CN217936322U - Liquid cooling plate for heat dissipation of electronic device - Google Patents
Liquid cooling plate for heat dissipation of electronic device Download PDFInfo
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- CN217936322U CN217936322U CN202221142141.3U CN202221142141U CN217936322U CN 217936322 U CN217936322 U CN 217936322U CN 202221142141 U CN202221142141 U CN 202221142141U CN 217936322 U CN217936322 U CN 217936322U
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Abstract
The utility model discloses a liquid cooling plate for heat dissipation of electronic devices, which relates to the technical field of electric automobile heat pipes and comprises a main plate, wherein the main plate is provided with a containing cavity, the containing cavity is provided with at least one runner clapboard so as to form a plurality of connected runners positioned in the containing cavity, and two runners positioned at two ends are respectively provided with a water flow inlet structure and a water flow outlet structure; the flow channel turbulence assembly comprises at least one long-strip-shaped fin arranged in the flow channel; the curve turbulence assembly comprises a first turbulence column and a plurality of arc-shaped fins, the first turbulence column is arranged close to the end part of the flow channel partition plate, and the arc-shaped fins are sequentially distributed from inside to outside around the first turbulence column; and the cover plate is connected with the main plate to hermetically contain the cavity, and is provided with an inflow hole and an outflow hole which are respectively communicated with the water flow inlet structure and the water flow outlet structure. The utility model discloses the radiating rate is fast, the radiating effect is good, temperature distribution is even.
Description
Technical Field
The utility model relates to an electric automobile heat pipe technical field, in particular to be used for radiating liquid cooling board of electron device.
Background
With the development of electric automobile technology, more and more vehicle-mounted high-power electronic devices are used and are more and more important. If the heat of the devices cannot be dissipated timely and effectively, the temperature of the devices can be gradually increased along with the prolonging of the service life, so that the working efficiency of the devices can be influenced, and even the devices can be damaged to influence the use, and therefore, the heat dissipation of the devices becomes an extremely important and indispensable work. The current heat dissipation method mainly utilizes the attachment of a liquid cooling plate and a heating device to achieve the purpose of heat dissipation. In order to improve the heat transfer performance of the liquid cooling plate, the design of the internal flow channel of the liquid cooling plate is very important, most flow channels of the liquid cooling plates on the market are simple and random, and the efficient heat dissipation effect is not realized, so that the working of a high-power electronic device is not facilitated, and the service life and the safety of the high-power electronic device are also influenced.
SUMMERY OF THE UTILITY MODEL
The utility model discloses aim at solving one of the above-mentioned technical problem among the prior art to a certain extent at least. Therefore, the embodiment of the utility model provides a be used for radiating liquid cooling board of electron device optimizes the runner, enables electron device temperature distribution more for even, is favorable to electron device's high efficiency work.
According to the embodiment of the utility model, the liquid cooling plate for heat dissipation of electronic devices comprises a main plate, wherein the main plate is provided with a containing cavity, the containing cavity is provided with at least one runner partition plate so as to form a plurality of connected runners positioned in the containing cavity, and two runners positioned at two ends are respectively provided with a water flow inlet structure and a water flow outlet structure; the flow channel turbulence assembly is positioned in the flow channel and comprises at least one long-strip-shaped fin arranged in the flow channel; the curve turbulence component is positioned at a curve between two adjacent flow channels and comprises a first turbulence column and a plurality of arc-shaped fins, the first turbulence column is arranged close to the end part of the flow channel partition plate, and the arc-shaped fins are sequentially distributed around the first turbulence column from inside to outside; and the cover plate is connected with the main plate to seal the accommodating cavity, and is provided with an inflow hole and an outflow hole which are respectively communicated with a water flow inlet structure and a water flow outlet structure.
In an alternative or preferred embodiment, at least two of the flow channel separators are arranged and staggered in sequence, so that each flow channel is arranged in an S shape.
In an alternative or preferred embodiment, at least two of the elongated fins in each flow channel are arranged, and are arranged at equal intervals.
In an optional or preferred embodiment, in each of the curved spoiler assemblies, at least two of the arc-shaped fins are arranged and are sequentially stacked at intervals, and the arc-shaped fins are semicircular.
In an alternative or preferred embodiment, the ends of the elongated fins are each provided with rounded corners.
