 311 and the second light module layer 312. The first liquid cold plate 321 is used to dissipate heat of the first light module layer 311 and the second light module layer 312.

The cooling liquid can flow in the liquid cooling plate and exchange heat with the components around the liquid cooling plate. The cooling liquid circulates and takes away the received heat.

By disposing the first liquid-cold plate 321 between the first light module layer 311 and the second light module layer 312, the first liquid-cold plate 321 can dissipate heat of the first light module layer 311 and the second light module layer 312 on two sides of the first liquid-cold plate 321, thereby improving heat dissipation efficiency of the electronic board.

The cooling fluid may include one or more of water, alcohol, glycerin, glycol, and the like.

The liquid cooling plate may include uniformly arranged flow channels. The flow passages may also be referred to as coolant flow passages. A cooling fluid may flow in the flow channel. Therefore, the cooling liquid can uniformly flow through the liquid cooling plate area, so that the heat dissipation of the liquid cooling plate is more uniform. The flow channel can be arranged in the whole liquid cooling plate area, so that the heat dissipation dead angle is avoided.

The flow channels in the liquid-cooled plate may be one or more. For example, the liquid cooled plate may include a serpentine flow channel, or the liquid cooled plate may include a plurality of parallel linear flow channels.

The corners of the serpentine flow path may be arcuate. Thereby, the flow of the coolant is made smoother.

It should be understood that the electronic board may also comprise a plurality of stacked device light module layers. A liquid cooling plate can be arranged between every two optical module layers, so that the heat dissipation efficiency of the electronic plate is improved.

The electronic board may also include a duct 330. The conduit 330 is used to deliver and recover the cooling fluid for the first fluid-cooled plate 321.

The electronic board may further comprise a substrate 340. The substrate 340 may be a support for electronic components. The substrate 340 may be, for example, a Printed Circuit Board (PCB) for electrically connecting the supported electronic components.

Each of the first and second light module layers 311, 312 may be used to provide at least one light module layer.

Illustratively, the first light module layer 311 may be provided with a first housing and the second light module layer 312 may be provided with a second housing. That is, the first housing is located at the first light module layer 311, and the second housing is located at the second light module layer 312. The electronic board may include a first housing and a second housing.

Each of the first and second housings is for inserting at least one light module.

The length of the first liquid cold plate 321 may be greater than or equal to the length of the first enclosure and may be greater than or equal to the length of the second enclosure. Thereby, the heat dissipation efficiency of the electronic board is improved.

The bottom of the first housing may be fixed on the base plate 340. The second housing is located on a side of the first housing away from the substrate 340. That is, the second light module layer 312 is located on a side of the first light module layer 311 away from the substrate 340.

The second housing may be provided with a support portion, and the support portion may be fixed on the substrate 340.

The first casing is fixed on the substrate 340 through the bottom of the first casing, and the second casing is provided with a support portion, so that the support portion is fixed on the substrate 340, and both the first casing and the second casing are fixed on the substrate 340. Thereby, the positions of the first and second housings in the electronic board are stabilized.

The electronic board may also include a connector array 360. The connector array 360 includes a plurality of connectors for electrically connecting with the light modules.

The support portion provided on the second housing may be fixed on the substrate 340 in a region where the connector array 360 is located.

In general, the number of optical modules that can be inserted into the first housing and the second housing is the same, that is, the first housing and the second housing may have the same size.

Compared with the manner of disposing the supporting portion on the second housing in the area where the first housing is disposed, the space utilization rate can be improved by disposing the supporting portion on the second housing in the area where the connector array 360 is disposed on the substrate 340.

The first liquid cold plate 321 and the connector array 360 may have an interface. That is, the first liquid cold plate 321 may be in contact with the connector array 360. Therefore, the first liquid-cooling plate 321 can dissipate heat from the contact surface, which can improve the heat dissipation efficiency of the electronic board.

The first housing and/or the second housing may be provided with a second boss. Thus, the first liquid-cooled plate 321 may be located between the array of connectors and the second boss.

