CN217936322U - Liquid cooling plate for heat dissipation of electronic device - Google Patents

Abstract

The utility model discloses a liquid cold plate used for heat dissipation of electronic devices, relates to the technical field of heat pipes of electric vehicles, and comprises a main board, the main board has an accommodation chamber, and the accommodation chamber is provided with at least one flow channel partition to form a cooling plate located in the accommodation chamber. A plurality of connected flow channels, the two flow channels at both ends are respectively provided with a water flow inlet structure and a water flow outlet structure; the flow channel spoiler assembly includes at least one elongated fin arranged in the flow channel; the bend spoiler The assembly includes a first spoiler column and several arc-shaped fins, the first spoiler column is arranged near the end of the flow channel partition, and each arc-shaped fin is arranged around the first spoiler column from inside to outside; and a cover plate, cover The plate is connected with the main board to seal the accommodating cavity, and the cover plate is provided with an inflow hole and an outflow hole, respectively communicating with the structure at the water inlet and the water outlet. The utility model has the advantages of fast heat dissipation speed, good heat dissipation effect and uniform temperature distribution.

Description

A liquid cooling plate for heat dissipation of electronic devices

technical field

The utility model relates to the technical field of electric vehicle heat pipes, in particular to a liquid cooling plate used for heat dissipation of electronic devices.

Background technique

With the development of electric vehicle technology, there are more and more high-power electronic devices on board, and they are becoming more and more important. And high power is also accompanied by high heat generation. If these devices cannot be dissipated in a timely and effective manner, the temperature of the devices themselves will gradually increase with the prolongation of use time, which will not only affect the working efficiency of the devices, but may even damage the devices. Therefore, the heat dissipation of these devices has become an extremely important and indispensable work. The current heat dissipation method is mainly to use the liquid cooling plate and the heating device to bond to achieve the purpose of heat dissipation. In order to improve the heat transfer performance of the liquid cooling plate, the design of the internal flow channel of the liquid cooling plate is very important. However, most of the liquid cooling plates on the market now have simple and random flow channels, which do not achieve efficient heat dissipation, which is not conducive to high-power electronics. The work of the device will also affect its life and safety.

Utility model content

The utility model aims to solve one of the above-mentioned technical problems in the prior art at least to a certain extent. Therefore, the embodiment of the utility model provides a liquid cooling plate for heat dissipation of electronic devices, which optimizes the flow channel and makes the temperature distribution of the electronic devices more uniform, which is beneficial to the efficient operation of the electronic devices.

The liquid-cooled plate for heat dissipation of electronic devices according to an embodiment of the present invention includes a main board, the main board has a housing chamber, and the housing chamber is provided with at least one flow channel partition to form a connecting channel located in the housing chamber. A plurality of flow channels, the two flow channels located at both ends are respectively provided with a structure at the water inlet and a structure at the water outlet; a flow channel spoiler assembly located in the flow channel, the flow channel spoiler assembly includes a At least one strip-shaped fin in the flow channel; a curve spoiler assembly located at a bend between two adjacent flow channels, and the bend spoiler assembly includes a first spoiler column and several arc-shaped fins, the first spoiler column is arranged near the end of the flow channel partition, and each arc-shaped fin is arranged around the first spoiler column from inside to outside; and a cover plate, the The cover plate is connected to the main board to seal the accommodating cavity, and the cover plate is provided with an inflow hole and an outflow hole, respectively communicating with the structure at the water inlet and the water outlet.

In an optional or preferred embodiment, at least two flow channel partitions are provided and arranged alternately in sequence, so that each of the flow channels is arranged in an S shape.

In an optional or preferred embodiment, at least two elongated fins are provided in each of the flow channels, and are arranged at equal intervals.

In an optional or preferred embodiment, in each of the curve spoiler components, at least two arc-shaped fins are provided, and are stacked one after the other at intervals, and the arc-shaped fins are in a semicircular shape.

In an optional or preferred embodiment, the ends of the elongated fins are all provided with rounded corners.

In an optional or preferred embodiment, both the structure at the water inlet and the structure at the water outlet include a pagoda head installation block arranged on the cover plate and a pagoda head connected to the pagoda head installation block.