In an alternative or preferred embodiment, the water inlet structure and the water outlet structure each include a pagoda head mounting block disposed on the cover plate and a pagoda head attached to the pagoda head mounting block.
In an alternative or preferred embodiment, the water inlet structure and the water outlet structure each comprise a slow flow ramp disposed in the respective flow passage.
In an alternative or preferred embodiment, the flow passage is provided with a second turbulence column at a position close to the slow flow ramp.
In an optional or preferred embodiment, the main plate, the flow channel spoiler assembly and the curved spoiler assembly are integrally formed. The sealing performance can be ensured by processing through an integrally formed processing technology.
In an optional or preferred embodiment, the main plate, the flow channel turbulent flow component, the bend turbulent flow component and the cover plate are all aluminum alloy components.
Based on the technical scheme, the embodiment of the utility model provides a following beneficial effect has at least: according to the technical scheme, the flow channel partition plate is arranged in the containing cavity of the main board to form a plurality of flow channels, so that the liquid cooling plate increases the contact area with the electronic device, and the heat conduction is enhanced; the long-strip-shaped fins, the first turbulence columns and the arc-shaped fins have the function of disturbing the cooling liquid while increasing the convection heat exchange area, and the flow channel is optimized, so that the cooling liquid is in a turbulent flow state when flowing through the flow channel, and the convection heat exchange function is strengthened. The utility model is used for radiating liquid cooling plate radiating rate is fast, the radiating effect is good, temperature distribution is even, is connected the back with electronic device, enables electronic device temperature distribution more for even, is favorable to electronic device's high-efficient work.
Drawings
The present invention will be further described with reference to the accompanying drawings and examples;
fig. 1 is a mounting structure diagram of a liquid cooling plate for heat dissipation of an electronic device attached to the electronic device according to an embodiment of the present invention;
fig. 2 is an exploded view of an embodiment of the present invention;
fig. 3 is a perspective view of an embodiment of the invention;
fig. 4 is a perspective view of another perspective of an embodiment of the present invention.
Detailed Description
This section will describe in detail the embodiments of the present invention, the preferred embodiments of which are shown in the attached drawings, which are used to supplement the description of the text part of the specification with figures, so that one can visually and vividly understand each technical feature and the whole technical solution of the present invention, but it cannot be understood as a limitation to the scope of the present invention.
In the description of the present invention, it should be understood that the directional descriptions, such as the directions or positional relationships indicated by upper, lower, front, rear, left, right, etc., are based on the directions or positional relationships shown in the drawings, and are only for convenience of description and simplification of the description, but not for indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and thus should not be construed as limiting the present invention.
In the description of the present invention, a plurality of meanings are one or more, a plurality of meanings are two or more, and the terms greater than, smaller than, exceeding, etc. are understood as excluding the number, and the terms greater than, lower than, within, etc. are understood as including the number. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
In the description of the present invention, unless there is an explicit limitation, the terms such as setting, installing, connecting, etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meaning of the terms in the present invention by combining the specific contents of the technical solution.
Referring now to fig. 2 to 4, a liquid cooling plate for heat dissipation of an electronic device is shown, which can be applied to heat dissipation of an electronic device. Referring to fig. 1, a liquid cooling plate 100 for heat dissipation of an electronic device is attached to an electronic device 200.
As shown in fig. 2 to 4, the liquid cooling plate 100 for dissipating heat of electronic devices in the present embodiment includes a main plate 11, a channel spoiler, a curved channel spoiler, and a cover plate 21.
The main board 11 has a receiving cavity, and the receiving cavity is provided with at least one flow channel partition board 12 to form a plurality of connected flow channels 13 in the receiving cavity. The flow channel turbulence assembly is positioned in the flow channel 13, and the curve turbulence assembly is positioned at a curve between two adjacent flow channels 13. The cover plate 21 is connected with the main plate 11 to seal the accommodation chamber.
Specifically, the flow-channel spoiler assembly includes at least one elongated fin 14 disposed in a flow channel 13. The curve spoiler assembly comprises a first spoiler column 16 and a plurality of arc-shaped fins 15, the first spoiler column 16 is arranged close to the end part of the flow channel partition plate 12, and the arc-shaped fins 15 are sequentially arranged from inside to outside around the first spoiler column 16.