The first liquid cold plate 321 may also be provided with a first protrusion, and the surface of the first shell and/or the second shell proximate to the first liquid cold plate 321 may be provided with a depression. Alternatively, the first liquid-cold plate 321 is provided with a concave portion, and the surface of the first shell and/or the second shell near the first liquid-cold plate 321 is provided with a first convex portion. The first convex portion can be inserted into the concave portion, so that the relative position of the first liquid-cold plate 321 and the housing provided with the first convex portion can be fixed.

The conduit 340 may be secured to the first liquid cold plate 321. One or more of the first housing, the second housing, and the substrate may have a fixing portion thereon, and the fixing portion is used for fixing the pipeline 340. The first liquid cold plate 321 may be secured by securing tubing 340.

Illustratively, the fixing portion may be used to fix a portion of the conduit 340 connected to the first liquid-cooled plate 321.

The electronic board further comprises heat sinks, which may be located at a side of the second housing remote from the first liquid-cooled board 321.

The material of the heat sink may comprise one or more of an aluminium alloy, brass and bronze. The shape of the heat sink may be plate-like, multi-plate-like, or the like.

Alternatively, the electronic board may further include a third liquid-cooled board, and the third liquid-cooled board may be located on a side of the second housing away from the first liquid-cooled board 321.

The heat dissipation plate or the third liquid cooling plate is arranged on one side, away from the first liquid cooling plate 321, of the second casing, so that the heat dissipation efficiency of the electronic board can be further improved.

The electronic board may also include a processing chip 350. The process chip 350 may be disposed on the substrate 340.

The first housing, the second housing, the connector array 360, and the processing chip 350 may be located on one side of the substrate 340.

The electronics board may also include a second liquid cold plate 322. The second cold plate 322 is disposed on the upper surface of the processing chip 350 for dissipating heat from the processing chip 350.

The conduit 330 is also used to deliver and recover the cooling fluid for the second liquid cooling plate 322.

The processing chip 350 may be electrically connected to a connector array 360. The processing chip 350 may receive data transmitted by any of the plurality of connectors 121-125 in the connector array 360. The processing chip 350 may also send data to any of the plurality of connectors 121-125 in the connector array 360. Illustratively, the processing chip 350 may forward data sent by one connector in the connector array 360 to other connectors in the connector array 360.

As shown in fig. 4, the cooling liquid may sequentially flow through the second liquid-cooling plate 322 and the first liquid-cooling plate 321, and then flow back to the second liquid-cooling plate 322 and then flow out.

That is, the pipe 330 may include a delivery section 331, a recovery section 334, a first transfer section 332, a second transfer section 333.

A first end of the transportation section 331 is connected to a coolant flow outlet (not shown) and a second end of the transportation section 331 is connected to the second liquid cooling plate 322.

A first end of the first transport segment 332 is coupled to the second liquid cold plate and a second end of the first transport segment 332 is coupled to the first liquid cold plate 321.

A first end of the second transfer section 333 is connected to the first liquid-cooled plate 321, and a second end of the second transfer section 333 is connected to the second liquid-cooled plate 322;

a first end of the recycling section 334 is connected to the second liquid cooling plate 332, and a second end of the recycling section 334 is connected to a cooling liquid recycling port (not shown).

Alternatively, the cooling fluid may flow out after sequentially flowing through the second liquid cold plate 322 and the first liquid cold plate 321.

Alternatively, the cooling fluid may flow out after flowing through the first and second fluid-cooled

plates

321 and 322, respectively. That is, the tubes 330 may be arranged to provide parallel flow of the cooling fluid through the first and second fluid-cooled

plates

321, 322.

In the case where the pipe 330 includes the conveying section 331, the recovery section 334, the first transfer section 332, and the second transfer section 333, the pipe 330 is easily installed.

Fig. 2 is a schematic structural diagram of a heat dissipation apparatus of an electronic device according to an embodiment of the present application.

The heat sink includes a first liquid-cooled plate 221 and a duct 230.

The first liquid cold plate 221 is disposed between the first light module layer 211 and the second light module layer 212 of the electronic device, and is used for dissipating heat from the first light module layer 211 and/or the second light module layer 212.