In an optional or preferred embodiment, both the structure at the water inlet and the structure at the water outlet include slow-flow ramps arranged in the corresponding flow channels.

In an optional or preferred embodiment, the flow channel is provided with a second spoiler column at a position close to the slow flow ramp.

In an optional or preferred embodiment, the main board, the channel spoiler assembly and the bend spoiler assembly are integrally formed. It is processed through an integral molding process to ensure sealing.

In an optional or preferred embodiment, the main board, the channel spoiler assembly, the bend spoiler assembly and the cover plate are all made of aluminum alloy.

Based on the above technical solution, the embodiment of the utility model has at least the following beneficial effects: in the above technical solution, a plurality of flow channels are formed by arranging a flow channel partition in the accommodation cavity of the main board, so that the liquid cooling plate increases the contact with the electronic device The area enhances the heat conduction; the long strip fins, the first spoiler column and the arc-shaped fins increase the convective heat transfer area while disturbing the cooling liquid, and optimize the flow channel so that the cooling liquid flows through The flow channel is in a turbulent state, which strengthens the convective heat transfer effect. The utility model has the advantages of fast heat dissipation speed, good heat dissipation effect and uniform temperature distribution of the liquid cooling plate used for heat dissipation of electronic devices. After being connected with the electronic devices, the temperature distribution of the electronic devices can be made more uniform, which is beneficial to the efficient work of the electronic devices.

Description of drawings

Below in conjunction with accompanying drawing and embodiment the utility model is further described;

Fig. 1 is the installation structure drawing of the liquid cooling plate used for the heat dissipation of the electronic device and the electronic device according to the embodiment of the present invention;

Fig. 2 is the explosion diagram of the utility model embodiment;

Fig. 3 is the perspective view of the utility model embodiment;

Fig. 4 is a perspective view of another viewing angle of the embodiment of the utility model.

Detailed ways

This part will describe the concrete embodiment of the utility model in detail, and the preferred embodiment of the utility model is shown in the accompanying drawing, and the function of the accompanying drawing is to supplement the description of the text part of the specification with figures, so that people can visually and vividly Each technical feature and overall technical solution of the present utility model should be understood, but they should not be construed as limiting the protection scope of the present utility model.

In the description of the present utility model, it should be understood that when it comes to orientation descriptions, for example, the orientations or positional relationships indicated by up, down, front, back, left, right, etc. are based on the orientations or positional relationships shown in the accompanying drawings, only It is for the convenience of describing the utility model and simplifying the description, but does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the utility model.

In the description of the present utility model, several means one or more, and multiple means two or more. Greater than, less than, exceeding, etc. are understood as not including the original number, and above, below, within, etc. are understood as including the original number. If the description of the first and second is only for the purpose of distinguishing the technical features, it cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features relation.

In the description of the utility model, unless otherwise clearly defined, words such as setting, installation, and connection should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above-mentioned words in the utility model in combination with the specific content of the technical solution .

Referring to FIG. 2 to FIG. 4 below, a liquid cold plate for heat dissipation of electronic devices is shown, which can be applied to heat dissipation of electronic devices. Referring to FIG. 1 , a liquid cooling plate 100 for heat dissipation of an electronic device is attached to an electronic device 200 .

As shown in FIG. 2 to FIG. 4 , the liquid cooling plate 100 used for heat dissipation of electronic devices in this embodiment includes a main board 11 , a channel spoiler assembly, a corner spoiler assembly and a cover plate 21 .

Wherein, the main board 11 has an accommodating cavity, and the accommodating cavity is provided with at least one flow channel partition 12 to form a plurality of connected flow channels 13 in the accommodating cavity. The channel spoiler assembly is located in the flow channel 13 , and the bend spoiler assembly is located at the bend between two adjacent flow channels 13 . The cover plate 21 is connected with the main board 11 to seal the cavity.

Specifically, the channel spoiler assembly includes at least one strip-shaped fin 14 disposed in the channel 13 . The curve spoiler assembly includes a first spoiler column 16 and several arc-shaped fins 15, the first spoiler column 16 is arranged near the end of the flow channel partition 12, and each arc-shaped fin 15 surrounds the first spoiler column 16 from Arranged inside out.