In addition, the two flow passages 13 at the two ends are respectively provided with a water inlet structure and a water outlet structure, and the cover plate 21 is provided with an inflow hole and an outflow hole which are respectively communicated with the water inlet structure and the water outlet structure. The cooling liquid flows in through the inflow hole of the cover plate 21, the cooling liquid flows in the flow channel 13, and the cooling liquid flows from the outflow hole under the driving of power provided by a device such as a water pump, and the like, takes away the heat of the liquid cooling plate, circulates to an external heat dissipation device, and dissipates the heat to the air. Then the low-temperature cooling liquid flows back to the liquid cooling plate, and the process is repeated in a circulating way.
It can be understood that a plurality of flow channels 13 are formed by arranging the flow channel partition plate 12 in the accommodating cavity of the main board 11, so that the liquid cooling plate increases the contact area with the electronic device, and enhances heat conduction. Preferably, at least two flow channel separators 12 are provided and are sequentially staggered so that the flow channels 13 are arranged in an S-shape. In this embodiment, two flow path partitions 12 are provided, thereby forming three flow paths 13.
The long-strip-shaped fins, the first turbulence columns and the arc-shaped fins have the function of disturbing the cooling liquid while increasing the convection heat exchange area, and the flow channel is optimized, so that the cooling liquid is in a turbulent flow state when flowing through the flow channel, and the convection heat exchange function is strengthened. Specifically, at least two elongated fins 14 are arranged in each flow channel 13, and the elongated fins 14 are arranged at equal intervals, as shown in fig. 2, the two elongated fins 14 of each flow channel 13 are uniformly arranged. Further, the ends of the elongated fins 14 are all provided with rounded corners.
In each curve turbulence assembly, at least two arc-shaped fins 15 are arranged and are sequentially overlapped at intervals, and the arc-shaped fins 15 are semicircular. It can be understood that the concentric first turbulence column 16 and the arc-shaped fin 15 are arranged at the bend between two adjacent flow channels for flow transmission, so as to avoid heat concentration.
Referring to fig. 1, one side of a main board 11 of a liquid cooling plate 100 for heat dissipation of an electronic device is attached to the electronic device 200, and heat conduction is performed between the main board 11 and the electronic device 200.
The arc-shaped fin 15, the long-strip-shaped fin 14 and the first flow disturbing column 16 inside the flow channel 13 in the liquid cooling plate 100 for heat dissipation of the electronic device are also in contact with the attachment surface of the electronic device of the main plate 11, so that part of heat conducted from the electronic device is also transmitted to the fin arc-shaped fin 15, the long-strip-shaped fin 14 and the first flow disturbing column 16.
The main plate 11, the flow channel turbulence assembly, the curve turbulence assembly and the cover plate 21 are all aluminum alloy material components. The aluminum alloy material has higher heat conductivity coefficient; and the binding surface of the electronic device on the main board 11 has a larger contact area, so that the heat flow in the heat conduction process is larger. Inside the flow channel 13, the coolant flows over the surfaces of the long strip fins 14, the arc fins 15, the first turbulence columns 16 and the flow channel 13, and the coolant and the main plate 11 generate heat convection.
The water inlet structure and the water outlet structure both comprise a pagoda head mounting block 22 arranged on the cover plate 21 and a pagoda head 23 connected to the pagoda head mounting block 22. Further, the structure at the water inlet and the structure at the water outlet both comprise a slow flow ramp 17 arranged at the corresponding flow channel. The flow path 13 is provided with a second turbulence column 18 at a position near the slow flow ramp 17.
The first turbulence column 16, the second turbulence column 18, the arc-shaped fins 15 and the long-strip-shaped fins 14 in the flow channel 13 enable the flowing-in cooling liquid to flow in a turbulent flow state, have a large Reynolds number, and can rapidly conduct heat conducted from the bonding surface of the liquid cooling plate to each part of the cooling liquid in a convection manner in time, so that the overall temperature is relatively uniform.
The arc-shaped fins 15 and the long-strip-shaped fins 14 not only greatly increase the contact area of the cooling liquid and the liquid cooling plate, but also form a small flow channel, so that the heat transfer in the heat convection is accelerated, and the cooling liquid can take away more heat in the same time; the small flow passages are not completely independent, but are combined at some places, so that the mixing of cooling liquid with different temperatures in each flow passage is facilitated, and the overall temperature is more uniform.