Each of the first and second light module layers 211 and 212 may be provided with at least one light module. Illustratively, any one of the first and second light module layers 211 and 212 may be inserted into at least one light module.

Tubing 230 is connected to the first liquid cold plate 221 for delivering and recovering cooling liquid for the first liquid cold plate 221.

By disposing the first liquid cold plate 221 between the first light module layer 211 and the second light module layer 212, the heat dissipation efficiency of the light modules can be improved in the case of stacked light modules.

The length of the first liquid cold plate 221 may be greater than the length of the shorter of the first and second light module layers 211, 212. Further, the length of the first liquid cold plate 221 may be greater than or equal to the length of the first light module layer 211, and the length of the first liquid cold plate 221 may be greater than or equal to the length of the second light module layer 212. That is, the length of the first liquid cooling plate 221 may be greater than the length of the longer one of the first and second light module layers 211 and 212. Therefore, the first liquid cooling plate 221 can dissipate heat for each of the first and second optical module layers 211 and 212, and the heat dissipation efficiency of each optical module is improved.

The width of the first liquid cold plate 221 may be greater than, less than, or equal to the length of a light module inserted in the light module layer. The width of the first liquid-cooling plate 221 is set to be less than or equal to the length of an optical module inserted into an optical module layer, so that the space occupation of the first liquid-cooling plate 221 can be reduced as much as possible while the heat dissipation efficiency is improved.

The electronic device may further include a first housing and a second housing. The first housing is for inserting at least one optical module in the first optical module layer 211 and the second housing is for inserting at least one optical module in the second optical module layer 212. The first housing may be located at the first light module layer 211 and the second housing may be located at the second light module layer 212. The first liquid cold plate 221 may be disposed between the first enclosure and the second enclosure.

The housing (cage) may also be referred to as a cage or shield.

The first liquid cold plate 221 may have a length greater than or equal to a length of the first enclosure, and the first liquid cold plate 221 may be greater than or equal to a length of the second enclosure. Therefore, the first liquid cooling plate 221 can dissipate heat of each optical module inserted into the first shell and the second shell, and heat dissipation efficiency of the electronic device is improved.

The first liquid cold plate 221 may cover all or a portion of the area of the first enclosure and/or the second enclosure.

The heat dissipation device may further include a heat dissipation fin, and the heat dissipation fin may be disposed on a side of the second housing away from the first liquid cooling plate 221, so as to further improve heat dissipation efficiency. In particular, reference may be made to the description of the housing in fig. 6.

The first liquid cold plate 221 may be disposed between the first enclosure and the second enclosure in a variety of ways.

The first liquid cold plate 221 is provided with a first protruding portion, and a surface of the first shell and/or the second shell, which is close to the first liquid cold plate 221, is provided with a recessed portion into which the first protruding portion can be inserted. In particular, reference may be made to the description of fig. 7.

Alternatively, the first liquid cold plate 221 is provided with the recessed portion, and the surface of the first shell and/or the second shell, which is close to the first liquid cold plate 221, is provided with a first raised portion.

Thus, the first protrusion and the recess cooperate to fix the position of the first liquid-cooling plate 221.

The tubing 230 may be secured to the first liquid cold plate 221. The first and second housings may be provided with fixing portions for fixing the pipe 230.

Thus, by securing the tubing 230, the first liquid cold plate 221 may be secured.

The heat sink may further include a second liquid cooling plate. The second liquid cooling plate is used for dissipating heat of a processing chip of the electronic device.

Tubing 230 may be coupled to the second liquid-cooled plate for delivering and recovering the cooling liquid for the second liquid-cooled plate.

The heat dissipation device can also be used for dissipating heat of a processing chip of the electronic equipment, so that the heat dissipation efficiency of the electronic equipment is further improved. The arrangement of the conduit 230 can be specifically referred to the description of fig. 4.

The electronic device may be the electronic board shown in fig. 3 or fig. 5A, or may be a switching device or the like.

Fig. 5A is a schematic perspective view of an electronic board according to an embodiment of the present application. Fig. 5B is a side view schematic of the electronic board shown in fig. 5A.