In addition, the two flow channels 13 located at both ends are respectively provided with a water inlet structure and a water outlet structure, and the cover plate 21 is provided with an inflow hole and an outflow hole, respectively communicating with the water inlet structure and the water outlet structure. The coolant flows in through the inflow hole of the cover plate 21, the coolant flows through the flow channel 13, and the coolant flows from the outflow port driven by the power provided by the water pump and other devices, taking away the heat of the liquid cold plate and circulating to the external heat dissipation device , dissipating heat to the air. Then the low-temperature coolant flows back to the liquid cold plate, and the cycle repeats.

It can be understood that, by arranging the flow channel separator 12 in the accommodation cavity of the main board 11, a plurality of flow channels 13 are formed, so that the contact area between the liquid cold plate and the electronic device is increased, and the heat conduction is enhanced. Preferably, at least two flow channel separators 12 are provided and arranged alternately in sequence, so that each flow channel 13 is arranged in an S shape. In this embodiment, two flow channel partitions 12 are provided, thereby forming three flow channels 13 .

The long strip fins, the first spoiler column and the arc-shaped fins can disturb the cooling liquid while increasing the convective heat transfer area, and optimize the flow channel so that the cooling liquid is in a turbulent state when flowing through the flow channel , enhanced convective heat transfer. Specifically, at least two strip-shaped fins 14 in each flow channel 13 are provided at least two, and are arranged at equidistant intervals. As shown in FIG. 2, the two strip-shaped fins 14 of each flow channel 13 are evenly arranged. . Further, the ends of the elongated fins 14 are all provided with rounded corners.

In each corner spoiler assembly, at least two arc-shaped fins 15 are provided, and are stacked one after the other at intervals, and the arc-shaped fins 15 are in a semicircular shape. It can be understood that at the bend between two adjacent flow channels, the first spoiler column 16 and the arc-shaped fins 15 with the same center are set up to conduct flow, so as to avoid heat concentration.

Referring to FIG. 1 , one side of the main board 11 in the liquid cooling plate 100 for heat dissipation of electronic devices is attached to the electronic device 200 , and heat conduction is performed between the main board 11 and the electronic device 200 .

The arc-shaped fins 15 and strip-shaped fins 14 and the first spoiler 16 inside the flow channel 13 in the liquid cooling plate 100 used for heat dissipation of electronic devices are also in contact with the bonding surface of the electronic devices of the main board 11, so that from the electronic device Part of the heat conducted by the device is also transferred to the arc-shaped fins 15 , the strip-shaped fins 14 and the first spoiler post 16 .

The main board 11, the channel spoiler assembly, the curve spoiler assembly and the cover plate 21 are all made of aluminum alloy. The aluminum alloy material has a higher thermal conductivity; and the bonding surface of the electronic device on the main board 11 has a larger contact area, so the heat flux during the heat conduction process is larger. Inside the flow channel 13 , the cooling liquid flows through the strip fins 14 , the arc-shaped fins 15 , the first spoiler column 16 and the surface of the flow channel 13 , and convective heat exchange occurs between the cooling liquid and the main board 11 .

Both the water inlet structure and the water outlet structure include a pagoda head mounting block 22 arranged on the cover plate 21 and a pagoda head 23 connected to the pagoda head mounting block 22 . Further, both the water inlet structure and the water outlet structure include slow flow ramps 17 arranged in corresponding flow channels. The flow channel 13 is provided with a second spoiler post 18 at a position close to the slow flow ramp 17 .

The first spoiler column 16, the second spoiler column 18, the arc-shaped fins 15, and the strip-shaped fins 14 inside the flow channel 13 make the inflowing coolant flow in a turbulent state, have a large Reynolds number, and can timely The heat conducted from the bonding surface of the liquid cold plate is quickly convected and transferred to each part of the cooling liquid, so that the overall temperature is relatively uniform.