In the use process, the plane on one side of the mainboard 11 of the liquid cooling plate 100 used for heat dissipation of the electronic device and the electronic device 200 are coated with heat-conducting silica gel, or tapping is carried out on the liquid cooling plate, and the liquid cooling plate is tightly attached to the electronic device through bolt connection. The pagoda head mounting block 22 is also tapped with threads, the pagoda head 23 can be screwed into the pagoda head after being sleeved with a waterproof gasket or wound with a waterproof adhesive tape, the pipeline is connected onto the two pagoda heads 23, and power is provided by devices such as a water pump, so that the cooling water path can be circulated.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present invention within the knowledge of those skilled in the art.
Claims (10)
1. The utility model provides a be used for radiating liquid cooling board of electron device which characterized in that: comprises that
The main board is provided with an accommodating cavity, the accommodating cavity is provided with at least one flow channel partition plate so as to form a plurality of connected flow channels positioned in the accommodating cavity, and two flow channels positioned at two ends are respectively provided with a water flow inlet structure and a water flow outlet structure;
the flow channel turbulence assembly is positioned in the flow channel and comprises at least one long-strip-shaped fin arranged in the flow channel;
the curve turbulence assembly is positioned at a curve between two adjacent runners and comprises a first turbulence column and a plurality of arc-shaped fins, the first turbulence column is arranged close to the end part of the runner partition plate, and the arc-shaped fins are sequentially arranged from inside to outside around the first turbulence column; and
the cover plate is connected with the main plate to seal the accommodating cavity, and is provided with an inflow hole and an outflow hole which are respectively communicated with a water flow inlet structure and a water flow outlet structure.
2. The liquid cooled plate for dissipating heat from an electronic device as recited in claim 1, wherein: the flow channel partition plates are at least two and are sequentially arranged in a staggered mode, so that the flow channels are arranged in an S shape.
3. A liquid cooled plate for electronic device heat dissipation as set forth in claim 2, wherein: at least two long-strip-shaped fins are arranged in each flow channel and are arranged at equal intervals.
4. A liquid cooled plate for electronic device heat dissipation as set forth in claim 3, wherein: in each curve turbulence assembly, at least two arc-shaped fins are arranged and are sequentially overlapped at intervals, and the arc-shaped fins are semicircular.
5. A liquid cooled plate for electronic device heat dissipation as set forth in claim 3, wherein: and the end parts of the long-strip fins are provided with fillets.
6. A liquid cooled plate for electronic device heat dissipation as set forth in claim 1, wherein: the water flow inlet structure and the water flow outlet structure are both arranged on the pagoda head mounting block of the cover plate and connected to the pagoda head on the pagoda head mounting block.
7. The liquid cooled plate for dissipating heat from an electronic device as recited in claim 6, wherein: the water flow inlet structure and the water flow outlet structure respectively comprise a slow flow ramp arranged on the corresponding flow channel.
8. The liquid cooled plate for electronic device heat dissipation of claim 7, wherein: and a second flow disturbing column is arranged at the position of the flow passage close to the slow flow ramp.
9. A liquid cooled plate for electronic device heat dissipation as defined in any one of claims 1 to 8, wherein: the mainboard runner vortex subassembly and bend vortex subassembly integrated into one piece.
10. The liquid cooled plate for dissipating heat from an electronic device as claimed in any one of claims 1 to 8, wherein: the mainboard, runner vortex subassembly bend vortex subassembly and the apron is the aluminum alloy material component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221142141.3U CN217936322U (en) | 2022-05-12 | 2022-05-12 | Liquid cooling plate for heat dissipation of electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221142141.3U CN217936322U (en) | 2022-05-12 | 2022-05-12 | Liquid cooling plate for heat dissipation of electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217936322U true CN217936322U (en) | 2022-11-29 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221142141.3U Active CN217936322U (en) | 2022-05-12 | 2022-05-12 | Liquid cooling plate for heat dissipation of electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217936322U (en) |
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2022
- 2022-05-12 CN CN202221142141.3U patent/CN217936322U/en active Active
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