The electronic board shown in fig. 5A includes a substrate 540, and a first housing 511, a second housing 512, a first liquid-cooling plate 521, a second liquid-cooling plate 522, a third liquid-cooling plate 523, a pipe 530, a connector array 560, and a processing chip 550 disposed on the substrate 540.

The first housing 511, the first liquid cooling plate 521, the second housing 512, and the third liquid cooling plate 523 are sequentially disposed along a direction away from the substrate 540.

The second liquid cold plate 512 is disposed on a side of the processing die 550 away from the base plate 540.

The pipe 530 is connected to each of the first, second, and third liquid-cooled

plates

521, 522, 523 to transport and recover the cooling fluid for each liquid-cooled plate.

The connector array 560 includes a plurality of connectors for electrically connecting with the optical modules inserted into the first and

second housings

511 and 512. The connector array 560 is electrically connected to the processing chip 550.

The length of the substrate 560 may be equal to the length of the first and

second housings

511 and 512.

By providing the third liquid cooling plate 523 on the side of the second enclosure 512 away from the substrate 540, the heat dissipation efficiency can be further improved.

Fig. 6 is a schematic structural diagram of an enclosure assembly provided in an embodiment of the present application.

The first housing at the first light module layer 211 shown in fig. 2, the first housing at the first light module layer 311 shown in fig. 3, and the first housing 511 shown in fig. 5 may each include at least one housing component having the structure shown in fig. 6.

The housing assembly shown in fig. 6 may include a plurality of insertion holes 621 to 624. Each jack may be used to plug in one optical module. The optical module may be electrically connected to one of the connectors in the connector array through the receptacle.

The bottom of the housing assembly may be provided with a fixing portion 611. The fixing portion 611 is used to fix the housing assembly on the substrate.

Fig. 7 is a schematic structural diagram of another enclosure assembly provided in an embodiment of the present application.

The housing assembly may include a plurality of receptacles 721-724. Each jack may be used to plug in one optical module.

The housing assembly may also include a support portion 712. The support portion 712 may be fixed on the substrate such that the relative position of the housing assembly and the substrate is fixed.

The support portion 712 may be located at a portion of the housing assembly that covers the area where the connector array is located.

The bottom of the supporting part 712 may be provided with a fixing part 711. The fixing portion 711 is used to fix the housing assembly on the substrate.

A heat sink 730 may be disposed above the insertion holes 721 to 724 and above the support portion 712. The portion of the heat sink 730 above the support portion 712 may be used to dissipate heat from the connector array, and the portion of the heat sink 730 above the receptacles 721 to 724 may be used to dissipate heat from the optical modules inserted in the receptacles 721 to 724.

The second housing at the second light module layer 212 shown in fig. 2 and the second housing at the second light module layer 312 shown in fig. 3 may each include at least one housing component having the structure shown in fig. 7.

By providing the heat radiating fins on the second housing, the heat radiating efficiency can be improved.

A first housing including a plurality of housing assemblies shown in fig. 6 and a second housing including a plurality of housing assemblies shown in fig. 7 are fixed on a substrate, so that the relative positions of the first housing, the second housing, and the substrate are stabilized.

One of the first case and the second case may be fixed to the substrate, and the other may be fixed to the one case, so that the relative positions of the first case, the second case, and the substrate are stabilized.

Under the condition that the relative positions of the first shell, the second shell and the substrate are stable, the first liquid cooling plate can be arranged between the first shell and the second shell in various modes. The description will be given by taking fig. 8 to 9 as an example.

As shown in fig. 8, the first liquid cold plate 810 may be provided with a first protrusion 811, and the surface of the housing 820 adjacent to the first liquid cold plate 810 may be provided with a recess 821.

The housing 820 may be a first housing or a second housing.

The first protrusion 811 may be inserted into the recess 821 to secure the first liquid cold plate 810 to the housing 820.

Or the surface of the shell close to the first liquid cooling plate can be provided with a first convex part, and the first liquid cooling plate is provided with a concave part.