The arc-shaped fins 15 and strip-shaped fins 14 not only greatly increase the contact area between the cooling liquid and the liquid-cooled plate, but also form small flow channels, which accelerate the heat transfer in the convective heat exchange, so that the cooling liquid More heat can be taken away at the same time; these small flow channels are not completely independent, but converge in some places, which is conducive to the mixing of different temperature coolants in each flow channel, making the overall temperature more uniform.

The main board 11 , the channel spoiler assembly and the corner spoiler assembly are integrally formed, and then connected to the cover plate 21 , so that the obtained liquid cooling plate has good sealing performance, which can avoid damage to electronic devices caused by water leakage of the liquid cooling plate.

During use, between the plane on one side of the motherboard 11 of the liquid cooling plate 100 used for heat dissipation of electronic devices and the electronic device 200, apply heat-conducting silica gel, or tap threads on the liquid cooling plate, and connect the liquid cooling plate and the electronic device 200 by bolts. Electronics fit snugly. The pagoda head mounting block 22 is also tapped with threads, and the pagoda head 23 can be screwed into it after putting on a waterproof gasket or winding a waterproof tape, and the pipeline is connected to the two pagoda heads 23, and power is provided by devices such as water pumps to make cooling Water circulation can be.

The above embodiments of the utility model have been described in detail in conjunction with the accompanying drawings, but the utility model is not limited to the above-mentioned embodiments. Make various changes below.

Claims (10)

1. A liquid cold plate for heat dissipation of electronic devices, characterized in that: comprising The main board, the main board has an accommodating cavity, and the accommodating cavity is provided with at least one flow channel partition to form a plurality of connected flow channels in the accommodating cavity, and the two flow channels at both ends are respectively provided with The structure at the water inlet and the water outlet; a flow channel spoiler assembly located in the flow channel, the flow channel spoiler assembly includes at least one elongated fin disposed in the flow channel; A curve spoiler assembly located at a curve between two adjacent flow channels, the curve spoiler assembly includes a first spoiler column and several arc-shaped fins, and the first spoiler column is close to The end of the flow channel partition is arranged, and each of the arc-shaped fins is arranged around the first spoiler column from inside to outside in sequence; and A cover plate, the cover plate is connected with the main board to seal the accommodating cavity, and the cover plate is provided with an inflow hole and an outflow hole, respectively communicating with the structure at the water inlet and the water outlet. 2 . The liquid cooling plate for heat dissipation of electronic devices according to claim 1 , wherein at least two flow channel partitions are provided and arranged alternately in sequence so that each of the flow channels is arranged in an S shape. 3 . 3 . The liquid cooling plate for heat dissipation of electronic devices according to claim 2 , wherein at least two elongated fins are provided in each of the flow channels, and are arranged at equal intervals. 4 . 4. The liquid-cooled plate used for heat dissipation of electronic devices according to claim 3, characterized in that: in each of the curved spoiler components, at least two arc-shaped fins are provided, and they are stacked in sequence , the arc-shaped fins are semicircular. 5 . The liquid-cooled plate for heat dissipation of electronic devices according to claim 3 , wherein the ends of the elongated fins are all provided with rounded corners. 6 . 6. The liquid cooling plate for heat dissipation of electronic devices according to claim 1, characterized in that: the structure at the water inlet and the structure at the outlet of the water include a pagoda head mounting block arranged on the cover plate and Be connected to the pagoda head on the pagoda head mounting block. 7. The liquid cooling plate for heat dissipation of electronic devices according to claim 6, characterized in that: the structure at the water inlet and the structure at the water outlet both include slow flow ramps arranged in the corresponding flow channels . 8 . The liquid cold plate used for heat dissipation of electronic devices according to claim 7 , wherein a second spoiler column is provided at a position close to the slow flow ramp in the flow channel. 9 . 9 . The liquid cooling plate for heat dissipation of electronic devices according to any one of claims 1 to 8 , characterized in that: the main board, the channel spoiler assembly and the bend spoiler assembly are integrally formed. 10. The liquid cooling plate for heat dissipation of electronic devices according to any one of claims 1 to 8, characterized in that: the main board, the flow channel spoiler assembly, the bend spoiler assembly and the The cover plates are all made of aluminum alloy.

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