As shown in fig. 9, the housing 920 is provided with a surrounding portion 930. The surrounding portion 930 may include a plurality of protrusions 931 to 934 as shown in fig. 9. A plurality of protrusions 931 to 934 are provided on the housing 920.

Alternatively, the surrounding portion 930 may further include a fence or the like.

An enclosure 930 surrounds the first liquid cold plate 910. The enclosure 920 is a first enclosure or a second enclosure and the surrounding portion 930 secures the first liquid cold plate 910 between the first enclosure and the second enclosure in an area surrounded by the surrounding portion 930.

Alternatively, the first liquid-cooled plate may be fixed to the first housing, the second housing, the base plate, and the like using a snap. The fastener can be arranged on the first liquid cooling plate, the first shell, the second shell or the base plate. The pipeline of being connected with first coolant liquid can be fixed on first liquid cold drawing, through fixed pipeline, can fix first liquid cold drawing.

The first housing and/or the second housing may be provided with a fixing portion, and the substrate may also be provided with a fixing portion. The fixing part is used for fixing the pipeline. The fixing part may be a snap, for example.

The embodiment of the application also provides the switching equipment which comprises the electronic board.

The exchange device may further comprise a power plant. The power plant may be used to control the flow of cooling fluid within the pipeline. The power means may be a pump, for example.

The exchange device may also include a heat exchange device. The heat exchange device is used for cooling the returned cooling liquid. The returned cooling liquid may also be understood as cooling liquid recovered by a pipeline.

The switching device may be a switch, for example.

Although the present application has been described with reference to the preferred embodiments, it is not intended to limit the present application, and those skilled in the art can make variations and modifications without departing from the spirit and scope of the present application, therefore, the scope of the present application should be determined by the appended claims.

Claims

1. An electronic board comprising a first optical module layer, a second optical module layer, and a first liquid-cooled board;

2. The electronic board according to claim 1, wherein said first optical module layer is provided with a first housing, said second optical module layer is provided with a second housing, said first liquid cooling plate is provided between said first housing and said second housing, each of said first housing and said second housing being adapted for insertion of at least one optical module.

3. The electronic board of claim 2, wherein a length of the first liquid cold plate is greater than or equal to a length of the first enclosure, and wherein a length of the first liquid cold plate is greater than or equal to a length of the second enclosure.

4. The electronic board according to claim 2 or 3, wherein the electronic board further comprises a substrate, the bottom of the first housing is fixed on the substrate, the second housing is located on a side of the first housing away from the substrate, and a support portion is provided on the second housing and fixed on the substrate.

5. The electronic board of claim 4, further comprising a connector array comprising a plurality of connectors, the connectors electrically connected with the light modules;

the support part is fixed on the substrate in the area where the connector array is located.

6. The electronic board of claim 4, further comprising a heat sink located on a side of the second housing remote from the first liquid-cooled plate.

7. The electronic board of any of claims 1-3, further comprising a connector array comprising a plurality of connectors electrically connected to the light module, the first liquid-cooled plate having a contact surface with the connector array.

8. The electronic board according to claim 7, wherein said first optical module layer is provided with a first housing, said second optical module layer is provided with a second housing, said first liquid cooling plate is provided between said first housing and said second housing, each of said first housing, said second housing for inserting at least one optical module;

9. The electronic board according to claim 2 or 3, wherein the first liquid-cooled plate is provided with a first protrusion, and the surface of the first housing and/or the second housing near the first liquid-cooled plate is provided with a recess into which the first protrusion can be inserted; alternatively, the first and second electrodes may be,

10. The electronic board according to claim 2 or 3, further comprising a conduit connected to the first liquid-cooled board for transporting and recovering a cooling liquid for the first liquid-cooled board;

11. The electronic board according to any of claims 1-3,

the electronic board further comprises a processing chip and a second liquid cooling plate, and the second liquid cooling plate is used for dissipating heat of the processing chip.

12. The electronic board of claim 11, wherein the electronic board further comprises a conduit;

13. The electronic board according to any of claims 1-3, wherein the first liquid cooled board comprises a uniform arrangement of coolant flow channels.

14. A switching device, characterized in that it comprises an electronic board according to any one of claims 1 to 13.